CN114473194A

CN114473194A - Welding equipment

Info

Publication number: CN114473194A
Application number: CN202111613264.0A
Authority: CN
Inventors: 彭信翰; 赵盛宇; 文锡
Original assignee: Shenzhen Hymson Laser Intelligent Equipment Co Ltd
Current assignee: Shenzhen Hymson Laser Intelligent Equipment Co Ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-13

Abstract

The invention discloses a welding device, comprising: a first holding section (101) for holding a welding object (201); a second holding section (102) which is provided below the first holding section (101) and holds an object to be welded (202), the object to be welded (201) and the object to be welded (202) being opposed to each other; a detection unit (103) that detects the position of the object to be welded (201) and/or the position of the object to be welded (202); an adjusting section (104) that adjusts the first holding section (101) and/or the second holding section (102) so that the object to be welded (201) and the object to be welded (202) are aligned, based on the detection result of the detecting section (103); and a welding part (105) which is provided above the first holding part (101) and welds the object to be welded (201) to the object to be welded (202). The welding equipment can improve the welding precision.

Description

Welding equipment

Technical Field

The invention relates to the field of processing equipment, in particular to welding equipment.

Background

A welding apparatus is widely used as a processing apparatus for fixing one of components (e.g., an object to be welded) to another component (e.g., an object to be welded). However, as the demand for precision of products and the like increases, the demand for welding precision of welding equipment also increases.

For example, LEDs have been widely used in the field of displays as a light source for emitting light. The LED chip is soldered into a circuit board by using a soldering apparatus or the like for use. As the demand for display quality, the size of display devices, and the like has increased, the demand for LED chips has also increased. Therefore, a trend toward miniaturization of LED chips has arisen. With the miniaturization of LED chips, it is possible to achieve higher pixel density of LED chip arrays, and to improve display quality and the like. At the same time, however, with the miniaturization of LED chips, the distance between the LED chips to each other also becomes very small, for example, as is known, the LED chips mounted on a carrier board are even as small as 180 micrometers apart from each other, and the work of soldering the LED chips to, for example, a circuit board becomes extremely difficult.

Disclosure of Invention

The present invention aims to solve at least to some extent one of the problems of the prior art. Therefore, the invention provides welding equipment which can improve the welding precision.

The welding apparatus according to the first aspect of the invention includes: a first holding section for holding an object to be welded; a second holding portion provided below the first holding portion and holding an object to be welded, the object to be welded and the object to be welded being opposed to each other; a detection unit that detects a position of the welding object and/or a position of the welding object; an adjusting portion that adjusts the first holding portion and/or the second holding portion so that the welding object and the welding object are aligned, based on a detection result of the detecting portion; and a welding portion that is provided above the first holding portion and welds the object to be welded to the object to be welded.

According to the welding device of the first aspect of the invention, the following beneficial effects are achieved: the welding precision can be improved.

In some embodiments, the first holding portion is fixed with respect to the adjusting portion, the second holding portion is placed on the adjusting portion, and the adjusting portion adjusts the second holding portion so that the welding object and the welding object are aligned.

In some embodiments, the adjusting portion includes a first X-axis adjusting platform and a first Y-axis adjusting platform mounted on the first X-axis adjusting platform, and the second holding portion is mounted on the first Y-axis adjusting platform.

In some embodiments, the adjusting portion further includes an angle adjusting platform, the angle adjusting platform being carried on the first Y-axis adjusting platform, the second holding portion being carried on the angle adjusting platform.

In some embodiments, the adjusting portion further includes a Z-axis adjusting platform, the Z-axis adjusting platform being carried on the angle adjusting platform, and the second holding portion being carried on the Z-axis adjusting platform.

In some embodiments, the first X-axis adjustment stage, the first Y-axis adjustment stage, and the Z-axis adjustment stage are each driven by a linear motor.

In some embodiments, the inspection portion is disposed above the first holding portion and spaced apart from the welding portion; the welding apparatus further includes a switching portion on which the first holding portion and the adjustment portion on which the second holding portion is placed are placed, respectively; the switching portion drives the first holding portion and the second holding portion to switch between a position corresponding to the detection portion and a position corresponding to the welded portion.

In some embodiments, the switching portion includes a second X-axis adjustment stage and a second Y-axis adjustment stage mounted on the second X-axis adjustment stage, and the first holding portion and the adjustment portion are respectively mounted on the second Y-axis adjustment stage.

In some embodiments, the second X-axis adjustment stage and the second Y-axis adjustment stage are each driven by a linear motor.

In some embodiments, the welding apparatus further includes a welding area control portion provided between the welding object and the welding portion.

In some embodiments, the weld comprises a laser; the welding area control portion includes a base material on which are formed: a transmissive region that allows laser light emitted from the laser to pass therethrough; a blocking region surrounding the transmissive region, the blocking region blocking laser light emitted from the laser from passing through the substrate.

A soldering apparatus according to a second aspect of the present invention for soldering an LED chip to a circuit board, includes: a first holding portion that holds a carrier on which the LED chip is mounted so that the LED chip faces downward; a second holding portion provided below the first holding portion, for holding a circuit board so that the circuit board and the LED chip are opposed to each other; the detection part is used for detecting the position of the LED chip on the carrier plate and/or the position of a bonding pad used for mounting the LED chip in the circuit board; an adjusting section that adjusts the first holding section and/or the second holding section based on a detection result of the detecting section to align positions of the LED chip and the pad; and a soldering part disposed above the first holding part and soldering the LED chip to a position of the pad.

According to the welding device of the second aspect of the invention, the following beneficial effects are achieved: the welding precision of the LED chip can be improved.

Drawings

FIG. 1 is a perspective view of one embodiment of the welding apparatus of the present invention.

Fig. 2 is a schematic view of the first holding portion, the second holding portion, and the adjusting portion in fig. 1.

Fig. 3 is a schematic view of the welded portion and the inspection portion in fig. 1.

Fig. 4 is a schematic view of the first holding portion in fig. 1.

Fig. 5 is a schematic view of an embodiment of a welding object.

Fig. 6 is a schematic view of an embodiment of an object to be welded.

Detailed Description

Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present embodiment, and are not to be construed as limiting the present embodiment.

In the description of the present embodiment, it should be understood that the orientation or positional relationship indicated by referring to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description of the present embodiment and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present embodiment.

In the description of the present embodiment, a plurality of the terms are one or more, a plurality of the terms are two or more, and the terms larger, smaller, larger, etc. are understood to include no essential numbers, and the terms larger, smaller, etc. are understood to include essential numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present embodiment, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be broadly construed, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present embodiment in combination with the specific contents of the technical solutions.

FIG. 1 is a perspective view of one embodiment of the welding apparatus of the present invention. Fig. 2 is a schematic view of the first holding portion 101, the second holding portion 102, and the adjustment portion 104. Fig. 3 is a schematic view of the welded portion 105 and the inspection portion 103. Referring to fig. 1 to 3, a welding apparatus according to a first aspect of the present embodiment includes: a first holding portion 101, a second holding portion 102, a detection portion 103, an adjustment portion 104, and a welding portion 105. The first holding portion 101 holds the welding object 201. The second holding portion 102 is provided below the first holding portion 101 (the Z-axis direction in the drawing is the vertical direction), and holds the object 202 to be welded, with the object 201 and the object 202 to be welded facing each other. The detection unit 103 detects the position of the welding object 201 and/or the position of the welding object 202. The adjusting portion 104 adjusts the first holding portion 101 and/or the second holding portion 102 based on the detection result of the detecting portion 103 so that the welding object 201 and the welding object 202 are aligned. The welding portion 105 is provided above the first holding portion 101, and welds the welding object 201 to the object 202 to be welded.

According to the welding equipment of the embodiment, the welding precision can be improved. Specifically, since the detection unit 103 for detecting the welding object 201 and/or the object 202 to be welded is provided and the adjustment unit 104 for adjusting the position of the welding object 201 and/or the object 202 to be welded so as to align them based on the detection result of the detection unit 103 is provided, the positional accuracy between the welding object 201 and the object 202 to be welded can be improved, and the welding accuracy can be improved.

The welding equipment of the present embodiment may include, for example, a base 106, and the base 106 is finished by, for example, marble processing. The first base 107 is attached to the base 106, and the first base 107 may be formed by, for example, marble processing. This can improve the mounting accuracy of the reference member of the welding equipment. The first base 107 may have an L-shape, for example, one end of the first base 107 is locked to the base 106, and the other end of the first base 107 is cantilevered and located above the upper surface of the base 106.

The first holding portion 101, the second holding portion 102, and the adjusting portion 104 for adjusting the first holding portion 101 and/or the second holding portion 102 may be directly or indirectly attached to the base 106.

The detection unit 103 may be attached to one end of the first base 107 in a cantilever shape. The detection unit 103 may be located directly above the first holding unit 101 and the second holding unit 102, or may be driven above the first holding unit 101 and the second holding unit 102 by a driving device (not shown) such as a robot or a switching unit 122 described later. If necessary, the detection unit 103 may be provided below the second holding unit 102, for example, if it is more appropriate to detect the position of the welding object 201 and/or the position of the welding object 202 from below the second holding unit 102. Further, when it is necessary to detect the position of the object 201 and the position of the object 202, respectively, a part of the detection portion 103 may be disposed above the first holding portion 101, and another part of the detection portion 103 may be disposed below the second holding portion 102. The detection component used in the detection unit 103 is not particularly limited as long as the position between the object 201 and the object 202 to be welded can be accurately determined, and may be appropriately selected according to the shape, type, and the like of the object 201 and the object 202 to be welded. For example, a commercially available detection component such as the CCD unit 108 or a laser displacement sensor can be used as the detection unit 103. For example, a detection method, a control method, and the like of the detection element such as the CCD unit 108 or the laser displacement sensor in the detection unit 103 may be used in the conventional detection method, control method, and the like.

Specifically, for example, the CCD element 108 as a detection element of the detection unit 103 may be attached to the cantilever end of the first base 107. The detection section 103 detects the position of the object 201 placed on the first holding section 101 and the position of the object 202 placed on the second holding section 102 by the CCD assembly 108, respectively. In order to clearly display the images of the object 201 and the object 202 to be welded, the detection unit 103 may further include an adjustment robot 109 driven in the Z-axis direction. The adjustment robot 109 is driven by a motor. A CCD module 108 as a detection component is attached to the adjustment robot 109. This enables appropriate adjustment according to the optimal detection distance of the object 201 and the object 202 to be welded with respect to the CCD assembly 108.

The welded portion 105 is located above the first holding portion 101 and the second holding portion 102. Specifically, the welding portion 105 may be directly attached to the first base 107 and positioned above the first holding portion 101 and the second holding portion 102. The first base 107 may be attached to a driving device (not shown) such as a robot or a switching unit 122 described later, and may be driven to the upper side of the first holding unit 101 and the second holding unit 102 by the driving device or the switching unit 122. The weld 105 may include, for example, a welding laser 110. In order to improve the welding accuracy, the spot 110a of the laser 110 is adjusted to be 50 micrometers or more and 100 micrometers or less, for example. A laser 110 as a welding component of the welding portion 105 may be attached to one end of the first base 107 in a cantilever shape along the X-axis direction at an interval together with the CCD assembly 108 as a detection component of the detection portion 103.

In some embodiments, in order to easily align the object 201 and the object 202 to be welded so that the object 201 is accurately welded to the object 202 to be welded at a corresponding position, the first holding portion 101 is fixed with respect to the adjusting portion 104, the second holding portion 102 is placed on the adjusting portion 104, and the adjusting portion 104 adjusts the second holding portion 102 so that the object 201 and the object 202 to be welded are aligned. That is, the position of the second holding portion 102 can be adjusted so that the object 202 to be welded placed on the second holding portion 102 and the object 201 to be welded placed on the first holding portion 101 are aligned with each other, based on the object 201 to be welded held by the first holding portion 101. Specifically, the second base 111 may be provided on the base 106. The second base 111 includes, for example, a first leg portion 112 and a second leg portion 113 that are respectively located on both sides of the adjustment portion 104 in the X-axis direction, and a support plate 114 that is located above the adjustment portion 104 in the Z-axis direction. Both ends of the support plate 114 in the X-axis direction are supported by the first leg portion 112 and the second leg portion 113, respectively. The second base 111 may be integrally formed, or the first leg portion 112, the second leg portion 113, and the support plate 114 may be formed as separate parts. Preferably, the first leg portion 112, the second leg portion 113, and the support plate 114 are individually machined, so that not only can the machining accuracy be improved, but also, in the case of assembly, the parallelism of the support plate 114 with respect to the base 106 can be adjusted according to the actual assembly condition.

Fig. 4 is a schematic view of the first holding portion 101. Fig. 5 is a schematic diagram of an LED chip 203 as an embodiment of the object 201 to be soldered. Fig. 6 is a schematic view of a circuit board 205 as an embodiment of the object 202 to be soldered. Referring to fig. 4, and with additional reference to fig. 1 and 2, the first holding portion 101 is mounted below the support plate 114 in the Z-axis direction. In order to weld the object 201 and the object 202 to be welded by the laser beam of the laser 110, for example, a first escape groove 115 is formed through the center of the support plate 114 in the X-axis direction. The first retaining portion 101 is at least partially exposed in the first avoidance slot 115. The first holding portion 101 is provided as appropriate in accordance with the shape of the welding object 201. For example, when the object 201 to be soldered is an LED chip 203 (see fig. 5), the LED chip 203 may be mounted on the carrier board 204 in a state where the LED chip is supplied. In this case, the first holding portion 101 may include a first vacuum adsorption plate 116 for adsorbing the carrier plate 204. A first vacuum suction plate 116 as the first holding portion 101 is attached to a lower portion of the support plate 114 in the Z-axis direction. The first vacuum suction plate 116 holds the LED chip 203 mounted on the carrier plate 204 by sucking the carrier plate 204.

With continued reference to fig. 2, in some embodiments, in order to accurately adjust the object 202 to be welded with respect to the object 201 to be welded, the adjusting portion 104 includes a first X-axis adjusting platform 117 and a first Y-axis adjusting platform 118 mounted on the first X-axis adjusting platform 117, and the second holding portion 102 is mounted on the first Y-axis adjusting platform 118. That is, the adjustment unit 104 adjusts the object 202 to be welded at least in the X-axis direction and the Y-axis direction. In order to improve the adjustment accuracy of the adjustment part 104, the first X-axis adjustment stage 117 and the first Y-axis adjustment stage 118 may be driven by linear motors. For example, the first X-axis adjusting stage 117 and the first Y-axis adjusting stage 118 may select a slide table module driven by a linear motor. This can improve the adjustment accuracy of the adjustment unit 104 along the X axis and the Y axis. The second holding portion 102 may be directly placed on the first Y-axis adjustment stage 118. The second holding portion 102 is provided as appropriate in accordance with the shape of the object 202 to be welded. For example, when the object 201 to be soldered is the LED chip 203 and the object 202 to be soldered is the circuit board 205 (see fig. 6), the second holding portion 102 may include the second vacuum suction plate 119 for sucking the circuit board 205. The second vacuum adsorption plate 119 is directly installed on the first Y-axis adjustment stage 118.

Thus, by providing the first X-axis adjustment stage 117 and the first Y-axis adjustment stage 118, the object 201 to be welded and the object 202 to be welded can be accurately aligned, and welding of both by the laser 110, for example, can be performed with high accuracy.

With continued reference to fig. 2, in addition, in some embodiments, adjustment portion 104 may further include an angle adjustment platform 120, with angle adjustment platform 120 riding on first Y-axis adjustment platform 118 and second retaining portion 102 riding on angle adjustment platform 120. Specifically, for example, when the object 201 has a requirement for angular accuracy with respect to the object 202, the object 201 and the object 202 can be aligned more accurately by mounting the angle adjustment table 120. As the angle adjustment stage 120, for example, a DD motor may be selected, the DD motor being directly mounted on the first Y-axis adjustment stage 118, and the second vacuum suction plate 119 of the second holding portion 102 being attached to the DD motor as the angle adjustment stage 120.

By mounting the angle adjustment stage 120 on the first Y-axis adjustment stage 118, the accuracy between the object 201 and the object 202 can be adjusted with higher accuracy. Taking the LED chip 203 and the circuit board 205 as an example, for example, the circuit board 205 has a plurality of pads 206 for mounting the LED chip 203, and the LED chips 203 are mounted on the carrier board 204 in an array. In addition, the carrier board 204 may be provided with a first mark point 207a, and the circuit board 205 is provided with a second mark point 207b corresponding to the first mark point 207 a. When the pads 206 of the circuit board 205 and the LED chips 203 on the carrier board 204 are aligned, the first mark point 207a of the carrier board 204 and the second mark point 207b of the circuit board 205 are first aligned by the first X-axis adjustment stage 117 and the first Y-axis adjustment stage 118 of the adjustment part 104. However, in the case of angular deviation between the carrier board 204 and the circuit board 205, it is difficult to effectively adjust the first X-axis adjustment stage 117 and the first Y-axis adjustment stage 118. Therefore, by providing the angle adjustment table 120, the accuracy between the object 201 and the object 202 can be adjusted with higher accuracy. In this case, since it is not necessary to accurately feed the object 201 or the object 202 to be welded, the difficulty in feeding the object 201 or the object 202 to be welded can be reduced.

With continued reference to fig. 2, in some embodiments, adjustment portion 104 may further include a Z-axis adjustment platform 121, with Z-axis adjustment platform 121 riding on angle adjustment platform 120 and second holding portion 102 riding on Z-axis adjustment platform 121. Specifically, for example, when the object 201 and the object 202 to be welded need to be welded in a state of being bonded to each other, the Z-axis adjustment table 121 may be mounted on the angle adjustment table 120. The Z-axis adjustment stage 121 can be driven by a linear motor, which can improve positioning accuracy.

With continuing reference to fig. 2 and with additional reference to fig. 5 and 6, when the second holding portion 102 is placed on the Z-axis adjustment stage 121, the distance between the second holding portion 102 and the first holding portion 101 is, for example, 20mm or less. Taking the LED chip 203 and the circuit board 205 as an example, when the circuit board 205 is mounted on the second holding portion 102 and the carrier board 204 having the LED chip 203 is mounted on the first holding portion 101, the distance between the LED chip 203 and the pad 206 of the circuit board 205 is, for example, preferably 10mm or less, and more preferably 5mm or less. When the LED chip 203 and the pad 206 of the circuit board 205 are bonded to each other in the Z-axis direction, the detection unit 103, the first X-axis adjustment stage 117, the first Y-axis adjustment stage 118, the angle adjustment stage 120, and the Z-axis adjustment stage 121 need to be adjusted as a whole. For example, the Z-axis adjusting stage 121 is driven at a distance of 0.5mm or less at a time, and after the Z-axis adjusting stage 121 is driven upward in the Z-axis direction by 0.5mm, the detecting portion 103 re-detects the position between the LED chip 203 and the pad 206 of the circuit board 205, and thus, re-aligns the LED chip 203 and the pad 206 of the circuit board 205 by at least one of the first X-axis adjusting stage 117, the first Y-axis adjusting stage 118, and the angle adjusting stage 120. Thereafter, every 0.5mm of feeding of the Z-axis adjusting stage 121, the position between the LED chip 203 and the pad 206 of the circuit board 205 is re-inspected, and the LED chip 203 and the pad 206 of the circuit board 205 are re-aligned by at least one of the first X-axis adjusting stage 117, the first Y-axis adjusting stage 118, and the angle adjusting stage 120 of the adjusting part 104. Multiple adjustments are thus made until the LED chip 203 and the pads 206 of the circuit board 205 are in solderable positions.

Therefore, in the present embodiment, it is necessary to dispose the Z-axis adjusting stage 121 on the end of the adjusting portion 104, that is, the angle adjusting stage 120. By so doing, it is possible to reduce the cumulative error of assembly of the Z-axis adjusting stage 121, and thereby reduce the situation in which the circuit board 205 held at the second holding portion 102 is displaced due to the feeding of the Z-axis adjusting stage 121. Further, by reducing the distance between the second holding portion 102 and the first holding portion 101 as much as possible, the distance that the Z-axis adjustment stage 121 needs to feed can be reduced, and thus the adjustment efficiency of the adjustment portion 104 can be improved.

That is, in the adjusting section 104 of the soldering apparatus according to the present embodiment, by mounting the angle adjustment stage 120 on the first Y-axis adjustment stage 118 and mounting the Z-axis adjustment stage 121 on the angle adjustment stage 120, in the case where the positions of the object 201 to be soldered (for example, the LED chip 203) and the object 202 to be soldered (the circuit board 205) need to be slightly adjusted, the influence of the feeding error or the cumulative assembly error of the Z-axis adjustment stage 121 on the adjustment can be effectively suppressed, and the adjustment accuracy can be improved. And thus, the welding accuracy is improved.

With continued reference to fig. 1, 2, in some embodiments, the welding apparatus may further include a switching portion 122, and the first holding portion 101 and the adjustment portion 104 on which the second holding portion 102 is mounted are respectively mounted on the switching portion 122. The switching portion 122 drives the first holding portion 101 and the second holding portion 102 to switch between a position corresponding to the detection portion 103 and a position corresponding to the welded portion 105. As described above, the laser 110 as the soldering component of the soldering portion 105 may be attached to one end of the first base 107 in the cantilever shape along the X-axis direction at intervals together with the CCD assembly 108 as the detection component of the detection portion 103. In this case, by providing the switching portion 122, the first holding portion 101 and the second holding portion 102 can be easily switched between the inspection position (i.e., the position corresponding to the inspection portion 103) and the welding position (i.e., the position corresponding to the welded portion 105).

Specifically, the switching part 122 may include a second X-axis adjustment stage 123 and a second Y-axis adjustment stage 124 mounted on the second X-axis adjustment stage 123, and the first holding part 101 and the adjustment part 104 are respectively mounted on the second Y-axis adjustment stage 124. The stroke of the second X-axis adjustment stage 123 is larger than the stroke of the first X-axis adjustment stage 117, and the stroke of the second Y-axis adjustment stage 124 is larger than the stroke ratio of the first Y-axis adjustment stage 118, so that the entire adjustment unit 104 can be directly mounted on the second Y-axis adjustment stage 124. The second base 111 is also directly mounted on the second Y-axis adjustment stage 124. That is, for example, the mounting board 125 may be provided on the second Y-axis adjustment stage 124, the first X-axis adjustment stage 117 of the adjustment unit 104 may be mounted on the mounting board 125, and the second base 111 may be mounted on the mounting board 125. Thus, the second base 111 on which the first holding portion 101 is mounted and the adjustment portion 104 on which the second holding portion 102 is mounted are mounted on the mounting board 125 as an integral component. At the detection position, the adjusting portion 104 adjusts the position of the second holding portion 102 with respect to the first holding portion 101 based on the detection result of the detecting portion 103 so that the object 202 to be welded and the object 201 to be welded are aligned. After the alignment is completed, the switching portion 122 switches the entire first holding portion 101 and the second holding portion 102 to the welding position while the first holding portion 101 and the second holding portion 102 maintain the aligned position, thereby enabling the object 202 to be welded and the object 201 to be welded, which are held at the aligned position, to be welded with high accuracy.

In some embodiments, in order to ensure that the object 202 to be welded and the object 201 to be welded still maintain sufficient positional accuracy after transfer, the second X-axis adjustment stage 123 and the second Y-axis adjustment stage 124 may also be driven by linear motors, respectively. For example, the second X-axis adjusting stage 123 and the second Y-axis adjusting stage 124 may select a slide table module driven by a linear motor. This can improve the switching accuracy of the switching unit 122 along the X axis and the Y axis. Specifically, the LED chip 203 is taken as the object 201 to be soldered, and the circuit board 205 is taken as the object 202 to be soldered. In some cases, the distance between the adjacent LED chip 203 groups arranged in an array is even as small as 180 micrometers, and further, the light spot 110a of the laser 110 is adjusted to be, for example, 50 micrometers or more and 100 micrometers or less, and here, in the present embodiment, by using a linear motor, it can be ensured that the welding object 201 and the object 202 to be welded, which are aligned with each other, can be accurately switched to the welding position at the time of switching, so that the welding object 201 and the object 202 to be welded are accurately located in the welding area of the laser 110, for example, the laser 105.

With continued reference to fig. 4, in some embodiments, in order to further improve the accuracy of welding, the welding apparatus of the present embodiment may further include a welding area control portion 126, the welding area control portion 126 being provided between the first holding portion 101 and the welded portion 105. The welding area control unit 126 controls the welding area by blocking the area that can be covered by the welding portion 105. Specifically, the LED chip 203 is taken as the object 201 to be soldered, and the circuit board 205 is taken as the object 202 to be soldered. As described above, since the distance between the adjacent LED chip 203 groups arranged in an array is even as small as 180 μm, in the case where the accuracy of the LED chip 203 at the bonding position is controlled as much as possible, and the diameter of the spot 110a of the laser 110 of the bonding portion 105 is controlled as much as possible, there is still a possibility that the spot 110a of the laser 110 burns to an adjacent LED chip 203 other than the LED chip 203 being soldered, and therefore, in the present embodiment, by providing the bonding area control section 126, depending on the specific area of the array of LED chips 203 to be bonded (for example, by bonding the array of LED chips 203 as a whole), and a bonding region through which laser light can pass corresponding to a specific region of the LED chip 203 to be bonded is previously set, and blocks the laser light outside the bonding region, and can prevent the spot 110a of the laser 110 from being irradiated on the other LED chip 203 adjacent to the LED chip 203 group being bonded. This can further improve the accuracy of welding.

The welding area control part 126 may include, for example, a base material 127, and the base material 127 has formed thereon: a pass-through region 128 and a barrier region 129. The transmission region 128 allows the spot 110a of the laser light emitted from the laser 110 to pass through the substrate 127. The barrier region 129 surrounds the transmissive region 128. The blocking region 129 blocks laser light emitted from the laser 110 from passing through the substrate 127. Specifically, the base 127 may be a plate, and the base 127 may be attached above the Z axis of the first vacuum suction plate 116. The substrate 127 may be selected from materials that allow laser light to pass through, such as sapphire materials, quartz glass materials, and the like. The material of the base material 127 may be selected to be different depending on the wavelength of the laser light. A coating may be formed on the substrate 127 as the barrier region 129 by, for example, coating, plating, or the like. The coating is selected, for example, to be useful for shielding laser light. Likewise, the coating may be made of different materials depending on the wavelength of the laser. The shape of the transmission region 128 defined by the blocked region 129 is not particularly limited, and may be determined appropriately according to the shape of the LED chip 203 group to be bonded, and may be, for example, rectangular or circular.

Although the above description has been made of an example in which the welding area control unit 126 is selected as the independent base material 127, the present invention is not limited to this. For example, it is also possible to directly select a material that allows laser light to pass through as the first vacuum suction plate 116, and form a coating or the like for the barrier region 129 on the first vacuum suction plate 116 by coating, plating, or the like.

Other embodiments

In the above description, although the example in which the first holding portion 101 is fixed with respect to the adjustment portion 104 and the second holding portion 102 is adjusted by the adjustment portion 104 has been described, the present invention is not limited to this. For example, the first holding portion 101 may be adjusted by fixing the second holding portion 102 to the base 106 and placing the first holding portion 101 on the adjusting portion 104 in response to this.

In the above description, although the example in which one of the holding portions is fixed and the other holding portion is adjusted has been described, the present invention is not limited to this. For example, the adjusting unit 104 may include a first X-axis adjusting stage 117 and a first Y-axis adjusting stage 118 that are independent of each other, and the first holding unit 101 may be adjusted by the first X-axis adjusting stage 117, and the second holding unit 102 may be adjusted by the first Y-axis adjusting stage 118. Alternatively, the second holding portion 102 is adjusted by the first X-axis adjustment stage 117 and the first Y-axis adjustment stage 118, the first holding portion 101 is adjusted by the angle adjustment stage 120, and the like.

In the above description, the first Y-axis adjustment stage 118 and the second Y-axis adjustment stage 124 are mounted on the first X-axis adjustment stage 117 and the second X-axis adjustment stage 123, respectively, for example, but the present invention is not limited thereto. The first X-axis adjustment stage 117 and the second X-axis adjustment stage 123 may be mounted on the first Y-axis adjustment stage 118 and the second Y-axis adjustment stage 124, respectively.

In the above description, the example in which each of the adjustment stages is driven by the linear motor has been described, but the present invention is not limited to this. The adjustment stages can also be driven, for example, by servo motors, stepper motors, etc., without the need for high precision.

In the above description, the position of welding object 201 and the position of welding object 202 are detected by detecting unit 103 as an example, but the present invention is not limited to this. When the accurate position of one of the object 201 and the object 202 to be welded is known in advance (for example, the position is detected in advance in another process or equipment), the detection unit 103 may detect only the position of the other of the object 201 and the object 202 to be welded.

In the above description, the laser 110 is used as the welding component of the welding part 105, but the invention is not limited to this. The welding portion 105 may be a welding component such as ultrasonic welding, for example, selected according to the welding object 201 and the object 202 to be welded.

In the above description, although the example in which the switching portion 122 drives the first holding portion 101 and the second holding portion 102 to switch between the welding portion 105 and the detection portion 103 has been described, it is not limited thereto. For example, the welding portion 105 and the detection portion 103 may be mounted on the switching portion 122, and the switching portion 122 may drive the welding portion 105 and the detection portion 103 to switch.

In the above description, the LED chip 203 is used as the object 201 to be soldered, and the circuit board 205 is used as the object 202 to be soldered. However, the soldering apparatus of the present embodiment may be used in various situations, for example, the object 201 to be soldered may be a conventional LED lamp bead, and the object 202 to be soldered may be a conventional circuit board, glass, or the like.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present implementation. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present embodiments have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the embodiments, the scope of which is defined by the claims and their equivalents.

Claims

1. Welding apparatus, characterized in that includes:

a first holding section (101) for holding a welding object (201);

a second holding section (102) which is provided below the first holding section (101) and holds an object to be welded (202), the object to be welded (201) and the object to be welded (202) being opposed to each other;

a detection unit (103) that detects the position of the welding object (201) and/or the position of the object to be welded (202);

an adjusting unit (104) that adjusts the first holding unit (101) and/or the second holding unit (102) so that the object to be welded (201) and the object to be welded (202) are aligned, based on the detection result of the detecting unit (103);

and a welding portion (105) that is provided above the first holding portion (101) and that welds the object to be welded (201) to the object to be welded (202).

2. The welding apparatus according to claim 1, wherein the first holding portion (101) is fixed with respect to the adjustment portion (104), the second holding portion (102) is placed on the adjustment portion (104), and the adjustment portion (104) adjusts the second holding portion (102) so that the welding object (201) and the welding object (202) are aligned.

3. The welding apparatus according to claim 2, wherein the adjustment portion (104) comprises a first X-axis adjustment platform (117) and a first Y-axis adjustment platform (118) mounted on the first X-axis adjustment platform (117), the second holding portion (102) being mounted on the first Y-axis adjustment platform (118).

4. The welding apparatus according to claim 3, wherein the adjustment portion (104) further comprises an angle adjustment platform (120), the angle adjustment platform (120) being piggybacked on the first Y-axis adjustment platform (118), the second holding portion (102) being piggybacked on the angle adjustment platform (120).

5. The welding apparatus according to claim 4, wherein the adjustment portion (104) further comprises a Z-axis adjustment platform (121), the Z-axis adjustment platform (121) being piggybacked on the angle adjustment platform (120), the second holding portion (102) being piggybacked on the Z-axis adjustment platform (121).

6. Welding apparatus according to claim 5, wherein the first X-axis adjustment stage (117), the first Y-axis adjustment stage (118) and the Z-axis adjustment stage (121) are each driven by a linear motor.

7. The welding apparatus according to any one of claims 2 to 6, wherein the detection portion (103) is disposed above the first holding portion (101) and is disposed at a distance from the welded portion (105);

the welding apparatus further includes a switching portion (122), and the first holding portion (101) and the adjustment portion (104) on which the second holding portion (102) is placed are placed on the switching portion (122), respectively;

the switching unit (122) drives the first holding unit (101) and the second holding unit (102) to switch between a position corresponding to the detection unit (103) and a position corresponding to the welding unit (105).

8. The welding apparatus according to claim 7, wherein the switching portion (122) includes a second X-axis adjustment stage (123) and a second Y-axis adjustment stage (124) mounted on the second X-axis adjustment stage (123), and the first holding portion (101) and the adjustment portion (104) are respectively mounted on the second Y-axis adjustment stage (124).

9. Welding apparatus according to claim 8, characterized in that the second X-axis adjustment stage (123) and the second Y-axis adjustment stage (124) are each driven by a linear motor.

10. The welding apparatus according to any one of claims 1 to 6, further comprising a welding area control portion (126), the welding area control portion (126) being provided between the welding object (201) and the welded portion (105).

11. The welding apparatus according to claim 10, wherein the weld (105) comprises a laser (110);

the welding area control part (126) comprises a base material (127), and the base material (127) is provided with:

a transmissive region (128), the transmissive region (128) allowing laser light emitted from the laser (110) to pass therethrough;

a blocking region (129), the blocking region (129) surrounding the transmissive region (128), the blocking region (129) blocking laser light emitted from the laser (110) from passing through the substrate (127).

12. Soldering apparatus for soldering an LED chip (203) to a circuit board (205), comprising:

a first holding section (101) that holds a carrier sheet (204) on which the LED chip (203) is placed so that the LED chip (203) faces downward;

a second holding portion (102) that is provided below the first holding portion (101) and holds a circuit board (205) so that the circuit board (205) and the LED chip (203) are opposed to each other;

a detection part (103) which detects the position of the LED chip (203) on the carrier board (204) and/or the position of a pad (206) for mounting the LED chip (203) in the circuit board (205);

an adjusting section (104) that adjusts the first holding section (101) and/or the second holding section (102) so as to align the positions of the LED chip (203) and the pad (206) based on the detection result of the detecting section (103);

and a soldering portion (105) which is provided above the first holding portion (101) and which solders the LED chip (203) to a position of the pad (206).