CN114439828A - Automatic die bonding coupling machine and coupling method - Google Patents
Automatic die bonding coupling machine and coupling method Download PDFInfo
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- CN114439828A CN114439828A CN202111591915.0A CN202111591915A CN114439828A CN 114439828 A CN114439828 A CN 114439828A CN 202111591915 A CN202111591915 A CN 202111591915A CN 114439828 A CN114439828 A CN 114439828A
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- 230000008878 coupling Effects 0.000 title claims abstract description 85
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 85
- 230000003287 optical effect Effects 0.000 claims abstract description 84
- 238000007599 discharging Methods 0.000 claims abstract description 44
- 230000005540 biological transmission Effects 0.000 claims description 63
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 6
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- 239000000126 substance Substances 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 20
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- 239000011265 semifinished product Substances 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000003848 UV Light-Curing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention provides an automatic die bonding coupling machine table and a coupling method, which are used for coupling a photoelectric module, wherein the photoelectric module comprises an optical device and a PCB (printed Circuit Board), the automatic die bonding coupling machine table comprises a CCD (charge coupled device) positioning coupling device, a feeding table, a vacuum suction nozzle device, a PCB operating table, a cartridge clip feeding and discharging device and a fixed platform, the cartridge clip feeding and discharging device is arranged on one side of the fixed platform, and the CCD positioning coupling device, the feeding table, the vacuum suction nozzle device and the PCB operating table are arranged on the fixed platform; the PCB operating platform is arranged on one side, close to the cartridge clip loading and unloading device, of the fixing platform and is used for fixing a PCB; the feeding platform is arranged on one side of the fixed platform, which is far away from the cartridge clip feeding and discharging device, and is used for placing optical devices; the CCD positioning coupling device is used for capturing images and focusing and positioning the optical devices and the PCB; the vacuum suction nozzle device is used for sucking the optical device. The problems that a light path coupling system is low in working efficiency, needs a large amount of manual operation and is difficult to achieve large-batch automatic production requirements are solved.
Description
Technical Field
The invention relates to the field of photoelectric module processing, in particular to an automatic die bonding coupling machine and a coupling method.
Background
The optical path coupling system is a transmission system which transmits an optical signal emitted by a laser to an optical fiber through an optical device, transmits the optical signal to a receiving end through the optical fiber, and converts the optical signal to a photoelectric detector through the optical device, so that the optical signal is transmitted in the optical fiber, and the purposes of improving the transmission rate, capacity and transmission distance are achieved. Therefore, in the production process of the photoelectric module, the precision and speed requirements of the optical path coupling between the laser/detector and the lens are very important for the yield and the productivity of the product.
The optical path coupling system in the related art has low working efficiency, needs a large amount of manual operation and is difficult to realize the requirement of large-batch automatic production.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is as follows: the optical path coupling system in the related art has low working efficiency, needs a large amount of manual operation and is difficult to realize the requirement of large-batch automatic production.
In order to solve the technical problem, the embodiment of the invention adopts the following technical scheme:
the embodiment of the invention provides an automatic die bonding coupling machine table which is used for coupling a photoelectric module, wherein the photoelectric module comprises an optical device and a PCB (printed circuit board), the automatic die bonding coupling machine table comprises a CCD (charge coupled device) positioning coupling device, a feeding table, a vacuum suction nozzle device, a PCB operating table, a cartridge clip feeding and discharging device and a fixed platform, the cartridge clip feeding and discharging device is arranged on one side of the fixed platform, and the CCD positioning coupling device, the feeding table, the vacuum suction nozzle device and the PCB operating table are arranged on the fixed platform; wherein the content of the first and second substances,
the PCB operating platform is arranged on one side, close to the cartridge clip loading and unloading device, of the fixed platform and is used for fixing the PCB;
the feeding table is arranged on one side, away from the cartridge clip feeding and discharging device, of the fixed platform and is used for placing the optical device;
the CCD positioning coupling device is used for image capture and focusing positioning;
the vacuum suction nozzle device is used for sucking the optical device and the PCB.
Further, CCD location coupling device includes first CCD, second CCD, third CCD and fourth CCD, first CCD set up in the material loading platform is kept away from one side of fixed platform, the second CCD set up in the PCB operation panel with between the material loading platform, the third CCD set up in the PCB operation panel is kept away from one side of fixed platform, the fourth CCD set up in PCB operation panel one side, just the extending direction of fourth CCD with the extending direction of third CCD sets up perpendicularly.
Further, the PCB board is provided with the locating hole, unloader on the cartridge clip includes cartridge clip, year dish, cartridge clip upper and lower layer changing structure, eave tile and drive group, the cartridge clip set up in one side of fixed platform, cartridge clip upper and lower layer changing structure with the cartridge clip is connected, just cartridge clip upper and lower layer changing structure one end suspension in on the PCB operation panel, the eave tile with cartridge clip upper and lower layer changing structure is close to the one end of PCB operation panel is connected, just the eave tile with locating hole looks adaptation, drive group with cartridge clip upper and lower layer changing structure electricity is connected, year dish set up in the cartridge clip, just the PCB board install in carry the dish.
Furthermore, the PCB operation table comprises an operation table, a fixing jig, a driving piece and an operation table transmission structure, the operation table is arranged on the operation table transmission structure, the fixing jig and the driving piece are arranged on one side of the operation table, the fixing jig is electrically connected with the driving piece, the operation table transmission structure is arranged on the fixing platform, the fixing jig is used for fixing the carrying disc, and the operation table transmission structure is used for driving the operation table to move in the X-axis direction and the Y-axis direction.
Further, the automatic die bonder coupling machine platform further comprises a dispensing device, wherein the dispensing device comprises a dispensing head, a dispensing transmission structure and a dispensing control member, one end of the dispensing transmission structure is movably connected with the fixed platform, the other end of the dispensing transmission structure is connected with the dispensing head, the dispensing control member is electrically connected with the dispensing head, and the dispensing transmission structure is used for driving the dispensing head to move.
Further, the automatic solid brilliant coupling board still includes UV irradiation device, UV irradiation device includes two UV irradiation lamps, UV fixed knot constructs and UV irradiation control, UV irradiation control install in fixed platform, UV fixed knot constructs one end swing joint in fixed platform, two UV irradiation lamps connect respectively in the other end of UV fixed knot constructs, and two the contained angle between the UV irradiation lamp irradiation direction is 45, UV irradiation lamp with UV irradiation control electricity is connected.
Further, the feeding platform comprises a limiting groove, a discharging platform and a discharging transmission structure, wherein the limiting groove is formed in the discharging platform, the discharging platform is arranged on the discharging transmission structure, the discharging transmission structure is arranged on the fixed platform, and the discharging transmission structure is used for driving the discharging platform to move in the X-axis direction and the Y-axis direction.
Further, the automatic solid crystal coupling machine table further comprises a display screen, and the display screen is arranged on the fixed platform.
Further, the automatic die bonding coupling machine table further comprises a transmission device, the transmission device is fixed on the fixed platform and connected with the vacuum suction nozzle device and the first CCD and the third CCD, and the transmission device is used for driving the vacuum suction nozzle device, the first CCD and the third CCD to move respectively.
The coupling method is also provided, the automatic die bonding coupling machine is adopted, and the specific steps are as follows:
presetting the multiplying power and focusing zooming of the CCD positioning coupling device;
placing the optical device in a feeding table, and installing the PCB on a cartridge clip feeding and discharging device;
the PCB is transported to a PCB operation table, the CCD positioning coupling device carries out image capture and focusing positioning on the optical device and the PCB, and a dispensing position is determined;
the vacuum suction nozzle device sucks the optical device, and moves the optical device to the dispensing position to be coupled with the PCB;
after the PCB finishes the surface mounting coupling process, the PCB which finishes the coupling process is transported to a placing area, the inside of the cartridge clip loading and unloading device is subjected to layer changing, and another PCB to be processed is transported to the PCB operation table to realize loading and material changing;
and after the PCB in the cartridge clip loading and unloading device is subjected to patch coupling, replacing the materials in the cartridge clip loading and unloading device again, and repeating the steps.
The embodiment of the invention has the beneficial effects that: the embodiment of the invention provides an automatic die bonding coupling machine table which is used for coupling a photoelectric module, wherein the photoelectric module comprises an optical device and a PCB (printed circuit board), the automatic die bonding coupling machine table comprises a CCD (charge coupled device) positioning coupling device, a feeding table, a vacuum suction nozzle device, a PCB operating table, a cartridge clip feeding and discharging device and a fixed platform, the cartridge clip feeding and discharging device is arranged on one side of the fixed platform, and the CCD positioning coupling device, the feeding table, the vacuum suction nozzle device and the PCB operating table are arranged on the fixed platform; the PCB operating platform is arranged on one side, close to the cartridge clip loading and unloading device, of the fixing platform and used for fixing the PCB; the feeding table is arranged on one side, away from the cartridge clip feeding and discharging device, of the fixed platform and is used for placing the optical device; the CCD positioning coupling device is used for capturing images and focusing and positioning the optical device and the PCB; the vacuum suction nozzle device is used for sucking the optical device. Placing the optical device on a feeding table, and installing a PCB board with a cartridge clip feeding and discharging device; the PCB to be processed is placed by the PCB operation table, the CCD positioning and coupling device is controlled to capture images of the optical device and the PCB and position the images in a focusing mode, the vacuum suction nozzle is used for absorbing the optical device to be coupled with the PCB, and after all products on the PCB are subjected to surface mounting coupling, the PCB is installed again by the cartridge clip loading and unloading device. The image capturing mode of the CCD positioning coupling device and the mode of replacing the feeding and discharging device of the cartridge clip are utilized, so that the production automation degree is improved, and the mass production can be realized; the problems that a light path coupling system in the related art is low in working efficiency, needs a large amount of manual operation and is difficult to meet the requirement of large-batch automatic production are solved.
Drawings
The detailed structure of the embodiment of the invention is described in detail below with reference to the accompanying drawings
Fig. 1 is a schematic structural diagram of an automated die attach coupling machine according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a magazine loader/unloader according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a PCB operating console according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a feeding table according to an embodiment of the present invention;
fig. 5 is a schematic partial structural view of a dispensing device according to an embodiment of the present invention;
fig. 6 is a schematic partial structural view of a UV irradiation apparatus according to an embodiment of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
Referring to fig. 1 to 4, an embodiment of the invention provides an automatic die bonding coupling machine for coupling a photoelectric module, where the photoelectric module includes an optical device and a PCB, the automatic die bonding coupling machine includes a CCD positioning coupling device 1, a feeding table 2, a vacuum suction nozzle device 3, a PCB operation table 4, a cartridge clip loading and unloading device 5 and a fixed platform 6, the cartridge clip loading and unloading device 5 is disposed on one side of the fixed platform 6, and the CCD positioning coupling device 1, the feeding table 2, the vacuum suction nozzle device 3 and the PCB operation table 4 are disposed on the fixed platform 6; the PCB operating platform 4 is arranged on one side, close to the cartridge clip loading and unloading device 5, of the fixing platform 6 and is used for fixing a PCB; the feeding table 2 is arranged on one side of the fixed platform 6, which is far away from the cartridge clip loading and unloading device 5, and is used for placing optical devices; the CCD positioning coupling device 1 is used for capturing images and focusing and positioning the optical devices and the PCB; the vacuum nozzle device 3 is used for sucking the optical device.
In this embodiment, the vacuum suction nozzle device 3 is used for sucking an optical device, and can rotate to finely adjust the position of the optical device so as to attach a chip; placing the optical device on a feeding table 2, and installing a PCB board with a cartridge clip feeding and discharging device 5; utilize PCB operation panel 4 to place and wait to process the PCB board, control CCD location coupling device 1 and carry out image capture and the location of focusing to optical device and PCB board to utilize vacuum suction nozzle device 3 to adsorb optical device and PCB board and carry out the coupling, after all products all accomplished paster coupling process on the PCB board, PCB board was installed again to feed discharging device 5 in the cartridge clip. The image capturing mode of the CCD positioning coupling device 1 and the mode of replacing the feeding and discharging of the cartridge clip feeding and discharging device 5 are utilized, so that the production automation degree is improved, and the mass production can be realized; the problems that a light path coupling system in the related art is low in working efficiency, needs a large amount of manual operation and is difficult to meet the requirement of large-batch automatic production are solved.
Further, CCD positioning and coupling device 1 includes first CCD11, second CCD12, third CCD13 and fourth CCD14, first CCD11 sets up in the one side that fixed platform 6 was kept away from to material loading platform 2, second CCD12 sets up between PCB operation panel 4 and material loading platform 2, third CCD13 sets up in the one side that fixed platform 6 was kept away from to PCB operation panel 4, fourth CCD14 sets up in PCB operation panel 4 one side, and the extending direction of fourth CCD14 sets up perpendicularly with the extending direction of third CCD 13.
In this embodiment, the CCD positioning and coupling device 1 includes: the first CCD11 located above the feeding table 2 can shoot and confirm the front position of the optical device, and is used for confirming the direction of taking materials and whether the feeding of the optical device is correct, and if the feeding is abnormal, the machine table can give an abnormal warning; a second CCD12 for shooting the back of the optical device, which can rotate the fine tuning vacuum suction nozzle device 3 to adjust the position of the optical device; the third CCD13 is positioned above the PCB operation table 4 and used for shooting the position of VSCEL on the PCB and determining the position of the adhesive dispensing chip; the fourth CCD14 is vertically positioned on the side surface of the PCB and is used for shooting whether the VSCEL and Lens in the optical device are concentric circles, the distance between the edges of the VSCEL and the optical device is about 5 mu m, and an error range can be set; the embodiment has the advantages that the production automation degree is improved by the four CCD image capturing modes, the mass production is realized, the process precision of alignment, surface mounting, adhesive dispensing and curing is higher, the product control is improved, and the coupling test cost is reduced.
Further, please refer to fig. 2, the PCB is provided with a positioning hole, the magazine loader/unloader 5 includes a magazine 51, a loading tray, a magazine vertical layer-changing structure 52, a hook 53 and a driving set 54, the magazine 51 is disposed on one side of the fixing platform 6, the magazine vertical layer-changing structure 52 is connected to the magazine 51, one end of the magazine vertical layer-changing structure 52 is suspended on the PCB operating platform 4, the hook 53 is connected to one end of the magazine vertical layer-changing structure 52 close to the PCB operating platform 4, the hook 53 is matched with the positioning hole, the driving set 54 is electrically connected to the magazine vertical layer-changing structure 52, the loading tray is disposed on the magazine 51, and the PCB is mounted on the loading tray.
In this embodiment, when loading is started, after the driving group 54 drives the hook pins 53 on the cartridge clip up-down layer changing structure 52 to move to positions right above the positioning holes of the PCB boards in the cartridge clip 51, the driving group 54 drives the cartridge clip up-down layer changing structure 52 to move downward to hook the carrier disc (the carrier disc contains incoming PCB materials), the cartridge clip up-down layer changing structure 52 moves along the carrier disc track to pull out the cartridge clip 51, and transports the carrier disc with the PCB boards to a given position (namely, a predetermined position on the PCB operation table 4), the hook pins 53 on the cartridge clip up-down layer changing structure 52 move upward to release the carrier disc, and at this time, the cartridge clip 51 moves downward to realize layer changing; therefore, after the PCB is processed, the steps can be repeated to realize batch production.
It should be noted that the cartridge clip 51 is provided with placing positions at intervals for placing a carrying disc (i.e. a PCB to be processed), and the cartridge clip 51 can be automatically replaced by an electric motor or manually replaced by a human; furthermore, the cartridge clip vertical layer changing structure 52 may be composed of a fixing block 521 and a connecting rod 522, the driving group 54 may be a motor (or a power device such as an air cylinder or an electric motor for driving), the fixing block 521 is fixed on one side of the cartridge clip 51, one end of the connecting rod 522 is connected with the fixing block 521, the other end of the connecting rod 522 is connected with the hook 53, the end of the connecting rod 522 connected with the fixing block 521 driven by the motor extends out of or retracts into the fixing block 521, of course, the end of the connecting rod 522 connected with the fixing block 521 may be a telescopic rod structure or is slidably connected to the fixing block 521; the end of the connecting rod 522 connected to the hook needle 53 can also be driven by the motor to extend or contract to control the hook needle 53 to move up or down, and similarly, the end of the connecting rod 522 connected to the fixed block 521 can be a telescopic rod structure or can be slidably connected to the end of the connecting rod 522 connected to the fixed block 521; moreover, two motors can be adopted for driving respectively and can be arranged as required; the feeding and discharging are replaced by the modes of pushing and pulling the hook needles 53 and changing the layers of the cartridge clips 51, the production efficiency is greatly improved, and the automatic integration of production is realized.
Further, referring to fig. 1 and fig. 3, the PCB operating platform 4 includes an operating platform 41, a fixing fixture 42, a driving member 43 and an operating platform transmission structure 44, the operating platform 41 is disposed on the operating platform transmission structure 44, the fixing fixture 42 and the driving member 43 are disposed on one side of the operating platform 41, the fixing fixture 42 is electrically connected to the driving member 43, the operating platform transmission structure 44 is disposed on the fixing platform 6, the fixing fixture 42 is used for fixing the carrying tray, and the operating platform transmission structure 44 is used for driving the operating platform 41 to move in the X-axis and Y-axis directions.
In this embodiment, after the hook pins 53 on the clip layer changing structure 52 move upward to release the tray, the fixing fixture 42 on the side of the console 41 is driven by the driving member 43 to move downward to fix the PCB, so as to maintain the stability of the PCB, and then the console 41 drives the tray to return to the initial position corresponding to the fourth CCD 14; of course, after the processing is completed, the fixing jig 42 is driven by the driving member 43 to move upward to release the PCB, thereby facilitating the replacement of the PCB.
It should be noted that the console 41 is driven by the console transmission structure 44 to move in the X-axis and Y-axis directions, the console transmission structure 44 includes a first X-axis slide rail 441 and a first Y-axis slide rail 442 that are vertically arranged and sequentially stacked, the first X-axis slide rail 441 is arranged above the first Y-axis slide rail 442, a sliding table 45 is arranged between the console 41 and the first X-axis slide rail 441, and of course, the console 41 may also be directly connected to the first X-axis slide rail 441; the first X-axis slide rail 441 and the first Y-axis slide rail 442 are respectively driven by a motor (or a power device for driving, such as an air cylinder, a motor, etc.), so as to increase the moving range of the console 41, wherein the directions of the X-axis and the Y-axis are shown in the coordinate system shown in fig. 1, and further, in other scenes, the directions of the X-axis and the Y-axis may be set as required, which is only an explanation for a certain scene of the moving direction of the console; meanwhile, the fixing jig 42 is a single-side claw structure, and a plurality of fixing jigs 42 are arranged in sequence along the side of the console 41 to fix the PCB by using the claw shape. This embodiment is through unilateral claw fixed PCB board, improves the stability of operation production, reduces because of the risk that PCB shifts and leads to the coupling failure.
Further, referring to fig. 1 and 5, the automatic die bonder coupling machine further includes a dispensing device 7, the dispensing device 7 includes a dispensing head 71, a dispensing transmission structure and a dispensing control member 72, one end of the dispensing transmission structure is movably connected to the fixing platform 6, the other end of the dispensing transmission structure is connected to the dispensing head 71, the dispensing control member 72 is electrically connected to the dispensing head 71, and the dispensing transmission structure is used for driving the dispensing head 71 to move.
In this embodiment, the dispensing head 71 cooperates with the dispensing control member 72 and the dispensing transmission structure to dispense glue at the precise dispensing position of the optical device, thereby completing dispensing; the dispensing speed and the dispensing amount of the dispensing head 71 are controlled by the dispensing control part 72, and the dispensing transmission structure realizes the dispensing position movement of the dispensing head 71. Wherein, one side of the fixed platform 6 can be provided with a supporting plate for fixing the dispensing transmission structure, the dispensing transmission structure can also be directly fixed on the fixed platform 6, and can be arranged as required, and the dispensing transmission structure and the dispensing head 71 can be connected through a fixing rod 73 or can be directly connected; of course, the dispensing head 71 may dispense UV glue or other glue.
Further, referring to fig. 1 and 6, the automatic die bonding and coupling machine further includes a UV irradiation device 8, the UV irradiation device 8 includes two UV irradiation lamps 81, a UV fixing structure 82 and a UV irradiation control member 83, the UV irradiation control member 83 is installed on the fixing platform 6, one end of the UV fixing structure 82 is movably connected to the fixing platform 6, the two UV irradiation lamps 81 are respectively connected to the other end of the UV fixing structure 82, an included angle between irradiation directions of the two UV irradiation lamps 81 is 45 °, and the UV irradiation lamps 81 are electrically connected to the UV irradiation control member 83.
In this embodiment, two UV radiation lamps 81 are fixed and radiated on the dispensing positions of the PCB at an angle of 45 ° through a UV fixing structure 82, and a UV radiation control member 83 sets and controls the time and intensity of UV light radiation according to the material characteristics of the glue; wherein, one side of the fixed platform 6 can be provided with a supporting plate for fixing the UV fixing structure 82, and certainly, the UV fixing structure 82 can also be directly fixed on the fixed platform 6 and can be arranged as required; two direct 45 UV light irradiation's mode behind the paster are adopted in this embodiment to improve the UV curing effect.
Further, referring to fig. 1 and 4, the feeding platform 2 includes a limiting groove 21, a material placing platform 22 and a material placing transmission structure 23, the limiting groove 21 is disposed on the material placing platform 22, the material placing platform 22 is disposed on the material placing transmission structure 23, the material placing transmission structure 23 is disposed on the fixing platform 6, and the material placing transmission structure 23 is used for driving the material placing platform 22 to move in the X-axis and Y-axis directions.
In this embodiment, the limiting groove 21 of the feeding table 2 is a 10 × 10 limiting sheet structure, and the optical device is placed in the limiting groove 21, and is positioned by using the structure of the limiting sheet, so that the optical device is convenient to place; of course, the number of the particles may be 5 × 5 or 20 × 20, etc., as necessary, and is not limited herein; it should be noted that the discharging table is driven by the discharging transmission structure 23 to move towards the X-axis and Y-axis directions, the discharging transmission structure 23 includes a second X-axis slide rail 231 and a second Y-axis slide rail 232 which are vertically arranged and sequentially stacked, the second X-axis slide rail 231 is arranged above the second Y-axis slide rail 232, a slide plate is arranged between the discharging table and the second X-axis slide rail 231, and of course, the discharging table can also be directly connected with the second X-axis slide rail 231; the second X-axis slide rail 231 and the second Y-axis slide rail 232 are respectively driven by motors (or power devices for driving such as air cylinders and motors), so as to increase the moving range of the material placing table, wherein the directions of the X-axis and the Y-axis are shown in the coordinate system shown in fig. 1, and further, in other scenes, the directions of the X-axis and the Y-axis may be set as required, which is only an explanation for a certain scene of the moving direction of the operation table.
Further, referring to fig. 1, the automatic die bonder coupling machine further includes a display screen 9, and the display screen 9 is disposed on the fixing platform 6.
In this embodiment, the display screen 9 may be provided with a first CCD11, a second CCD12, a third CCD13 and a fourth CCD14, which automatically rotate to capture and focus the image, and display the shooting angle in real time; of course, it is also possible to display the operation interfaces such as dispensing, pasting the optical device, UV irradiation, changing the layers of the upper and lower clips 51, or to set the clips 51 for manual layer changing and to control the initial operations such as dispensing amount, UV irradiation time, auto-focusing and manual focusing of the CCD positioning and coupling device 1.
Further, referring to fig. 1, the automatic die bonder coupling machine further includes a transmission device 10, the transmission device 10 is fixed on the fixed platform 6, the transmission device 10 is connected to the vacuum nozzle device 3, the first CCD11 and the third CCD13, and the transmission device 10 is used for driving the vacuum nozzle device 3, the first CCD11 and the third CCD13 to move respectively.
In this embodiment, the driving device 10 is used to drive the vacuum suction nozzle device 3, the first CCD11 and the third CCD13, so as to facilitate real-time adjustment according to different positions of the PCB or the optical device.
Of course, it should be added that the vacuum nozzle device 3 may also include a vacuum nozzle and a vacuum driving member, the vacuum nozzle is electrically connected to the vacuum driving member, and the vacuum driving member is used to drive the vacuum nozzle to suck the optical device, so as to avoid damaging the optical device.
The coupling method is also provided, the automatic die bonding coupling machine is adopted, and the specific steps are as follows:
s110, pre-adjusting the multiplying power and focusing zooming of the CCD positioning coupling device 1;
s120, placing the optical device in the feeding table 2, and installing the PCB on the cartridge clip feeding and discharging device 5;
s130, conveying the PCB to the PCB operating table 4, and carrying out image capture and focusing positioning on the optical device and the PCB by the CCD positioning coupling device 1 to determine a dispensing position;
s140, the vacuum suction nozzle device 3 sucks the optical device, and moves the optical device to a dispensing position to be coupled with the PCB;
s150, after the PCB finishes the surface mounting coupling process, the PCB which finishes the coupling process is transported to a placing area, the inside of the cartridge clip loading and unloading device 5 is subjected to layer changing, and another PCB to be processed is transported to a PCB operation table 4 to realize loading and material changing;
and S160, after the PCB in the cartridge clip loading and unloading device 5 is subjected to surface mounting coupling, replacing the materials in the cartridge clip loading and unloading device 5 again, and repeating the steps.
Specifically, in the operating state: selecting a certain optical device to be attached to a specific semi-finished product with a connector on a PCB (the semi-finished product refers to a product obtained by attaching an electric chip and an optical chip VCSEL/PD to a PCB with a plurality of connectors on an incoming material), and attaching the optical device with Lens and the semi-finished product corresponding to the single connector on the PCB; in the non-working state: the upper optical device that is in under treating operating condition in the spacing groove 21 of material loading platform 2, after the material loading:
step 1, performing initial setting on an interface of a display screen 9, and performing initial automatic focusing and positioning on a first CCD11, a second CCD12, a third CCD13 and a fourth CCD14, wherein the position of a second CCD12 and the position of a fourth CCD14 are fixed.
Step 3, after the first CCD11 focuses automatically, selecting an optical device with Lens in a working state, and positioning;
step 7, the transmission device 10 drives the vacuum suction nozzle device 3 to move to the optical device point position located by the second CCD12 through the back image of the optical device and the fourth CCD14, and the vacuum suction nozzle device 3 rotates to finely adjust the position of the optical device;
9, after the optical device is placed, automatically focusing the fourth CCD14, automatically identifying the optical device dispensing position with good coupling quality by accurately confirming the dispensing position of the optical device and accurately coupling and positioning in order to enable the circular edge of Lens inside the optical device and the circular edge emitted by VCSEL laser to be concentric circles;
and 14, repeating the steps 3-13 until the semi-finished products on the carrier disc are installed, moving the operating platform 41 to the side face of the fixed height of the cartridge clip 51, moving the hook pins 53 on the cartridge clip up-down layer changing structure 52 to be right above the holes of the PCB in the carrier disc, moving the cartridge clip down to hook the carrier, and moving the cartridge clip up-down layer changing structure 52 along the carrier disc track of the operating platform 41 to push out the carrier disc with the PCB to the given position of the cartridge clip 51.
And step 15, the cartridge clip 51 moves downwards to realize layer changing, the carrier disc with the PCB board is pulled out along the carrier disc track of the operation table 41 through the hook pins 53, and the steps 3-13 are repeated until the carrier disc in the cartridge clip 51 is completely coupled and pasted, and then the cartridge clip 51 is changed.
It should be noted that the device and the PCB can be polished manually, and the tray can be turned over to replace the manual polishing device, so that the efficiency is improved.
In summary, the automatic die bonding coupling machine and the coupling method provided by the invention have the advantages that the production automation degree is improved, the mass production is realized, the process precision of alignment, chip mounting, dispensing and curing is higher, the product control is improved, and the coupling test cost is reduced by means of four CCD image capturing modes; the PCB is fixed through the single-side claw, stability of operation and production is improved, and the risk of coupling failure caused by displacement of the PCB is reduced. In addition, the feeding and discharging are replaced by the modes of hook needle pushing and pulling and cartridge clip layer changing, so that the production efficiency is greatly improved, and the automatic integration of production is realized. Meanwhile, the UV curing effect is improved by a mode of directly irradiating two 45-degree UV lights after surface mounting.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are. Here, the upper, lower, left, right, front, and rear represent only relative positions thereof and do not represent absolute positions thereof.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The utility model provides an automatic change solid brilliant coupling board for the coupling of photovoltaic module, the photovoltaic module includes optical device and PCB board, its characterized in that: the automatic die bonding coupling machine table comprises a CCD positioning coupling device, a feeding table, a vacuum suction nozzle device, a PCB operation table, a cartridge clip feeding and discharging device and a fixed platform, wherein the cartridge clip feeding and discharging device is arranged on one side of the fixed platform, and the CCD positioning coupling device, the feeding table, the vacuum suction nozzle device and the PCB operation table are arranged on the fixed platform; wherein the content of the first and second substances,
the PCB operating platform is arranged on one side, close to the cartridge clip loading and unloading device, of the fixed platform and is used for fixing the PCB;
the feeding table is arranged on one side, away from the cartridge clip feeding and discharging device, of the fixed platform and is used for placing the optical device;
the CCD positioning coupling device is used for capturing images and focusing and positioning the optical device and the PCB;
the vacuum suction nozzle device is used for sucking the optical device.
2. The automated die bonding machine of claim 1, wherein: CCD location coupling device includes first CCD, second CCD, third CCD and fourth CCD, first CCD set up in the material loading platform is kept away from one side of fixed platform, the second CCD set up in PCB operation panel with between the material loading platform, the third CCD set up in the PCB operation panel is kept away from one side of fixed platform, the fourth CCD set up in PCB operation panel one side, just the extending direction of fourth CCD with the extending direction of third CCD sets up perpendicularly.
3. The automated die bonding machine of claim 1, wherein: the PCB board is provided with the locating hole, unloader includes cartridge clip, year dish, cartridge clip upper and lower layer changing structure, crochet hook and drive group on the cartridge clip, the cartridge clip set up in one side of fixed platform, cartridge clip upper and lower layer changing structure with the cartridge clip is connected, just cartridge clip upper and lower layer changing structure one end suspension in on the PCB operation panel, the crochet hook with cartridge clip upper and lower layer changing structure is close to the one end of PCB operation panel is connected, just the crochet hook with locating hole looks adaptation, the drive group with cartridge clip upper and lower layer changing structure electricity is connected, year dish set up in the cartridge clip, just the PCB board install in carry the dish.
4. The automated die bonding machine of claim 3, wherein: the PCB operation table comprises an operation table, a fixing jig, a driving piece and an operation table transmission structure, the operation table is arranged on the operation table transmission structure, the fixing jig and the driving piece are arranged on one side of the operation table, the fixing jig is electrically connected with the driving piece, the operation table transmission structure is arranged on the fixing platform, the fixing jig is used for fixing the carrying disc, and the operation table transmission structure is used for driving the operation table to move in the X-axis direction and the Y-axis direction.
5. The automated die bonding machine of claim 1, wherein: the automatic die bonding coupling machine table further comprises a dispensing device, wherein the dispensing device comprises a dispensing head, a dispensing transmission structure and a dispensing control piece, one end of the dispensing transmission structure is movably connected with the fixed platform, the other end of the dispensing transmission structure is connected with the dispensing head, the dispensing control piece is electrically connected with the dispensing head, and the dispensing transmission structure is used for driving the dispensing head to move.
6. The automated die bonding machine of claim 1, wherein: the automatic solid crystal coupling machine table further comprises a UV irradiation device, wherein the UV irradiation device comprises two UV irradiation lamps, a UV fixing structure and a UV irradiation control piece, the UV irradiation control piece is installed on the fixing platform, one end of the UV fixing structure is movably connected to the fixing platform, the two UV irradiation lamps are respectively connected to the other end of the UV fixing structure, the included angle between the irradiation directions of the UV irradiation lamps is 45 degrees, and the UV irradiation lamps are electrically connected with the UV irradiation control piece.
7. The automated die bonding machine of claim 1, wherein: the feeding platform comprises a limiting groove, a discharging platform and a discharging transmission structure, wherein the limiting groove is formed in the discharging platform, the discharging platform is arranged on the discharging transmission structure, the discharging transmission structure is arranged on the fixed platform, and the discharging transmission structure is used for driving the discharging platform to move in the X-axis direction and the Y-axis direction.
8. The automated die bonding machine of claim 1, wherein: the automatic solid crystal coupling machine table further comprises a display screen, and the display screen is arranged on the fixed platform.
9. The automated die bonding machine of claim 2, wherein: the automatic solid crystal coupling machine table further comprises a transmission device, the transmission device is fixed on the fixed platform and connected with the vacuum suction nozzle device, the first CCD and the third CCD, and the transmission device is used for driving the vacuum suction nozzle device, the first CCD and the third CCD to move respectively.
10. A coupling method using the automatic die bonding coupling machine as claimed in any one of claims 1 to 9, wherein: the method comprises the following specific steps:
presetting the multiplying power and focusing zooming of the CCD positioning coupling device;
placing the optical device in a feeding table, and installing the PCB on a cartridge clip feeding and discharging device;
the PCB is transported to a PCB operation table, the CCD positioning coupling device carries out image capture and focusing positioning on the optical device and the PCB, and a dispensing position is determined;
the vacuum suction nozzle device sucks the optical device, and moves the optical device to the dispensing position to be coupled with the PCB;
after the PCB finishes the surface mounting coupling process, the PCB which finishes the coupling process is transported to a placing area, the inside of the cartridge clip loading and unloading device is subjected to layer changing, and another PCB to be processed is transported to the PCB operation table to realize loading and material changing;
and after the PCB in the cartridge clip loading and unloading device is subjected to patch coupling, replacing the materials in the cartridge clip loading and unloading device again, and repeating the steps.
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