CN114433980A - 一种电弧增材制造过程中熔池尺寸的控制装置和方法 - Google Patents
一种电弧增材制造过程中熔池尺寸的控制装置和方法 Download PDFInfo
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Abstract
本发明公开了一种电弧增材制造过程中熔池尺寸的控制装置和方法,包括增材制造设备、连接装置、双侧气流装置、CCD相机;通过调节连接装置,使双侧气流装置与焊枪具有合适的的相对位置;将CCD相机装夹于焊枪后侧,配合合适的滤光片,检测熔池尺寸信息。在增材过程中,双侧气流装置和焊枪保持同步运动,焊丝由送丝装置输送至沉积层指定位置,双侧气流能够直接同步作用于熔化区域。该电弧增材制造过程中熔池尺寸的控制装置和方法,根据CCD相机检测到的熔池尺寸实时调节流量控制器,控制双侧高速气流的流速和压力,对熔池侧壁施加压力,约束熔池尺寸。同时通过改变气体类型和温度来调节沉积层的流动和凝固,实现样件尺寸的精准控制。
Description
技术领域
本发明属于增材制造领域,尤其涉及一种电弧增材制造过程中熔池尺寸的控制装置和方法。
背景技术
增材制造技术又被称为“3D打印”、“快速成型”,是根据零件的三维模型,基于离散、堆积原理采用材料逐层累加的方法来制造实体零件。在金属增材制造领域,快速成型技术采用的热源主要分为激光、电子束和电弧,电弧增材制造技术以其材料利用率高、范围广、成本低等诸多优点而受到人们的广泛关注。但是,在电弧增材制造过程中,沉积层随着热积累的逐渐增大,会出现诸如沉积层塌陷、成形精度低等问题。
对此,有学者提出了基于夹持约束的复合增材制造技术以解决上述问题。能够在不削减沉积层的前提下,提高成形零件的组织性能和成形精度。在现有的相关研究中,对于成形精度方面中国专利CN112916874A提出的增材制造过程中熔池两侧夹持辅助成形装置和方法,通过夹持部件的夹持约束作用,能够在一定程度上提高沉积层侧壁的表面平整度及宽度方向的尺寸精度。但由于其直接作用于半熔化半凝固状态的沉积层熔池外壁,会造成整个沉积层内部性能分布不均,且由于该装置的滚轮与熔池长时间直接接触,会对滚轮的造成损耗,减少使用寿命,增加使用成本。对此,提出一种电弧增材制造过程中熔池尺寸的控制装置和方法,增材制造过程中对沉积层侧壁施加双侧气流作用,通过CCD相机检测到的熔池尺寸信息,实时调节流量控制器,控制双侧高速气流的流量,改变双侧气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸。以获得沉积层形貌优良,性能良好,成形尺寸精确的样件。
发明内容
为了解决上述技术问题,本发明提供了一种电弧增材制造过程中熔池尺寸的控制装置和方法,主要满足不同需求下的电弧增材制造。
本发明采用的技术方案是:
一种电弧增材制造过程中熔池尺寸的控制装置和方法,所述的装置包括:增材制造设备、连接装置、双侧气流装置。所述的增材制造设备包括焊枪、焊接电源、气瓶II、送丝装置、送丝装置连接板。焊丝通过送丝装置输送至沉积层指定位置,在电弧的作用下熔滴与基板相结合,将构件沉积成形在指定基板上;其中,增材过程中的热源由与焊枪相连的焊接电源提供;送丝装置通过送丝装置连接板与焊枪上的连接块相连,使焊枪和送丝装置同步运动;CCD相机装夹于焊枪后侧,配合合适的滤光片,检测熔池尺寸信息。
所述连接装置包括连接块、z轴调位装置、y轴调位装置、x轴调位装置、偏转角调位装置;连接块固定在焊枪上,作为双侧气流装置与焊枪相对位置调位的基准结构件;焊枪、连接块、z轴调位装置、y轴调位装置、x轴调位装置、偏转角调位装置及双侧气流装置通过螺栓连接依次连接组合。
所述的双侧气流装置与连接装置相连接,通过调节连接装置,实现双侧气流装置与焊枪相对位置的精准调节;通过调节连接装置,可以调节双侧气流装置的间距,控制样件的成形尺寸精度;在沉积成形的过程中双侧高速气流对熔池侧壁施加压力,对沉积层起到柔性支撑的作用,同时通过改变气体类型和温度来调节沉积层的流动和凝固,实现成形样件尺寸的精准控制。
所述的CCD相机装夹于焊枪后侧,配合合适的滤光片,检测熔池尺寸信息。根据CCD相机检测到的熔池尺寸信息,实时调节流量控制器,控制双侧高速气流的流量,改变双侧高速气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸,提高成形样件的尺寸精度。
所述的z轴调位装置、y轴调位装置、x轴调位装置和偏转角调位装置等连接部位具有尺寸刻度,使双侧气流装置与焊枪的相对位置能够实现精准调节。
所述的焊丝种类为不锈钢或者铝合金。
所述的气瓶内用于焊枪内部及沉积层两侧的气体均为惰性气体。
所述的电弧增材制造方式包括GMAW、GTAW及等离子弧。
所述的双侧气流装置的材料需高于沉积成形过程中熔池温度300℃及以上。
所述的z轴调位装置、y轴调位装置、x轴调位装置和偏转角调位装置等连接部位具有尺寸刻度,使双侧气流装置与焊枪的相对位置能够实现精准调节。
一种电弧增材制造过程中熔池尺寸的控制装置和方法,包括以下步骤:
步骤一:调节连接装置使双侧气流装置气流喷嘴的水平间距比所需沉积层宽度大1mm,气流喷嘴与水平位置的夹角为15°,待调位完成后紧固连接装置,使双侧气流装置与焊枪能够保持一定的相对位置关系同步移动;
步骤二:启动增材制造系统,在焊枪焊枪、连接装置及焊接电源的协同作用下,配合三维运动机构进行增材制造,在沉积成形的过程中,根据CCD相机检测到的熔池尺寸实时调控双侧高速气流的流量,改变双侧气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸,同时通过改变气体类型和温度来调节沉积层的流动和凝固,形成沉积层形貌优良且尺寸精确的样件;
步骤三:回到初始位置,将焊枪提升一定的高度;
步骤四:重复步骤二与步骤三,不断循环往复沉积成形所需的构件。
本发明的有益效果:
(1)相较于现有发明,本发明通过气体柔性支撑辅助成形,避免机械刚性支撑与沉积层相接触,减少增材装置的损耗和沉积层裂纹等缺陷。
(2)相较于现有发明,本发明可根据CCD相机检测到的熔池尺寸实时调控双侧高速气流的流量,改变双侧气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸。
(3)相较于现有发明,本发明可通过改变气体类型和温度,调节沉积层的流动和凝固,提高成形质量。
附图说明
图1为一种电弧增材制造过程中熔池尺寸的控制装置结构示意图,采用旁轴送丝的方式。
图2为连接装置及双侧气流装置示意图,其中所述的z轴调位装置、y轴调位装置、x轴调位装置和偏转角调位装置通过螺栓依次连接组合,偏转角调位装置与双侧气流装置相连,z轴调位装置与连接块相连,双侧气流装置与气瓶I相连。
图中:1、焊枪;2、连接装置;2-1、连接块;2-2、z轴调位装置;2-3、y轴调位装置;2-4、x轴调位装置;2-5、偏转角调位装置;3、CCD相机;4、构件;5、基板;6、双侧气流装置;7、气瓶I;8、送丝装置;9、送丝装置连接板;10、气瓶II;11、焊接电源。
具体实施方式
为了能进一步了解本发明的内容、特点及效果,列举以下实施例,并配合附图详细说明如下:
本发明的基本思想是根据CCD相机检测到的熔池尺寸实时调控双侧高速气流的流量,改变双侧气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸,同时通过改变气体类型和温度来调节沉积层的流动和凝固,形成沉积层形貌优良且尺寸精确的样件。
实施例1:
以等离子弧增材的方式制造一个沉积层宽度为4mm的铝合金薄壁件为例,如图一所示,采用旁轴送丝的方式,电弧增材制造的焊接电源为变极性等离子弧电源,使用三维运动机构带动等离子焊枪移动,气流喷嘴为圆筒状喷嘴,具体包括以下步骤:
步骤一:用砂纸打磨5A06铝合金基板表面,去除表面的氧化膜,将基板置于工作台表面,将ER4043铝合金丝放入送丝机中,打开送丝机电源并设置送丝速度为4m/min,将离子气流量设置为1.4L/min,将保护气流量设置为15L/min。打开变极性等离子弧电源,将等离子弧EN阶段电流设置为60A,EP阶段电流设置为70A;
步骤二:通过三维运动机构控制器,调节等离子焊枪和增材基板的相对位置,使其位于基板上方8mm处;
步骤三:首先调节y轴调位装置使气流喷嘴在y方向距离等离子焊枪6mm处,随后调整z轴调位装置使气流喷嘴贴近基板表面,最后调整x轴调位装置使两侧气流喷嘴关于等离子焊枪中心对称且保证两者相距5mm,气流喷嘴与水平位置的夹角为15°;
步骤四:启动送丝机及等离子电源,按照预先编辑好的程序下运行,开始进行等离子弧增材制造;
步骤五:CCD相机采集熔池的图像信息,并对熔池宽度信息进行实时提取。将CCD相机采集到的的熔池尺寸D与预设的熔池宽度Dp比较;如果D>Dp,则气体流量器输出的气体流量增大;如果D=Dp,则气体流量器输出的气体流量不变;如果D<Dp,则气体流量器输出的气体流量减小。
步骤六:如上所述,进行单向熔覆沉积,得到沉积层宽度为4mm的薄壁件。
Claims (9)
1.一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:包括:增材制造设备、连接装置(2)、双侧气流装置(6);所述的增材制造设备包括焊枪(1)、焊接电源(11)、气瓶II(10)、送丝装置(8)、送丝装置连接板(9);焊丝通过送丝装置(8)输送至沉积层指定位置,在电弧的作用下熔滴与基板相结合,将构件(4)沉积成形在指定基板(5)上;增材过程中的热源由与焊枪(1)相连的焊接电源(11)提供;送丝装置(8)通过送丝装置连接板(9)与焊枪(1)上的连接装置(2)相连,使焊枪(1)和送丝装置(8)同步运动;所述的双侧气流装置(6)与连接装置(2)相连接,通过调节连接装置(2),实现双侧气流装置(6)与焊枪(1)相对位置的精准调节。
2.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:所述连接装置(2)包括连接块(2-1)、z轴调位装置(2-2)、y轴调位装置(2-3)、x轴调位装置(2-4)、偏转角调位装置(2-5);连接块(2-1)固定在焊枪(1)上,作为双侧气流装置(6)与焊枪(1)相对位置调位的基准结构件;焊枪(1)、连接块(2-1)、z轴调位装置(2-2)、y轴调位装置(2-3)、x轴调位装置(2-4)、偏转角调位装置(2-5)及双侧气流装置(6)通过螺栓连接依次连接组合。
3.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:通过调节连接装置(2)调节双侧气流装置(6)的间距,控制样件的成形尺寸精度;在沉积成形的过程中双侧高速气流对熔池侧壁施加压力,对沉积层起到柔性支撑的作用,通过改变气体类型和温度来调节沉积层的流动和凝固,实现成形样件尺寸的精准控制。
4.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:CCD相机(3)装夹于焊枪(1)后侧,配合滤光片检测熔池尺寸信息;根据CCD相机(3)检测到的熔池尺寸信息,实时调节流量控制器,控制双侧高速气流的流量,改变双侧高速气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸,提高成形样件的尺寸精度。
5.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:所述的焊丝为不锈钢或者铝合金。
6.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置和方法,其特征在于:所述的气瓶I(7)和气瓶II(10)内用于焊枪内部及沉积层两侧的气体均为惰性气体。
7.根据权利要求1所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:电弧增材制造方式包括GMAW、GTAW及等离子弧。
8.根据权利要求2所述一种电弧增材制造过程中熔池尺寸的控制装置,其特征在于:所述的z轴调位装置(2-2)、y轴调位装置(2-3)、x轴调位装置(2-4)和偏转角调位装置(2-5)连接部位设有尺寸刻度,使双侧气流装置(6)与焊枪(1)的相对位置能够实现精准调节。
9.利用权利要求1-8任一所述装置进行的一种电弧增材制造过程中熔池尺寸的控制方法,其特征在于:该方法包括如下步骤:
步骤一:调节连接装置(2)使双侧气流装置(6)气流喷嘴的水平间距比所需沉积层宽度大1mm,气流喷嘴与水平位置的夹角为15°,待调位完成后紧固连接装置(2),使双侧气流装置(6)与焊枪(1)能够保持相对位置关系同步移动;
步骤二:启动增材制造装置,在焊枪(1)、连接装置(2)及焊接电源(11)的协同作用下,配合三维运动机构进行增材制造,在沉积成形的过程中,根据CCD相机(3)检测到的熔池尺寸实时调控双侧高速气流的流量,改变双侧气流对熔池侧壁施加的变形压力和柔性支撑作用,约束熔池尺寸,同时通过改变气体类型和温度来调节沉积层的流动和凝固;
步骤三:回到初始位置,将焊枪(1)提升高度;
步骤四:重复步骤二与步骤三不断循环往复沉积,最终成形得到所需构件(4)。
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