CN114388682A - Anti-sulfuration bonding silver wire - Google Patents
Anti-sulfuration bonding silver wire Download PDFInfo
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- CN114388682A CN114388682A CN202210017006.4A CN202210017006A CN114388682A CN 114388682 A CN114388682 A CN 114388682A CN 202210017006 A CN202210017006 A CN 202210017006A CN 114388682 A CN114388682 A CN 114388682A
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- Prior art keywords
- silver wire
- coating
- vulcanization
- bonding
- bonded silver
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 238000005987 sulfurization reaction Methods 0.000 title claims description 9
- 238000000576 coating method Methods 0.000 claims abstract description 75
- 239000011248 coating agent Substances 0.000 claims abstract description 69
- 238000004073 vulcanization Methods 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- DSEKYWAQQVUQTP-XEWMWGOFSA-N (2r,4r,4as,6as,6as,6br,8ar,12ar,14as,14bs)-2-hydroxy-4,4a,6a,6b,8a,11,11,14a-octamethyl-2,4,5,6,6a,7,8,9,10,12,12a,13,14,14b-tetradecahydro-1h-picen-3-one Chemical compound C([C@H]1[C@]2(C)CC[C@@]34C)C(C)(C)CC[C@]1(C)CC[C@]2(C)[C@H]4CC[C@@]1(C)[C@H]3C[C@@H](O)C(=O)[C@@H]1C DSEKYWAQQVUQTP-XEWMWGOFSA-N 0.000 claims abstract description 22
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004793 Polystyrene Substances 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 22
- 229920002223 polystyrene Polymers 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000000137 annealing Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 238000005491 wire drawing Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 3
- 238000005486 sulfidation Methods 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D193/00—Coating compositions based on natural resins; Coating compositions based on derivatives thereof
- C09D193/04—Rosin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/45198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/45298—Fillers
- H01L2224/45399—Coating material
- H01L2224/4549—Coating material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses an anti-vulcanization bonding silver wire, wherein an anti-vulcanization coating is coated on the surface of the bonding silver wire. The anti-vulcanization coating comprises the following components in percentage by weight: 1-35% of rosin, 1-35% of epoxy resin, 1-25% of ozokerite and 1-50% of polystyrene. The preparation method of the anti-vulcanization bonding silver wire comprises the steps of coating the bonding silver wire of a wire drawing finished product by using a coating liquid before the bonding silver wire is conveyed to an annealing process, and then annealing and drying to obtain the bonding silver wire with the anti-vulcanization coating. The invention has the characteristics of anti-vulcanization effect, improvement of the quality of the bonded silver wire and the like.
Description
Technical Field
The invention relates to an anti-vulcanization bonding silver wire.
Background
Bonding wires of two materials, i.e., gold bonding wires and silver bonding wires, have been widely used as leads of LEDs. However, with the sharp rise of gold price, the cost of enterprises, whether producing or using, is high. The bonded silver wire is the most ideal material when used as an inner lead of the LED, the price is far lower than that of gold, and the product cost can be greatly reduced; the silver reflector has various metal crowns, and can increase the light by about 5%. However, silver is easily vulcanized in an environment containing sulfur, which seriously affects the popularization and application of the bonding silver wire. Some enterprises plate a layer of gold on the surface of silver to prevent vulcanization, which increases cost virtually and does not have the effect of brightening.
Disclosure of Invention
The invention aims to provide a sulfide-resistant bonded silver wire aiming at the defects of the prior art.
In order to realize the purpose of the invention, the following technical scheme is adopted:
an anti-sulfidation bonded silver wire, the surface of the bonded silver wire being coated with an anti-sulfidation coating.
Further, the anti-vulcanization coating comprises the following components in percentage by weight: 1-35% of rosin, 1-35% of epoxy resin, 1-25% of ozokerite and 1-50% of polystyrene.
And coating the bonding silver wire of the wire drawing finished product by using a coating solution before the bonding silver wire is conveyed to an annealing process, and then annealing and drying to obtain the bonding silver wire with the anti-vulcanization coating.
Further, the preparation method of the coating liquid comprises the following steps: grinding the rosin weighed according to the weight part into powder, mixing the powder with the epoxy resin weighed according to the weight part, then putting the mixture into a container, heating to 150-180 ℃, adding the ceresin and the polystyrene weighed according to the weight part, heating to 250-260 ℃, melting, and cooling to generate a solid; and grinding the solid to prepare a 5% toluene solution to obtain a coating solution.
Further, the coating method comprises coating the coating liquid in alignment with the bonding silver wire.
Furthermore, the corresponding coating speed is set according to the diameter of the bonding silver wire, and the speed is 1-10 m/s.
Further, the coating method comprises the step of immersing the bonding silver wire into a groove filled with a coating liquid, wherein the coating liquid is uniformly coated on the surface of the bonding silver wire.
Further, the annealing performs roll-to-roll in-line annealing.
Further, the epoxy resin is 101 epoxy resin.
Furthermore, the purity of the bonding silver wire is more than or equal to 99.99 wt%, and the thickness of the anti-vulcanization coating is 5-10 nanometers.
Compared with the prior art, the invention has the advantages that:
1. the invention has the advantages of anti-sulfuration, enhancing the corrosion resistance of the bonding silver wire and improving the reliability of the bonding silver wire.
2. According to the preparation method of the bonding silver wire, a coating treatment is carried out after annealing, namely, an anti-vulcanization coating is attached to the surface of the bonding copper wire, a thin and compact transparent protective layer can be formed on the surface of the bonding silver wire, the protective layer effectively prevents the bonding silver wire from being vulcanized, and the prepared bonding silver wire is enabled not to generate vulcanization in storage, transportation and use.
3. The rosin has the functions of bonding, sealing and other mechanical properties, the epoxy resin has better bonding strength and chemical resistance, and the ozokerite has good heat insulation, insulation and water-proof properties; the polystyrene has good optical performance and electrical performance; rosin, epoxy resin, ozokerite and polystyrene are mixed and processed into coating liquid, and the coating liquid is coated on the surface of the bonded silver wire, so that the bonded silver wire has good anti-vulcanization effect.
Detailed Description
In order to make the technical solutions in the present application better understood, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and all other embodiments obtained by a person of ordinary skill in the art without making creative efforts based on the embodiments in the present application shall fall within the protection scope of the present application.
Example 1:
an anti-sulfidation bonded silver wire, the surface of the bonded silver wire being coated with an anti-sulfidation coating.
The bonding silver wire realizes the effects of corrosion resistance and vulcanization resistance through the vulcanization resistant coating, and improves the reliability of the bonding silver wire.
Example 2:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 1% of rosin, 24% of epoxy resin, 25% of ozokerite and 50% of polystyrene.
Example 3:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 25% of rosin, 25% of epoxy resin, 20% of ozokerite and 30% of polystyrene.
Example 4:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 35% of rosin, 15% of epoxy resin, 25% of ozokerite and 25% of polystyrene.
Example 5:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 35% of rosin, 1% of epoxy resin, 24% of ozokerite and 40% of polystyrene.
Example 6:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 35% of rosin, 35% of epoxy resin, 1% of ozokerite and 29% of polystyrene.
Example 7:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 35% of rosin, 35% of epoxy resin, 24% of ozokerite and 1% of polystyrene.
Example 8:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 15% of rosin, 35% of epoxy resin, 10% of ozokerite and 40% of polystyrene.
Example 9:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 19% of rosin, 19% of epoxy resin, 13% of ozokerite and 49% of polystyrene.
Example 10:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 34% of rosin, 20% of epoxy resin, 20% of ozokerite and 26% of polystyrene.
Example 11:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 30% of rosin, 30% of epoxy resin, 20% of ozokerite and 20% of polystyrene.
Example 12:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 35% of rosin, 30% of epoxy resin, 5% of ozokerite and 30% of polystyrene.
Example 13:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 10% of rosin, 15% of epoxy resin, 25% of ozokerite and 50% of polystyrene.
Example 14:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 25% of rosin, 35% of epoxy resin, 5% of ozokerite and 35% of polystyrene.
Example 15:
compared with the embodiment 1, the anti-vulcanization coating comprises the following components in percentage by weight: 30% of rosin, 25% of epoxy resin, 12% of ozokerite and 33% of polystyrene.
Example 16:
a method for preparing an anti-sulfidation bonding silver wire as in any one of embodiments 1 to 15, wherein a bonding silver wire of a wire-drawing finished product is coated with a coating solution before being sent to an annealing process, and then is annealed and dried to obtain the bonding silver wire with the anti-sulfidation coating.
Example 17:
in comparison with example 16, a method for preparing the coating solution is given.
The preparation method of the coating liquid comprises the following steps: grinding the rosin weighed according to the weight part into powder, mixing the powder with the epoxy resin weighed according to the weight part, then putting the mixture into a container, heating to 150-180 ℃, adding the ceresin and the polystyrene weighed according to the weight part, heating to 250-260 ℃, melting, and cooling to generate a solid; and grinding the solid to prepare a 5% toluene solution to obtain a coating solution.
Example 18:
in comparison with example 16 or 17, a method of coating is given.
The coating method comprises the step of coating the coating liquid in alignment with the bonding silver wire.
Example 19:
compared with the example 18, the coating speed is limited, namely the corresponding coating speed is set according to the diameter of the bonding silver wire, and the speed is 1-10 m/s.
Typical coating speeds are 1m/s, 2m/s, 3m/s, 4m/s, 5m/s, 6m/s, 7m/s, 8m/s, 9m/s or m/s etc. Therefore, the bonding silver wire coating solution can be conveniently adapted to bonding silver wires with different diameters, and the surface of the bonding silver wire with the corresponding diameter can be coated with the coating solution.
Example 20:
in comparison with example 16 or 17, another method of coating is given.
The coating method comprises the step of immersing the bonding silver wire into a groove filled with coating liquid, and the coating liquid is uniformly coated on the surface of the bonding silver wire.
Example 21:
in contrast to any of examples 16-20, the annealing was performed as a roll-to-roll in-line anneal.
Example 22:
compared with any of the embodiments 2-21, the epoxy resin is 101 epoxy resin.
Example 23:
compared with any of embodiments 1-22, the purity of the bonding silver wire is more than or equal to 99.99 wt%, and the thickness of the anti-vulcanization coating is 5-10 nanometers.
Typical thicknesses for the anti-vulcanization coating are 5, 6, 7, 8, 9, or 10 nanometers, and the like. Can realize effective anti-vulcanization effect.
The invention relates to an anti-sulfuration bonding silver wire, which has the following product performance:
table 1 shows the properties of the products of examples 2 to 8
| Name of item | Index (I) | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 |
| Resistivity of | <1.7μΩ·cm | 1.69 | 1.65 | 1.66 | 1.68 | 1.69 | 1.68 | 1.69 |
| Sulfur steam cooking | >5min | >10min | >12min | >11min | >10min | >10min | >10min | >11min |
Table 2 shows the properties of the products of examples 9 to 15
From the above two tables, it can be seen that the sulfide-resistant bonded silver wire of the present invention has good sulfide resistance and low resistivity.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are intended to be within the scope of the invention.
Claims (10)
1. An anti-sulfuration bonding silver wire is characterized in that: the surface of the bonded silver wire is coated with an anti-sulfuration coating.
2. The sulfidation-resistant bonded silver wire of claim 1, wherein the sulfidation-resistant coating comprises the following components in weight percent:
1 to 35 percent of rosin
1 to 35 percent of epoxy resin
1 to 25 percent of ozokerite
1-50% of polystyrene.
3. A method of preparing the sulfuration resistant bonded silver wire according to claim 1 or 2, wherein: and coating the bonding silver wire with the wire drawing finished product by using a coating liquid before the wire drawing finished product is conveyed to an annealing process, and then annealing and drying to obtain the bonding silver wire with the anti-vulcanization coating.
4. The sulfidation resistant bonded silver wire of claim 3, wherein: the preparation method of the coating liquid comprises the following steps: grinding the rosin weighed according to the weight part into powder, mixing the powder with the epoxy resin weighed according to the weight part, then putting the mixture into a container, heating to 150-180 ℃, adding the ceresin and the polystyrene weighed according to the weight part, heating to 250-260 ℃, melting, and cooling to generate a solid; and grinding the solid to prepare a 5% toluene solution to obtain a coating solution.
5. The sulfide-resistant bonded silver wire of claim 3, wherein the coating process comprises coating the coating solution in alignment with the bonded silver wire.
6. The sulfuration-resistant bonded silver wire according to claim 5, wherein the corresponding coating speed is set according to the diameter of the bonded silver wire and is 1 to 10 m/s.
7. The sulfuration resistant bonded silver wire of claim 3, wherein the coating method comprises immersing the bonded silver wire in a bath filled with a coating solution, the coating solution being uniformly applied to the surface of the bonded silver wire.
8. The sulfidation resistant bonded silver wire of claim 3, wherein: annealing is performed by roll-to-roll in-line annealing.
9. The sulfidation resistant bonded silver wire of claim 2, wherein: the epoxy resin is 101 epoxy resin.
10. The sulfidation resistant bonded silver wire of claim 1, wherein: the purity of the bonding silver wire is more than or equal to 99.99 wt%, and the thickness of the anti-vulcanization coating is 5-10 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210017006.4A CN114388682A (en) | 2022-01-08 | 2022-01-08 | Anti-sulfuration bonding silver wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210017006.4A CN114388682A (en) | 2022-01-08 | 2022-01-08 | Anti-sulfuration bonding silver wire |
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| CN114388682A true CN114388682A (en) | 2022-04-22 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204792774U (en) * | 2015-07-25 | 2015-11-18 | 烟台一诺电子材料有限公司 | Copper bonding wire with coat |
| CN111876810A (en) * | 2020-08-17 | 2020-11-03 | 广东禾木科技有限公司 | Silver-based bonding wire cathode passivation protective solution and preparation method and application thereof |
| CN113026009A (en) * | 2021-03-29 | 2021-06-25 | 广东禾木科技有限公司 | Passivation solution, method for improving bonding performance of metal material, bonding wire and application |
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- 2022-01-08 CN CN202210017006.4A patent/CN114388682A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204792774U (en) * | 2015-07-25 | 2015-11-18 | 烟台一诺电子材料有限公司 | Copper bonding wire with coat |
| CN111876810A (en) * | 2020-08-17 | 2020-11-03 | 广东禾木科技有限公司 | Silver-based bonding wire cathode passivation protective solution and preparation method and application thereof |
| CN113026009A (en) * | 2021-03-29 | 2021-06-25 | 广东禾木科技有限公司 | Passivation solution, method for improving bonding performance of metal material, bonding wire and application |
Non-Patent Citations (1)
| Title |
|---|
| 欧阳鑫: "《电镀工工艺学 初级本》", pages: 95 - 97 * |
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