CN114369338A - Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof - Google Patents
Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof Download PDFInfo
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- CN114369338A CN114369338A CN202111660267.XA CN202111660267A CN114369338A CN 114369338 A CN114369338 A CN 114369338A CN 202111660267 A CN202111660267 A CN 202111660267A CN 114369338 A CN114369338 A CN 114369338A
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- China
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- epoxy resin
- resin composition
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- agent
- triazole
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 142
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 142
- 239000000203 mixture Substances 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 14
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 14
- 239000002516 radical scavenger Substances 0.000 claims abstract description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 239000003063 flame retardant Substances 0.000 claims abstract description 13
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003607 modifier Substances 0.000 claims abstract description 12
- 239000003086 colorant Substances 0.000 claims abstract description 11
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 9
- 150000003852 triazoles Chemical class 0.000 claims abstract description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 13
- 229920003986 novolac Polymers 0.000 claims description 13
- 150000002500 ions Chemical class 0.000 claims description 12
- -1 triazole compound Chemical class 0.000 claims description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 10
- 229910000077 silane Inorganic materials 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- 239000004843 novolac epoxy resin Substances 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011258 core-shell material Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000002086 nanomaterial Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- FMCUPJKTGNBGEC-UHFFFAOYSA-N 1,2,4-triazol-4-amine Chemical compound NN1C=NN=C1 FMCUPJKTGNBGEC-UHFFFAOYSA-N 0.000 claims description 4
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 2
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 claims description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 2
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 2
- WZUUZPAYWFIBDF-UHFFFAOYSA-N 5-amino-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound NC1=NNC(S)=N1 WZUUZPAYWFIBDF-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 150000001450 anions Chemical class 0.000 claims description 2
- DAQREMPZDNTSMS-UHFFFAOYSA-M butyl(triphenyl)phosphanium;thiocyanate Chemical compound [S-]C#N.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 DAQREMPZDNTSMS-UHFFFAOYSA-M 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000004203 carnauba wax Substances 0.000 claims description 2
- 235000013869 carnauba wax Nutrition 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 2
- DEKLIKGLDMCMJG-UHFFFAOYSA-M decanoate;tetrabutylphosphanium Chemical compound CCCCCCCCCC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC DEKLIKGLDMCMJG-UHFFFAOYSA-M 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims description 2
- 230000005294 ferromagnetic effect Effects 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 125000005641 methacryl group Chemical group 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004200 microcrystalline wax Substances 0.000 claims description 2
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 2
- 239000004209 oxidized polyethylene wax Substances 0.000 claims description 2
- 235000013873 oxidized polyethylene wax Nutrition 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 claims description 2
- KPXVKOYWKPPTAU-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethenyl]silane Chemical compound C1C(C=C[Si](OC)(OC)OC)CCC2OC21 KPXVKOYWKPPTAU-UHFFFAOYSA-N 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 1
- 229940106691 bisphenol a Drugs 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052759 nickel Inorganic materials 0.000 abstract description 12
- 230000000052 comparative effect Effects 0.000 description 17
- 229920006336 epoxy molding compound Polymers 0.000 description 16
- 238000004806 packaging method and process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000032798 delamination Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 210000003141 lower extremity Anatomy 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
Abstract
The invention relates to the field of epoxy resin, and discloses an epoxy resin composition and application thereof, and an epoxy resin and a preparation method and application thereof. The epoxy resin composition comprises 2-10 wt% of epoxy resin, 1-5 wt% of phenolic resin curing agent, 0.2-3 wt% of coupling agent, 65-90 wt% of filler, 0.1-5 wt% of colorant, 0.1-20 wt% of flame retardant and/or ion scavenger, 0.1-5 wt% of accelerator, 0.15-1.5 wt% of release agent and a tackifier composition; the tackifying composition comprises 0.05-3 wt% of low stress modifier, 0.01-1 wt% of triazole auxiliary agent and 0.5-5 wt% of dicyclopentadiene epoxy resin. The epoxy resin prepared from the composition can effectively improve the adhesion with nickel.
Description
Technical Field
The invention relates to the field of epoxy resin, in particular to an epoxy resin composition and application thereof, and an epoxy resin and a preparation method and application thereof.
Background
Although the common shapes of Transistors (TO) packaging, namely TO-220, TO-247 and TO-3P, do not need TO be mounted, the devices are applied TO the field of automobiles, and the requirements on the performance of the devices are obviously higher than those in the field of household appliances due TO the fact that the devices relate TO personal safety. In order to improve the stability of the product, nickel is generally plated on a chip carrier and an inner pin area, and in practical application, the product has extremely high requirements on the stability.
The traditional Epoxy Molding Compound (EMC) and nickel basically have no adhesive force, the use requirements of the products cannot be met, and in order to meet the packaging requirements of domestic packaging and testing enterprises, a bonding auxiliary agent is sprayed in the packaging process. The spraying of the bonding aid not only increases the cost, but also the spraying precision is not easy to control.
In order to improve the adhesion of EMC and nickel, researchers have conducted extensive research. CN107636071A discloses an epoxy molding compound with high adhesion to nickel surfaces, its preparation method and use. Specifically disclosed are epoxy molding compounds comprising an epoxy resin, a phenolic resin, a filler, a catalyst, an adhesion promoter, and optionally additives such as flame retardants, pigments, stress modifiers, and mold release agents. The adhesion of the prepared material to EMC and nickel is not higher than 20.3kgf, but the layering effect of the prepared material cannot meet the requirements of customers on reliability after reliability tests (TC1000cyc, HTRB1000H and HTGS 1000H).
Therefore, there is a need for an Epoxy Molding Compound (EMC) that can have excellent adhesion to nickel.
Disclosure of Invention
The invention aims to overcome the technical problem of poor adhesion between EMC and nickel in the prior art, and provides an epoxy resin composition and application thereof, an epoxy resin and a preparation method and application thereof. The adhesion of the epoxy resin prepared from the composition to nickel can be significantly improved.
In order to achieve the above object, a first aspect of the present invention provides an epoxy resin composition characterized by comprising an epoxy resin, a phenolic resin curing agent, a coupling agent, a filler, a colorant, a flame retardant and/or an ion scavenger, an accelerator, a release agent and a tackifier composition;
based on the total weight of the epoxy resin composition, the content of the epoxy resin is 2-10 wt%, the content of the phenolic resin curing agent is 1-5 wt%, the content of the coupling agent is 0.2-3 wt%, the content of the filler is 65-90 wt%, the content of the colorant is 0.1-5 wt%, the content of the flame retardant and/or the ion scavenger is 0.1-20 wt%, the content of the accelerator is 0.1-5 wt%, and the content of the release agent is 0.15-1.5 wt%;
wherein, based on the total weight of the epoxy resin composition, the tackifying composition comprises 0.05-3 wt% of low stress modifier, 0.01-1 wt% of triazole auxiliary agent and 0.5-5 wt% of dicyclopentadiene epoxy resin.
The second aspect of the present invention provides a method for preparing an epoxy resin, which is characterized by mixing the components of an epoxy resin composition to obtain a mixture; melting, premixing and curing the mixture to obtain the epoxy resin;
wherein the epoxy resin composition is the epoxy resin composition.
The third aspect of the present invention provides an epoxy resin obtained from the above epoxy resin composition.
The fourth aspect of the invention provides an application of the epoxy resin composition or the epoxy resin in the field of packaging of nickel-plated semiconductors.
Through the technical scheme, the epoxy resin composition and the application thereof, the epoxy resin and the preparation method and the application thereof provided by the invention have the following beneficial effects:
the epoxy resin prepared by adding the tackifier specified in the application into the epoxy resin composition is applied to the field of encapsulation, and the adhesion force of the epoxy resin and nickel after curing is at least 300N.
Drawings
FIG. 1 is a layered scanning diagram of a carrier and a chip area after TC1000c treatment of an epoxy resin package nickel-plated TO-247 prepared in example 1;
FIG. 2 is a layer scan of the pin area of an epoxy resin prepared from the epoxy resin composition of example 1, encapsulated with a nickel-plated TO-247, processed with TC1000 c;
FIG. 3 is a layer scan of an epoxy resin prepared from the epoxy resin composition of example 2, encapsulated nickel-plated TO-220, treated with TC1000 c;
FIG. 4 is a scan of a layer scan of an epoxy resin encapsulated nickel-plated TO-3P treated with HTRB1000H made from the epoxy resin composition of example 3;
FIG. 5 is a scanning view of the epoxy resin prepared from the epoxy resin composition of comparative example 1, after encapsulation with nickel-plated TO-220.
Detailed Description
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The invention provides an epoxy resin composition, which is characterized by comprising an epoxy resin, a phenolic resin curing agent, a coupling agent, a filler, a coloring agent, a flame retardant and/or an ion trapping agent, an accelerator, a release agent and a tackifier composition;
based on the total weight of the epoxy resin composition, the content of the epoxy resin is 2-10 wt%, the content of the phenolic resin curing agent is 1-5 wt%, the content of the coupling agent is 0.2-3 wt%, the content of the filler is 65-90 wt%, the content of the colorant is 0.1-5 wt%, the content of the flame retardant and/or the ion scavenger is 0.1-20 wt%, the content of the accelerator is 0.1-5 wt%, and the content of the release agent is 0.15-1.5 wt%;
wherein, based on the total weight of the epoxy resin composition, the tackifying composition comprises 0.05-3 wt% of low stress modifier, 0.01-1 wt% of triazole auxiliary agent and 0.5-5 wt% of dicyclopentadiene epoxy resin.
In the invention, the total content of all the components in the epoxy resin composition is 100 wt%.
According to the invention, the epoxy resin composition with the above proportion is adopted, so that the combination of EMC and nickel can be improved, and the EMC, tube legs and a carrier are often layered in the packaging process by using a conventional system, so that the chip is failed.
Further, based on the total weight of the epoxy resin composition, the content of the epoxy resin is 3-8 wt%, the content of the phenolic resin curing agent is 1.5-4.5 wt%, the content of the coupling agent is 0.4-1 wt%, the content of the filler is 78-85 wt%, the content of the colorant is 0.2-1 wt%, the content of the flame retardant and/or the ion scavenger is 0.2-10 wt%, the content of the accelerator is 1-2 wt%, and the content of the release agent is 0.2-1 wt%;
wherein, based on the total weight of the epoxy resin composition, the tackifying composition comprises 1-3 wt% of low stress modifier, 0.03-0.8 wt% of triazole auxiliary agent and 1-3 wt% of dicyclopentadiene epoxy resin.
According to the invention, the low-stress modifier is selected from at least one of silicone rubber micro powder, carboxyl-terminated butadiene-acrylonitrile rubber and core-shell structure micro-nano materials.
Further, the organic core-shell structure micro-nano material is selected from at least one of carboxyl-terminated nitrile butadiene rubber, core-shell structure micro-nano material and silicone rubber micro powder. For example: PBA/PMMA core-shell elastomer particles.
According to the invention, the triazole compound is at least one selected from 4-amino-1, 2, 4-triazole, 3-amino-5-mercapto-1, 2, 4-triazole, 3-mercapto-1, 2, 4-triazole and 1-amino-1, 3, 4-triazole.
According to the invention, the dicyclopentadiene epoxy resin has a viscosity of 0.1 to 6 dPas at 150 ℃.
According to the invention, the softening point of the dicyclopentadiene epoxy resin is 53-95 ℃.
According to the invention, the dicyclopentadiene epoxy resin has an epoxide equivalent of 235-280 g/eq.
According to the invention, the epoxy resin is selected from at least one of bisphenol epoxy resin, biphenyl epoxy resin, novolac epoxy resin, phenyl epoxy resin, dicyclopentadiene phenol-based epoxy resin, phenol aralkyl epoxy resin, naphthol novolac epoxy resin and naphthol aralkyl epoxy resin.
According to the invention, the viscosity of the epoxy resin at 150 ℃ is between 0.1 and 4.3 dPas.
According to the invention, the epoxy equivalent of the epoxy resin is 170-270 g/eq.
According to the invention, the softening point of the epoxy resin is 65-85 ℃.
The epoxy resin used in the present application may be selected from, but is not limited to, the following epoxy resins. For example: bisphenol epoxy resins such as bisphenol a epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, and the like; biphenyl epoxy resins such as biphenyl epoxy resin, tetramethyl biphenyl epoxy resin, and the like; novolac epoxy resins such as phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol a novolac epoxy resin, epoxy compounds of condensates of phenol and aromatic aldehydes containing phenolic hydroxyl groups, biphenol aldehyde epoxy resin, and the like; triphenylmethane epoxy resin; tetraphenylethane epoxy resin and dicyclopentadiene phenol addition reaction type epoxy resin; phenol aralkyl epoxy resin.
According to the present invention, the coupling agent is at least one selected from the group consisting of an epoxy-containing silane, a vinyl-containing silane, a methacryl-containing silane, an amino-containing silane, and a mercapto-containing silane.
Further, the coupling agent is at least one selected from the group consisting of 3- (glycidoxypropyl) trimethoxysilane, 2- (3, 4-epoxycyclohexyl) vinyl-trimethoxysilane, 2-propenyl-trimethoxysilane, 3-mercaptopropyltrimethoxysilane and 3-aminopropyltrimethoxysilane.
According to the invention, the filler is an inorganic filler.
Further, the filler is selected from at least one of crystalline silica, fused angular silica, fused spherical silica, titanium oxide, aluminum oxide, magnesium hydroxide, zirconium dioxide, calcium carbonate, calcium silicate, talc, clay, carbon fiber, glass fiber, ferrite, and ferromagnetic powder.
According to the invention, the colorant is selected from at least one of carbon black, pigments and mill bases.
According to the invention, the flame retardant is selected from at least one of magnesium hydroxide, hexaphenoxycyclophosphazene, aluminum hydroxide and zinc borate.
According to the present invention, the ion scavenger is at least one selected from the group consisting of an acid absorption stabilizer, a cation scavenger and an anion scavenger.
According to the present invention, the accelerator is selected from at least one of an organophosphorus compound, an imidazole compound and a diazacycloolefin.
Further, the organic phosphorus compound is at least one selected from the group consisting of triphenylphosphine, benzoquinone conjugates, butyltriphenylphosphonium thiocyanate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate and tetraphenylphosphonium thiocyanate.
Further, the imidazole compound is at least one selected from the group consisting of 2-ethyl-4-methylimidazole, 2-methylimidazole and 2-phenylimidazole.
In the present invention, the specific imidazole compound is used to improve the adhesion of EMC to a metal material by exerting the synergistic effect of the imidazole accelerator and other components.
Further, the diazacycloolefin is selected from 1, 5-diazabicyclo [4.3.0] non-5-ene and/or 1, 8-diazabicyclo [5.4.0] undec-7-ene.
In the invention, the diazacycloolefin of the specific type is adopted, so that the pH value of EMC can be adjusted to be within the range of 5-8, and the electrical property of EMC is improved.
According to the invention, the release agent is selected from at least one of carnauba wax, oxidized polyethylene wax, polyamide, polyethylene wax and microcrystalline wax.
In the invention, the specific release agent is adopted, so that the ion concentration is low, and the influence of external ions on EMC performance is reduced.
According to the present invention, the phenolic resin curing agent is at least one selected from the group consisting of a phenol novolac resin (PN novolac for short), a bisphenol a novolac resin, a phenol aralkyl novolac resin (Xylok resin), a polyaromatic novolac resin, and a multifunctional novolac resin (MFN novolac).
The second aspect of the present invention provides a method for preparing an epoxy resin, which is characterized by mixing the components of an epoxy resin composition to obtain a mixture; melting, premixing and curing the mixture to obtain the epoxy resin;
according to the present invention, the epoxy resin composition is the above epoxy resin composition.
The curing conditions include: the curing temperature is 155-190 ℃, and the curing time is 45-150 s.
The third aspect of the present invention provides an epoxy resin obtained from the above epoxy resin composition.
The fourth aspect of the invention provides an application of the epoxy resin composition or the epoxy resin in the field of packaging of nickel-plated semiconductors.
The present invention will be described in detail below by way of examples.
(1) Adhesion test conditions: curing the EMC and the nickel sheet at 175 ℃ for 110s to prepare an adhesive area of 176.66mm2A cylinder having a height of 10mm, and a 180 ° peel strength was measured using a universal tester. The running speed of a universal experimental machine (model: UTM5000) is 50mm/min, and the test is carried out at a constant speed at room temperature.
(2) TC1000c processing method: operating according to the requirements of standard JESD 22-A104C.
(3) HTRB 1000H: operation is required according to standard JESD 22-A101D.
The following examples and comparative examples used the following starting materials:
dicyclopentadiene epoxy resin HP7200L, available from DIC, softening point 54-58 ℃, epoxy equivalent weight: 245-250 g/eq and a viscosity at 150 ℃ of 0.2-0.5 dPas.
The multifunctional o-cresol formaldehyde glycidyl ether type epoxy resin CNE200ELA is purchased from Changchun artificial resin factory, Ltd, softening point: 62-68 ℃, epoxy equivalent: 190-205 g/equivalent, and a viscosity at 150 ℃ of 3.0-4.3 dPas.
Novolac resin, designation PF8013, available from the jonan holy spring group gmbh, softening point: 89-94 ℃, hydroxyl equivalent: 105-109 g/equivalent.
The other raw materials used in the examples and comparative examples are commercially available.
Examples 1 to 5, and comparative examples 1 to 2
The kinds and amounts of materials used in examples and comparative examples are shown in Table 1, and examples 1 to 5 are abbreviated as A1 to A5, and comparative examples 1 to 2 are abbreviated as D1 to D2.
TABLE 1
Comparative example 3
The tackifying composition comprises 0.3 wt% of triazole auxiliary agent and 2 wt% of dicyclopentadiene epoxy resin based on the total weight of the epoxy resin composition, a low-stress modifier is not used, and the amount of other substances is the same as that in example 1.
Comparative example 4
Based on the total weight of the epoxy resin composition, the tackifying composition comprises 2 wt% of low-stress modifier and 0.3 wt% of triazole auxiliary agent, dicyclopentadiene epoxy resin is not used, and the amount of other substances is the same as that in example 1.
Preparation example:
is prepared by the following steps:
firstly, crushing epoxy resin, phenolic resin curing agent, stress modifier, release agent and flame retardant (if any), sieving the crushed raw materials at 5 ℃, and selecting a sieve with 13 meshes;
weighing the components and mixing in a high-speed stirrer;
thirdly, adding the uniformly mixed materials into a screw extruder at a certain speed, and melting and premixing at 120 ℃;
(IV) cooling the extruded material, crushing, and sieving by using a 30-mesh sieve to obtain particles;
and (V) directly packaging the crushed materials or packaging the crushed materials after cake making.
The epoxy resin compositions of examples 1 to 5 and comparative examples 1 to 4 were prepared by the preparation methods of the preparation examples, and the properties of the epoxy resins were measured and the results are shown in Table 2.
TABLE 2
| Adhesive force/N | |
| Example 1 | 370 |
| Example 2 | 440 |
| Example 3 | 400 |
| Example 4 | 300 |
| Example 5 | 400 |
| Comparative example 1 | The adhesion is very low and the machine is not shown |
| Comparative example 2 | The adhesion is very low and the machine is not shown |
| Comparative example 3 | 100 |
| Comparative example 4 | 130 |
As can be seen from the figures, after the reliability test, no delamination occurs in the stage and the tube leg in fig. 1-4 (the scanning picture uses red marks to mark the delamination position and range, the more red areas indicate the more delamination area), while the comparative example 1 (fig. 5) has large delamination after packaging. Severe delamination of the PMC hind leg occurred in figure 5.
The epoxy resin compositions of comparative example 1 and comparative example 2 were prepared TO obtain epoxy resins, which were used TO encapsulate nickel-plated TO-220, and severe delamination of the legs occurred after post-curing treatment. From the results of the layered scanning of the encapsulated TO-247 and TO-3P, TO-220 in the examples and the comparative examples, the epoxy resin provided by the invention can meet the use requirements in the field of automotive electronics through strict reliability check.
Claims (10)
1. An epoxy resin composition, characterized in that the epoxy resin composition comprises an epoxy resin, a phenolic resin curing agent, a coupling agent, a filler, a colorant, a flame retardant and/or an ion scavenger, an accelerator, a mold release agent and a tackifier composition;
based on the total weight of the epoxy resin composition, the content of the epoxy resin is 2-10 wt%, the content of the phenolic resin curing agent is 1-5 wt%, the content of the coupling agent is 0.2-3 wt%, the content of the filler is 65-90 wt%, the content of the colorant is 0.1-5 wt%, the content of the flame retardant and/or the ion scavenger is 0.1-20 wt%, the content of the accelerator is 0.1-5 wt%, and the content of the release agent is 0.15-1.5 wt%;
wherein, based on the total weight of the epoxy resin composition, the tackifying composition comprises 0.05-3 wt% of low stress modifier, 0.01-1 wt% of triazole auxiliary agent and 0.5-5 wt% of dicyclopentadiene epoxy resin.
2. The epoxy resin composition of claim 1, wherein the epoxy resin is present in an amount of 3 to 8 wt%, the phenolic resin curing agent is present in an amount of 1.5 to 4.5 wt%, the coupling agent is present in an amount of 0.4 to 1 wt%, the filler is present in an amount of 78 to 85 wt%, the colorant is present in an amount of 0.2 to 1 wt%, the flame retardant and/or ion scavenger is present in an amount of 0.2 to 10 wt%, the accelerator is present in an amount of 1 to 2 wt%, and the mold release agent is present in an amount of 0.2 to 1 wt%, based on the total weight of the epoxy resin composition;
wherein, based on the total weight of the epoxy resin composition, the tackifying composition comprises 1-3 wt% of low stress modifier, 0.03-0.8 wt% of triazole auxiliary agent and 1-3 wt% of dicyclopentadiene epoxy resin.
3. The epoxy resin composition according to claim 1 or 2, wherein the low stress modifier is selected from at least one of silicone rubber micropowder, carboxyl-terminated nitrile rubber and core-shell structure micro-nano material;
preferably, the organic core-shell structure micro-nano material is selected from at least one of carboxyl-terminated nitrile butadiene rubber, core-shell structure micro-nano material and silicone rubber micro powder;
preferably, the triazole compound is at least one selected from 4-amino-1, 2, 4-triazole, 3-amino-5-mercapto-1, 2, 4-triazole, 3-mercapto-1, 2, 4-triazole and 1-amino-1, 3, 4-triazole;
preferably, the dicyclopentadiene epoxy resin has a viscosity of 0.1 to 6 dPas at 150 ℃;
preferably, the softening point of the dicyclopentadiene epoxy resin is 53-95 ℃;
preferably, the dicyclopentadiene epoxy resin has an epoxide equivalent weight of 235-280 g/equivalent.
4. The epoxy resin composition according to any one of claims 1 to 3, wherein the epoxy resin is at least one selected from the group consisting of a bisphenol epoxy resin, a biphenyl epoxy resin, a novolac epoxy resin, a phenyl epoxy resin, a dicyclopentadiene phenol-based epoxy resin, a phenol aralkyl epoxy resin, a naphthol novolac epoxy resin, and a naphthol aralkyl epoxy resin;
preferably, the epoxy resin has a viscosity of 0.1 to 4.3dpa.s at 150 ℃;
preferably, the epoxy equivalent of the epoxy resin is 170-270 g/eq;
preferably, the epoxy resin has a softening point of 65-85 ℃.
5. The epoxy resin composition according to any one of claims 1 to 4, wherein the coupling agent is at least one selected from the group consisting of an epoxy group-containing silane, a vinyl group-containing silane, a methacryl group-containing silane, an amino group-containing silane, and a mercapto group-containing silane;
preferably, the coupling agent is selected from at least one of 3- (glycidoxypropyl) trimethoxysilane, 2- (3, 4-epoxycyclohexyl) vinyl-trimethoxysilane, 2-propenyl-trimethoxysilane, 3-mercaptopropyltrimethoxysilane and 3-aminopropyltrimethoxysilane.
6. The epoxy resin composition of any one of claims 1-5, wherein the filler is an inorganic filler;
preferably, the filler is selected from at least one of crystalline silica, fused angular silica, fused spherical silica, titanium oxide, aluminum oxide, magnesium hydroxide, zirconium dioxide, calcium carbonate, calcium silicate, talc, clay, carbon fiber, glass fiber, ferrite, and ferromagnetic powder;
preferably, the colorant is selected from at least one of carbon black, pigment and color paste;
preferably, the flame retardant is selected from at least one of magnesium hydroxide, hexaphenoxycyclophosphazene, aluminum hydroxide and zinc borate;
preferably, the ion scavenger is selected from at least one of an acid absorption stabilizer, a cation scavenger and an anion scavenger;
preferably, the accelerator is selected from at least one of an organophosphorus compound, an imidazole compound and a diazacycloolefin;
preferably, the organophosphorus compound is at least one selected from the group consisting of triphenylphosphine, benzoquinone conjugates, butyltriphenylphosphonium thiocyanate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate and tetraphenylphosphonium thiocyanate;
preferably, the imidazole compound is selected from at least one of 2-ethyl-4-methylimidazole, 2-methylimidazole and 2-phenylimidazole;
preferably, the diazacycloolefin is selected from 1, 5-diazabicyclo [4.3.0] non-5-ene and/or 1, 8-diazabicyclo [5.4.0] undec-7-ene;
preferably, the release agent is selected from at least one of carnauba wax, oxidized polyethylene wax, polyamide, polyethylene wax, and microcrystalline wax;
preferably, the phenolic resin curing agent is at least one selected from the group consisting of a phenol-formaldehyde novolac resin, a bisphenol-a novolac resin, a phenol aralkyl novolac resin, a polyaromatic novolac resin, and a multifunctional novolac resin.
7. The preparation method of the epoxy resin is characterized in that all components in the epoxy resin composition are mixed to obtain a mixture; melting, premixing and curing the mixture to obtain the epoxy resin;
wherein the epoxy resin composition is the epoxy resin composition according to any one of claims 1 to 6.
8. The production method according to claim 7, wherein the curing conditions include: the curing temperature is 155-190 ℃, and the curing time is 45-150 s.
9. An epoxy resin obtained by the production method according to claim 7 or 8.
10. Use of the epoxy resin composition of any one of claims 1 to 6 or the epoxy resin of claim 9 in the field of encapsulating nickel-plated semiconductors.
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| CN107636071A (en) * | 2015-03-19 | 2018-01-26 | 衡所华威电子有限公司 | There is epoxy molding compounds, the preparation method and use of high adhesion to nickel surface |
| CN111909645A (en) * | 2020-07-24 | 2020-11-10 | 江苏科化新材料科技有限公司 | Epoxy resin composition for motor rotor encapsulation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107636071A (en) * | 2015-03-19 | 2018-01-26 | 衡所华威电子有限公司 | There is epoxy molding compounds, the preparation method and use of high adhesion to nickel surface |
| CN111909645A (en) * | 2020-07-24 | 2020-11-10 | 江苏科化新材料科技有限公司 | Epoxy resin composition for motor rotor encapsulation |
Non-Patent Citations (1)
| Title |
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| 范宏等: "PBA/PMMA型核壳弹性粒子增韧环氧树脂研究", 《高分子材料科学与工程》, vol. 17, no. 1, pages 121 - 124 * |
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