CN111909645A - Epoxy resin composition for motor rotor encapsulation - Google Patents
Epoxy resin composition for motor rotor encapsulation Download PDFInfo
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- CN111909645A CN111909645A CN202010722674.8A CN202010722674A CN111909645A CN 111909645 A CN111909645 A CN 111909645A CN 202010722674 A CN202010722674 A CN 202010722674A CN 111909645 A CN111909645 A CN 111909645A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 130
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 130
- 239000000203 mixture Substances 0.000 title claims abstract description 100
- 238000005538 encapsulation Methods 0.000 title claims abstract description 19
- 239000007822 coupling agent Substances 0.000 claims abstract description 57
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 54
- 239000003063 flame retardant Substances 0.000 claims abstract description 39
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000002516 radical scavenger Substances 0.000 claims abstract description 24
- 239000003607 modifier Substances 0.000 claims abstract description 21
- 239000003086 colorant Substances 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 14
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 42
- 239000005011 phenolic resin Substances 0.000 claims description 30
- 150000003851 azoles Chemical class 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 27
- 229920001568 phenolic resin Polymers 0.000 claims description 27
- 150000002500 ions Chemical class 0.000 claims description 22
- -1 aralkyl phenol Chemical compound 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 14
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 13
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000004203 carnauba wax Substances 0.000 claims description 12
- 235000013869 carnauba wax Nutrition 0.000 claims description 12
- 239000005350 fused silica glass Substances 0.000 claims description 12
- 239000000155 melt Substances 0.000 claims description 12
- 239000001993 wax Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 10
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical group [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- 229960001545 hydrotalcite Drugs 0.000 claims description 7
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 7
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 claims description 6
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 claims description 6
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 claims description 6
- 125000002252 acyl group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000001450 anions Chemical class 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical group 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 125000000623 heterocyclic group Chemical group 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004209 oxidized polyethylene wax Substances 0.000 claims description 4
- 235000013873 oxidized polyethylene wax Nutrition 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical group [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- VSTXCZGEEVFJES-UHFFFAOYSA-N 1-cycloundecyl-1,5-diazacycloundec-5-ene Chemical compound C1CCCCCC(CCCC1)N1CCCCCC=NCCC1 VSTXCZGEEVFJES-UHFFFAOYSA-N 0.000 claims description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 2
- 239000000194 fatty acid Substances 0.000 claims description 2
- 229930195729 fatty acid Natural products 0.000 claims description 2
- 150000004665 fatty acids Chemical class 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 229920000428 triblock copolymer Polymers 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 23
- 229910000831 Steel Inorganic materials 0.000 abstract description 17
- 239000010959 steel Substances 0.000 abstract description 17
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 239000000853 adhesive Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 238000002156 mixing Methods 0.000 description 20
- 229920006336 epoxy molding compound Polymers 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 239000002994 raw material Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000005022 packaging material Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 125000001624 naphthyl group Chemical group 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- GMVPRGQOIOIIMI-DODZYUBVSA-N 7-[(1R,2R,3R)-3-hydroxy-2-[(3S)-3-hydroxyoct-1-enyl]-5-oxocyclopentyl]heptanoic acid Chemical compound CCCCC[C@H](O)C=C[C@H]1[C@H](O)CC(=O)[C@@H]1CCCCCCC(O)=O GMVPRGQOIOIIMI-DODZYUBVSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000013022 formulation composition Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides an epoxy resin composition for motor rotor encapsulation, which comprises the following components: 20-150 parts of epoxy resin, 10-100 parts of curing agent, 0.1-5 parts of coupling agent, 800 parts of solid filler, 0.1-5 parts of accelerator, 0.5-5 parts of low-stress modifier, 0.1-10 parts of release agent, 0.1-5 parts of ion scavenger, 1-20 parts of flame retardant and 0.1-5 parts of colorant. Compared with the prior art, the epoxy resin composition has the main advantages that: (1) the fluidity is excellent, and the formability is good; (2) the glass transition temperature is extremely high, and the motor running requirement under the high-temperature working condition can be met; (3) the adhesive has excellent magnetic steel adhesive property and can meet the requirement of high-speed operation of a motor.
Description
Technical Field
The invention relates to an epoxy resin composition for motor rotor packaging, and belongs to the field of rotor packaging.
Background
At present, the motor rotor is generally formed by inserting magnetic steel sheets into rotor core holes and filling and bonding the magnetic steel sheets with liquid resin. In this field of encapsulation technology, liquid resin such as urethane resin or epoxy resin is generally used and fabricated by potting process. (e.g., Chinese patent CN 109370150A). However, the production efficiency of the process is extremely low, and meanwhile, the glass transition temperature of the resin material is low, so that the bonding performance to the magnetic steel is poor, and the phenomenon that the magnetic steel falls off easily occurs in the high-speed running process of the motor; and during the operation of the motor, the strength of the resin material is deteriorated due to the high operating temperature, which may further affect the use of the motor.
Although a solid epoxy resin composition for rotor encapsulation is disclosed in TW 20144903a and CN109082077A, the glass transition temperature of the resin composition is low (< 150 ℃), and no attention is paid to the adhesion property of magnetic steel, and under the condition of higher working temperature, the use of the motor is greatly affected, so that there is still room for further improvement. In addition, CN109467881A discloses a super heat-resistant high thermal conductivity epoxy molding compound, but the fluidity of the material is difficult to meet the requirement of motor rotor packaging, and there is a great room for improving the adhesion property of the resin to the magnetic steel.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides an epoxy resin composition for motor rotor encapsulation.
The inventor finds that the naphthalene ring type epoxy resin and the curing agent with the melt viscosity of not more than 3 Pa.s at 150 ℃ are added to serve as a resin matrix, the resin has a rigid structure, so that molecular chains are not easy to move, and meanwhile, the resin has a multifunctional structure, so that the crosslinking density of the cured resin can be increased, and the effects of increasing the glass transition temperature of the material and improving the bonding performance are achieved. In addition, by introducing the coupling agent with a special structure, the crosslinking density of the resin can be further increased, the glass transition temperature is increased, the bonding property between the resin and the magnetic steel is also greatly improved, and the high-speed operation requirement of the motor can be met.
The technical problem to be solved by the invention is realized by the following technical scheme:
an epoxy resin composition for motor rotor encapsulation comprises the following components: 20-150 parts of epoxy resin, 10-100 parts of curing agent, 0.1-5 parts of coupling agent, 800 parts of solid filler, 0.1-5 parts of accelerator, 0.5-5 parts of low-stress modifier, 0.1-10 parts of release agent, 0.1-5 parts of ion scavenger, 1-20 parts of flame retardant and 0.1-5 parts of colorant.
Wherein,
the epoxy resin is naphthalene epoxy resin or a mixture of naphthalene epoxy resin and one or more of the following components: o-cresol epoxy resin, biphenyl type epoxy resin, aralkyl type epoxy resin, ester ring type epoxy resin, heterocyclic type epoxy resin, bisphenol a type epoxy resin, bisphenol F type epoxy resin, dicyclopentadiene type epoxy resin, and polyfunctional group type epoxy resin;
when the epoxy resin is composed of a naphthalene epoxy resin and one or more of the above-mentioned other components, the content ratio by weight therebetween is not particularly limited, for example: can be 0.1-10: 1.
The curing agent is selected from one or more of linear phenolic resin, biphenyl type phenolic resin, naphthalene type phenolic resin, aralkyl phenol type phenolic resin or polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 3 Pa.s.
The coupling agent is any one or more of azole compounds shown in a formula 1 or a mixture of any one or more of azole compounds shown in the formula 1 and compounds shown in a formula 2; when the selected coupling agent is any one of azole compounds shown in the formula 1 or a mixture of several of the azole compounds shown in the formula 1 and the compound shown in the formula 2, the weight of the azole compounds shown in the formula 1 at least accounts for 10 percent of the total weight of the coupling agent mixture;
wherein,
R1represents hydrogen, methyl, carboxyl, amino, mercapto or acyl.
R2Represents hydrogen, methyl, carboxyl, amino, mercapto or acyl.
R3Represents hydrogen, methyl, carboxyl, amino, mercapto or acyl.
The solid filler is selected from one or more of crystalline silica powder, fused silica powder, metal oxide and metal nitride.
The accelerator is one or more selected from triphenylphosphine and derivatives thereof, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1, 8-diazabicycloundec-7-ene or organic amine accelerators.
The low-stress modifier is selected from one or more of organic silicon modified epoxy resin, silicon resin, liquid carboxyl-terminated butadiene-acrylonitrile rubber and triblock copolymer containing organic silicon components.
The release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax and fatty acid wax.
The ion trapping agent is selected from one or more of an anion trapping agent, a cation trapping agent, an anion-cation composite ion trapping agent and a hydrotalcite compound.
The flame retardant is selected from one or more of halogen flame retardants, non-halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, phosphorus-halogen flame retardants, phosphorus-nitrogen flame retardants and hydroxide flame retardants.
The colorant is selected from one or more of carbon black, titanium dioxide and zinc oxide.
Preferably, the first and second electrodes are formed of a metal,
the epoxy resin composition for encapsulating the motor rotor comprises the following components: 45-120 parts of epoxy resin, 20-80 parts of curing agent, 1-4 parts of coupling agent, 750 parts of solid filler 450-750 parts, 0.5-4 parts of accelerator, 1-5 parts of low-stress modifier, 1-8 parts of release agent, 0.5-3 parts of ion scavenger, 1-18 parts of flame retardant and 1-4 parts of colorant.
The epoxy resin is naphthalene epoxy resin or a mixture of the naphthalene epoxy resin and one or more of the following components: o-cresol epoxy resin, ester ring type epoxy resin, heterocyclic type epoxy resin, and polyfunctional type epoxy resin.
The curing agent is selected from one or more of linear phenolic resin, naphthalene type phenolic resin or polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 2 Pa.s.
The coupling agent is any one or more of azole compounds shown in a formula 1, or a mixture of any one or more of azole compounds shown in the formula 1 and compounds shown in a formula 2; when the coupling agent is any one of azole compounds shown in formula 1 or a mixture of several of the azole compounds shown in formula 1 and the compound shown in formula 2, the weight of the azole compounds shown in formula 1 accounts for at least 15% of the total weight of the coupling agent mixture.
The solid filler is selected from one or a composite of more of crystalline silica powder and fused silica powder.
The accelerator is selected from one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole or organic amine accelerators.
The low-stress modifier is selected from organic silicon modified epoxy resin and/or liquid carboxyl-terminated butadiene-acrylonitrile rubber.
The release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax and Fischer-Tropsch wax.
The ion scavenger is selected from an anion scavenger and/or a hydrotalcite compound.
The flame retardant is selected from hydroxide flame retardant and/or phosphorus flame retardant.
The colorant is selected from carbon black.
More preferably still, the first and second liquid crystal compositions are,
the epoxy resin composition for encapsulating the motor rotor comprises the following components: 61.05-98.25 parts of epoxy resin, 30-64.5 parts of curing agent, 1.5-2.65 parts of coupling agent, 562.5-637.5 parts of solid filler, 1.125-2.25 parts of accelerator, 1.875-3.75 parts of low-stress modifier, 2.625-6.75 parts of release agent, 0.75-2.25 parts of ion scavenger, 3.75-15 parts of flame retardant and 1.5-3.75 parts of colorant.
The epoxy resin is naphthalene epoxy resin or a mixture of naphthalene epoxy resin and o-cresol epoxy resin.
The curing agent is selected from one or two of linear phenolic resin and polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 1.5 Pa.s.
The coupling agent is any one of azole compounds shown in a formula 1, or a mixture of any one of azole compounds shown in the formula 1 and a compound shown in a formula 2; when the coupling agent is a mixture of any one of azole compounds shown in formula 1 and a compound shown in formula 2, the weight of the azole compounds shown in formula 1 accounts for at least 22.5 percent of the total weight of the coupling agent mixture; the coupling agent shown in the formula 1 is 1,2, 4-triazole, 3-mercapto-1, 2, 4-triazole or 3-amino-1, 2, 4-triazole;
the solid filler is selected from fused silica powder;
the accelerator is selected from 2-ethyl-4-methylimidazole;
the low-stress modifier is selected from organosilicon modified epoxy resin;
the release agent is selected from carnauba wax;
the ion scavenger is selected from hydrotalcite;
the flame retardant is selected from zinc borate;
the colorant is selected from carbon black.
The invention also provides a preparation method of the epoxy resin composition for motor rotor encapsulation, which comprises the following steps:
(1) preparing raw materials of epoxy resin, a curing agent, a coupling agent, a solid filler, an accelerator, a low-stress modifier, a release agent, an ion trapping agent, a flame retardant and a colorant according to parts by weight;
(2) the raw materials are mixed evenly on a double-roller mixing roll, the mixing temperature is 80-90 ℃, and the raw materials are cooled and crushed after being mixed.
According to the epoxy resin composition for motor rotor encapsulation, naphthalene ring type epoxy resin and a curing agent with the melt viscosity not greater than 3 Pa.s at 150 ℃ are added to serve as a resin matrix, the resin has a rigid structure, so that molecular chains are not easy to move, and meanwhile, due to the fact that the resin has a multifunctional structure, the cross-linking density of the cured resin can be increased, and therefore the effects of increasing the glass transition temperature of the material and improving the bonding performance are achieved. In addition, by introducing the coupling agent with a special structure, the crosslinking density of the resin can be further increased, the glass transition temperature is increased, the bonding property between the resin and the magnetic steel is also greatly improved, and the high-speed operation requirement of the motor can be met.
Compared with the prior art, the epoxy resin composition has the main advantages that:
(1) the fluidity is excellent, and the formability is good;
(2) the glass transition temperature is extremely high, and the motor running requirement under the high-temperature working condition can be met;
(3) the adhesive has excellent magnetic steel adhesive property and can meet the requirement of high-speed operation of a motor.
Drawings
FIG. 1 is a schematic view of a bonded sample.
Wherein, 1 is epoxy plastic packaging material, and 2 is magnetic steel sheet sample.
Detailed Description
The present invention is described in detail below by way of examples.
In the following examples, the glass transition temperature was measured using a thermomechanical analyzer (TMA).
Gel time: heating an electric heating plate to 175 +/-1 ℃, placing 2-3 g of sample on an iron plate, continuously stirring by using a small needle, and testing the time for the sample to change from fluid to colloid.
Fluidity: a30 g sample was taken and measured by means of a spiral flow metal mold with a resin transfer injection molding machine at an injection pressure of 70kgf/cm2 and a mold temperature of 175. + -. 1 ℃.
Flame retardancy: the method is carried out according to the GB/T2408 standard by adopting a vertical combustion method.
Bonding strength:
(1) sample preparation-the obtained epoxy molding compound molding material was molded on the surface of a sample wafer using a low-pressure transfer molding machine under conditions of mold temperature 175 ℃, injection pressure 60bar, and curing time 110s, as shown in fig. 1. The sample wafer is made of a magnetic steel sheet.
(2) And (3) testing the bonding force, namely applying a shearing acting force along the surface of the sample wafer at the speed of 20mm/min, testing the maximum force value before the plastic package material is separated from the sample wafer, and dividing the bonding force by the bonding area to obtain bonding strength data.
The sources of the components are as follows:
o-cresol epoxy resin ("SQCN 700-1" manufactured by Shengquan chemical Co., Ltd.).
Naphthalene ring type epoxy resin ("HP 4700" manufactured by DIC corporation).
The novolac resin (PF 8011 manufactured by Shengquan chemical) has a melt viscosity of 1.18-1.50 pas at 150 ℃.
A polyfunctional phenol resin (MEH 7500 manufactured by Minghe Kaishi chemical Co., Ltd.) having a melt viscosity of 0.73 to 1.03 pas at 150 ℃.
The coupling agent shown in the formula 1 is 1,2, 4-triazole, 3-mercapto-1, 2, 4-triazole or 3-amino-1, 2, 4-triazole respectively, and is purchased from Jiangsu Aikang biological medicine research and development Limited company.
The coupling agent of formula 2 is available from Nippon Denmark under the designation KBM-803.
Accelerator, 2-ethyl-4-methylimidazole, was purchased from Nanjing blue Bian Biochemical science and technology Ltd.
Low stress modifier, silicone modified epoxy resin, available from Dow Corning Inc. under the designation SF-8241 EG.
Ion scavenger, hydrotalcite, available from Nippon Kangshu chemical industries, under the trade designation DHT-4C.
The flame retardant, zinc borate, was purchased from the fine chemical company ltd, thacin, denna.
Example 1
The composition of the raw materials of the epoxy resin composition for sealing a rotor of an electric motor of example 1 is shown in Table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 73.5g of epoxy resin SQCN 700-1, 18.75g of epoxy resin HP 4700, 45.00g of phenolic resin PF 8011, 0.75g of ion scavenger DHT-4C, 1.88g of low stress modifier SF-8241EG, 0.60g of coupling agent (1,2, 4-triazole) of formula 1, 2.05g of coupling agent of formula 2, 2.25g of accelerator 2-ethyl-4 methylimidazole, 592.5g of fused silica micropowder, 3.00g of release agent carnauba wax, 7.50g of flame retardant zinc borate and 2.25g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and then the mixture is discharged to obtain the epoxy molding compound mixture.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Example 2
The composition of the raw materials of the epoxy resin composition for encapsulating a rotor of an electric motor of example 2 is shown in Table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 45.75g of epoxy resin SQCN 700-1, 45.75g of epoxy resin HP 4700, 53.25g of phenolic resin PF 8011, 1.50g of ion scavenger DHT-4C, 3.75g of low stress modifier SF-8241EG, 1.50g of coupling agent (3-mercapto-1, 2, 4-triazole) of formula 1, 0.375g of coupling agent of formula 2, 1.875g of accelerator 2-ethyl-4 methylimidazole, 585.00g of fused silica micropowder, 6.00g of release agent carnauba wax, 3.75g of flame retardant zinc borate and 1.5g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and then the mixture is discharged to obtain the epoxy molding compound mixture.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Example 3
The formulation of the raw materials of the epoxy resin composition for encapsulating a rotor of an electric motor of example 3 is shown in Table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 5.55g of epoxy resin SQCN 700-1, 55.50g of epoxy resin HP 4700, 37.95g of phenolic resin MEH 7500, 1.125g of ion scavenger DHT-4C, 3.75g of low stress modifier SF-8241EG, 2.25g of coupling agent (3-amino-1, 2, 4-triazole) of formula 1, 1.50g of accelerator 2-ethyl-4 methylimidazole, 622.5g of fused silica micropowder, 6.75g of release agent carnauba wax, 11.25g of flame retardant zinc borate and 1.875g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and the mixture is discharged to obtain the epoxy molding compound mixture.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Example 4
The formulation of the raw material of the epoxy resin composition for encapsulating a rotor of an electric motor of example 4 is shown in table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 46.50g of epoxy resin SQCN 700-1, 15.75g of epoxy resin HP 4700, 30.00g of phenolic resin PF 8011, 1.50g of ion scavenger DHT-4C, 2.625g of low stress modifier SF-8241EG, 0.75g of coupling agent of formula 1 (a mixture of 0.25g of 1,2, 4-triazole and 0.50g of 3-amino-1, 2, 4-triazole), 0.75g of coupling agent of formula 2, 1.125g of accelerator 2-ethyl-4 methylimidazole, 637.50g of fused silica micropowder, 3.00g of release agent carnauba wax, 7.50g of flame retardant zinc borate and 3.00g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and then the mixture is discharged to obtain the epoxy molding compound mixture.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Example 5
The composition of the raw materials of the epoxy resin composition for encapsulating a rotor of an electric motor of example 5 is shown in Table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 86.25g of epoxy resin HP 4700, 28.50g of phenolic resin PF 8011, 28.50g of phenolic resin MEH 7500, 2.25g of ion scavenger DHT-4C, 1.875g of low-stress modifier SF-8241EG, 0.75g of coupling agent of formula 1 (a mixture of 0.35g of 3-amino-1, 2, 4-triazole and 0.40g of 3-mercapto-1, 2, 4-triazole), 1.5g of coupling agent of formula 2, 1.875g of accelerator 2-ethyl-4 methylimidazole, 577.50g of fused silica micropowder, 3.75g of release agent carnauba wax, 15.00g of flame retardant zinc borate and 2.25g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and then the epoxy molding compound mixture is obtained after discharging.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Example 6
The composition of the raw materials of the epoxy resin composition for encapsulating a rotor of an electric motor of example 6 is shown in Table 1.
The method for preparing the epoxy resin composition for encapsulating the motor rotor in the embodiment is as follows:
(1) 98.25g of epoxy resin HP 4700, 64.50g of phenolic resin MEH 7500, 1.125g of ion scavenger DHT-4C, 2.25g of low stress modifier SF-8241EG, 1.125g of coupling agent of formula 1 (a mixture of 0.75g of 1,2, 4-triazole and 0.375g of 3-mercapto-1, 2, 4-triazole), 1.125g of coupling agent of formula 2, 1.50g of accelerator 2-ethyl-4-methylimidazole, 562.50g of fused silica micropowder, 2.625g of release agent carnauba wax, 11.25g of flame retardant zinc borate and 3.75g of colorant carbon black are put into a high-speed mixer to be mixed for 5min, and the mixture is discharged to obtain the epoxy molding compound mixture.
(2) And (2) adding the epoxy plastic packaging material mixture obtained in the step (1) into an open mill for mixing. The mixing temperature was 80 ℃ and 8min after mixing, epoxy resin molding compounds were obtained, and gel time, fluidity, glass transition temperature, flame retardancy and adhesive properties were evaluated as shown in Table 2.
Comparative example 1 epoxy resin naphthalene Ring-type resin not selected
An epoxy molding compound mixture was prepared according to the method of example 1, except that 18.75g of HP 4700 epoxy resin in step (1) was entirely changed to SQCN 700-1 epoxy resin to obtain an epoxy molding compound mixture.
The gel time, flow, glass transition temperature, flame retardancy, and adhesive properties were then tested as shown in table 2.
Comparative example 2 curing agent melt viscosity at 150 ℃ of greater than 3 pas
An epoxy molding compound mixture was prepared by following the procedure of example 2 except that 53.25g of the phenol resin PF 8011 in the step (1) was entirely changed to a phenol resin PF 8010 (melt viscosity at 150 ℃ C. was 10-12.5 pas) to obtain an epoxy molding compound mixture.
The gel time, flow, glass transition temperature, flame retardancy, and adhesive properties were then tested as shown in table 2.
Comparative example 3 coupling agent the compound of formula 1 was not selected
An epoxy molding compound mixture was prepared according to the method of example 3, except that 2.25g of the coupling agent of formula 1 in step (1) was changed to KH 560 in its entirety, to obtain an epoxy molding compound mixture.
The gel time, flow, glass transition temperature, flame retardancy, and adhesive properties were then tested as shown in table 2.
Comparative example 4 coupling agent the compound of formula 1 was used in an amount of less than 10% based on the total amount of the coupling agent
An epoxy molding compound mixture was prepared according to the method of example 5, except that 0.55g of the coupling agent of formula 1 was changed to the coupling agent of formula 2 in step (1), to obtain an epoxy molding compound mixture.
The gel time, flow, glass transition temperature, flame retardancy, and adhesive properties were then tested as shown in table 2.
TABLE 1 formulation compositions (in units of g, by weight) of the epoxy resin compositions for rotor encapsulation of motors of examples 1 to 6
TABLE 2
As can be seen from the above examples and comparative examples,
in the embodiments 1-6, naphthalene ring type epoxy resin and curing agent with melt viscosity not greater than 3Pa · s at 150 ℃ are added as resin matrix, the resin has rigid structure, so that molecular chain is not easy to move, and simultaneously, the resin has multifunctional structure, so that the crosslinking density of the resin after curing can be increased, thereby achieving the effects of increasing the glass transition temperature of the material and improving the adhesive property. In addition, by introducing the coupling agent with a special structure, the crosslinking density of the resin can be further increased, the glass transition temperature is increased, the bonding property between the resin and the magnetic steel is also greatly improved, and the high-speed operation requirement of the motor can be met.
As can be seen from comparative example 1, the glass transition temperature of the composition was lowered when the naphthalene ring type epoxy resin was not selected as the epoxy resin, and the selection of the epoxy resin was found to affect the glass transition temperature of the composition.
As can be seen from comparative example 2, the melt viscosity of the curing agent at 150 ℃ is more than 3 pas, the resin flow property is poor, and the moldability is poor, and it can be seen that whether the melt viscosity of the curing agent at 150 ℃ is more than 3 pas affects the fluidity and moldability of the composition.
As can be seen from comparative examples 3 and 4, the compound of formula 1 is not selected as the coupling agent or the amount of the compound of formula 1 is less than 10% of the total amount of the coupling agent, and the magnetic steel bonding strength is 0, which indicates that the compound of formula 1 is a key factor influencing the magnetic steel bonding strength of the composition.
In addition, the first and second substrates are,
although the compound coupling agent of formula 1 is used in each of comparative examples 1-2 and examples 1-2, the magnetic steel adhesion strength of comparative examples 1-2 is lower than that of examples 1-2, which indicates that the combination of the naphthalene ring-type epoxy resin, the specific curing agent and the compound coupling agent of formula 1, the combination of the specific curing agent and the compound coupling agent of formula 1, or the combination of the naphthalene ring-type epoxy resin and the compound coupling agent of formula 1 is more advantageous in increasing the magnetic steel adhesion strength of the composition, and thus, the naphthalene ring-type epoxy resin, the specific curing agent and the compound coupling agent of formula 1 act synergistically.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the technical features described in the above embodiments may be combined in any way without contradiction, and in order to avoid unnecessary repetition, the present invention does not separately describe various possible combinations.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The epoxy resin composition for encapsulating the motor rotor is characterized by comprising the following components: 20-150 parts of epoxy resin, 10-100 parts of curing agent, 0.1-5 parts of coupling agent, 800 parts of solid filler, 0.1-5 parts of accelerator, 0.5-5 parts of low-stress modifier, 0.1-10 parts of release agent, 0.1-5 parts of ion scavenger, 1-20 parts of flame retardant and 0.1-5 parts of colorant;
wherein,
the epoxy resin is naphthalene epoxy resin or a mixture of naphthalene epoxy resin and one or more of the following components: o-cresol epoxy resin, biphenyl type epoxy resin, aralkyl type epoxy resin, ester ring type epoxy resin, heterocyclic type epoxy resin, bisphenol a type epoxy resin, bisphenol F type epoxy resin, dicyclopentadiene type epoxy resin, and polyfunctional group type epoxy resin;
the curing agent is selected from one or more of linear phenolic resin, biphenyl type phenolic resin, naphthalene type phenolic resin, aralkyl phenol type phenolic resin or polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 3 Pa.s;
the coupling agent is any one or more of azole compounds shown in a formula 1 or a mixture of any one or more of azole compounds shown in the formula 1 and compounds shown in a formula 2; when the selected coupling agent is any one of azole compounds shown in the formula 1 or a mixture of several of the azole compounds shown in the formula 1 and the compound shown in the formula 2, the weight of the azole compounds shown in the formula 1 at least accounts for 10 percent of the total weight of the coupling agent mixture;
wherein,
R1represents hydrogen, methyl, carboxyl, amino, mercapto or acyl;
R2represents hydrogen, methyl, carboxyl, amino, mercapto or acyl;
R3represents hydrogen, methyl, carboxyl, amino, mercapto or acyl;
2. the epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the solid filler is selected from one or more of crystalline silica powder, fused silica powder, metal oxide and metal nitride.
3. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the accelerator is one or more selected from triphenylphosphine and its derivatives, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1, 8-diazabicycloundec-7-ene or organic amine accelerators.
4. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the low stress modifier is one or more selected from silicone modified epoxy resin, silicone resin, liquid carboxyl-terminated nitrile rubber, and triblock copolymer containing silicone component.
5. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the release agent is one or more selected from carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax, and fatty acid wax.
6. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the ion scavenger is one or more selected from the group consisting of an anion scavenger, a cation scavenger, an anion-cation complex ion scavenger, and a hydrotalcite compound.
7. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the flame retardant is one or more selected from halogen flame retardants, non-halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, phosphorus-halogen flame retardants, phosphorus-nitrogen flame retardants, and hydroxide flame retardants.
8. The epoxy resin composition for motor rotor encapsulation according to claim 1, wherein the colorant is one or more selected from carbon black, titanium dioxide and zinc oxide.
9. The epoxy resin composition for rotor encapsulation of an electric machine according to any one of claims 1 to 8, characterized by comprising the following components: 45-120 parts of epoxy resin, 20-80 parts of curing agent, 1-4 parts of coupling agent, 750 parts of solid filler, 0.5-4 parts of accelerator, 1-5 parts of low-stress modifier, 1-8 parts of release agent, 0.5-3 parts of ion scavenger, 1-18 parts of flame retardant and 1-4 parts of colorant;
the epoxy resin is naphthalene epoxy resin or a mixture of the naphthalene epoxy resin and one or more of the following components: o-cresol epoxy resin, ester ring type epoxy resin, heterocyclic type epoxy resin and polyfunctional group type epoxy resin;
the curing agent is selected from one or more of linear phenolic resin, naphthalene type phenolic resin or polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 2 Pa.s;
the coupling agent is any one or more of azole compounds shown in a formula 1, or a mixture of any one or more of azole compounds shown in the formula 1 and compounds shown in a formula 2; when the coupling agent is any one of azole compounds shown in the formula 1 or a mixture of several of the azole compounds shown in the formula 1 and the compound shown in the formula 2, the weight of the azole compounds shown in the formula 1 at least accounts for 15 percent of the total weight of the coupling agent mixture;
the solid filler is selected from one or more of crystalline silica powder and fused silica powder;
the accelerator is selected from one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole or organic amine accelerators;
the low-stress modifier is selected from organic silicon modified epoxy resin and/or liquid carboxyl-terminated butadiene-acrylonitrile rubber;
the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax and Fischer-Tropsch wax;
the ion scavenger is selected from an anion scavenger and/or a hydrotalcite compound;
the flame retardant is selected from hydroxide flame retardant and/or phosphorus flame retardant;
the colorant is selected from carbon black.
10. The epoxy resin composition for rotor encapsulation of an electric machine according to any one of claims 1 to 8, characterized by comprising the following components: 61.05-98.25 parts of epoxy resin, 30-64.5 parts of curing agent, 1.5-2.65 parts of coupling agent, 562.5-637.5 parts of solid filler, 1.125-2.25 parts of accelerator, 1.875-3.75 parts of low-stress modifier, 2.625-6.75 parts of release agent, 0.75-2.25 parts of ion scavenger, 3.75-15 parts of flame retardant and 1.5-3.75 parts of colorant;
the epoxy resin is naphthalene epoxy resin or a mixture of naphthalene epoxy resin and o-cresol epoxy resin;
the curing agent is selected from one or two of linear phenolic resin and polyfunctional phenolic resin, and the melt viscosity of the curing agent at 150 ℃ is not more than 1.5 Pa.s;
the coupling agent is any one of azole compounds shown in a formula 1, or a mixture of any one of azole compounds shown in the formula 1 and a compound shown in a formula 2; when the coupling agent is a mixture of any one of azole compounds shown in formula 1 and a compound shown in formula 2, the weight of the azole compounds shown in formula 1 accounts for at least 22.5 percent of the total weight of the coupling agent mixture; the coupling agent shown in the formula 1 is 1,2, 4-triazole, 3-mercapto-1, 2, 4-triazole or 3-amino-1, 2, 4-triazole;
the solid filler is selected from fused silica powder;
the accelerator is selected from 2-ethyl-4-methylimidazole;
the low-stress modifier is selected from organosilicon modified epoxy resin;
the release agent is selected from carnauba wax;
the ion scavenger is selected from hydrotalcite;
the flame retardant is selected from zinc borate;
the colorant is selected from carbon black.
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