CN114361117A - Preparation method of heat dissipation substrate and heat dissipation substrate - Google Patents
Preparation method of heat dissipation substrate and heat dissipation substrate Download PDFInfo
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- CN114361117A CN114361117A CN202111623166.5A CN202111623166A CN114361117A CN 114361117 A CN114361117 A CN 114361117A CN 202111623166 A CN202111623166 A CN 202111623166A CN 114361117 A CN114361117 A CN 114361117A
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Abstract
The invention discloses a preparation method of a heat dissipation substrate and the heat dissipation substrate. The preparation method of the heat dissipation substrate comprises the following steps: the embedding component comprises a metal block and a ceramic block, wherein the metal block is in welded connection with the metal heat dissipation plate; the circuit substrate is manufactured on the metal heat dissipation plate and comprises an insulating substrate, a through hole for accommodating the embedded assembly and circuit patterns arranged on the outer surface of the insulating substrate. The circuit pattern is arranged on the insulating substrate, the embedded component is arranged in the circuit substrate, the embedded component comprises the ceramic block welded on the metal heat radiating plate and the metal block arranged on the ceramic block, the heat conducting and voltage resisting performances are excellent, and the problem that the substrate is deformed and even cracks are generated due to large difference of thermal expansion coefficients between ceramic and metal in the existing heat radiating substrate is effectively solved.
Description
Technical Field
The invention relates to a heat dissipation substrate and a preparation method thereof.
Background
Conventionally, a heat dissipation substrate used for a power device generally includes a circuit substrate and a metal heat dissipation plate provided on a heat dissipation surface side of the circuit substrate. In order to achieve the purposes of high current carrying, high voltage resistance, rapid heat dissipation and the like, the circuit substrate usually adopts a structure for manufacturing a metallized circuit on a ceramic plate, and the structure needs to adopt a ceramic plate with a large area, but because the difference of the thermal expansion coefficients between the ceramic and the metal is large, the ceramic plate, the metal circuit and the metal heat dissipation plate interface can generate large interface stress in the process of cold and heat circulation, and further the deformation of the heat dissipation substrate is caused, even cracks are generated.
Disclosure of Invention
The present invention provides a method for manufacturing a heat dissipation substrate and a heat dissipation substrate, which can solve or reduce the defect of deformation and even crack generation of the heat dissipation substrate caused by a large difference between thermal expansion coefficients of ceramic and metal while maintaining excellent thermal conductivity and voltage resistance of the heat dissipation substrate.
In order to achieve the above main object, a first aspect of an embodiment of the present invention provides a method for manufacturing a heat dissipation substrate, including the steps of:
the embedding component comprises a metal block and a ceramic block, wherein the metal block is in welded connection with the metal heat dissipation plate;
the circuit substrate is manufactured on the metal heat dissipation plate and comprises an insulating substrate, a through hole for accommodating the embedded assembly and circuit patterns arranged on the outer surface of the insulating substrate.
According to one embodiment of the invention, the method comprises the following steps: and performing windowing treatment on the bonding sheet and the outer core plate with the outer surface coated with the metal foil, then stacking the outer core plate on the metal heat dissipation plate, and arranging the bonding sheet between the outer core plate and the metal heat dissipation plate for hot pressing.
According to another embodiment of the invention, the method comprises the following steps: windowing the bonding sheet, the outer core plate and the metal foil, then stacking the outer core plate and the metal foil on the metal heat dissipation plate, and arranging the bonding sheet between the outer core plate and the metal heat dissipation plate and between the outer core plate and the metal foil for hot pressing.
Further, step two can also include: and carrying out windowing treatment on the inner core plate, and alternately arranging bonding sheets and the inner core plate between the metal heat dissipation plate and the outer core plate.
Further, step two can also include: and removing the adhesive material flowing to the surface of the heat dissipation substrate after hot pressing.
Further, step two can also include: and after hot pressing, manufacturing a metal connecting layer for connecting the metal foil and the metal block on the surface of the heat dissipation substrate, and carrying out graphical etching on the metal foil and the metal connecting layer to form a circuit pattern.
According to an embodiment of the invention, the ceramic block and the metal heat dissipation plate are connected by welding with active solder.
In order to achieve the above-described main object, a second aspect of an embodiment of the present invention provides a heat dissipation substrate including a metal heat dissipation plate and a circuit substrate disposed on the metal heat dissipation plate; the circuit substrate comprises an insulating substrate and a circuit pattern arranged on the outer surface of the insulating substrate; the circuit substrate is provided with at least one through hole along the thickness direction, an embedding component is arranged in the through hole, and the embedding component comprises a ceramic block welded on the metal heat dissipation plate and a metal block arranged on the ceramic block.
Preferably, the ceramic block is an aluminum nitride, silicon nitride or aluminum oxide ceramic block, and the metal block is a copper block.
Preferably, the surface of the heat dissipation substrate is provided with a metal connection layer, and the circuit pattern is electrically connected with at least a part of the metal block of the embedded component through the metal connection layer.
The embedded component is arranged in the circuit substrate and comprises the ceramic block welded on the metal heat dissipation plate and the metal block arranged on the ceramic block, when the embedded component is used, the power device can be arranged on the embedded component, heat generated by the power device is quickly conducted to the metal heat dissipation plate through the metal block and the ceramic block, and the ceramic block can well electrically insulate the metal block and the metal heat dissipation plate, so that the heat dissipation substrate has excellent heat conduction voltage resistance; furthermore, the circuit pattern is arranged on the insulating substrate, so that the area of the ceramic in the radiating substrate can be obviously reduced, and the problem that the substrate is deformed and even cracks are generated due to large difference of thermal expansion coefficients between the ceramic plate and metal in the existing radiating substrate is effectively solved or reduced.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation substrate in embodiment 1 of the present invention;
FIG. 2 is a schematic view of a metal heat sink with embedded components soldered thereto;
fig. 3 is a schematic structural diagram of a circuit substrate according to embodiment 1 of the present invention;
fig. 4 is a schematic structural view of the circuit substrate after being laminated in embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a heat dissipation substrate in embodiment 2 of the present invention;
fig. 6 is a schematic structural view of a circuit substrate according to embodiment 2 of the present invention;
fig. 7 is a schematic structural view of a heat dissipation substrate in embodiment 3 of the present invention;
FIG. 8 is a schematic structural view of an embedded component manufactured in embodiment 3 of the present invention;
fig. 9 is a schematic structural view of a heat dissipation substrate in embodiment 4 of the present invention;
fig. 10 is a schematic structural view of a circuit substrate according to embodiment 4 of the present invention;
fig. 11 is a schematic structural diagram of a heat dissipation substrate in embodiment 5 of the present invention.
It should be noted that, in order to clearly illustrate the structures that are being represented, the various parts of the drawings may not be drawn to the same scale. Therefore, unless explicitly stated otherwise, the drawings do not limit the dimensions and proportional relationships of the heat dissipation substrate.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below. It should be noted that, in the case of no conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other, and partial description of different embodiments may be omitted because of mutual reference.
Example 1
As shown in fig. 1, the heat dissipating substrate of embodiment 1 includes a metal heat dissipating plate 10 and a circuit substrate 20 disposed on the metal heat dissipating plate 10, and the circuit substrate 20 includes an insulating substrate and a circuit pattern 22 disposed on an outer surface of the insulating substrate. The circuit substrate 20 is provided with one or more through holes along the thickness direction thereof, the embedded component 30 is provided in the through hole, and the embedded component 30 includes a ceramic block 31 welded to the metal heat sink 10 and a metal block 32 provided on the ceramic block 31. The embedded component 30 is adapted to the shape of the through hole, and may be, for example, a circle, a square or an ellipse, which is not limited by the present invention.
In the embodiment of the present invention, the metal heat dissipation plate 10 may be a copper plate, an aluminum plate, or an aluminum-copper composite plate, and the thickness thereof may not be limited. In an alternative embodiment, the thickness of the metal heat dissipation plate 10 is 1mm to 5mm, for example, a copper plate with a thickness of 3mm is used.
In the embodiment of the present invention, the ceramic block 31 may be a silicon nitride, aluminum nitride or aluminum oxide ceramic block, preferably an aluminum nitride or silicon nitride ceramic block; the thickness of the ceramic block 31 may be 0.1mm to 1.5mm, preferably 0.2mm to 0.8mm, but the present invention is not limited thereto. The metal block 32 may be a copper block, and the thickness thereof may be 0.1mm to 1.0mm, and preferably 0.3mm to 0.8mm, but the present invention is not limited thereto.
In embodiment 1, the insulating substrate includes an outer core board 211 and an adhesive sheet 212, the outer core board 211 is adhesively connected to the metal heat dissipation plate 10 by the adhesive sheet 212, and the circuit pattern 22 is formed on the outer surface of the outer core board 211. In the embodiment of the present invention, the outer core board 211 may be an FR-4 core board, and the bonding sheet 212 may be a prepreg, but the present invention is not limited thereto.
The method for manufacturing the heat dissipating substrate of embodiment 1 includes a step of soldering the embedded component 30 at a predetermined position of the metal heat dissipating plate 10 and a step of manufacturing the circuit substrate 20 on the metal heat dissipating plate 10.
In an alternative embodiment, as shown in fig. 2, the metal block 32 is welded to the ceramic block 31 using an active solder while the ceramic block 31 is welded to the metal heat dissipation plate 10 using an active solder. Alternatively, the metal block 32 may be welded to the ceramic block 31, and then the ceramic block 31 may be welded to the metal heat sink 10, or vice versa. The metal block 32 may also be formed directly on the ceramic block 31 without an active solder therebetween, but in direct contact therewith, to achieve better thermal conductivity.
As shown in fig. 3, the manufacturing of the circuit substrate 20 in embodiment 1 includes: the bonding sheet 212 and the outer core board 211, the outer surface of which is covered with the metal foil 220 (preferably copper foil), are subjected to a windowing process to form a through hole for accommodating the embedded component 30; the outer core plate 211 is stacked on the metal heat dissipation plate 10, and a bonding sheet 212 is provided between the outer core plate 211 and the metal heat dissipation plate 10 to perform hot pressing.
As shown in fig. 4, the surface of the metal foil 220 and the metal block 32 are substantially flush after hot pressing. In addition, the bonding sheet 212 may flow to the surface of the heat dissipation substrate during the hot pressing process, and the preparation method of the embodiment may include a step of grinding the heat dissipation substrate in order to remove the adhesive material flowing to the surface of the heat dissipation substrate. In other embodiments of the present invention, a chemical glue removing method may also be used to remove the adhesive material flowing to the surface of the heat dissipation substrate after the hot pressing.
In the embodiment of the invention, after the hot pressing, the metal connection layer 40 connecting the metal foil 220 and the metal block 32 may be formed on the surface of the heat dissipation substrate, and the metal foil 220 and the metal connection layer 40 may be patterned and etched to form the circuit pattern 22. In the embodiment of the present invention, the thickness of the circuit pattern 22 may be 0.1mm to 1mm, and more specifically, may be 0.3mm to 0.8mm, but the present invention is not limited thereto.
In an embodiment of the present invention, the circuit pattern 22 may be electrically connected to at least a portion of the metal block 32 of the embedded component 30 through the metal connection layer 40. It should be noted that the metal connection layer 40 is not necessary, and for example, when the metal block 32 does not need to be electrically connected to the circuit pattern 22, the surface of the heat dissipation substrate may not have the metal connection layer 40.
Example 2
As shown in fig. 5, in the heat dissipating substrate of embodiment 2, the insulating substrate includes an outer core board 211, and both surfaces of the outer core board 211 are adhesively connected to the metal heat dissipating plate 10 and the circuit pattern 22 by adhesive sheets 212, respectively.
As shown in fig. 6, the manufacturing of the circuit substrate 20 in embodiment 2 includes: windowing the bonding sheet 212, the metal foil 220 and the outer core panel 211 to form a through hole accommodating the embedded component 30; the outer core board 211 and the metal foil 220 are stacked on the metal heat dissipation plate 10, and the bonding sheets 212 are provided between the outer core board 211 and the metal heat dissipation plate 10 and between the outer core board 211 and the metal foil 220 for hot pressing.
Other aspects of embodiment 2 can be referred to embodiment 1, and are not described again.
Example 3
As shown in fig. 7, in the heat dissipating substrate of embodiment 3, the embedded component 30 includes a ceramic block 31 and a metal block 32 directly formed on the ceramic block 32, the area of the metal block 32 is smaller than that of the ceramic block 31, and the side edge of the metal block 32 is recessed from the side edge of the ceramic block 31.
In embodiment 3, the embedded component 30 may be obtained by processing a ceramic metal composite plate 300, and the ceramic metal composite plate 300 includes a ceramic plate 310 and a metal layer 320 formed on a surface of the ceramic plate. Specifically, as shown in fig. 8, a predetermined region of the metal layer 320 may be first etched to form a metal block 32 having an area smaller than that of the ceramic block 31, and then the ceramic plate 310 may be cut along a predetermined cutting line, thereby obtaining the embedded component 30.
The metal block 32 is formed by etching the metal layer 320, and the metal layer 320 is not cut when the ceramic plate 310 is cut, so that burrs generated by cutting the metal layer 320 are avoided, the production efficiency is improved, and the problem that the product quality is affected by burrs generated on the side edge of the metal block 32 is solved.
Other aspects of embodiment 3 can be found in embodiments 1 or 2, and are not described in detail.
Example 4
As shown in fig. 9, in the heat dissipating substrate of embodiment 4, the insulating substrate includes an inner core board 213 disposed between an outer core board 211 and a metal heat dissipating board 10. The inner core 213 may be one or more layers, and may be specifically configured according to the thickness requirement of the insulating substrate, which is not limited by the present invention.
As shown in fig. 10, the manufacturing of the circuit board 20 in embodiment 4 includes: firstly, the bonding sheet 212, the metal foil 220, the outer core board 211 and the inner core board 213 are subjected to windowing treatment to form a through hole for accommodating the embedded component 30; then, the outer core board 211 is stacked on the metal heat dissipation plate 10 with the metal foil 220 facing upward, and the bonding sheets 212 and the inner core board 213 are alternately disposed between the outer core board 211 and the metal heat dissipation plate 10 for hot pressing.
It is easy to understand that in embodiment 3, the bonding sheets 212 and the inner core plates 213 may be alternately disposed between the outer core plate 211 and the metal heat dissipation plate 10 for hot pressing.
Example 5
In the embodiment of the present invention, the metal heat dissipation plate 10 may have a non-planar structure such as a heat dissipation fin to increase the heat dissipation area; further, a heat dissipation fluid channel may be formed in the metal heat dissipation plate 10.
As shown in fig. 11, in the heat dissipation substrate of embodiment 5, the heat dissipation fins 12 are formed on the metal heat dissipation plate 10, and the heat dissipation fluid channel 11 is formed in the metal heat dissipation plate 10, so that a heat conduction fluid such as cooling water can be introduced into the heat dissipation fluid channel 11 during operation to promote heat dissipation.
In other embodiments of the present invention, an inner circuit may be further fabricated on the inner surface of the outer core board 211 and/or the inner core board 213, and the specific fabrication steps of the inner circuit may be the same as those in the prior art, and are not described herein again.
Although the present invention has been described above by way of examples, it should be understood that the above examples are merely illustrative of possible embodiments of the present invention and should not be construed as limiting the scope of the present invention, and that equivalent variations made by those skilled in the art in light of the present invention are intended to be covered by the scope of the appended claims.
Claims (10)
1. A preparation method of a heat dissipation substrate is characterized by comprising the following steps:
the method includes the steps that an embedding component is welded at a preset position of a metal radiating plate, and the embedding component comprises a metal block and a ceramic block, wherein the metal block is welded with the metal radiating plate, and the ceramic block is arranged on the metal block;
the circuit substrate is manufactured on the metal heat dissipation plate and comprises an insulating substrate, a through hole for accommodating the embedded component and a circuit pattern arranged on the outer surface of the insulating substrate.
2. The preparation method according to claim 1, characterized in that the steps of: windowing is carried out on the bonding sheet and the outer core plate with the outer surface covered with the metal foil, then the outer core plate is stacked on the metal heat dissipation plate, and the bonding sheet is arranged between the outer core plate and the metal heat dissipation plate for hot pressing.
3. The preparation method according to claim 1, characterized in that the steps of: windowing is conducted on the bonding sheets, the outer core board and the metal foil, then the outer core board and the metal foil are stacked on the metal heat dissipation board, and the bonding sheets are arranged between the outer core board and the metal heat dissipation board and between the outer core board and the metal foil for hot pressing.
4. The method for preparing a composite material according to claim 2 or 3, characterized by comprising the following steps: and carrying out windowing treatment on the inner core plate, and alternately arranging the bonding sheets and the inner core plate between the metal heat dissipation plate and the outer core plate.
5. The method for preparing a composite material according to claim 2 or 3, characterized by comprising the following steps: and removing the adhesive material flowing to the surface of the heat dissipation substrate after hot pressing.
6. The method for preparing a composite material according to claim 2 or 3, characterized by comprising the following steps: and after hot pressing, manufacturing a metal connecting layer for connecting the metal foil and the metal block on the surface of the heat dissipation substrate, and carrying out graphical etching on the metal foil and the metal connecting layer to form the circuit pattern.
7. The method of claim 1, wherein: the ceramic block and the metal heat dissipation plate are connected through active solder in a welding mode.
8. A heat dissipation substrate comprises a metal heat dissipation plate and a circuit substrate arranged on the metal heat dissipation plate, wherein the circuit substrate comprises an insulating substrate and a circuit pattern arranged on the outer surface of the insulating substrate; the method is characterized in that: the circuit substrate is provided with at least one through hole along the thickness direction, an embedded component is arranged in the through hole and comprises a ceramic block welded on the metal heat dissipation plate and a metal block arranged on the ceramic block.
9. The heat dissipating substrate according to claim 8, wherein: the ceramic block is an aluminum nitride, silicon nitride or aluminum oxide ceramic block, and the metal block is a copper block.
10. The heat dissipating substrate according to claim 8, wherein: the surface of the heat dissipation substrate is provided with a metal connecting layer, and the circuit pattern is electrically connected with at least one part of the metal block of the embedded component through the metal connecting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111623166.5A CN114361117A (en) | 2021-12-28 | 2021-12-28 | Preparation method of heat dissipation substrate and heat dissipation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111623166.5A CN114361117A (en) | 2021-12-28 | 2021-12-28 | Preparation method of heat dissipation substrate and heat dissipation substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114361117A true CN114361117A (en) | 2022-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111623166.5A Pending CN114361117A (en) | 2021-12-28 | 2021-12-28 | Preparation method of heat dissipation substrate and heat dissipation substrate |
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| Country | Link |
|---|---|
| CN (1) | CN114361117A (en) |
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2021
- 2021-12-28 CN CN202111623166.5A patent/CN114361117A/en active Pending
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