CN114353476A - Method for improving drying of monocrystalline silicon wafer - Google Patents
Method for improving drying of monocrystalline silicon wafer Download PDFInfo
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- CN114353476A CN114353476A CN202210014271.7A CN202210014271A CN114353476A CN 114353476 A CN114353476 A CN 114353476A CN 202210014271 A CN202210014271 A CN 202210014271A CN 114353476 A CN114353476 A CN 114353476A
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- basket
- flower basket
- lifting mechanism
- drying
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Abstract
The invention belongs to the technical field of monocrystalline cells, and particularly relates to a method for improving drying of monocrystalline silicon wafers. Specifically, improve the basket of flowers support of cell body, by the original motionless basket of flowers support, through increasing elevating system for the basket of flowers support, make it slowly go up and down at the stoving in-process, make the basket of flowers have certain inclination when drying, utilize the hot nitrogen gas flow that gravity and stoving time let in, make each silicon chip remove between two adjacent basket of flowers teeth in the basket of flowers, thereby avoid silicon chip and basket of flowers to adsorb because of the surface tension of water together, improve the condition of the stoving difficulty that arouses because of the contact of silicon chip and basket of flowers. The invention reduces the temperature of the silicon wafer drying process, shortens the drying process time, can effectively degrade energy consumption and saves cost; meanwhile, the number of liquid-carrying pieces after drying can be reduced, and the product yield is improved.
Description
Technical Field
The invention belongs to the technical field of monocrystalline cells, and particularly relates to a method for improving drying of a monocrystalline silicon wafer.
Background
The conventional single crystal cell production process comprises the following steps: texturing, diffusion, alkali polishing, annealing, SiNx film coating, screen printing, sintering, sorting and detection. Both texturing and groove type alkali polishing relate to dehydration and drying of silicon wafers after the process is finished.
After texturing and groove type alkali polishing are finished, the surface of the silicon wafer is cleaned by mixed acid of HF and HCl to increase hydrophobicity, the silicon wafer is subjected to pre-dehydration after passing through a slow lifting groove, and finally hot nitrogen is used for drying the silicon wafer to remove water on the surface of the silicon wafer. In the drying process, because the silicon wafer is in contact with the bearing flower basket, the moisture at the contact position of the silicon wafer and the flower basket is not easy to be dried, and the temperature of the drying gas needs to be increased and the drying time needs to be prolonged for achieving the drying effect. The higher drying temperature and the longer drying time bring greater energy consumption and consumption of drying gas, which are unfavorable to the control of production cost; in addition, when the current drying tank works, the flower basket bearing the silicon wafers is fixed in the tank body, and the silicon wafers are easily adsorbed together due to the surface tension of water when contacting with the flower basket, so that the drying of the surfaces of the silicon wafers by hot nitrogen is not facilitated.
Disclosure of Invention
The invention aims to solve the problem that liquid carrying condition of a silicon wafer is generated due to incomplete drying of a monocrystalline silicon wafer caused by contact of the monocrystalline silicon wafer and a basket in the drying process of monocrystalline texturing or trough type alkali polishing, and provides a method for improving drying of the monocrystalline silicon wafer.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a method for improving the drying of a monocrystalline silicon wafer comprises the following steps:
s1, placing a flower basket into a drying groove, and keeping a flower basket support lifting mechanism A and a flower basket support lifting mechanism B in a horizontally aligned position, wherein silicon wafers in the flower basket are in a disordered state;
s2, controlling the lifting mechanism A of the flower basket support to slowly descend in a direction vertical to a horizontal plane, and simultaneously controlling the lifting mechanism B of the flower basket support to slowly ascend in a direction vertical to the horizontal plane, wherein in the process, silicon wafers in the flower basket are influenced by gravity and airflow of hot nitrogen and are consistently leaned against a flower basket direction a with a lower position, and one surface of the silicon wafer which is not in contact with teeth of the flower basket in the flower basket direction B is dried;
s3, controlling the lifting mechanism A of the flower basket support to slowly rise in a direction vertical to the horizontal plane, and simultaneously controlling the lifting mechanism B of the flower basket support to slowly fall in a direction vertical to the horizontal plane, wherein in the process, the silicon wafers in the flower basket are influenced by gravity and the airflow of hot nitrogen and are consistently leaned to a flower basket direction B with a lower position, and one surface of the silicon wafer which is not contacted with the teeth of the flower basket in the flower basket direction a is dried;
and S4, controlling the flower basket support lifting mechanism A to slowly descend in the direction vertical to the horizontal plane, and simultaneously controlling the flower basket support lifting mechanism B to slowly ascend in the direction vertical to the horizontal plane, so that the flower basket support lifting mechanism A and the flower basket support lifting mechanism B are in a horizontally aligned position, and finishing drying.
Furthermore, the flower basket support lifting mechanism A and the flower basket support lifting mechanism B are pneumatic lifting mechanisms, and double-stroke or three-stroke lifting is realized through the air cylinder and double guide rods or four guide rods.
Furthermore, one row of the basket teeth is arranged on the inner bottom surface of the basket support, and the other row of the basket teeth is arranged above the inner middle of the basket support.
Furthermore, the tangent plane shape of the basket teeth on the inner bottom surface of the basket support is regular triangle, and the tangent plane shape of the basket teeth at the middle upper part in the basket support is square.
Further, the number of the silicon wafers is 21.
According to the invention, the drying groove is optimized, so that the states of the silicon wafer and the flower basket in the drying groove are changed, and the moisture between the silicon wafer and the flower basket is easier to dry. Specifically, improve the basket of flowers support of cell body, by the original motionless basket of flowers support, through increasing elevating system for the basket of flowers support, make it slowly go up and down at the stoving in-process, make the basket of flowers have certain inclination when drying, utilize the hot nitrogen gas flow that gravity and stoving time let in, make each silicon chip remove between two adjacent basket of flowers teeth in the basket of flowers, thereby avoid silicon chip and basket of flowers to adsorb because of the surface tension of water together, improve the condition of the stoving difficulty that arouses because of the contact of silicon chip and basket of flowers.
Compared with the prior art, the invention reduces the temperature of the silicon wafer drying process, shortens the drying process time, can effectively degrade energy consumption and saves cost; meanwhile, the number of liquid-carrying pieces after drying can be reduced, and the product yield is improved.
Drawings
FIG. 1 shows a first basket state during the drying process of the method of the present invention;
FIG. 2 shows a second basket state during the drying process of the method of the present invention;
FIG. 3 shows a third basket of flowers during the drying process of the method of the present invention;
the designations in FIGS. 1-3 have the following meanings: the silicon wafer drying machine comprises a 1-basket, a 2-basket support lifting mechanism A, a 3-basket support lifting mechanism B, 4-silicon wafers, a 5-basket direction a, a basket direction B6, basket teeth 7, a drying groove 8 and a basket support 9.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to examples. Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention. It should be understood that the following description is only for the purpose of illustrating the present invention and is not intended to limit the present invention, and the methods in the following examples are conventional in the art, unless otherwise specified.
The following detailed description of specific embodiments of the invention refers to the accompanying drawings.
A method for improving the drying of a monocrystalline silicon wafer comprises the following steps:
s1, when a flower basket 1 is just placed into a drying groove 8, keeping a flower basket support lifting mechanism A2 and a flower basket support lifting mechanism B3 in a horizontally aligned position, and keeping the flower basket 1 in a state I shown in figure 1, wherein silicon wafers 4 in the flower basket 1 are in a disordered state;
s2, controlling the lifting mechanism A2 of the flower basket support to slowly descend in the direction vertical to the horizontal plane, simultaneously controlling the lifting mechanism B3 of the flower basket support to slowly ascend in the direction vertical to the horizontal plane, and finally enabling the flower basket 1 to be in a state II shown in figure 2;
s3, after the drying of the side, not in contact with the teeth 7, of the silicon wafer 4 in the basket direction B6 is completed, controlling the basket support lifting mechanism A2 to slowly lift in the direction vertical to the horizontal plane, and finally, controlling the basket 1 to be in the state III shown in the figure 3, and simultaneously, controlling the basket support lifting mechanism B3 to slowly descend in the direction vertical to the horizontal plane, wherein in the process, the silicon wafer 4 in the basket 1 is influenced by gravity and the airflow of hot nitrogen and consistently leans to the basket direction B6 with a lower position, and the side, not in contact with the teeth 7, of the silicon wafer 4 in the basket direction a 5 is easily dried;
s4, after the drying of the side, which is not in contact with the silicon wafer 4 of the basket teeth 7, of the basket direction a 5 is completed, controlling the basket support lifting mechanism A2 to slowly descend in the direction vertical to the horizontal plane, and simultaneously controlling the basket support lifting mechanism B3 to slowly ascend in the direction vertical to the horizontal plane, so that the basket support lifting mechanism A2 and the basket support lifting mechanism B3 are in the horizontal alignment position, finally, the basket 1 returns to the state I shown in the figure 1, and the drying process is finished.
The flower basket support lifting mechanism A2 and the flower basket support lifting mechanism B3 both adopt the existing pneumatic lifting mechanism and realize double-stroke lifting through the cylinder and the double guide rods.
One row of the basket teeth 7 is arranged on the inner bottom surface of the basket support 9, and the other row is arranged above the inner middle of the basket support 9.
The tangential shape of the basket teeth 7 on the bottom surface in the basket support 9 is a regular triangle, and the tangential shape of the basket teeth 7 at the middle upper part in the basket support 9 is a square.
The number of the silicon wafers 4 is 21.
The above embodiments are merely preferred embodiments of the present invention, and any simple modification, modification and substitution changes made to the above embodiments according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (5)
1. A method for improving the drying of a monocrystalline silicon wafer is characterized by comprising the following steps:
s1, placing a flower basket (1) into a drying groove (8), and keeping a flower basket support lifting mechanism A (2) and a flower basket support lifting mechanism B (3) in a horizontally aligned position, wherein silicon wafers (4) in the flower basket (1) are in a disordered state;
s2, controlling a lifting mechanism A (2) of the flower basket support to slowly descend in a direction vertical to a horizontal plane, and simultaneously controlling a lifting mechanism B (3) of the flower basket support to slowly ascend in a direction vertical to the horizontal plane, wherein in the process, silicon wafers (4) in the flower basket (1) are influenced by gravity and air flow of hot nitrogen and are consistently leaned against a flower basket direction a (5) with a lower position, and one surface, which is not contacted with the silicon wafers (4) of the flower basket teeth (7), in the flower basket direction B (6) is dried;
s3, controlling the lifting mechanism A (2) of the flower basket support to slowly rise in a direction vertical to the horizontal plane, and simultaneously controlling the lifting mechanism B (3) of the flower basket support to slowly fall in a direction vertical to the horizontal plane, wherein in the process, the silicon wafers (4) in the flower basket (1) are influenced by gravity and the airflow of hot nitrogen and are consistently leaned against a flower basket direction B (6) with a lower position, and one surface of the silicon wafers (4) which is not contacted with the flower basket teeth (7) in the flower basket direction a (5) is dried;
and S4, controlling the flower basket support lifting mechanism A (2) to slowly descend in the direction vertical to the horizontal plane, and simultaneously controlling the flower basket support lifting mechanism B (3) to slowly ascend in the direction vertical to the horizontal plane, so that the flower basket support lifting mechanism A (2) and the flower basket support lifting mechanism B (3) are in a horizontally aligned position, and finishing drying.
2. The method for improving the drying of the monocrystalline silicon wafer according to claim 1, wherein the basket support lifting mechanism A (2) and the basket support lifting mechanism B (3) are pneumatic lifting mechanisms, and double-stroke or three-stroke lifting is realized through a cylinder and double guide rods or four guide rods.
3. The method for improving the drying of the monocrystalline silicon wafers as claimed in claim 1, wherein one row of the basket teeth (7) is arranged on the inner bottom surface of the basket support (9), and the other row is arranged above the inner middle of the basket support (9).
4. The method for improving the drying of the monocrystalline silicon wafers as claimed in claim 3, wherein the shape of the tangent plane of the basket teeth (7) on the inner bottom surface of the basket support (9) is regular triangle, and the shape of the tangent plane of the basket teeth (7) at the middle upper part in the basket support (9) is square.
5. The method for improving the baking of the monocrystalline silicon wafer according to claim 1, wherein the number of the silicon wafers (4) is 21.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210014271.7A CN114353476A (en) | 2022-01-04 | 2022-01-04 | Method for improving drying of monocrystalline silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210014271.7A CN114353476A (en) | 2022-01-04 | 2022-01-04 | Method for improving drying of monocrystalline silicon wafer |
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| CN202210014271.7A Pending CN114353476A (en) | 2022-01-04 | 2022-01-04 | Method for improving drying of monocrystalline silicon wafer |
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Citations (10)
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| KR20080010997A (en) * | 2006-07-28 | 2008-01-31 | 주식회사 하이닉스반도체 | Wafer drying method |
| CN101435655A (en) * | 2008-12-19 | 2009-05-20 | 江苏三联生物工程有限公司 | Method and tool for drying hard substrate biological chips |
| TWM446970U (en) * | 2012-08-07 | 2013-02-11 | Sino American Silicon Prod Inc | Wafer drying device |
| CN203607381U (en) * | 2013-11-19 | 2014-05-21 | 有研半导体材料股份有限公司 | Wafer sorter capable of reducing wafer surface contamination |
| CN203629225U (en) * | 2013-12-11 | 2014-06-04 | 天津中环新光科技有限公司 | Drying machine for wafers |
| CN103868329A (en) * | 2011-12-31 | 2014-06-18 | 聚灿光电科技(苏州)有限公司 | High efficiency drying flower basket |
| CN206637959U (en) * | 2017-03-20 | 2017-11-14 | 东方日升（洛阳）新能源有限公司 | A kind of groove type etching drying unit for adjusting support plate lifting |
| US20180151348A1 (en) * | 2016-11-28 | 2018-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for drying wafer with gaseous fluid |
| CN210110816U (en) * | 2019-03-29 | 2020-02-21 | 山西潞安太阳能科技有限责任公司 | Clamping tooth of silicon wafer carrier flower basket |
| CN212934645U (en) * | 2020-09-29 | 2021-04-09 | 常州时创能源股份有限公司 | Groove type polishing device for silicon wafer |
-
2022
- 2022-01-04 CN CN202210014271.7A patent/CN114353476A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080010997A (en) * | 2006-07-28 | 2008-01-31 | 주식회사 하이닉스반도체 | Wafer drying method |
| CN101435655A (en) * | 2008-12-19 | 2009-05-20 | 江苏三联生物工程有限公司 | Method and tool for drying hard substrate biological chips |
| CN103868329A (en) * | 2011-12-31 | 2014-06-18 | 聚灿光电科技(苏州)有限公司 | High efficiency drying flower basket |
| TWM446970U (en) * | 2012-08-07 | 2013-02-11 | Sino American Silicon Prod Inc | Wafer drying device |
| CN203607381U (en) * | 2013-11-19 | 2014-05-21 | 有研半导体材料股份有限公司 | Wafer sorter capable of reducing wafer surface contamination |
| CN203629225U (en) * | 2013-12-11 | 2014-06-04 | 天津中环新光科技有限公司 | Drying machine for wafers |
| US20180151348A1 (en) * | 2016-11-28 | 2018-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for drying wafer with gaseous fluid |
| CN206637959U (en) * | 2017-03-20 | 2017-11-14 | 东方日升（洛阳）新能源有限公司 | A kind of groove type etching drying unit for adjusting support plate lifting |
| CN210110816U (en) * | 2019-03-29 | 2020-02-21 | 山西潞安太阳能科技有限责任公司 | Clamping tooth of silicon wafer carrier flower basket |
| CN212934645U (en) * | 2020-09-29 | 2021-04-09 | 常州时创能源股份有限公司 | Groove type polishing device for silicon wafer |
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Application publication date: 20220415 |