CN201387879Y - Non-water stain substrate cleaning and drying device - Google Patents
Non-water stain substrate cleaning and drying device Download PDFInfo
- Publication number
- CN201387879Y CN201387879Y CN200920126840U CN200920126840U CN201387879Y CN 201387879 Y CN201387879 Y CN 201387879Y CN 200920126840 U CN200920126840 U CN 200920126840U CN 200920126840 U CN200920126840 U CN 200920126840U CN 201387879 Y CN201387879 Y CN 201387879Y
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- substrate
- drying
- gas
- clearing
- clean container
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Abstract
The utility model relates to a non-water stain substrate cleaning and drying device, wherein a substrate cleaning container and a substrate gas drying chamber are used for cleaning substrates and drying the substrates at room temperature through drying gas, a substrate drying container is used for drying the substrates at high temperature through drying gas, and a substrate transfer component is used to transfer the substrates from the substrate cleaning container to the substrate drying container. Two step drying methods of room temperature drying gas and high temperature drying gas are adopted, the requirements of technique to substrate relative humidity can be satisfied, edge shapes on the upper portion of a bottom supporting block of a substrate supporting frame are utilized, water stain on the bottom of the substrates can be effectively reduced or eliminated, and thereby the production efficiency and the substrate finished product rate can be improved.
Description
Technical field
The utility model relates to a kind of anhydrous mark substrate clearing and drying device; specifically; relate to being used to produce the circular silicon chip of semiconductor wafer; the glass, pottery and the aluminium matter circular substrate that are used for scheduler magnetic recording memory (HDD) medium; be used to produce optical recording memory CD (CD), digital versatile disc (DVD) plastics circular substrate; be used for producing polishing, the cleaning device of the glass circular substrate of optics, the device of anhydrous mark cleaning-drying substrate.
Background technology
Circular silicon chip, glass, pottery, plastics and aluminium matter circular substrate are widely used in semiconductor, computer, information industry, reach in the product for civilian use.In the production process of substrate, must mill repeatedly to substrate, chemico-mechanical polishing (CMP, Chemical mechanical polishing), by using the wet clean process of deionized water (DIW) or chemicals, removal remains in chemical substance, granule and other impurity on surface, reduce the surface roughness of substrate, improve any surface finish of substrate, thereby improve the rate of finished products of product.
In existing substrate polishing, cleaning device, substrate is positioned in the substrate clean container by the substrate transmitting assembly is vertical with the substrate lifting assembly, and the cleaning liquid feeding assembly provides substrate clean container cleaning liquid, and the substrate in the substrate clean container is cleaned.After finishing the substrate cleaning step, substrate is sent to the substrate drying receptacle by substrate transmitting assembly and substrate lifting assembly, and substrate is carried out drying steps.
Existing a kind of substrate clearing and drying device, its substrate drying receptacle are installed in substrate clean container top, are combined into holistic substrate clearing and drying device.When the substrate clean container promoted out, the substrate drying receptacle was supplied with and through heated nitrogen substrate is carried out drying at substrate.Because substrate is placed on the substrate support frame, the clean liquid that is positioned at substrate and substrate support bridge joint synapsis can't be discharged when substrate promotes, and the clean liquid of contact position forms the water mark on substrate surface when dry run.Existing another kind of substrate clearing and drying device, its substrate gas hothouse are installed in substrate clean container top, open and close when the substrate transmitting assembly transmits substrate.When the substrate clean container promoted out, substrate gas hothouse was supplied with isopropyl alcohol (IPA) gas of room temperature, and substrate is carried out drying at substrate.In dry run, substrate is placed on the substrate support frame, and the clean liquid that is positioned at substrate and substrate support bridge joint synapsis can't be discharged when substrate promotes, and forms the water mark on substrate surface.Because dry run is at room temperature carried out, the relative humidity of substrate also can't satisfy technological requirement.Thereby reduced the cleaning-drying effect of equipment, thereby influenced the rate of finished products of efficiency of equipment and substrate.
Summary of the invention
In order to overcome the deficiencies in the prior art, the utility model provides a kind of anhydrous mark substrate clearing and drying device, is used for polishing, cleaning device at substrate, and substrate is carried out anhydrous mark cleaning-drying.Being used for substrate of the present utility model can be circular silicon chip, magnetic recording medium substrate, and other circular discoid substrates with similar shape structure.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of anhydrous mark substrate clearing and drying device, it is characterized in that it comprises: the substrate clean container is used to clean substrate; Substrate gas hothouse is used for substrate and supplies with the room temperature dry gas when the substrate clean container promotes; The substrate drying receptacle is used to supply with high temperature drying gas substrate is carried out the high-temperature gas drying; And the substrate transmitting assembly, be used for substrate is sent to the substrate drying receptacle from the substrate clean container; Wherein, substrate gas hothouse is arranged in the top of substrate clean container, substrate clean container and substrate drying receptacle parallel arranged, and the substrate transmitting assembly is arranged in a side of substrate clean container and substrate drying receptacle.
The anhydrous mark substrate of the utility model clearing and drying device adopts drying at room temperature gas two step seasonings dry and high temperature drying gas drying in the substrate drying receptacle in the substrate clean container.After the drying of the drying at room temperature gas of finishing the substrate clean container, the substrate transmitting assembly takes out the substrate support frame of substrate from the substrate clean container, because the lip-deep water mark of the dry meron of drying at room temperature gas is not dried, under the effect of gravity, the water mark flows to substrate bottom (six o'clock place) along substrate edge.The substrate transmitting assembly is sent to the substrate drying receptacle with substrate, the point of a knife shape is formed at the bottom support piece top at its substrate support frame, when substrate is put into the substrate support frame, the point of a knife shape on bottom support piece top contacts with the water mark of substrate bottom, the water mark is along under the point of a knife surface current, thereby reduces or eliminated the water mark of substrate bottom.Because the substrate drying receptacle adopts the drying of high temperature drying gas, after the substrate drying, the relative humidity of substrate can satisfy the requirement of technology simultaneously.
Aforesaid anhydrous mark substrate clearing and drying device, wherein substrate slowly is promoted to substrate gas hothouse from the substrate clean container.
Aforesaid anhydrous mark substrate clearing and drying device, the drying at room temperature gas that wherein is used for substrate gas hothouse are room temperature isopropyl alcohol (IPA) gas.
Aforesaid anhydrous mark substrate clearing and drying device, the high temperature drying gas that wherein is used for the substrate drying receptacle are high temperature drying clean air (CAD) or nitrogen (N2).
Aforesaid anhydrous mark substrate clearing and drying device, the bottom support piece top that wherein is used for the substrate support frame of substrate drying receptacle becomes the point of a knife shape.
Aforesaid anhydrous mark substrate clearing and drying device, wherein the substrate of substrate transmitting assembly picks and places arrangement of components above substrate, and the opening and closing substrate picks and places assembly and picks and places substrate from the substrate support frame.
The beneficial effects of the utility model are, adopt drying at room temperature gas two step seasonings dry and high temperature drying gas drying in the substrate drying receptacle in the substrate clean container, and the relative humidity of substrate satisfies technological requirement; Transmit in the substrate process at the substrate transmitting assembly, utilize the point of a knife shape on bottom support piece top of the substrate support frame of substrate drying receptacle, reduce or eliminated the water mark of substrate bottom effectively; Thereby improved the rate of finished products of efficiency of equipment and substrate.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the perspective view of the anhydrous mark substrate of the utility model clearing and drying device embodiment.
Fig. 2 is the front organigram of the anhydrous mark substrate of the utility model clearing and drying device embodiment.
Fig. 3 is the substrate transmitting assembly perspective view of the anhydrous mark substrate of the utility model clearing and drying device embodiment.
Fig. 4 is that the substrate water mark of the anhydrous mark substrate of the utility model clearing and drying device embodiment flows to schematic diagram.
Fig. 5 is the substrate and the substrate support frame perspective view of the substrate drying receptacle of the anhydrous mark substrate of the utility model clearing and drying device embodiment.
Fig. 6 is the substrate and the substrate support frame front organigram of the substrate drying receptacle of the anhydrous mark substrate of the utility model clearing and drying device embodiment.
Embodiment
The anhydrous mark substrate of the utility model clearing and drying device is used for polishing, cleaning device at substrate, and substrate is carried out anhydrous mark cleaning-drying.Wherein related substrate, comprise the circular silicon chip that is used to produce semiconductor wafer, the glass, pottery and the aluminium matter circular substrate that are used for scheduler magnetic recording storage medium, be used to produce the plastics circular substrate of optical recording memory CD, digital versatile disc, and be used to produce the glass circular substrate of optics.For convenience of description, mentioned " substrate " is the above-mentioned various substrates of expression among the embodiment below, represents with 101.
Fig. 1 is the perspective view of the anhydrous mark substrate of the utility model clearing and drying device embodiment.In the embodiment shown in fig. 1, anhydrous mark substrate clearing and drying device is by substrate clean container 103, and substrate gas hothouse 105, substrate drying receptacle 104 and substrate transmitting assembly 115 are installed in device support stand 102 and constitute.Substrate clean container 103 and substrate drying receptacle 104 parallel being arranged on the device support stand 102.Substrate gas hothouse 105 is arranged in 103 tops of substrate clean container, opens and closes when substrate transmitting assembly 115 transmits substrate 101.One drying receptacle lid 106 is installed on substrate drying receptacle 104, when substrate transmitting assembly 115 transmits substrate 101 turnover substrate drying receptacles 104, is opened and close.Substrate transmitting assembly 115 is arranged in a side of substrate clean container and substrate drying receptacle, is driven by transmission component 107.
Fig. 2 is the front organigram of the anhydrous mark substrate of the utility model clearing and drying device embodiment.As shown in Figure 2, its cleaning-drying process is:
After finishing cleaning and drying at room temperature gas drying, substrate gas hothouse 105 is opened along direction 131, and substrate 101 is promoted to substrate transmitting assembly 115 with the substrate support frame by the substrate lifting assembly.Substrate transmitting assembly 115 takes out substrate 101 from the substrate support frame, along direction 130 substrate 101 is delivered to substrate drying receptacle 104 tops.Drying receptacle lid 106 is opened along direction 132, by substrate lifting assembly (not shown) substrate 101 is placed on the substrate support frame of substrate gas hothouse 105 again.And meron 101 is sent in the substrate drying receptacle 104 by the substrate lifting assembly with the substrate support frame, and drying receptacle lid 106 is closed.The dry gas feeding assembly 109 of substrate drying receptacle 104 is supplied with high temperature drying gas, and substrate 101 is carried out high temperature drying gas drying.The high temperature drying of substrate 101 can satisfy the relative humidity requirement of technology to substrate 101.
After finishing high temperature drying gas drying, drying receptacle lid 106 is opened along direction 132, the substrate lifting assembly is sent to substrate transmitting assembly 115 with substrate 101 and substrate support frame along direction 134 from substrate drying receptacle 104, by substrate transmitting assembly 115 substrate 101 is taken out from the substrate support frame again and send out clearing and drying device, finish the cleaning-drying process of substrate 101.
In the embodiment of the anhydrous mark substrate of the utility model clearing and drying device, substrate 101 slowly is promoted to substrate gas hothouse 105 by the substrate lifting assembly from substrate clean container 103; The drying at room temperature gas that dry gas feeding assembly 108 in the substrate gas hothouse 105 is supplied with is room temperature isopropyl alcohol (IPA) gas; It is high temperature drying clean air (CAD) or nitrogen (N2) that the dry gas feeding assembly 109 of substrate drying receptacle 104 is supplied with high temperature drying gas.
Fig. 3 is the substrate transmitting assembly perspective view of the anhydrous mark substrate of the utility model clearing and drying device embodiment.As shown in Figure 3, substrate transmitting assembly 115 picks and places assembly 118,119 by substrate, back shaft 116,117, and driven unit 120 constitutes.Driven unit 120 drives back shaft 116,117 and rotates along direction 135, and substrate picks and places assembly 118,119 and is installed on the back shaft 116,117.When picking and placeing substrate 101, driven unit 120 drives back shaft 116,117 and rotates, and opens substrate and picks and places assembly 118,119, and the substrate lifting assembly promotes 101 of substrates and substrate support frame to substrate picks and places assembly 118,119.Then driven unit 120 drives back shaft 116,117 rotations, closes substrate and picks and places assembly 118,119, and substrate lifting assembly and substrate support frame descend, and substrate 101 is taken out from the substrate support frame.Substrate 101 is put into the similar process of substrate support frame.
Fig. 4 is that the substrate water mark of the anhydrous mark substrate of the utility model clearing and drying device embodiment flows to schematic diagram.Because substrate 101 is placed on the substrate support frame, in substrate clean container 103, finish cleaning-drying after because the surface tension of cleaning liquid, substrate 101 lip-deep water marks 125,126 are present in substrate 101 and substrate support bridge joint synapsis, as shown in Figure 4.The anhydrous mark substrate of the utility model clearing and drying device adopt in substrate clean container 103 drying at room temperature gas dry and in substrate drying receptacle 104 the dry two step seasonings of high temperature drying gas; at substrate transmitting assembly 115 the substrate support frame of substrate 101 from substrate clean container 103 taken out; because the lip-deep water mark of the dry meron of drying at room temperature gas 101 125,126 is not dried; under the effect of gravity; water mark 126 according to direction 136,137 along substrate 101 marginal flows to substrate 101 bottoms (six o'clock place), combine with water mark 125.
Fig. 5 is the substrate and the substrate support frame perspective view of the substrate drying receptacle of the anhydrous mark substrate of the utility model clearing and drying device embodiment.As shown in Figure 5, the substrate support frame is made of two outer back-up blocks 127, a bottom support piece 128 and two side back-up blocks 129, and bottom support piece 128 tops become the point of a knife shape.Substrate 101 is located and is supported on the substrate support frame by grooving on the outer back-up block 128 and bottom support piece 128.
Fig. 6 is the substrate and the substrate support front organigram of the substrate drying receptacle of the anhydrous mark substrate of the utility model clearing and drying device embodiment.As shown in Figure 6, at substrate transmitting assembly 115 substrate 101 is passed to substrate drying receptacle 104 places, substrate 101 lip-deep water marks concentrate on the bottom (six o'clock place) of substrate 101, the substrate lifting assembly of substrate drying receptacle 104 promotes the substrate support frame to substrate 101 places, when substrate 101 is put into the substrate support frame, the point of a knife shape on bottom support piece 128 tops contacts with the water mark of substrate 101 bottoms, and the water mark is along under the point of a knife surface current, thereby reduces or eliminated the water mark of substrate 101 bottoms.
The above only is preferred embodiment of the present utility model, the utility model is not done any pro forma restriction.Every any simple modification, variation and modification of the foregoing description being done according to the technical solution of the utility model all still belongs to the scope of technical solutions of the utility model.
Claims (6)
1. anhydrous mark substrate clearing and drying device is characterized in that it comprises:
The substrate clean container is used to clean substrate;
Substrate gas hothouse is used for substrate and supplies with the room temperature dry gas when the substrate clean container promotes;
The substrate drying receptacle is used to supply with high temperature drying gas substrate is carried out the high-temperature gas drying; And
The substrate transmitting assembly is used for substrate is sent to the substrate drying receptacle from the substrate clean container;
Wherein, substrate gas hothouse is arranged in the top of substrate clean container, substrate clean container and substrate drying receptacle parallel arranged, and the substrate transmitting assembly is arranged in a side of substrate clean container and substrate drying receptacle.
2. anhydrous mark substrate clearing and drying device as claimed in claim 1 is characterized in that: substrate slowly is promoted to described substrate gas hothouse from described substrate clean container.
3. anhydrous mark substrate clearing and drying device as claimed in claim 1 is characterized in that: the drying at room temperature gas that is used for described substrate gas hothouse is room temperature isopropyl alcohol (IPA) gas.
4. anhydrous mark substrate clearing and drying device as claimed in claim 1 is characterized in that: the high temperature drying gas that is used for described substrate drying receptacle is high temperature drying clean air (CAD) or nitrogen (N2).
5. anhydrous mark substrate clearing and drying device as claimed in claim 1 is characterized in that: the bottom support piece top that is used for the substrate support frame of described substrate drying receptacle becomes the point of a knife shape.
6. anhydrous mark substrate clearing and drying device as claimed in claim 1, it is characterized in that: the substrate of described substrate transmitting assembly picks and places arrangement of components above substrate, and the opening and closing substrate picks and places assembly and picks and places substrate from the substrate support frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920126840U CN201387879Y (en) | 2009-03-30 | 2009-03-30 | Non-water stain substrate cleaning and drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920126840U CN201387879Y (en) | 2009-03-30 | 2009-03-30 | Non-water stain substrate cleaning and drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201387879Y true CN201387879Y (en) | 2010-01-20 |
Family
ID=41580420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920126840U Expired - Fee Related CN201387879Y (en) | 2009-03-30 | 2009-03-30 | Non-water stain substrate cleaning and drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201387879Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569024A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Drying method and drying equipment after grinding and cleaning TSV (Temperature Safety Valve) through hole |
| CN105990198A (en) * | 2016-07-05 | 2016-10-05 | 常州大学 | Slot-type basket device for solar battery cell |
| CN111774368A (en) * | 2019-04-03 | 2020-10-16 | 芯恩（青岛）集成电路有限公司 | Cleaning equipment and cleaning method |
-
2009
- 2009-03-30 CN CN200920126840U patent/CN201387879Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569024A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Drying method and drying equipment after grinding and cleaning TSV (Temperature Safety Valve) through hole |
| CN105990198A (en) * | 2016-07-05 | 2016-10-05 | 常州大学 | Slot-type basket device for solar battery cell |
| CN111774368A (en) * | 2019-04-03 | 2020-10-16 | 芯恩（青岛）集成电路有限公司 | Cleaning equipment and cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100120 Termination date: 20110330 |