CN114351233A - A method and device for localized electrodeposition by using laser for local activation of anode - Google Patents

Abstract

The invention discloses a method and a device for realizing localized electrodeposition by using laser to perform local activation of anode, and relates to the technical field of special processing. The flow direction is to localize the electrochemical deposition of the area on the workpiece where the peroxide film is removed. The invention adopts the method of laser irradiation induced electrolysis to realize local activation, avoids the substrate damage caused by directly using laser etching oxide layer or passivation layer, and can also control the laser scanning path and range through the numerical control system to realize the local activation area of the workpiece surface It has extremely high flexibility and precision, and the activation and deposition are carried out in-situ under the liquid, which avoids the re-oxidation or passivation of the workpiece between the two processes, and improves the efficiency, precision and surface performance of the local coating.

Description

A method and device for localized electrodeposition by using laser for local activation of anode

technical field

The invention relates to the technical field of composite special processing, in particular to a method and a device for performing localized electrodeposition by performing local activation of an anode with a laser.

Background technique

With the continuous expansion of the field of micromachining, the requirements for the surface properties of materials are gradually increasing. In the production of electronic components, in order to cope with the harsh use environment of electronic products, functional coatings are generally used on the surface of the components to meet the requirements of corrosion resistance, wear resistance, and magnetic properties. However, due to the high cost of precious metals, electroplating processes that save precious metals consumption are being studied at home and abroad. Partial electroplating can realize partial electroplating on workpiece parts that only need functional coatings, which can meet the requirements of materials, and at the same time improve production efficiency and save costs.

In the article "Research on Partial Electroplating", some local electroplating methods such as wrapping method, profiling fixture method, and insulating layer coating method are proposed. However, the wrapping method is difficult to wrap parts with complex shapes, and it is difficult to clean the gaps; the production accuracy of the profiling jig is high, and different plated parts require different jigs, the process is cumbersome and the cost is high; the insulating layer method is not suitable for high-temperature electroplating. In the article "Research on Pretreatment Technology of Aluminum Alloy Electroplating", it is proposed to remove the oxide film on the surface by pickling, alkaline activation and other pretreatment methods before aluminum alloy electroplating. Corrosion of the base aluminum, and electroplating after pretreatment is difficult to ensure that the oxide film or passivation film will no longer be formed. In the article "Laser Electroplating and Laser Etching", due to the short pulse, strong directionality and high energy of the laser, it is proposed to use the laser to electroplate the surface of the workpiece. Although the laser can remove the oxide film or other passivation film on the surface of the material, but There is a problem of laser damage to the substrate during laser plating.

SUMMARY OF THE INVENTION

Aiming at the deficiencies in the prior art, the present invention provides a method for localized electrodeposition by using laser to perform local activation of anode , adjust the current flow of the electrochemical circuit to realize the deposition of the local area on the area where the peroxide film is removed on the workpiece. In the present invention, the workpiece is first connected to the positive electrode of the power supply, the tool electrode is connected to the negative electrode of the power supply, and the oxide film or other surface of the workpiece is partially irradiated by laser. The passivation film is activated to remove the oxide film or other passivation film in the irradiation area; then the current direction is changed, the workpiece is connected to the negative electrode of the power supply, the tool electrode is connected to the positive electrode of the power supply, and electrochemical deposition occurs in the locally activated area on the surface of the workpiece, and the rest of the workpiece Electrochemical deposition does not occur without activation of the surface.

The present invention achieves the above technical purpose through the following technical means.

A method for localized electrodeposition by using laser to perform local activation of anode Electrochemical deposition.

Further, the workpiece is a metal or semiconductor material capable of forming an oxide film in the air.

Further, in the step of removing the oxide film in a specific area on the workpiece, the workpiece is connected to the positive electrode of the DC pulse power supply, the tool electrode is connected to the negative electrode of the DC pulse power supply, and the workpiece is placed in the electrolyte, thereby forming an electrochemical circuit, which is irradiated by a laser beam. A specific area of the workpiece is used to remove the oxide film in a specific area.

Further, after removing the oxide film in a specific area on the workpiece, the workpiece and the tool electrode are respectively connected to the negative electrode and the positive electrode of the DC pulse power supply, and localized electrochemical deposition is performed on the area where the peroxide film is removed on the workpiece.

Further, during localized electrodeposition, the area of the peroxide film is removed by laser irradiation to strengthen the localized deposition process.

A device for realizing a method for localized electrodeposition by using a laser to perform local activation of anodes, including a laser irradiation system, an electrodeposition processing system and a motion control system; the laser irradiation system includes a pulsed laser, a mirror, a focusing lens and an auxiliary anode ; The laser beam emitted by the laser is irradiated on the workpiece through the auxiliary anode after changing the optical path by the reflector and focusing by the focusing lens;

The electrodeposition processing system includes a DC pulse power supply, a current steering device, a working tank, an electrolyte and a tool electrode;

The DC pulse power supply is respectively connected with the workpiece and the tool electrode through the current steering device; the direction of the electrochemical loop current can be adjusted through the current steering device;

The working tank is built with an electrolyte, and the workpiece is placed in the electrolyte;

The motion control system includes a computer and a motion controller, the computer controls a pulsed laser and a DC pulse power supply; the motion controller controls an x-y-z three-coordinate mobile platform; a working slot is arranged on the x-y-z three-coordinate mobile platform;

The position of the laser beam relative to the workpiece 7 is adjusted by adjusting the movement of the x-y-z three-coordinate moving platform and controlling the pulsed laser by the computer.

Further, the auxiliary anode material is a transparent conductive material.

Further, the auxiliary anode material is a transparent conductive polymer.

Further, the pulsed laser is a nanosecond laser or a picosecond laser.

Further, the current steering device includes four interfaces a, b, c and d, wherein the two interfaces a and d can be connected to the negative pole of the DC pulse power supply, and the two interfaces b and c can be connected to the negative pole of the DC pulse power supply. positive electrode.

Further, when removing the oxide film in a specific area on the workpiece, the workpiece is connected to the b interface to connect the positive electrode of the DC pulse power supply, and the tool electrode is connected to the d interface to connect to the negative electrode of the DC pulse power supply; when the workpiece from which the oxidation mold has been removed is localized electrodeposition. , the workpiece is connected to the a interface to connect the negative pole of the DC pulse power supply, and the tool electrode is connected to the c interface to connect to the positive pole of the DC pulse power supply.

Beneficial effects:

1. The present invention uses laser irradiation to induce electrolysis to achieve local activation, avoids substrate damage caused by directly using laser etching oxide layer or passivation layer, and can also control the laser scanning path and range through a numerical control system to achieve local workpiece surface. The selection of the activation area has extremely high flexibility and precision, and the activation and deposition are carried out in-situ under the liquid, which avoids the re-oxidation or passivation of the workpiece between the two processes, and improves the efficiency, precision and surface performance of the local coating.

2. Using anodic activation, the anodic current can promote the dissolution of the oxide film on the surface of the substrate, and at the same time, the laser parameters can be adjusted to avoid the damage of the laser irradiation to the material and improve the processing efficiency.

3. The invention adopts the auxiliary anode, which can effectively solve the problem of uneven electric field distribution during traditional laser-assisted electrodeposition, and improve the forming precision, surface processing quality and localization of micro-electrodeposition.

4. Continue to irradiate the deposition area with laser when depositing in the local activation area to strengthen the deposition process.

Description of drawings

Fig. 1 is the schematic diagram of utilizing laser to carry out anode local activation to realize localized electrodeposition device;

Fig. 2 is the schematic diagram of the device when using laser to locally activate the anode;

FIG. 3 is a schematic diagram of a laser-enhanced deposition device after the local activation of the anode by the laser;

FIG. 4 is a schematic diagram of laser irradiation scanning when the laser performs local activation of the anode.

The reference numbers are as follows:

1-computer; 2-pulse laser; 3-reflector; 4-focusing lens; 5-laser beam; 6-auxiliary anode; 7-workpiece; 8-tool electrode; 9-deposition solution; 10-DC pulse power supply; 11 - Current steering device; 12 - motion controller; 13 - working tank; 14 - x-y-z three-coordinate moving platform; 15 - oxide film.

Detailed ways

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "axial", The orientation or positional relationship indicated by "radial", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description , rather than indicating or implying that the indicated device or element must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

Specifically, the method and device of the present invention will be further described with reference to the accompanying drawings 1-4.

A method for using laser to locally activate the anode to realize localized electrodeposition, the workpiece 7 is connected to the positive electrode of the DC pulse power supply 10, the tool electrode 8 is connected to the negative electrode of the DC pulse power supply 10, the workpiece 7 is locally activated by the laser beam 5, and then the current is passed through. Steering device 11, workpiece 7 is connected to the negative electrode of DC pulse power supply 10, tool electrode 8 is connected to the positive electrode of DC pulse power supply 10, the surface of workpiece 7 is electrochemically deposited through the locally activated area, and the rest of the surface of workpiece 7 does not undergo electrochemical deposition without activation. , to achieve localized deposition on the surface of workpiece 7 .

The workpiece 7 is a metal or semiconductor material capable of forming oxide films or other passivation films in the air.

The positive and negative poles of the power supply are interchanged by using the current steering device 11, and the current steering device 11 has four interfaces a, b, c, and d. The a and d interfaces are connected to the negative pole of the DC pulse power supply 10 , and the b and c interfaces are connected to the positive pole of the DC pulse power supply 10 .

When the laser locally activates the anode, the workpiece 7 is connected to the b interface of the current steering device 11, that is, the positive pole of the DC pulse power supply 10, and the tool electrode 8 is connected to the d interface of the current steering device 11, that is, the negative pole of the DC pulse power supply 10.

The oxide film or other passivation film on the surface of the workpiece 7 through the local activation area has been completely removed, and the unactivated oxide film or other passivation film on the remaining surface of the workpiece 7 is still there.

After the local activation of the anode by the laser, the workpiece 7 is connected to the a interface of the current steering device 11, that is, the negative electrode of the DC pulse power supply 10, and the tool electrode 8 is connected to the c interface of the current steering device 11, that is, the positive electrode of the DC pulse power supply 10.

The auxiliary electrodes 6 are arranged in parallel above the workpiece 7 .

The auxiliary anode 4 is a transparent conductive material, and the light transmittance is not less than 80%.

The auxiliary anode 4 is a conductive transparent polymer, such as conductive glass.

The implementation of the localized deposition of the laser beam 5 is that the laser beam 5 is fixed, the workpiece 7 is placed on the X-Y-Z worktable 14, and the relative motion with the laser spot is realized through the control system of the computer 1 to perform localized deposition; or the workpiece 7 Fixed, the laser spot realizes localized deposition under the control of the optical path transmission system; or the above two methods work together to realize.

Specific steps are as follows:

Surface and process the workpiece 7;

Draw the motion path model according to the graph of the area to be deposited, and import it into the computer 1 after optimization;

The workpiece 7 is fixed at the bottom of the working tank 13, connected to the positive pole of the DC pulse power supply 10, and the working tank is placed on the x-y-z three-coordinate moving platform 14;

The tool electrode 8 is perpendicular to the working slot 13 and is close to the left end of the working slot 13, and is connected to the negative electrode of the DC pulse power supply 10;

The deposition solution 9 is injected into the working tank 13, so that the workpiece 7 and the tool electrode 8 are both immersed in the deposition solution 9, and after electrification, the workpiece 7 and the tool electrode 8 form an electrochemical circuit;

The auxiliary anode 6 is placed in parallel above the workpiece 7, the motion controller 12 is manipulated, and the x-y-z three-coordinate moving platform 14 is adjusted, so that the laser beam 5 is focused on the surface of the workpiece 7 through the auxiliary anode 6;

The DC pulse power supply 10 and the pulse laser 2 are turned on, and the laser performs local activation of the anode.

After local activation, the workpiece 7 is connected to the a interface of the current steering device 11, that is, the negative electrode of the DC pulse power supply 10 is connected, and the tool electrode 8 is connected to the c interface of the current steering device 11, that is, the positive electrode of the DC pulse power supply 10;

When the DC pulse power supply 10 is turned on, electrochemical deposition occurs in the locally activated area on the surface of the workpiece 7, and no electrochemical deposition occurs on the remaining surface of the workpiece 7 without activation, so that localized deposition on the surface of the workpiece 7 is realized.

A device for realizing localized electrodeposition by using laser to perform local activation of anode, including laser irradiation system, electrodeposition processing system, and motion control system; the laser irradiation system includes pulse laser 2, reflecting mirror 3, focusing lens 4, Auxiliary anode 6; The laser beam 5 emitted by the laser 2 is reflected at 45° by the mirror 3 and then changes the transmission direction, and is focused to the surface of the workpiece 7 through the focusing lens 4 and the auxiliary anode 6; The electrodeposition processing system includes a DC pulse current. 10, the current steering device 11, the working tank 13, the deposition liquid 9, the workpiece 7 and the tool electrode 8; the motion control system includes a computer 1 and a motion controller 12, and the computer 1 controls the pulse laser 1 and the DC pulse power supply 10, The motion controller 12 controls the x-y-z three-coordinate moving platform 14 .

The pulsed laser 2 is a nanosecond or picosecond laser.

When depositing in a local activation area, the deposition area can also be irradiated with a laser to strengthen the deposition process.

Referring to FIG. 2 , when the laser locally activates the anode, the workpiece is fixed at the bottom of the working tank 13 and connected to the b interface of the current steering device 11 , that is, connected to the positive electrode of the DC pulse power supply 10 . The tool electrode 8 is perpendicular to the working slot 13 and is close to the left end of the working slot 13 , and is connected to the d interface of the current steering, that is, the negative electrode of the DC pulse power supply 10 . The auxiliary anode 6 is arranged above the workpiece 7, and the x-y-z three-coordinate moving platform 14 is adjusted by the motion controller 12, so that the laser is irradiated in the selected area through the auxiliary anode 6 for local activation. The activation current density, activation time, and laser parameters can be determined according to Local coating thickness, precision and processing time can be selected by yourself.

The laser scanning direction is shown in FIG. 4 , the oxide film or other passivation film in the laser scanning area has been removed, and the oxide film or other passivation film in the laser local activation area is still there.

Referring to FIG. 3 , during the laser-enhanced localized deposition, the tool electrode 8 is connected to the c-interface of the current steering device 11 , that is, connected to the positive electrode of the DC pulse power supply 10 . The workpiece is connected to the a-interface of the current steering, that is, the negative pole of the DC pulse power supply 10 . The auxiliary anode 6 is arranged above the workpiece, and the x-y-z three-coordinate moving platform 14 is adjusted by the motion controller 12, so that the laser is irradiated on the activation area through the auxiliary anode 6. Turn on the power, the current density and laser parameters can be selected according to the local coating thickness, precision and processing time. Localized deposition occurs in the activation area, and the coating layer is deposited. The remaining surface of the workpiece is not activated and does not undergo electrochemical deposition, and is still a dense oxide film.

Referring to FIG. 4 , the laser irradiation path and range are controlled by the numerical control system to achieve the removal of the oxide film 15 or other passivation films in the target area of the workpiece surface, that is, to achieve local activation of the workpiece surface.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those of ordinary skill in the art will not depart from the principles and spirit of the present invention Variations, modifications, substitutions, and alterations to the above-described embodiments are possible within the scope of the present invention without departing from the scope of the present invention.

Claims (10)

1. a method that utilizes laser to carry out anode local activation and realizes localized electrodeposition, it is characterized in that, utilize laser irradiation and electrochemical reaction to remove the oxide film of specific area on workpiece (7), adjust electrochemical loop current to flow to workpiece (7) Regionally localized electrochemical deposition for removing the peroxide film. 2. The method according to claim 1, characterized in that the workpiece (7) is a metal or semiconductor material capable of generating an oxide film in the air. 3. the method that utilizes laser to carry out anode local activation according to claim 1 and realizes localized electrodeposition, it is characterized in that, in removing the oxide film step of specific area on workpiece (7), workpiece (7) is connected with DC pulse power supply The positive pole of (10), the tool electrode (8) is connected to the negative pole of the DC pulse power supply (10), the workpiece (7) is placed in the electrolyte, thereby forming an electrochemical circuit, and the laser beam (5) is used to irradiate the workpiece (7) specific area to remove the oxide film in a specific area. 4. The method according to claim 3, characterized in that, after removing the oxide film in a specific area on the workpiece (7), the workpiece (7) and the tool electrode (8) It is respectively connected to the negative electrode and the positive electrode of the DC pulse power supply (10), and localized electrochemical deposition is performed on the workpiece (7) where the peroxide film is removed. 5 . The method according to claim 1 , wherein, during the localized electrodeposition, laser irradiation is used to remove the area of the peroxide film to strengthen the localized deposition process. 6 . 6. The device for realizing the method for realizing localized electrodeposition by utilizing laser to carry out local activation of anode according to any one of claims 1 to 5, is characterized in that, comprising laser irradiation system, electrodeposition processing system and motion control system; The laser irradiation system comprises a pulsed laser (2), a reflection mirror (3), a focusing lens (4) and an auxiliary anode (6); the laser light emitted by the laser (2) is changed by the reflection mirror (3) and focused by changing the optical path The laser beam (5) focused by the lens (4) is irradiated onto the workpiece (7) through the auxiliary anode (4); The electrodeposition processing system comprises a DC pulse power supply (10), a current steering device (11), a working tank (13), an electrolyte (9) and a tool electrode (8); The DC pulse power supply (10) is respectively connected with the workpiece (7) and the tool electrode (10) through the current steering device (11); the direction of the electrochemical loop current can be adjusted by the current steering device (11); The working tank (13) is built with an electrolyte (9), and the workpiece (7) is placed in the electrolyte (9); The motion control system comprises a computer (1) and a motion controller (12), the computer (1) controls the pulsed laser (2) and the DC pulse power supply (10); the motion controller (12) controls the x-y-z three-coordinate a mobile platform (14); a working slot (13) is arranged on the x-y-z three-coordinate mobile platform (14); The position of the laser beam (5) relative to the workpiece (7) is adjusted by adjusting the movement of the x-y-z three-coordinate moving platform (14) and the computer controls the pulsed laser (2). 7. The device according to claim 6, characterized in that, the material of the auxiliary anode (4) is a transparent conductive material. 8. The device according to claim 7, characterized in that, the material of the auxiliary anode (4) is a transparent conductive polymer. 9. The device according to claim 6, wherein the current steering device (11) comprises four interfaces a, b, c and d, wherein the two interfaces a and d can be connected to the DC pulse power supply ( The negative pole of 10), the two interfaces b and c can be connected to the positive pole of the DC pulse power supply (10). 10. The device according to claim 9, characterized in that, when removing the oxide film in a specific area on the workpiece (7), the workpiece (7) is connected to the b interface so as to connect the positive electrode of the DC pulse power supply (10), the tool electrode (8) ) connect the d interface so as to connect the negative pole of the DC pulse power supply (10); during localized electrodeposition of the workpiece that has removed the oxidation mold, the workpiece (7) is connected to the a interface so as to connect the negative pole of the DC pulse power supply (10), the tool electrode (8) ) is connected to the c interface so as to connect the positive pole of the DC pulse power supply (10).

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