CN114351233A - Method and device for realizing localized electrodeposition by locally activating anode by using laser - Google Patents
Method and device for realizing localized electrodeposition by locally activating anode by using laser Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000003213 activating effect Effects 0.000 title claims abstract description 15
- 230000004913 activation Effects 0.000 claims abstract description 28
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- 239000002184 metal Substances 0.000 claims description 3
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Abstract
The invention discloses a method and a device for realizing localized electrodeposition by locally activating an anode by using laser, which relate to the technical field of special processing. The invention adopts a laser irradiation induced electrolysis mode to realize local activation, avoids substrate damage caused by directly adopting laser to etch an oxide layer or a passivation layer, can also realize the selection of a local activation region on the surface of a workpiece by controlling a laser scanning path and range through a numerical control system, has extremely high flexibility and precision, and can carry out activation and deposition in situ under liquid, avoid reoxidation or passivation of the workpiece between two procedures and improve the efficiency, precision and surface performance of a local coating.
Description
Technical Field
The invention relates to the technical field of composite special processing, in particular to a method and a device for realizing localized electrodeposition by locally activating an anode by laser.
Background
With the continuous expansion of the field of micro-processing, the requirements on the surface performance of materials are gradually improved. In the production of electronic components, in order to meet the harsh use environment of electronic products, functional plating is generally adopted on the surface of the components to meet the requirements of corrosion resistance, wear resistance, magnetism and the like. However, because of the high cost of noble metals, electroplating processes that save noble metal consumption are being researched and explored both at home and abroad. The local electroplating can be realized on the part of the workpiece which only needs the functional coating, the requirement of materials is met, and meanwhile, the production efficiency is improved and the cost is saved.
In the article "research on local plating", local plating methods such as a bundling method, a profile modeling jig method, a method of coating an insulating layer, and the like are proposed. But the binding method is difficult to bind parts with complex shapes and difficult to clean cracks; the manufacturing precision of the profiling fixture is very high, different plating pieces need different fixtures, the process is complicated, and the cost is very high; the method of coating an insulating layer is not suitable for high temperature plating. In the article of aluminum alloy electroplating pretreatment technical research, the method of removing the oxide film on the surface of the aluminum alloy by acid washing, alkaline activation and other pretreatment methods before the aluminum alloy electroplating is provided, but residual liquid can enter a crack of a matrix during the acid-base treatment to corrode the matrix aluminum, and meanwhile, the electroplating after the pretreatment is difficult to ensure that the oxide film or a passive film is not generated any more. In the article of laser electroplating and laser etching, because of short pulse, strong directivity and high energy of laser, the laser is proposed to electroplate the surface of a workpiece, and although the laser can remove an oxide film or other passive films on the surface of a material, the laser has the problem of damaging a substrate during laser electroplating.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method for realizing localized electrodeposition by locally activating an anode by using laser, which comprises the steps of improving the temperature of an irradiation area by using laser to promote an electrochemical reaction, removing an area oxide film or other passivation films, and adjusting the current flow direction of an electrochemical loop to realize the deposition of the local area on the area where the peroxide film is removed on a workpiece; and then changing current steering, connecting the workpiece with the cathode of a power supply, connecting the tool electrode with the anode of the power supply, carrying out electrochemical deposition on the surface of the workpiece in a locally activated area, and carrying out non-activation on the rest surface of the workpiece to avoid electrochemical deposition.
The present invention achieves the above-described object by the following technical means.
A method for realizing localized electro-deposition by locally activating an anode by using laser is characterized in that an oxide film in a specific area on a workpiece is removed by using laser irradiation and electrochemical reaction, and the current flow direction of an electrochemical loop is adjusted to perform localized electro-deposition on the area of the workpiece from which the oxide film is removed.
Further, the workpiece is a metal or semiconductor material capable of forming an oxide film in air.
Further, in the step of removing the oxide film on the specific area of the workpiece, the workpiece is connected with the anode of the direct current pulse power supply, the tool electrode is connected with the cathode of the direct current pulse power supply, the workpiece is placed in the electrolyte to form an electrochemical loop, and the specific area of the workpiece is irradiated by the laser beam to remove the oxide film on the specific area.
Further, after removing the oxidation film on the specific area of the workpiece, the workpiece and the tool electrode are respectively connected with the cathode and the anode of the direct current pulse power supply, and the area on the workpiece where the oxidation film is removed is subjected to localized electrochemical deposition.
Furthermore, during the localized electrodeposition, the laser irradiation is utilized to remove the area of the peroxide film, so as to strengthen the localized deposition process
The device for realizing the method for realizing the localized electrodeposition by locally activating the anode by utilizing the laser comprises a laser irradiation system, an electrodeposition processing system and a motion control system; the laser irradiation system comprises a pulse laser, a reflector, a focusing lens and an auxiliary anode; laser emitted by the laser device changes a light path through the reflector, and a laser beam focused by the focusing lens irradiates a workpiece through the auxiliary anode;
the electro-deposition processing system comprises a direct-current pulse power supply, a current steering device, a working tank, electrolyte and a tool electrode;
the direct current pulse power supply is respectively connected with the workpiece and the tool electrode through a current steering device; the direction of the current of the electrochemical loop can be adjusted through the current steering device;
electrolyte is arranged in the working groove, and the workpiece is placed in the electrolyte;
the motion control system comprises a computer and a motion controller, wherein the computer controls the pulse laser and the direct current pulse power supply; the motion controller controls the x-y-z three-coordinate moving platform; a working groove is arranged on the x-y-z three-coordinate moving platform;
the position of the laser beam relative to the workpiece 7 is adjusted by adjusting the movement of the x-y-z three-coordinate moving platform and computer control of the pulsed laser.
Further, the auxiliary anode material is a transparent conductive material.
Further, the auxiliary anode material is a transparent conductive polymer.
Further, the pulse laser is a nanosecond laser or a picosecond laser.
Furthermore, the current steering device comprises four interfaces a, b, c and d, wherein the two interfaces a and d can be communicated with the negative electrode of the direct current pulse power supply, and the two interfaces b and c can be communicated with the positive electrode of the direct current pulse power supply.
Further, when the oxide film of a specific area on the workpiece is removed, the workpiece is connected with the interface b so as to be communicated with the anode of the direct current pulse power supply, and the tool electrode is connected with the interface d so as to be communicated with the cathode of the direct current pulse power supply; when the workpiece with the oxidation mold removed is subjected to localized electrodeposition, the workpiece is connected with the interface a so as to be communicated with the negative electrode of the direct-current pulse power supply, and the tool electrode is connected with the interface c so as to be communicated with the positive electrode of the direct-current pulse power supply.
Has the advantages that:
1. the invention adopts a laser irradiation induced electrolysis mode to realize local activation, avoids substrate damage caused by directly adopting laser to etch an oxide layer or a passivation layer, can also realize the selection of a local activation region on the surface of a workpiece by controlling a laser scanning path and range through a numerical control system, has extremely high flexibility and precision, and can carry out activation and deposition in situ under liquid, avoid reoxidation or passivation of the workpiece between two procedures and improve the efficiency, precision and surface performance of a local coating.
2. By adopting anode activation, the anode current can promote the dissolution of the oxide film on the surface of the substrate, and simultaneously can regulate and control laser parameters, avoid the damage of laser irradiation to materials and improve the processing efficiency.
3. The invention adopts the auxiliary anode, can effectively solve the problem of uneven electric field distribution in the traditional laser-assisted electrodeposition, and improves the forming precision, the surface processing quality and the localization of the micro electrodeposition.
4. And when the local activation area is deposited, the laser is continuously used for irradiating the deposition area, so that the deposition process is strengthened.
Drawings
FIG. 1 is a schematic view of a localized electrodeposition apparatus using laser for localized anodic activation;
FIG. 2 is a schematic view of an apparatus for locally activating an anode by using a laser;
FIG. 3 is a schematic view of a laser-enhanced deposition apparatus after local activation of the anode by a laser;
fig. 4 is a schematic diagram of laser irradiation scanning when the laser is used for anode local activation.
The reference numbers are as follows:
1-a computer; 2-a pulsed laser; 3-a mirror; 4-a focusing lens; 5-a laser beam; 6-an auxiliary anode; 7-a workpiece; 8-a tool electrode; 9-a deposition solution; 10-a direct current pulse power supply; 11-current steering means; 12-a motion controller; 13-a working groove; 14-x-y-z three-coordinate moving platform; 15-oxide film.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In particular, the method and apparatus of the present invention will be further described with reference to FIGS. 1-4.
A method for realizing localized electrodeposition by locally activating an anode by utilizing laser comprises the steps that a workpiece 7 is connected with the anode of a direct current pulse power supply 10, a tool electrode 8 is connected with the cathode of the direct current pulse power supply 10, the workpiece 7 is locally activated by adopting a laser beam 5, then the workpiece 7 is connected with the cathode of the direct current pulse power supply 10 through a current steering device 11, the tool electrode 8 is connected with the anode of the direct current pulse power supply 10, electrochemical deposition occurs on the surface of the workpiece 7 in a locally activated area, and electrochemical deposition does not occur on the rest surface of the workpiece 7 without activation, so that localized deposition on the surface of the workpiece 7 is realized.
The work 7 is a metal or semiconductor material capable of forming an oxide film or other passivation film in air.
The current steering device 11 is used for exchanging the anode and the cathode of a power supply, and the current steering device 11 is provided with four interfaces a, b, c and d. The interfaces a and d are connected with the negative electrode of the direct current pulse power supply 10, and the interfaces b and c are connected with the positive electrode of the direct current pulse power supply 10.
When the laser carries out anode local activation, the workpiece 7 is connected with a b interface of the current steering device 11, namely, the workpiece is connected with the positive electrode of the direct current pulse power supply 10, and the tool electrode 8 is connected with a d interface of the current steering device 11, namely, the tool electrode is connected with the negative electrode of the direct current pulse power supply 10.
The oxide film or other passive film on the surface of the workpiece 7 in the local activation area is completely removed, and the oxide film or other passive film on the rest surface of the workpiece 7 which is not activated is still remained.
After the laser carries out anode local activation, the workpiece 7 is connected with an interface a of the current steering device 11, namely, the workpiece is connected with the negative electrode of the direct current pulse power supply 10, and the tool electrode 8 is connected with an interface c of the current steering device 11, namely, the tool electrode is connected with the positive electrode of the direct current pulse power supply 10.
The auxiliary electrode 6 is arranged in parallel above the workpiece 7.
The auxiliary anode 4 is made of transparent conductive material, and the light transmittance is not lower than 80%.
The auxiliary anode 4 is a conductive transparent polymer, such as conductive glass.
The laser beam 5 is fixed, the workpiece 7 is arranged on the X-Y-Z worktable 14, and the control system of the computer 1 realizes the relative movement with the laser spot to carry out the localized deposition; or the workpiece 7 is fixed, and the laser spots realize localized deposition under the control of the optical path transmission system; or the two ways can work together.
The method comprises the following specific steps:
carrying out surface treatment on the workpiece 7;
drawing a motion path model according to the graph of the area to be deposited, and guiding the motion path model into the computer 1 after optimization;
the workpiece 7 is fixed at the bottom of the working groove 13, is connected with the anode of the direct current pulse power supply 10, and is placed on the x-y-z three-coordinate moving platform 14;
the tool electrode 8 is vertical to the working groove 13 and clings to the left end of the working groove 13, and is connected with the negative electrode of the direct current pulse power supply 10;
the deposition liquid 9 is injected into the working tank 13, so that the workpiece 7 and the tool electrode 8 are both immersed in the deposition liquid 9, and after electrification, the workpiece 7 and the tool electrode 8 form an electrochemical loop;
placing the auxiliary anode 6 above the workpiece 7 in parallel, operating the motion controller 12, and adjusting the x-y-z three-coordinate moving platform 14 to enable the laser beam 5 to be focused on the surface of the workpiece 7 through the auxiliary anode 6;
and starting the direct current pulse power supply 10 and the pulse laser 2, and locally activating the anode by the laser.
After local activation, the workpiece 7 is connected with an interface a of the current steering device 11, namely, the negative electrode of the direct current pulse power supply 10, and the tool electrode 8 is connected with an interface c of the current steering device 11, namely, the positive electrode of the direct current pulse power supply 10;
and (3) starting the direct current pulse power supply 10, carrying out electrochemical deposition on the surface of the workpiece 7 in the area subjected to local activation, and carrying out localized deposition on the surface of the workpiece 7 without carrying out activation on the other surface of the workpiece 7.
A device for realizing localized electrodeposition by locally activating an anode by using laser comprises a laser irradiation system, an electrodeposition processing system and a motion control system; the laser irradiation system comprises a pulse laser 2, a reflector 3, a focusing lens 4 and an auxiliary anode 6; the laser beam 5 emitted by the laser 2 is reflected by the reflector 3 at an angle of 45 degrees, then the transmission direction is changed, and the laser beam is focused on the surface of a workpiece 7 through the focusing lens 4 and the auxiliary anode 6; the electro-deposition processing system comprises direct current pulse current 10, a current steering device 11, a working groove 13, deposition liquid 9, a workpiece 7 and a tool electrode 8; the motion control system comprises a computer 1 and a motion controller 12, wherein the computer 1 controls a pulse laser 1 and a direct current pulse power supply 10, and the motion controller 12 controls an x-y-z three-coordinate moving platform 14.
The pulse laser 2 is a nanosecond or picosecond laser.
When the local activation area is deposited, the deposition area can be irradiated by laser again to strengthen the deposition process.
Referring to fig. 2, when the laser performs anode local activation, the workpiece is fixed at the bottom of the working tank 13 and connected to the interface b of the current steering device 11, that is, the anode of the dc pulse power supply 10. The tool electrode 8 is perpendicular to the working groove 13 and is tightly attached to the left end of the working groove 13, and is connected with a d interface for current steering, namely, the negative electrode of the direct current pulse power supply 10. The auxiliary anode 6 is arranged above the workpiece 7, the x-y-z three-coordinate moving platform 14 is adjusted through the motion controller 12, laser penetrates through the auxiliary anode 6 to be irradiated in a selected area to be locally activated, and the activation current density, the activation time and the laser parameters can be selected according to the local coating thickness, the local coating precision and the processing time.
The laser scanning direction is as shown in fig. 4, the oxide film or other passivation film in the laser scanning area has been removed, and the oxide film or other passivation film in the area which has not been locally activated by the laser remains.
Referring to fig. 3, during laser-enhanced localized deposition, the tool electrode 8 is connected to the c interface of the current steering device 11, i.e. to the positive electrode of the dc pulse power supply 10. The workpiece is connected with an a interface for current diversion, namely, the negative electrode of the direct current pulse power supply 10. The auxiliary anode 6 is arranged above the workpiece, and the x-y-z three-coordinate moving platform 14 is adjusted by the motion controller 12, so that laser penetrates through the auxiliary anode 6 to irradiate in an activated area. When the power supply is turned on, the current density and the laser parameters can be selected according to the thickness, the precision and the processing time of the local coating. The activation area is subjected to localized deposition to deposit a coating, and the rest surface of the workpiece is not subjected to electrochemical deposition without activation and is still a compact oxide film.
With reference to fig. 4, the laser irradiation path and range are controlled by a numerical control system, so as to remove the oxide film 15 or other passivation films in the target region of the workpiece surface, i.e. to locally activate the workpiece surface.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (10)
1. The method for realizing the localized electrodeposition by locally activating the anode by using the laser is characterized in that an oxide film in a specific area on a workpiece (7) is removed by using laser irradiation and electrochemical reaction, and the current flow of an electrochemical loop is adjusted to perform the localized electrochemical deposition on the area of the workpiece (7) from which the oxide film is removed.
2. Method for localized electrodeposition with anodic local activation by laser according to claim 1, characterized in that the workpiece (7) is a metal or semiconductor material capable of generating an oxide film in air.
3. The method for realizing the localized electrodeposition by anodic local activation with laser according to claim 1, wherein in the step of removing the oxide film on the specific region of the workpiece (7), the workpiece (7) is connected with the positive pole of the direct current pulse power supply (10), the tool electrode (8) is connected with the negative pole of the direct current pulse power supply (10), the workpiece (7) is placed in the electrolyte to form an electrochemical loop, and the specific region of the workpiece (7) is irradiated with the laser beam (5) to realize the removal of the oxide film on the specific region.
4. The method for realizing the localized electrodeposition by locally activating the anode by using the laser according to the claim 3, characterized in that after removing the oxide film on the specific area on the workpiece (7), the workpiece (7) and the tool electrode (8) are respectively connected with the negative electrode and the positive electrode of the direct current pulse power supply (10) to perform the localized electrochemical deposition on the area of the workpiece (7) where the peroxide film is removed.
5. The method for realizing the localized electrodeposition by locally activating the anode by using the laser as claimed in claim 1, wherein the localized electrodeposition is performed by removing the area of the peroxide film by using laser irradiation to enhance the localized deposition process.
6. The device for realizing the method for realizing the localized electrodeposition by locally activating the anode by using the laser according to any one of claims 1 to 5, which is characterized by comprising a laser irradiation system, an electrodeposition processing system and a motion control system; the laser irradiation system comprises a pulse laser (2), a reflector (3), a focusing lens (4) and an auxiliary anode (6); laser emitted by the laser (2) changes a light path through the reflector (3), and a laser beam (5) focused by the focusing lens (4) irradiates a workpiece (7) through the auxiliary anode (4);
the electro-deposition processing system comprises a direct-current pulse power supply (10), a current steering device (11), a working groove (13), electrolyte (9) and a tool electrode (8);
the direct current pulse power supply (10) is respectively connected with the workpiece (7) and the tool electrode (10) through a current steering device (11); the direction of the current of the electrochemical loop can be adjusted through the current steering device (11);
electrolyte (9) is arranged in the working groove (13), and the workpiece (7) is placed in the electrolyte (9);
the motion control system comprises a computer (1) and a motion controller (12), wherein the computer (1) controls a pulse laser (2) and a direct current pulse power supply (10); the motion controller (12) controls an x-y-z three-coordinate moving platform (14); a working groove (13) is arranged on the x-y-z three-coordinate moving platform (14);
the position of the laser beam (5) relative to the workpiece (7) is adjusted by adjusting the movement of the x-y-z three-coordinate moving platform (14) and computer control of the pulsed laser (2).
7. The device according to claim 6, characterized in that the auxiliary anode (4) material is a transparent conductive material.
8. The device according to claim 7, characterized in that the auxiliary anode (4) material is a transparent conductive polymer.
9. The device according to claim 6, characterized in that the current diverting device (11) comprises four ports a, b, c and d, wherein both ports a and d can be connected to the negative pole of the DC pulse power supply (10) and both ports b and c can be connected to the positive pole of the DC pulse power supply (10).
10. The apparatus according to claim 9, wherein when removing the oxide film on the specific region of the workpiece (7), the workpiece (7) is connected to the b interface to communicate with the positive electrode of the DC pulse power supply (10), and the tool electrode (8) is connected to the d interface to communicate with the negative electrode of the DC pulse power supply (10); when the workpiece with the oxidation mold removed is subjected to localized electrodeposition, the workpiece (7) is connected with the interface a so as to be communicated with the negative electrode of the direct current pulse power supply (10), and the tool electrode (8) is connected with the interface c so as to be communicated with the positive electrode of the direct current pulse power supply (10).
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Application publication date: 20220415 |