CN110528035A - It is a kind of for improving the mask-type jet stream electric deposition device and its method of small-sized EDM electrode performance - Google Patents
It is a kind of for improving the mask-type jet stream electric deposition device and its method of small-sized EDM electrode performance Download PDFInfo
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- CN110528035A CN110528035A CN201910902361.8A CN201910902361A CN110528035A CN 110528035 A CN110528035 A CN 110528035A CN 201910902361 A CN201910902361 A CN 201910902361A CN 110528035 A CN110528035 A CN 110528035A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- Organic Chemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a kind of for improving the mask-type jet stream electric deposition device and method of small-sized EDM electrode performance, and the urea and TiB of certain content are carried by jet electrolytic liquid line2Nano-ceramic particle forms nanocrystalline copper-TiB in common copper electroforming electrode surface2Composite construction enhance coating, which facilitates the mechanical property for pointedly improving EDM electrode material and the corrosion resisting property in processing, and excellent conductive performance of the matrix copper electroforming as electrode material is utilized.Present invention combination jet stream electro-deposition and mask technique generate a kind of new processing method, are scanned processing for the electrode material of complicated shape, copper part can be directly used as the electrode tool of electric pulse processing lathe.The process is easy, and equipment cost is low, and preparation part size range is wide, when using the nozzle diameter of very little, can play invigoration effect to miniature electrodes tool part.
Description
Technical field
The present invention relates to a kind of for improving the mask-type jet stream electric deposition device and its method of small-sized EDM electrode performance.
Background technique
Electrical discharge machining (EDM) is a kind of special Special Working Technology, it utilizes the galvano-cautery between workpiece and tool
Phenomenon removes extra conductive metal.In edm process, the selection of electrode material is most important, because in workpiece material
In the corrosion process of material, electrode material itself also will receive corrosion, to influence the form and dimensional precision of workpiece.Therefore, it drops
Export license in low edm process is of great significance.It is graphite or red copper material that usual EDM materials industry, which uses,
Material.Graphite has good electric conductivity, but mechanical performance is poor, is easily broken off.Electroforming red copper have good conductive property and
Electrical property, can complicated, the accurate electrode of suitable for making various shape, be common electrode material in electrical discharge machining.But by
Have the characteristics that low melting point, soft, traditional copper electroforming can not inhibit the electrode erosion damage in EDM processing in copper product itself
It loses, so that machining accuracy is reduced, it is particularly evident in high current processing.
In order to reduce export license, improve electrode performance, electrode manufacturing industry be dedicated to inventing at present new electrode material at
Type method and change material composition.These work include powder metallurgy, high―temperature nuclei, composite electrodeposition etc..It is such as related in recent years
Patent 201510367154.9, have studied prepare carbon/carbon-copper composite material by the more powders of sinter molding with prepare electrical discharge machining electricity
The method of pole.For another example report introduces the high-temperature synthesis occurred and prepares TiB2 granule reinforced copper base composite material at present, relative to
Common copper electrode material has certain performance improvement.
In general, mesh is in the majority with high energy field technology to the improved method for being directed to EDM copper electrode material, as laser is molten
It covers, thermal spraying etc., although speed is fast, high-efficient, alloying component is adjustable, there is also the device is complicated, relative cost is high, forming is thick
The problems such as degree is difficult to control, there are heat affecting residual stress.Additionally by powder metallurgy, high―temperature nuclei method needed for raw material compared with
It is more, while also needing to carry out the multiple working procedures such as melting, cleaning, annealing, cold working, production technology is complicated, and cost is larger.
Jet stream electro-deposition is the new electro-deposition techniques of one kind developed in recent years, has good locality and shape
At the special nature of special nanocrystalline structure.Using jet stream electro-deposition method combination mask technique, it is multiple that shape can be prepared
Miscellaneous, microstructure is nanocrystalline metal microstructure.And based on existing the study found that nanocrystalline material has the micro- of densification
See structure and good mechanical property.It is strong that in common copper electrode material surface nanocrystalline performance is prepared by jet stream electrodeposition process
Change coating, the electrode performance of common red copper material can be effectively improved, reduces the loss of electrode in process, have important
Realistic meaning.By update search, the work of small-sized EDM electrode material corrosion resisting property is carried out by jet stream electro-deposition method at present
Skill, technical though and scheme occur not yet.
Summary of the invention
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of the present invention is to provide one kind for improving small-sized EDM electrode performance
Mask-type jet stream electric deposition device and its method, process it is easy, equipment cost is low.
2. technical solution
To solve the above problems, the present invention adopts the following technical scheme that.
It is a kind of for improving the mask-type jet stream electric deposition device of small-sized EDM electrode performance, it is characterised in that: EDM electrode
The preparation facilities of material is by liquid-transport pipe-line, electrolyte tank, electrolyte pump, flow control valve, power supply, numerical control nozzle system, workpiece
Clamping module composition；Electrolyte tank, electrolyte pump, flow control valve, nozzle system, electrode material to be processed pass through liquid-transport pipe-line
Each component sequence is connected, and positive pole connects nozzle anode stub, and power cathode connects electrode material to be processed, electrolyte pump starting
Afterwards, electrolyte line forms a closed circuit through nozzle directive electrode material to be processed.
The numerical control nozzle system is made of digital control mechanical arm, nozzle.Nozzle is fixed on digital control mechanical arm front end, numerical control machine
Tool hand can be driven nozzle to reach designated position by program instruction and be precisely accomplished the movement such as process such as nozzle scan.Nozzle is by sun
Pole chamber and nozzle head two parts form, and anode stub is fixed among anode cavities, and lower end is connected by screw thread with nozzle；Working condition
Lower electrolyte, which is flowed into from anode cavities inlet from nozzle head, to be sprayed.
Nozzle is rectangular nozzle, having a size of 20mm × 1mm.
It is a kind of for improving the mask-type jet stream electro-deposition method of small-sized EDM electrode performance, comprising the following steps:
Red copper electrode material surface pretreatment to be deposited: degreasing firstly, acetone cleans red copper electrode surface to be processed, with
Red copper electrode is placed in 15% dilution heat of sulfuric acid and is soaked by 800-1200 mesh abrasive paper for metallograph by the gradual grinding of electrode surface, polishing
Erosion 2 minutes so as in one layer of fine and close passivation layer of surface formation；Distilled water flushing is clean, dries up, for use；
Mask material is selected and processing method: mask material selects waterproof with a thickness of 0.1-2mm, anti-acid epoxy resin board,
Waterproof layers of two-sided is pasted in advance in the back side.Before processing exposure mask, electrode material plane CAD diagram case file to be processed is drawn, in die plate pattern
Must design has dowel hole.File is imported into CNC computer engraving machine, processes the exposure mask that there is same profile with electrode material
Plate will affect electro-deposition quality because template inner hole wall processing quality is relatively rough, need the sulfuric acid for being 98% in concentration by template
It is middle to impregnate 6 minutes, keep hole wall smooth.One group of template with same shape is prepared, general thickness D after superposition=wait locate
Manage thickness of electrode d1+ coating layer thickness d2；
Template groups of after processing is fixed to each other by double-sided adhesive, and fixed on the table by positioning pin, composition has
The inner cavity of electrode shape.Electrode to be processed is put into inner cavity, electrode surface to be treated is placed upwards, surface and template upper layer table
The distance between face is coating layer thickness；
Spray process is controlled by numerical control program, should be according to deposition thickness and the setting scanning time of deposition region area in the numerical control program
The General Parameters such as number, scanning distance should be such that metal deposition layer is accurately deposited in mask plate limited area according to specified thickness,
Form the nanocrystalline metal sedimentary of even compact, the basic parameter of spray process are as follows: nozzle motion scan speed 10mm/s, electricity
Flow velocity 300L/h is solved, nozzle to 7 mm of cathode distance, pulse power parameters: the μ s of pulsewidth ton=20, the μ s of toff=40 between arteries and veins are put down
Equal current density 250A/dm2；
After the coating layer thickness of spray process reaches template restriction height, it can terminate to process.The type chamber and electrode that template is formed
Separation, the electrode material that strengthened that treated.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
1) present invention is the urea and TiB2 nano-ceramic particle that certain content is carried by jet electrolytic liquid line, in common electricity
Cast copper electrode surface forms the composite construction enhancing coating of nanocrystalline copper-TiB2, which helps pointedly to mention
The mechanical property and the corrosion resisting property in processing of high EDM electrode material, and matrix copper electroforming is utilized as electrode material
Excellent conductive performance.
2) present invention combines jet stream electro-deposition and mask technique to generate a kind of new processing method, for the electricity of complicated shape
Pole material is scanned processing, and copper part can be directly used as the electrode tool of electric pulse processing lathe.The process is easy, if
Standby at low cost, preparation part size range is wide, when using the nozzle diameter of very little, can play to miniature electrodes tool part by force
Change effect.
Detailed description of the invention
Fig. 1 is the device of the invention system schematic；
Fig. 2 is mask plate material object schematic diagram；
Fig. 3 is manufacturing procedure figure；
Attached drawing 4 is that the relative loss factor of electrode compares；
Attached drawing 5 is the electrode part scene photo of forming.
1. power supply, 2. electrolyte delivery pipe nozzles, 3. NC machine suckers, 4. speed governing valves, 5. circulating pump galvanic deposition cells, 6.
Filter positioning pin, 7. blender laminated form boards, 8. electrolyte recycling bins cathode guide plates, 9. filter chambers, 10. support frames, 11. works
Make platform, 12. nozzles, 13. copper electrode materials to be processed, 14. work piece holders, 15. 5-shaft linkage numerical control manipulators, 16. superpositions cover
Template.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention；Technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description；Obviously；Described embodiments are only a part of the embodiments of the present invention；Instead of all the embodiments, it is based on
Embodiment in the present invention；It is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment；It shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "inner", "outside", " top/bottom end "
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Be equipped with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to removable
Connection is unloaded, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements.It for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
The invention is realized by the following technical scheme, and specific structure and operating procedure are as follows:
1) preparation facilities of EDM electrode material is by liquid-transport pipe-line, electrolyte tank, electrolyte pump, flow control valve, power supply, numerical control
The parts such as nozzle system, clamping workpiece module composition.As shown in Fig. 1.Electrolyte tank, electrolyte pump, flow control valve, nozzle
System, electrode material to be processed are connected by each component sequence of liquid-transport pipe-line, and positive pole connects nozzle anode stub, power cathode
Connect electrode material to be processed.After electrolyte pump starting, electrolyte line is through nozzle directive electrode material to be processed (cathode) shape
At a closed circuit, the necessary processing conditions of electrical-chemistry method is constituted.
2) numerical control nozzle system is made of digital control mechanical arm, nozzle.Nozzle is fixed on digital control mechanical arm front end, numerical controlled machinery
Hand can be driven nozzle to reach designated position by program instruction and be precisely accomplished the movement such as process such as nozzle scan.Nozzle is by anode
Chamber and nozzle head two parts form, and anode stub is fixed among anode cavities, and lower end is connected by screw thread with nozzle.Under working condition
Electrolyte, which is flowed into from anode cavities inlet from nozzle head, to be sprayed.Nozzle is rectangular nozzle, having a size of 20mm × 1mm.
3) processing electrolyte composition and configuration processing method: 250 grams/L of cupric sulfate pentahydrate, 50 grams/L of the concentrated sulfuric acid, activity
10 grams/L of agent urea, the TiB220 grams/L that partial size is 5 μm.Firstly, copper sulphate and the concentrated sulfuric acid are matched according to concentration and operating condition needs
It is set to the basic electrolyte of certain volume, then a certain number of TiB2 particles and activating agent urea are added 10 according to concentration is formulated
It grinds in the mortar of mL basic electrolyte, is then transferred in remaining basic electrolyte completely, machinery stirs at 300 r/min
Mix about 12 h.Before electro-deposition, composite electrolyte must also be stirred by ultrasonic 30 minutes.It, must be with 1000 r/min speed in processing
Mechanical stirring is spent, reducing particle agglomeration keeps its evenly dispersed, while comes into full contact with activating agent with TiB2 particle.Electrolyte temperature
It is controlled by water bath with thermostatic control at 60 DEG C, to guarantee that activating agent has preferable activity, plays optimum efficiency.
4) red copper electrode material surface pretreatment to be deposited: firstly, acetone, which cleans red copper electrode surface to be processed, goes oil removing
It is dirty.With 800-1200 mesh abrasive paper for metallograph by the gradual grinding of electrode surface, polishing.The dilute sulfuric acid that red copper electrode is placed in 15% is molten
Etch 2 minutes is in liquid to form one layer of fine and close passivation layer on surface.Distilled water flushing is clean, dries up, for use.
5) mask material is selected and processing method: mask material selects waterproof with a thickness of 0.1-2mm, anti-acid asphalt mixtures modified by epoxy resin
Waterproof layers of two-sided is pasted at rouge plate, the back side in advance.Before processing exposure mask, electrode material plane CAD diagram case file to be processed, Prototype drawing are drawn
Must design in case has dowel hole.File is imported into CNC computer engraving machine (its machining accuracy must reach ± 0.01mm), is processed
There is the mask plate of same profile with electrode material, as shown in Fig. 2.It, can shadow because template inner hole wall processing quality is relatively rough
Electro-deposition quality is rung, needs in the sulfuric acid that concentration is 98% to impregnate template 6 minutes, keeps hole wall smooth.Preparing has
One group of template of same shape, general thickness D=thickness of electrode to be processed d1+ coating layer thickness d2 after superposition.As shown in Fig. 3.
6) template groups of after processing is fixed to each other by double-sided adhesive, and fixed on the table by positioning pin, structure
At the inner cavity with electrode shape.Electrode to be processed is put into inner cavity, electrode surface to be treated is placed upwards, surface and template
The distance between upper surface is coating layer thickness.As shown in attached drawing 1,3
7) spray process is controlled by numerical control program, should be according to deposition thickness and the setting scanning of deposition region area in the numerical control program
The General Parameters such as number, scanning distance should make metal deposition layer accurately be deposited on mask plate limited area according to specified thickness
It is interior, form the nanocrystalline metal sedimentary of even compact.The basic parameter of spray process are as follows: nozzle motion scan speed 10mm/
S, electrolyte flow rate 300L/h, nozzle to 7 mm of cathode distance, pulse power parameters: the μ s of pulsewidth ton=20, the μ of toff=40 between arteries and veins
S, average current density 250A/dm2.
8) after the coating layer thickness of spray process reaches template restriction height, can terminate to process.The type chamber that template is formed
With electrode separation, the electrode material that strengthened that treated.
Reinforcing electrode material of different shapes is prepared using mask-type jet stream electro-deposition processing method.
Use electrolyte: copper sulphate 250g/L, sulfuric acid 50g/L, 10 grams/L of activating agent urea, the TiB220 that partial size is 5 μm
Gram/L.30 DEG C of electrolyte temperature.
Molding technique parameter: 20 × 1mm of nozzle diameter, nozzle motion scan speed 10mm/s, electrolyte flow rate 300 are used
L/h, nozzle to 7 mm of cathode distance；Pulse parameter: the μ s of pulsewidth ton=20, the μ s of toff=40 between arteries and veins, average current density are
250A/dm2。
Under the process conditions of above-mentioned determination, forming experiment has been carried out in attached jet stream electrodeposition apparatus shown in FIG. 1.By attached
Shown in Fig. 5, molding one group of electrode part of different shapes, it is clear-cut and have good contour structures, have certain 1mm
Nanocrystalline coating thickness.Pentalpha, triangle and square molded part in figure reach (10 in the dimensional accuracy of X, Y-direction
± 0.2) mm, radius of corner r < 1.5mm.Performance comparison is carried out by the copper product for preparing different processing methods, obtains table 1.
Seen from table 1, by nanocrystalline treated the copper electrodes material of jet stream electro-deposition, mechanical property includes tensile strength and hard
Degree all has a big promotion.From attached drawing 4 it can also be seen that, jet stream electro-deposition is nanocrystalline treated copper electrodes material,
Electrode proportion of relative loss will be significantly lower than common copper electroforming
Table 1
Compared with being currently known method, have the advantage that
1) present invention forms highly conductive height on common copper electroforming surface by jet stream electro-deposition means using common copper electroforming as ontology
Hardness EDM Cu alloy material, has obtained composite nanocrystalline structure coating, has the preferable mechanical properties such as crystalline structure densification,
Chemiluminescence is generated with high-intensitive TiB2 enhancing particle simultaneously, significantly reduces loss of the electrode material in EDM processing
Rate is the ideal substitute that red copper and graphite material are commonly used in current EDM processing.
2) present invention processes excellent locality using jet stream electro-deposition exposure mask, and combining with digital control process equipment can be for tool
There is the copper electroforming electrode material surface of complicated shape to carry out plating processing, is applicable to electrode of different shapes, simplifies processing
Difficulty.
It is described above；It is merely preferred embodiments of the present invention；But scope of protection of the present invention is not limited thereto；
Anyone skilled in the art is in the technical scope disclosed by the present invention；According to the technique and scheme of the present invention and its
It improves design and is subject to equivalent substitution or change；It should be covered by the scope of protection of the present invention.
Claims (4)
1. a kind of for improving the mask-type jet stream electric deposition device of small-sized EDM electrode performance, it is characterised in that: EDM electrode material
The preparation facilities of material is filled by liquid-transport pipe-line, electrolyte tank, electrolyte pump, flow control valve, power supply, numerical control nozzle system, workpiece
Clip module composition；Electrolyte tank, electrolyte pump, flow control valve, nozzle system, electrode material to be processed are each by liquid-transport pipe-line
Component sequence is connected, and positive pole connects nozzle anode stub, and power cathode connects electrode material to be processed, electrolyte pump starting
Afterwards, electrolyte line forms a closed circuit through nozzle directive electrode material to be processed.
2. a kind of equipment for carrying out surface Hardening Treatment for ball valve sealing pair according to claim 1, it is characterised in that:
The numerical control nozzle system is made of digital control mechanical arm, nozzle；
Nozzle is fixed on digital control mechanical arm front end, and it is accurately complete that digital control mechanical arm can drive nozzle to reach designated position by program instruction
It is acted at process such as nozzle scan etc.；
Nozzle is made of anode cavities and nozzle head two parts, and anode stub is fixed among anode cavities, and lower end passes through screw thread and nozzle
It is connected；Electrolyte is flowed into from nozzle head from anode cavities inlet and is sprayed under working condition.
3. it is according to claim 2 a kind of for improving the mask-type jet stream electric deposition device of small-sized EDM electrode performance,
Be characterized in that: the nozzle is rectangular nozzle, having a size of 20mm × 1mm.
4. a kind of for improving the mask-type jet stream electro-deposition method of small-sized EDM electrode performance, it is characterised in that: including following step
It is rapid:
Red copper electrode material surface pretreatment to be deposited: degreasing firstly, acetone cleans red copper electrode surface to be processed, with
Red copper electrode is placed in 15% dilution heat of sulfuric acid and is soaked by 800-1200 mesh abrasive paper for metallograph by the gradual grinding of electrode surface, polishing
Erosion 2 minutes so as in one layer of fine and close passivation layer of surface formation；Distilled water flushing is clean, dries up, for use；
Mask material is selected and processing method: mask material selects waterproof with a thickness of 0.1-2mm, anti-acid epoxy resin board,
Waterproof layers of two-sided is pasted in advance in the back side；
Before processing exposure mask, electrode material plane CAD diagram case file to be processed is drawn, must design in die plate pattern has dowel hole；
File is imported into CNC computer engraving machine, the mask plate that there is same profile with electrode material is processed, because of template inner hole wall
Processing quality is relatively rough, will affect electro-deposition quality, needs in the sulfuric acid that concentration is 98% to impregnate template 6 minutes, makes hole
Wall is smooth；
One group of template with same shape is prepared, general thickness D=thickness of electrode to be processed d1+ coating layer thickness d2 after superposition；
Template groups of after processing is fixed to each other by double-sided adhesive, and fixed on the table by positioning pin, composition has
Electrode to be processed is put into inner cavity by the inner cavity of electrode shape, and electrode surface to be treated is placed upwards, surface and template upper layer table
The distance between face is coating layer thickness；
Spray process is controlled by numerical control program, should be according to deposition thickness and the setting scanning time of deposition region area in the numerical control program
The General Parameters such as number, scanning distance should be such that metal deposition layer is accurately deposited in mask plate limited area according to specified thickness,
Form the nanocrystalline metal sedimentary of even compact, the basic parameter of spray process are as follows: nozzle motion scan speed 10mm/s, electricity
Flow velocity 300L/h is solved, nozzle to 7 mm of cathode distance, pulse power parameters: the μ s of pulsewidth ton=20, the μ s of toff=40 between arteries and veins are put down
Equal current density 250A/dm2；
After the coating layer thickness of spray process reaches template restriction height, it can terminate to process；The type chamber and electrode that template is formed
Separation, the electrode material that strengthened that treated.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112605398A (en) * | 2020-10-20 | 2021-04-06 | 南京航空航天大学 | Electrolysis-electrodeposition processing device and method for repairing SLM (Selective laser melting) formed part |
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| CN112605398A (en) * | 2020-10-20 | 2021-04-06 | 南京航空航天大学 | Electrolysis-electrodeposition processing device and method for repairing SLM (Selective laser melting) formed part |
| CN112605398B (en) * | 2020-10-20 | 2021-10-26 | 南京航空航天大学 | Electrolysis-electrodeposition processing device and method for repairing SLM (Selective laser melting) formed part |
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