CN114247595A - Packaging device based on semiconductor device manufacturing - Google Patents
Packaging device based on semiconductor device manufacturing Download PDFInfo
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- CN114247595A CN114247595A CN202111580897.6A CN202111580897A CN114247595A CN 114247595 A CN114247595 A CN 114247595A CN 202111580897 A CN202111580897 A CN 202111580897A CN 114247595 A CN114247595 A CN 114247595A
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- conveying
- gear
- frame
- disc
- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0235—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being a combination of rotation and linear displacement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0278—Arrangement or mounting of spray heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/40—Arrangements for collecting, re-using or eliminating excess spraying material for use in spray booths
- B05B14/43—Arrangements for collecting, re-using or eliminating excess spraying material for use in spray booths by filtering the air charged with excess material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/40—Construction elements specially adapted therefor, e.g. floors, walls or ceilings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a packaging device based on semiconductor device manufacturing and processing, which belongs to the technical field of semiconductor processing and aims to solve the problems that atomized coatings are not uniform enough, a film body cannot be timely and uniformly solidified on the surface of a wafer after the wafer is coated with a film, the wafer is easily collided with a material basket during subsequent packaging, the wafer is damaged and the like, and comprises a conveying structure; cladding material structure, cladding material structure is the rectangle structure, and cladding material structure sets up transport structure top right-hand member position, cladding material structure including: atomizing pole, atomizing pole are vertical structure, and the atomizing pole shower nozzle has increased directly to the spraying of process wafer through the multiunit atomizing pole in the protecting crust for setting towards the lower extreme, through vertical and towards the atomizing pole of lower extreme, has increased the wafer spraying to the process, makes the spraying more even, adds through the position between with the atomizing pole and establishes the auxiliary heat pipe, is favorable to carrying out preliminary condensation to the protective coating on the spraying.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a packaging device based on semiconductor device manufacturing and processing.
Background
The semiconductor device is mainly composed of chips, the chips are manufactured by mainly adopting a plurality of complex processes and are formed by overlapping layer by layer, wherein the most critical step is photoetching, a layer of photoresist is coated on the surface of a wafer, layers are overlapped on the surface of the wafer through a photoetching machine and a plurality of templates, the photoetching precision requirement at the initial development stage of photoetching is not high, the photoetching precision is gradually increased along with the progress of the processes, light rays are easy to reflect during photoetching and the like after the photoetching precision is increased, the problem of light reflection is solved by arranging a layer of anti-reflection film on the surface of a precision element and then coating the photoresist, the wafer is packaged and then conveyed after being sliced, and the transportation safety and the later processing of the wafer are realized.
Based on the aforesaid, current wafer is when photoetching and packing, and the reflection of light cladding material can let the fog leak in atomizing, and inside atomizing cladding material is not even enough, and after the wafer coating film, can not in time evenly solidify the film body on the wafer surface, and the collision of easy emergence wafer and material basket during follow-up packing causes the damage of wafer.
In view of the above, the present invention is directed to provide a packaging apparatus based on semiconductor device manufacturing process, which is improved in view of the conventional structure and defects, so as to achieve the purpose of higher practical value.
Disclosure of Invention
In order to solve the technical problems, the invention provides a packaging device based on semiconductor device manufacturing and processing, which aims to solve the problems that mist can be leaked due to an atomized anti-reflection coating when the conventional wafer is subjected to photoetching and packaging, the atomized coating inside the wafer is not uniform enough, a film body cannot be timely and uniformly solidified on the surface of the wafer after the wafer is coated, and the wafer is easily collided with a material basket during subsequent packaging to cause damage to the wafer.
The purpose and the effect of the packaging device based on the manufacturing and processing of the semiconductor device are achieved by the following specific technical means:
a packaging device based on semiconductor device manufacturing process comprises a conveying structure; cladding material structure, cladding material structure is the rectangle structure, and cladding material structure sets up transport structure top right-hand member position, cladding material structure including: the protective shell is of a rectangular box structure and is fixed at the top of the mounting frame; the connecting frames are provided with four rows, each row of connecting frames are communicated from the middle position, and the right end of the communicating position of the connecting frames is provided with an outer joint; the atomizing rods are of a vertical structure, the nozzles of the atomizing rods are arranged towards the lower end, the top of each group of atomizing rods is communicated with the connecting frame, and the bottom of each row of connecting frames is provided with four groups of atomizing rods; the auxiliary heat pipes are of a horizontal structure, six groups of auxiliary heat pipes are arranged, every two groups of auxiliary heat pipes are fixed on one group of ejector rods, the ejector rods are fixed in the protective shell, the left side of the coating structure is provided with a recovery structure, and the left end position of the top of the conveying structure is provided with heating equipment; the bearing device is placed at the left end of the conveying structure, a frame structure is arranged at the bottom of the bearing device, and a transmission assembly is arranged at the contact position between the frame structure and the conveying structure.
Further, the conveying structure comprises:
the mounting frame is of a rectangular frame structure, and three groups of shaft bodies are rotatably mounted on the mounting frame; the conveying belt is wound and installed on the three groups of shaft bodies, a protruding structure is arranged in the middle of the outer wall of the conveying belt, and an outer strip is arranged on the outer wall of the protruding position of the conveying belt; interior strip, interior strip adopt the bar magnet material, and interior strip embedding sets up in the arch of conveyer belt.
Further, the coating structure comprises:
the side plate is fixed in the position, close to the bottom, in the protective shell, and is provided with a gear row and is horizontally arranged; the bottom of the conveying disc is made of an iron material, the conveying disc is clamped and mounted on a protruding position of the conveying belt, and a disc-shaped protrusion is arranged at the top of the conveying disc;
the rotating disc is of a disc structure and is rotatably installed on the conveying disc, gear teeth are arranged on the outer wall of the rotating disc and are meshed with the gear rows of the side plates, and the top of the rotating disc is provided with an annular ring.
Further, the recovery structure comprises:
the recovery bin is of a vertical structure and is fixed at the left end position of the protective shell, two groups of external connecting pipes are arranged at the top of the recovery bin, and an inclined groove is formed in the recovery bin; the filter plates are inserted and installed in the chute of the recovery bin and are inclined;
the recycling bin is arranged at the bottom of the recycling bin and is in contact with the bottommost filter plate, the recycling bin is of a front-back through structure, and the recycling bin is inclined forwards and backwards.
Further, the heating device comprises:
the heating cabinet, the left end at the mount frame top is installed to the heating cabinet joint, is provided with two sets of inside grooves that are the trapezium structure in the heating cabinet, all adds in every group inside groove and is equipped with two sets of heating pipes.
Further, the carrying device comprises:
the bearing basket is of a U-shaped frame structure and consists of more than twenty groups of U-shaped frames; the packing ring, the packing ring is the U-shaped structure, and the packing ring is fixed in the interior border position that bears the basket, bears the basket and adopts soft rubber material.
Further, the transmission assembly comprises:
the driven wheel consists of an inner gear and an outer gear, the inner gear of the driven wheel is meshed with a gear on the shaft body of the mounting frame, the outer gear of the driven wheel is meshed with a gear on the worm of the driving wheel, the outer gear of the driven wheel is in a one-tenth gear structure, the driving wheel consists of two gears, and the two gears of the driving wheel are meshed with each other through the worm and gear;
the sliding rod is of a vertical structure, a tooth row structure is arranged on the outer wall of the sliding rod, and the sliding rod is meshed with the gear of the driving wheel.
Further, the frame structure comprises:
the bearing frame is of a flat plate structure, the front end and the rear end of the bearing frame are respectively contacted with the sliding rods, the bearing frame is provided with a through hole, the lifting frame and the bearing frame are of the same structure, and the bottom of the bearing frame is rotatably provided with a knob;
the guide rods are of a vertical rod structure and are provided with four groups, the guide rods are all fixed at the bottom of the lifting frame and are sleeved in through holes of the bearing frame, threads are arranged on the outer wall of the guide rod at the middle position, and the knob is screwed on the guide rods.
Compared with the prior art, the invention has the following beneficial effects:
in the conveying structure, the height of the wafer is increased through the convex structure of the conveying belt, so that the wafer is better contacted with the coating liquid, the stabilizing effect of the wafer conveyed at the convex position is improved through the outer strip additionally arranged at the convex position, and the stability of the wafer on the conveying belt is further improved through the inner strip embedded in the conveying belt.
In the coating structure, the protection of the protective shell on the internal components of the coating structure is increased through the protective shell with a rectangular structure, the uniform supply of the connecting frames is facilitated through the connecting frame with a communicating structure, the external joint is arranged at the right end of the communicating position of the connecting frame, the communication between the connecting frame and external paint is increased through the external joint on the connecting frame, the direct spraying on the wafer passing through is increased through the vertical atomizing rods towards the lower end, the spraying on the wafer passing through is increased through the multiple groups of atomizing rods in the protective shell, the spraying is more uniform, the primary condensation of the protective coating sprayed on is facilitated through the additional arrangement of the auxiliary heat pipe at the position between the atomizing rods, the side plate which is arranged at the bottom part in the protective shell is not in direct contact with a conveying belt, the side plate is not in contact with the wafer, and is in a perfect position, make things convenient for the completion of subsequent handling, delivery disc through the bottom adoption speciality, the better effect fixed with the conveyer belt contact of delivery disc has been realized, let the delivery disc can be more stable when following the conveyer belt and transporting, it is protruding through the disc of delivery disc, be favorable to the rotation installation of rolling disc, through direct and curb plate intermeshing's rolling disc, it is in transporting to have realized the delivery disc, the effect of incessant rotation simultaneously has, reach and let better even formation picture layer on the wafer, the rolling disc top sets up to cyclic annular circle, through the cyclic annular circle of multiunit on the rolling disc, the frictional force of rolling disc with the wafer has been increased, let the wafer more stable when being carried.
In the recovery structure, the filter plate with the inclined structure is used for increasing the filtering of the filter plate when the filter plate recovers water mist, the water mist on the filter plate can effectively slide down, the water mist can be conveniently collected and treated, the collection of the water mist on the filter plate by the recovery groove is increased by the recovery groove arranged at the bottom, the recovery groove is communicated with the recovery groove in the front and back direction, the recovery groove is simultaneously connected with two groups of external connecting pipes, the recovery of the water mist is increased, the recovery bin is arranged in a manner of inclining forwards and backwards, and the effect that the water mist on the recovery groove can conveniently slide down outwards is increased by the recovery groove with the inclined structure.
According to the transmission assembly, the driven wheel forms a wheel shaft mechanism through the inner gear and the outer gear of the driven wheel, the transmission effect of the driven wheel to the transmission wheel is convenient to achieve, the intermittent transmission effect of the driven wheel to the transmission wheel is achieved through one tenth of gear teeth on the outer gear of the driven wheel, the self-locking effect of the driven wheel is increased through the worm gear structure on the transmission wheel, the transmission effect of the transmission wheel to the sliding rod is achieved through the sliding rod with the outer wall of the sliding rod in the tooth row structure, and the effect that the bearing frame ascends and descends along with the sliding rod is achieved through the bearing frame fixedly connected with the sliding rod.
Drawings
Fig. 1 is a schematic structural view of the present invention.
FIG. 2 is a schematic view of the bottom cross-sectional structure of the protective shell of the present invention.
FIG. 3 is a schematic cross-sectional view of the protective shell of the present invention.
Fig. 4 is a schematic view of the structure of the rotating disc and the conveying disc of the present invention.
Fig. 5 is a schematic view of the heating apparatus of the present invention.
Fig. 6 is a schematic view of the transmission assembly of the present invention.
Fig. 7 is a schematic view of the frame structure of the present invention.
Fig. 8 is a schematic view of the present invention at a part enlarged in fig. 2.
Fig. 9 is a partial enlarged structural view of the invention at B in fig. 4.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
1. a conveying structure; 101. a mounting frame; 102. a conveyor belt; 103. an inner strip; 104. a protrusion; 105. an outer strip; 2. a plating layer structure; 201. a protective shell; 202. a connecting frame; 203. an atomizing rod; 204. an auxiliary heat pipe; 205. a side plate; 206. rotating the disc; 207. a delivery tray; 3. a recovery structure; 301. a recovery bin; 302. filtering the plate; 303. a recovery tank; 4. a heating device; 401. a heating box; 402. heating a tube; 5. a carrying device; 501. a carrying basket; 502. a gasket; 6. a transmission assembly; 601. a driven wheel; 602. a driving wheel; 603. a slide bar; 7. a frame structure; 701. a carrier; 702. a lifting frame; 703. a guide rod.
Detailed Description
Example (b):
as shown in figures 1 to 9:
the invention provides a packaging device based on semiconductor device manufacturing, which comprises a conveying structure 1;
cladding material structure 2, cladding material structure 2 are the rectangle structure, and cladding material structure 2 sets up at 1 top right-hand member position of transport structure, and cladding material structure 2 is including: the protective shell 201 is of a rectangular box structure, the protective shell 201 is fixed to the top of the mounting frame 101, and the protective shell 201 protects the internal components of the plating layer structure 2 through the protective shell 201 of the rectangular structure; the connecting frames 202 are provided with four rows in total, each row of connecting frames 202 are communicated from the middle position, uniform supply of the connecting frames 202 is facilitated through the connecting frames 202 with a communicated structure, the right end of the communicated position of the connecting frames 202 is provided with an external joint, and the connection between the connecting frames 202 and external paint is increased through the external joint on the connecting frames 202; the atomizing rods 203 are vertical structures, the nozzles of the atomizing rods 203 are arranged towards the lower end, the spraying of the passing wafers is increased through the vertical atomizing rods 203 towards the lower end, the top of each group of atomizing rods 203 is communicated with the connecting frame 202, four groups of atomizing rods 203 are arranged at the bottom of each row of connecting frame 202, and the spraying of the passing wafers is increased through the multiple groups of atomizing rods 203 in the protective shell 201, so that the spraying is more uniform; the auxiliary heat pipes 204 are of a horizontal structure, six groups of auxiliary heat pipes 204 are arranged, every two groups of auxiliary heat pipes 204 are fixed on one group of ejector rods which are fixed in the protective shell 201, the auxiliary heat pipes 204 are additionally arranged between the atomizing rods 203, preliminary condensation of the sprayed protective coating is facilitated, the recovery structure 3 is arranged on the left side of the coating structure 2, and the heating device 4 is arranged at the left end position of the top of the conveying structure 1;
wherein, transport structure 1 includes:
the mounting frame 101 is of a rectangular frame structure, various devices are mounted on the mounting frame 101 through the mounting frame 101 of the rectangular frame structure, three groups of shaft bodies are rotatably mounted on the mounting frame 101, and the overall conveying stability effect of the conveying structure 1 is improved through the three groups of shaft bodies;
the conveying belt 102 is wound and installed on the three groups of shaft bodies, a protrusion 104 structure is arranged in the middle of the outer wall of the conveying belt 102, the height of the wafer is increased through the protrusion 104 structure of the conveying belt 102, the wafer is better contacted with coating liquid, an outer strip 105 is arranged on the outer wall of the protrusion 104 position of the conveying belt 102, and the stabilizing effect when the wafer is conveyed at the protrusion 104 position is improved through the outer strip 105 additionally installed at the protrusion 104 position;
Wherein, cladding material structure 2 includes:
the side plate 205 is fixed at the position close to the bottom in the protective shell 201, the side plate 205 is provided with the gear row, the side plate 205 is horizontally arranged, and the side plate 205 arranged at the position close to the bottom in the protective shell 201 is not in direct contact with the conveying belt 102, and the side plate 205 is not in contact with the wafer, so that the side plate 205 is in a perfect position, and the completion of subsequent processes is facilitated;
the bottom of the conveying disc 207 is made of ferrous materials, and the conveying disc 207 is made of a special conveying disc 207, so that the conveying disc 207 is better contacted and fixed with the conveying belt 102, the conveying disc 207 is more stable when conveyed along with the conveying belt 102, the conveying disc 207 is clamped and mounted on the position of the bulge 104 of the conveying belt 102, and the top of the conveying disc 207 is provided with the disc-shaped bulge 104;
the rotating disc 206, the rotating disc 206 is a disc structure, the rotating disc 206 is rotatably installed on the conveying disc 207, the disc protrusion 104 through the conveying disc 207 is beneficial to the rotating installation of the rotating disc 206, gear teeth are arranged on the outer wall of the rotating disc 206 and are meshed with gear rows of the side plates 205, the rotating disc 206 directly meshed with the side plates 205 is used, the conveying disc 207 is conveyed, the effect of continuous rotation is achieved, a better uniform pattern layer formed on a wafer is achieved, the top of the rotating disc 206 is arranged to be an annular ring, and through multiple groups of annular rings on the rotating disc 206, the friction force between the rotating disc 206 and the wafer is increased, and the wafer is more stable when being conveyed.
Wherein, retrieve structure 3 including:
the recycling bin 301 is of a vertical structure, the recycling bin 301 is fixed at the left end position of the protective shell 201, two groups of external connecting pipes are arranged at the top of the recycling bin 301, a chute is formed in the recycling bin 301, and the efficient air extraction effect on the inner cavity of the recycling bin 301 is improved through the two groups of external connecting pipes at the top of the recycling bin 301;
the filter plates 302 are inserted into the chutes of the recovery bin 301, the filter plates 302 are inclined, and the filter plates 302 with inclined structures increase the filtering effect of the filter plates 302 when water mist is recovered, so that the water mist on the filter plates 302 can effectively slide down, and the water mist can be conveniently collected;
Wherein, heating apparatus 4 includes:
The specific use mode and function of the embodiment are as follows:
when in use, firstly, the middle position of the outer wall of the conveying belt 102 of the bulge 104 is arranged to be a bulge 104 structure, the bottom of the conveying disc 207 is provided with a groove matched with the bulge 104 structure, the conveying disc 207 is clamped on the bulge 104 structure of the conveying belt 102 through the groove, the stability of the conveying disc 207 is increased, the contact position of the groove at the bottom of the conveying disc 207 and the bulge 104 structure of the outer wall of the conveying belt 102 is additionally provided with the outer strip 105, the friction force between the conveying disc 207 and the conveying belt 102 is increased, the inner strip 103 of the bulge 104 is embedded in the bulge 104 structure of the outer wall of the conveying belt 102, the inner strip 103 adopts a magnetic attraction structure, the magnetic attraction effect of the conveying belt 102 on the conveying disc 207 is increased, the conveying belt 102 is more stable in the operation process, the problems of dislocation and falling are avoided, the side plate 205 is directly fixed on the protective shell 201, the side plate 205 is close to the conveying belt 102, the tooth rows are arranged on the side plate 205, the outer wall of the rotating disc 206 is provided with gear teeth, the transmission disc 207 is provided with a rotating disc 206 in a rotating way, wafers are placed on the transmission disc 207 in advance by external equipment, the transmission disc 207 can enable the outer wall of the rotating disc 206 on the transmission disc 207 to be contacted with a side plate 205 in the process of conveying the wafers, the transmission of gear teeth and gear rows is completed, the rotation of the rotating disc 206 in the process of conveying the transmission disc 207 is achieved, the wafers on the rotating disc 206 can be better coated, the mutually communicated connecting frames 202 on the protective shell 201 are favorable for realizing the supply control of the connecting frames 202, the atomizing rods 203 mutually communicated with the connecting frames 202 are both arranged to be of a structure facing towards the bottom, when in use, liquid is directly atomized, the better contact with the wafers is realized, the purpose of coating anti-reflection films on the wafers is completed, the auxiliary heat pipes 204 are additionally arranged between the adjacent atomizing rods 203, the preliminary stable treatment on the coatings is increased, and the top of the recovery bin 301 is provided with two groups of external pipes, the external connection pipe is communicated with external air pumping equipment, the recovery bin 301 is arranged on the right side of the protective shell 201, the bottom of the protective shell 201 is tightly attached to the recovery bin 301, when fog overflows from the bottom of the protective shell 201, the fog can be preferentially contacted with the bottom of the recovery bin 301 tightly attached to the protective shell 201, the effect of collecting and recovering the redundant fog by the recovery bin 301 is achieved, the multi-layer inclined structure filter plate 302 in the recovery bin 301 is achieved, filtering of moisture in the fog is increased, the recovery tank 303 is arranged at the bottommost part of the filter plate 302, the recovery tank 303 is a front-back through structure, the recovery tank 303 is connected with external water pumping equipment, moisture falling into the recovery tank 303 on the filter plate 302 is discharged, recovery and collection of the fog are achieved, water drops generated after a large amount of fog in the protective shell 201 are prevented from remaining, and the problem of dropping onto a wafer is solved.
Example two:
the carrying device 5 is placed at the left end of the conveying structure 1, a frame structure 7 is arranged at the bottom of the carrying device 5, and a transmission assembly 6 is arranged at the contact position between the frame structure 7 and the conveying structure 1.
Wherein, load bearing device 5 includes:
the carrying basket 501 is of a U-shaped frame structure, the carrying basket 501 is composed of more than twenty groups of U-shaped frames, and the carrying basket 501 composed of a plurality of groups of U-shaped frames is beneficial to replacing a certain group of U-shaped frames of the carrying basket 501 conveniently after the U-shaped frames are damaged;
the gasket 502 and the gasket 502 are of a U-shaped structure, the gasket 502 is fixed at the inner edge of the carrier basket 501, the carrier basket 501 is made of soft rubber, and the protective effect of the gasket 502 on wafers is increased by fixing the gasket 502 at the inner edge of the carrier basket 501.
Wherein, transmission assembly 6 includes:
the driven wheel 601 consists of an inner gear and an outer gear, the inner gear of the driven wheel 601 is meshed with a gear on the shaft body of the mounting frame 101, the outer gear of the driven wheel 601 is meshed with a gear on the worm of the driving wheel 602, an axle mechanism consisting of the driven wheel 601 is realized through the inner gear and the outer gear of the driven wheel 601, the transmission effect of the driven wheel 601 on the driving wheel 602 is convenient, the outer gear of the driven wheel 601 is in a one-tenth gear structure, the intermittent transmission effect of the driven wheel 601 on the driving wheel 602 is realized through one-tenth gear on the outer gear of the driven wheel 601, the driving wheel 602 consists of two gears, the two gears of the driving wheel 602 are meshed with each other through the worm and worm gears, and the self-locking effect of the driven wheel 601 is improved through the worm and gear structure on the driving wheel 602;
the slide bar 603, the slide bar 603 is vertical structure, sets up to the tooth row structure on the slide bar 603 outer wall, and the gear intermeshing of slide bar 603 and drive wheel 602 sets up to the slide bar 603 of tooth row structure through the outer wall, has realized the transmission effect of drive wheel 602 to slide bar 603.
Wherein, frame construction 7 includes:
the bearing frame 701 and the bearing frame 701 are of flat plate structures, the front end and the rear end of the bearing frame 701 are respectively in contact with the sliding rods 603, the effect that the bearing frame 701 goes up and down along with the sliding rods 603 is achieved through the bearing frame 701 fixedly connected with the sliding rods 603, the bearing frame 701 is provided with through holes, the lifting frame 702 is identical to the bearing frame 701 in structure, and the bottom of the bearing frame 701 is rotatably provided with a knob;
the utility model discloses a crane, including the guide bar 703, the guide bar 703 is the montant structure, the guide bar 703 is provided with four groups altogether, the guide bar 703 is all fixed in the bottom of crane 702, the guide bar 703 cup joints to be installed in bearing the through-hole of frame 701, through cup jointing the guide bar 703 in bearing the through-hole of frame 701, the direction purpose of bearing the through-hole of frame 701 to guide bar 703 has been realized, be provided with the screw thread on the guide bar 703 outer wall of intermediate position, the knob connects to install on the guide bar 703 by twisting, connect the knob of installing in the middle of the guide bar 703 by twisting, the rotation regulation of knob to guide bar 703 has been increased, reach crane 702 altitude control, let crane 702 be applicable to arbitrary height.
The specific use mode and function of the embodiment are as follows:
when the wafer lifting device is used, the rotating disc 206 on the conveying disc 207 is mainly used for bearing and lifting wafers, after the conveying belt 102 conveys the conveying disc 207 to the position of the bearing device 5, the lifted wafers are at the same horizontal height with the bearing basket 501, so that the wafers can be directly inserted into the bearing basket 501, the bearing basket 501 with the gasket 502 can play a role of buffering the wafers, the wafers cannot be damaged, after the wafers are inserted into the bearing basket 501, the rotating shaft body on the mounting frame 101 drives the driven wheel 601 to rotate, the rotating outer gear of the driven wheel 601 can be uninterruptedly contacted with the driving wheel 602 to complete transmission, incomplete gear teeth on the outer gear of the driven wheel 601 have an effect of driving the driving wheel 602 to perform intermittent motion, so that the sliding rod 603 can be intermittently lifted, the purpose of gradually lifting the bearing device 5 after the wafers are inserted is achieved, and after the bearing device 5 is lifted, the wafer on the rotating disc 206 is lifted up to be separated from the rotating disc 206, the rotating disc 206 and the conveying disc 207 in motion are turned to the bottom of the conveying belt 102, the conveying belt 102 with the magnetic attraction structure can prevent the rotating disc 206 and the conveying disc 207 from falling at the moment, the effect that the conveying belt 102 drives the rotating disc 206 and the conveying disc 207 to circularly convey is achieved, the wafer is inserted into the bearing device 5, the packaging of the wafer is achieved, and the photoetching treatment is conveniently carried out after the wafer is conveyed.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (9)
1. A packaging device based on semiconductor device manufacturing and processing is characterized in that: comprising a conveying structure (1);
cladding material structure (2), cladding material structure (2) are the rectangle structure, and cladding material structure (2) set up transport structure (1) top right-hand member position, cladding material structure (2) including: the protective shell (201), the protective shell (201) is a rectangular box structure, and the protective shell (201) is fixed on the top of the mounting frame (101); the connecting frames (202) are arranged in four rows, each row of connecting frames (202) are communicated from the middle position, and the right end of the communicating position of the connecting frames (202) is provided with an external joint; the atomizing rods (203) are vertical structures, the spray heads of the atomizing rods (203) are arranged towards the lower end, the top of each group of atomizing rods (203) is communicated with the connecting frame (202), and the bottom of each group of connecting frames (202) is provided with four groups of atomizing rods (203); the side plate (205), the side plate (205) is fixed in the protective shell (201) close to the bottom, the side plate (205) is provided with a gear row, and the side plate (205) is horizontally arranged; the bottom of the conveying disc (207) is made of ferrous materials, the conveying disc (207) is clamped and mounted on the position of the bulge (104) of the conveying belt (102), and the top of the conveying disc (207) is provided with a disc-shaped bulge (104); the rotary disc (206) is of a disc structure, the rotary disc (206) is rotatably mounted on the conveying disc (207), gear teeth are arranged on the outer wall of the rotary disc (206), the gear teeth are meshed with the gear rows of the side plates (205), and the top of the rotary disc (206) is provided with an annular ring; a recovery structure (3) is arranged on the left side of the plating layer structure (2), and a heating device (4) is arranged at the left end position of the top of the conveying structure (1);
the device comprises a bearing device (5), wherein the bearing device (5) is placed at the left end position of the conveying structure (1), a frame structure (7) is arranged at the bottom of the bearing device (5), and a transmission assembly (6) is arranged at the contact position between the frame structure (7) and the conveying structure (1).
2. A packaging unit based on semiconductor device manufacturing process according to claim 1, characterized in that said conveying structure (1) comprises:
the mounting rack (101), the mounting rack (101) is of a rectangular rack structure, and three groups of shaft bodies are rotatably mounted on the mounting rack (101);
the conveying belt (102) is wound on the three groups of shaft bodies, a protrusion (104) structure is arranged in the middle of the outer wall of the conveying belt (102), and an outer strip (105) is arranged on the outer wall of the protrusion (104) position of the conveying belt (102);
inner strip (103), inner strip (103) adopt the bar magnet material, and inner strip (103) embedding sets up in the arch (104) of conveyer belt (102).
3. A packaging arrangement based on a semiconductor device manufacturing process according to claim 1, characterized in that the coating structure (2) comprises:
the auxiliary heat pipes (204) are of a horizontal structure, six groups of auxiliary heat pipes (204) are arranged, every two groups of auxiliary heat pipes (204) are fixed on one group of ejector rods, and the ejector rods are fixed in the protective shell (201).
4. Bumps (104) the encapsulating device according to claim 1, characterized in that said recycling structure (3) comprises:
the recovery bin (301) is of a vertical structure, the recovery bin (301) is fixed at the left end of the protective shell (201), two groups of external connecting pipes are arranged at the top of the recovery bin (301), and a chute is formed in the recovery bin (301);
the filter plates (302), the filter plates (302) are inserted and installed in the chutes of the recovery bin (301), and the filter plates (302) are all inclined.
5. A packaging arrangement based on semiconductor device manufacturing process according to claim 1, characterized in that said recycling structure (3) comprises:
the recycling bin (301) is arranged at the bottom of the recycling bin (301), the recycling bin (301) is in contact with the bottommost filter plate (302), the recycling bin (303) is of a front-back through structure, and the recycling bin (301) is inclined towards the front and the back.
6. A packaging unit based on semiconductor device manufacturing process according to claim 1, characterized in that said heating means (4) comprises:
heating cabinet (401), heating cabinet (401) joint are installed at the left end at mounting bracket (101) top, are provided with two sets of ladder structure's of being inside groove in heating cabinet (401), all add in every group inside groove and are equipped with two sets of heating pipes (402).
7. A packaging unit based on semiconductor device manufacturing process according to claim 1, characterized in that said carrier means (5) comprises:
the bearing basket (501) is of a U-shaped frame structure, and the bearing basket (501) is composed of more than twenty groups of U-shaped frames;
the bearing basket is characterized by comprising a gasket (502), wherein the gasket (502) is of a U-shaped structure, the gasket (502) is fixed at the position of the inner edge of the bearing basket (501), and the bearing basket (501) is made of soft rubber.
8. A packaging unit based on semiconductor device manufacturing process according to claim 1, characterized in that said driving member (6) comprises:
the driven wheel (601), the driven wheel (601) is made up of two sets of gears inside and outside, the gear of inner end of the driven wheel (601) is meshed with the gear on the shaft body of the mounting rack (101), the gear of outer end of the driven wheel (601) is meshed with the gear on the worm of the driving wheel (602), the gear of outer end of the driven wheel (601) is a one-tenth gear structure, the driving wheel (602) is made up of two sets of gears, two sets of gears of the driving wheel (602) are meshed with each other through the worm gear;
slide bar (603), slide bar (603) are vertical structure, set up to the tooth row structure on slide bar (603) the outer wall, and slide bar (603) and the gear intermeshing of drive wheel (602).
9. A packaging arrangement based on a semiconductor device manufacturing process according to claim 1, characterized in that said frame structure (7) comprises:
the bearing frame (701), the bearing frame (701) is of a flat plate structure, the front end and the rear end of the bearing frame (701) are respectively contacted with the sliding rod (603), the bearing frame (701) is provided with a through hole, the lifting frame (702) and the bearing frame (701) are of the same structure, and the bottom of the bearing frame (701) is rotatably provided with a knob;
the guide rod (703), guide rod (703) are the montant structure, and guide rod (703) are provided with four groups altogether, and guide rod (703) are all fixed in the bottom of crane (702), and guide rod (703) cup joint and install in the through-hole that bears frame (701), are provided with the screw thread on the guide rod (703) outer wall of intermediate position, and the knob is screwed on installing on guide rod (703).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111580897.6A CN114247595B (en) | 2021-12-22 | 2021-12-22 | Packaging device based on semiconductor device manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111580897.6A CN114247595B (en) | 2021-12-22 | 2021-12-22 | Packaging device based on semiconductor device manufacturing |
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| Publication Number | Publication Date |
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| CN114247595A true CN114247595A (en) | 2022-03-29 |
| CN114247595B CN114247595B (en) | 2022-10-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2014212072A (en) * | 2013-04-19 | 2014-11-13 | 新日鉄住金エンジニアリング株式会社 | Thin-film electrostatic coating device |
| CN106423649A (en) * | 2016-11-01 | 2017-02-22 | 重庆理工大学 | Continuous production-type ultrasonic atomization spraying film-coating equipment |
| CN108176533A (en) * | 2017-11-24 | 2018-06-19 | 河南高盛企业管理咨询有限公司 | A kind of bearing automates oiling station |
| CN112246506A (en) * | 2020-10-19 | 2021-01-22 | 广州罗罗食品有限公司 | Coated plastic tableware and preparation method thereof |
| CN213468326U (en) * | 2020-08-20 | 2021-06-18 | 江苏经贸职业技术学院 | Product conveying device based on intelligent automatic spraying |
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2021
- 2021-12-22 CN CN202111580897.6A patent/CN114247595B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212072A (en) * | 2013-04-19 | 2014-11-13 | 新日鉄住金エンジニアリング株式会社 | Thin-film electrostatic coating device |
| CN106423649A (en) * | 2016-11-01 | 2017-02-22 | 重庆理工大学 | Continuous production-type ultrasonic atomization spraying film-coating equipment |
| CN108176533A (en) * | 2017-11-24 | 2018-06-19 | 河南高盛企业管理咨询有限公司 | A kind of bearing automates oiling station |
| CN213468326U (en) * | 2020-08-20 | 2021-06-18 | 江苏经贸职业技术学院 | Product conveying device based on intelligent automatic spraying |
| CN112246506A (en) * | 2020-10-19 | 2021-01-22 | 广州罗罗食品有限公司 | Coated plastic tableware and preparation method thereof |
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| CN114247595B (en) | 2022-10-18 |
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