CN114242914B - 一种oled器件 - Google Patents
一种oled器件 Download PDFInfo
- Publication number
- CN114242914B CN114242914B CN202111552389.7A CN202111552389A CN114242914B CN 114242914 B CN114242914 B CN 114242914B CN 202111552389 A CN202111552389 A CN 202111552389A CN 114242914 B CN114242914 B CN 114242914B
- Authority
- CN
- China
- Prior art keywords
- oled device
- composite aerogel
- conductive composite
- layer
- aerogel structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000004964 aerogel Substances 0.000 claims abstract description 76
- 239000002131 composite material Substances 0.000 claims abstract description 76
- 229920001721 polyimide Polymers 0.000 claims abstract description 9
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004642 Polyimide Substances 0.000 claims abstract description 8
- 239000002121 nanofiber Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 23
- 238000005538 encapsulation Methods 0.000 claims description 21
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 239000002346 layers by function Substances 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 6
- 239000011147 inorganic material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910010052 TiAlO Inorganic materials 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- CKUAXEQHGKSLHN-UHFFFAOYSA-N [C].[N] Chemical compound [C].[N] CKUAXEQHGKSLHN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111552389.7A CN114242914B (zh) | 2021-12-17 | 2021-12-17 | 一种oled器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111552389.7A CN114242914B (zh) | 2021-12-17 | 2021-12-17 | 一种oled器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114242914A CN114242914A (zh) | 2022-03-25 |
CN114242914B true CN114242914B (zh) | 2024-03-05 |
Family
ID=80758045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111552389.7A Active CN114242914B (zh) | 2021-12-17 | 2021-12-17 | 一种oled器件 |
Country Status (1)
Country | Link |
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CN (1) | CN114242914B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250899A (ja) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
KR100772646B1 (ko) * | 2006-09-20 | 2007-11-02 | (주) 아모센스 | 반도체 패키지 |
CN101562077A (zh) * | 2009-05-11 | 2009-10-21 | 湘潭大学 | 一种用于染料敏化太阳能电池的炭气凝胶复合对电极及其制备方法 |
JP2011124333A (ja) * | 2009-12-09 | 2011-06-23 | Tdk Corp | Led実装用基板 |
CN109443630A (zh) * | 2018-10-31 | 2019-03-08 | 福州大学 | 一种基于qled发光器件的压力传感器 |
CN110164364A (zh) * | 2018-12-07 | 2019-08-23 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
CN112694858A (zh) * | 2020-12-29 | 2021-04-23 | 哈尔滨工业大学(深圳) | 一种金属气凝胶包覆液态金属的导热胶的制备及封装方法 |
KR20210151544A (ko) * | 2020-06-05 | 2021-12-14 | 한화솔루션 주식회사 | 수분 안정성과 장기 안정성이 향상된 태양전지 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011108227A1 (ja) * | 2010-03-01 | 2011-09-09 | パナソニック株式会社 | 発光素子用基板及びその製造方法ならびに発光装置 |
CN104350617A (zh) * | 2012-06-12 | 2015-02-11 | 株式会社村田制作所 | 发光装置 |
CN205121517U (zh) * | 2015-10-29 | 2016-03-30 | 深圳市汇顶科技股份有限公司 | 压力检测结构和终端设备 |
DE102017110605A1 (de) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung, Videowand-Modul und Signalgeber für eine Lichtsignalanlage |
-
2021
- 2021-12-17 CN CN202111552389.7A patent/CN114242914B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250899A (ja) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
KR100772646B1 (ko) * | 2006-09-20 | 2007-11-02 | (주) 아모센스 | 반도체 패키지 |
CN101562077A (zh) * | 2009-05-11 | 2009-10-21 | 湘潭大学 | 一种用于染料敏化太阳能电池的炭气凝胶复合对电极及其制备方法 |
JP2011124333A (ja) * | 2009-12-09 | 2011-06-23 | Tdk Corp | Led実装用基板 |
CN109443630A (zh) * | 2018-10-31 | 2019-03-08 | 福州大学 | 一种基于qled发光器件的压力传感器 |
CN110164364A (zh) * | 2018-12-07 | 2019-08-23 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
KR20210151544A (ko) * | 2020-06-05 | 2021-12-14 | 한화솔루션 주식회사 | 수분 안정성과 장기 안정성이 향상된 태양전지 |
CN112694858A (zh) * | 2020-12-29 | 2021-04-23 | 哈尔滨工业大学(深圳) | 一种金属气凝胶包覆液态金属的导热胶的制备及封装方法 |
Non-Patent Citations (1)
Title |
---|
Liu, H等.Lightweight, Superelastic,and Hydrophobic Polyimide Nanofiber /MXene Composite Aerogel for Wearable Piezoresistive Sensor and Oil/Water Separation Applications.《ADVANCED FUNCTIONAL MATERIALS》.2021,第31卷(第13期),论文正文1-12页,附图1-6. * |
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Publication number | Publication date |
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CN114242914A (zh) | 2022-03-25 |
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Inventor after: Mu Donghua Inventor after: Kang Jianxi Inventor after: Zhu Yingguang Inventor after: Zhang Guohui Inventor after: Li Xiaosong Inventor after: Hu Yonglan Inventor after: Chen Xu Inventor after: Zhao Yang Inventor before: Mu Donghua Inventor before: Kang Jianxi Inventor before: Zhu Yingguang Inventor before: Zhang Guohui Inventor before: Li Xiaosong Inventor before: Hu Yonglan Inventor before: Chen Xu Inventor before: Zhao Yang |