CN114230374A - Silicon nitride surface metallization method - Google Patents
Silicon nitride surface metallization method Download PDFInfo
- Publication number
- CN114230374A CN114230374A CN202111546449.4A CN202111546449A CN114230374A CN 114230374 A CN114230374 A CN 114230374A CN 202111546449 A CN202111546449 A CN 202111546449A CN 114230374 A CN114230374 A CN 114230374A
- Authority
- CN
- China
- Prior art keywords
- silicon nitride
- laser
- ceramic
- nitride ceramic
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052581 Si3N4 Inorganic materials 0.000 title claims abstract description 43
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000001465 metallisation Methods 0.000 title claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000013307 optical fiber Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- 238000010329 laser etching Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 abstract description 11
- 239000000945 filler Substances 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5116—Ag or Au
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5144—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the metals of the iron group
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention belongs to the technical field of metallization, and discloses a method for metalizing a silicon nitride surface. The technical scheme of the invention realizes the modification of the surface of the silicon nitride ceramic, can obtain a uniform and compact active metal conducting layer which is well connected with the ceramic matrix on the surface of the silicon nitride ceramic, relieves the stress between the ceramic matrix and the metal coating, and obviously improves the spreadability and wettability of the brazing filler metal on the surface of the ceramic in the brazing process.
Description
Technical Field
The invention belongs to the technical field of metallization, and particularly relates to a silicon nitride surface metallization method.
Background
The silicon nitride ceramic is an inorganic nonmetal strong covalent bond compound, has the advantages of high specific strength, high specific modulus, high temperature resistance, oxidation resistance, wear resistance, high thermal shock resistance and the like, and has special use value in the working environment with high temperature, high speed and strong corrosive medium. However, due to the disadvantages of large brittleness, low ductility, difficult processing and the like, the application of the ceramic material in engineering is limited to a great extent, parts with large size and complex shape are difficult to manufacture for use, and the metal material has excellent room temperature strength and ductility, and a ceramic-metal composite member is obtained by connecting the ceramic and the metal, so that the advantages of the ceramic and the metal can be combined, the excellent performance of the ceramic material can be fully exerted, and the application range of the ceramic is further expanded. Therefore, the silicon nitride ceramic surface metallization is realized by adopting a proper method, and the active metal coating is prepared, so that the wear resistance of the ceramic can be improved, the wetting and spreading performance of the brazing filler metal on the ceramic surface in the brazing process can be improved, and the method has a particularly important significance for improving the internal stress distribution state of a structural member, reducing the manufacturing cost and widening the application range of the ceramic material.
Common ceramic surface metallization methods include a chemical Ni plating method, an electroplating Ni method, a sintering Ag method, a Mo-Mn method and a vacuum evaporation coating method, but the traditional metallization method is long in time consumption and high in cost. The properties of the silicon nitride ceramic such as hardness and toughness are different from those of common dense ceramics, so that the traditional metallization method cannot be well applied to realizing the surface metallization of the silicon nitride ceramic.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the surface metallization method of the silicon nitride ceramic, which can be implemented at room temperature, does not need post-treatment, has low cost, and can realize the surface modification of the silicon nitride ceramic and the high-strength effective connection between the silicon nitride ceramic and a metal material.
The above purpose of the invention is realized by the following technical scheme:
a silicon nitride surface metallization method specifically comprises the following steps: and completely covering the laser-etched uniform metal conducting layer on the surface of the silicon nitride ceramic through laser scanning.
Further, the method comprises the following specific implementation steps:
the method comprises the following steps: drawing a pattern of a metalized area on laser parameter control software carried by the fiber laser according to the size of the silicon nitride ceramic igniter and setting laser parameters;
step two: placing the silicon nitride ceramic igniter on a laser workbench, and coating a metal foil on the surface of the silicon nitride ceramic igniter to enable the metal foil to be tightly attached to the silicon nitride ceramic;
step three: and starting a power supply of the optical fiber laser, and then starting laser etching until laser completes one scanning according to the path of the pattern of the metalized area, which indicates that the laser scanning etching is finished, and forming a metal layer on the surface of the silicon nitride ceramic, namely completing the metallization of the surface of the silicon nitride ceramic.
Furthermore, after the third step is completed, the second step and the third step can be repeated on the obtained product, and any one of copper, silver and nickel metal foils can be selected in the process of repeating the second step, and the repeated etching times are 1-10 times.
Furthermore, the method further comprises the following step four: the metallized silicon substrate waits for soldering or surface circuit etching.
As a further alternative, the pattern of the metalized area is designed according to the size of the ceramic, and includes a rectangular shape, a circular shape or other figures.
As a further alternative, the metal foil comprises any one of copper, silver and nickel sheets, and the thickness is 10 μm to 20 μm.
Furthermore, the optical fiber laser adopted by the method is produced by Changchun optical precision machinery and physical research institute of Chinese academy of sciences, New Changchun industry optoelectronics technology Co., Ltd, and is JK-MAX-50 with the number of HPW-YE0560D, and the laser parameter control software is EZCad2.5.3.
Furthermore, the power of the optical fiber laser is 0-1000W, the scanning speed is 1-1000mm/s, and the scanning distance is 0.01-1 mm.
Compared with the prior art, the invention has the beneficial effects that:
the technical scheme of the invention realizes the modification of the surface of the silicon nitride ceramic, can obtain a uniform and compact active metal conducting layer which is well connected with the ceramic matrix on the surface of the silicon nitride ceramic, relieves the stress between the ceramic matrix and the metal coating, and obviously improves the spreadability and wettability of the brazing filler metal on the surface of the ceramic in the brazing process.
1. The invention focuses on a method for forming a metal conducting layer on the surface of ceramic through copper-clad sheet laser etching, the laser etching method can be effectively applied to the surface modification of ceramic, silicon nitride ceramic is selected as a substrate, and the existence of a ceramic porous structure can buffer and absorb the energy of laser in the etching process, so that a metallization layer is melted on the surface of the ceramic, permeates into pores and reacts in a ceramic aggregate to form the tightly connected metal conducting layer. The formation of the metallized conducting layer improves the wear resistance of the surface of the silicon nitride ceramic and obviously improves the spreadability and wettability of the brazing filler metal on the surface of the ceramic in the brazing process.
2. Compared with the prior high-temperature sintering technology, the method does not need post-heat treatment, saves a large amount of energy, the power of the high-temperature sintering furnace is about 10KW, and the power of equipment used by the method does not exceed 300W, so the method saves a large amount of energy and has low cost.
3. The metal layer is a single metal uniform conducting layer, and is simpler, and has better electrical conductivity and thermal conductivity compared with the prior metal mixture.
Detailed Description
The invention is described in more detail below with reference to specific examples, without limiting the scope of the invention. Unless otherwise specified, the experimental methods adopted by the invention are all conventional methods, and experimental equipment, materials, reagents and the like used in the experimental method can be obtained from commercial sources.
Example 1
S1, drawing related metallized area patterns in a computer by using EZCad2.5.3 software, and setting laser parameters, wherein the laser power is 600W, the scanning speed is 200mm/s, and the scanning distance is 0.02 mm;
s2, horizontally placing the silicon nitride ceramic substrate on a laser processing workbench, and covering a layer of copper foil with the thickness of 10 mu m on the surface of the ceramic to enable the copper foil to be tightly attached to the ceramic;
s3, starting a power supply of the optical fiber laser, aligning the laser focal length to the ceramic metalized area, and starting to perform laser scanning to etch the copper foil;
s4, the metallized silicon nitride ceramics waits for welding or surface circuit etching is carried out. After brazing at 400 ℃ under the temperature of 300-.
Example 2
S1, drawing related metallized area patterns in a computer by using EZCad2.5.3 software, and setting laser parameters, wherein the laser power is 600W, the scanning speed is 200mm/s, and the scanning distance is 0.02 mm;
s2, horizontally placing the silicon nitride ceramic substrate on a laser processing workbench, and covering a silver foil with the thickness of 10 mu m on the surface of the ceramic to enable the silver foil to be tightly attached to the ceramic;
s3, starting a power supply of the optical fiber laser, aligning the laser focal length to the ceramic metalized area, and starting to perform laser scanning etching on the silver foil;
s4, the metallized silicon nitride ceramics waits for welding or surface circuit etching is carried out. After brazing at 400 ℃ under the temperature of 300-.
Example 3
S1, drawing related metallized area patterns in a computer by using EZCad2.5.3 software, and setting laser parameters, wherein the laser power is 600W, the scanning speed is 200mm/s, and the scanning distance is 0.02 mm;
s2, placing the silicon nitride ceramic substrate on a laser processing workbench, and covering a layer of nickel foil with the thickness of 10 mu m on the surface of the ceramic to enable the nickel foil to be tightly attached to the ceramic;
s3, starting a power supply of the optical fiber laser, aligning the laser focal length to the ceramic metalized area, and starting to perform laser scanning etching on the silver foil;
s4, the metallized silicon nitride ceramics waits for welding or surface circuit etching is carried out. After brazing at 400 ℃ under the temperature of 300-.
The above embodiments of the present invention are described in detail, and specific embodiments are applied to illustrate the principle and the implementation manner of the present invention, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. A silicon nitride surface metallization method is characterized by specifically comprising the following steps: and completely covering the laser-etched uniform metal conducting layer on the surface of the silicon nitride ceramic through laser scanning.
2. The silicon nitride surface metallization method of claim 1, characterized by the specific implementation steps of:
the method comprises the following steps: drawing a pattern of a metalized area on laser parameter control software carried by the fiber laser according to the size of the silicon nitride ceramic igniter and setting laser parameters;
step two: placing the silicon nitride ceramic igniter on a laser workbench, and coating a metal foil on the surface of the silicon nitride ceramic igniter to enable the metal foil to be tightly attached to the silicon nitride ceramic;
step three: and starting a power supply of the optical fiber laser, and then starting laser etching until laser completes one scanning according to the path of the pattern of the metalized area, which indicates that the laser scanning etching is finished, and forming a metal layer on the surface of the silicon nitride ceramic, namely completing the metallization of the surface of the silicon nitride ceramic.
3. The method for metalizing silicon nitride surface according to claim 2, wherein the obtained product can be repeated in the second step and the third step after the third step is completed, and any one of copper, silver and nickel metal foils can be selected during the repeated step two, and the repeated etching times are 1-10 times.
4. A method for metallizing a silicon nitride surface as defined in claim 2 further comprising the steps of four: the metallized silicon substrate waits for soldering or surface circuit etching.
5. The method of claim 2, wherein the pattern of the first metalized area is designed according to ceramic dimensions, and comprises a rectangle, a circle or other figures.
6. The method of claim 2, wherein the metal foil of step two comprises any one of a copper foil, a silver foil and a nickel foil, and has a thickness of 10 μm to 20 μm.
7. The method of claim 2, wherein the model of the fiber laser used in the third step is JK-MAX-50, and the laser parameter control software is ezcad2.5.3.
8. The silicon nitride surface metallization method of claim 2, wherein the power of the fiber laser in step three is 0-1000W, the scanning speed is 1-1000mm/s, and the scanning distance is 0.01-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111546449.4A CN114230374A (en) | 2021-12-16 | 2021-12-16 | Silicon nitride surface metallization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111546449.4A CN114230374A (en) | 2021-12-16 | 2021-12-16 | Silicon nitride surface metallization method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114230374A true CN114230374A (en) | 2022-03-25 |
Family
ID=80757380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111546449.4A Pending CN114230374A (en) | 2021-12-16 | 2021-12-16 | Silicon nitride surface metallization method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114230374A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437484A (en) * | 1987-08-04 | 1989-02-08 | Nippon Steel Corp | Metallizing of ceramic by active metal |
| JPS6437483A (en) * | 1987-08-04 | 1989-02-08 | Nippon Steel Corp | Metallizing of ceramic by alloy comprising noble metal as main component |
| CN103880478A (en) * | 2012-12-21 | 2014-06-25 | 比亚迪股份有限公司 | Ceramic surface selective metallization method and ceramic |
| CN106413270A (en) * | 2016-11-04 | 2017-02-15 | 大连大学 | Aluminum nitride ceramic circuit board and preparation method thereof |
| CN110240494A (en) * | 2019-06-28 | 2019-09-17 | 大连大学 | A kind of fiber reinforcement Cf/SiC composite plate weld connector |
| CN111269028A (en) * | 2020-03-05 | 2020-06-12 | 哈尔滨工业大学（威海） | Silicon nitride ceramic surface metallization method |
-
2021
- 2021-12-16 CN CN202111546449.4A patent/CN114230374A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437484A (en) * | 1987-08-04 | 1989-02-08 | Nippon Steel Corp | Metallizing of ceramic by active metal |
| JPS6437483A (en) * | 1987-08-04 | 1989-02-08 | Nippon Steel Corp | Metallizing of ceramic by alloy comprising noble metal as main component |
| CN103880478A (en) * | 2012-12-21 | 2014-06-25 | 比亚迪股份有限公司 | Ceramic surface selective metallization method and ceramic |
| CN106413270A (en) * | 2016-11-04 | 2017-02-15 | 大连大学 | Aluminum nitride ceramic circuit board and preparation method thereof |
| CN110240494A (en) * | 2019-06-28 | 2019-09-17 | 大连大学 | A kind of fiber reinforcement Cf/SiC composite plate weld connector |
| CN111269028A (en) * | 2020-03-05 | 2020-06-12 | 哈尔滨工业大学（威海） | Silicon nitride ceramic surface metallization method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109354512B (en) | Preparation method for chemical copper plating on surface of high-thermal-conductivity silicon nitride ceramic | |
| CN103819215B (en) | Preparation method of aluminium nitride base ceramic copper-clad plate | |
| CN105777210B (en) | A kind of aluminium nitride ceramics copper-clad plate and preparation method thereof | |
| CN102339758A (en) | Method for manufacturing copper-ceramic substrate by adopting low-temperature bonding | |
| CN105405601B (en) | One kind metallization FERRITE CORE and preparation method thereof | |
| CN104105353A (en) | Preparation method of high-accuracy ceramic printed circuit board | |
| RU2008138883A (en) | METHOD FOR PRODUCING PELLIET MODULES, AND ALSO PELLIET MODULE | |
| CN105418132A (en) | Method for adopting aluminum or aluminum alloy to directly braze aluminum nitride ceramics | |
| CN111269028A (en) | Silicon nitride ceramic surface metallization method | |
| CN108054106A (en) | A kind of method for preparing high heat dissipation ceramic package substrate | |
| US4591088A (en) | Solder reflow process for soldering shaped articles together | |
| CN102943225A (en) | Carbon fiber cloth/aluminium alloy composite material and preparation method thereof | |
| CN110721999B (en) | Copper-aluminum composite plate strip added with nickel grid layer and continuous production method thereof | |
| RU2558323C1 (en) | Method of metallisation of substrate from aluminium-nitride ceramics | |
| CN109759665B (en) | Preparation method of TiB whisker reinforced ceramic/metal joint with three-dimensional net distribution | |
| CN114230374A (en) | Silicon nitride surface metallization method | |
| CN113501725B (en) | Preparation method of aluminum-coated ceramic insulating lining plate | |
| CN110642644B (en) | Aluminum nitride ceramic copper-clad plate and preparation method thereof | |
| CN100434218C (en) | Application method of surface alloying ceramic | |
| CN105436643A (en) | Direct aluminum or aluminum alloy brazing method for aluminum oxide ceramics | |
| US4495253A (en) | Solderable plated plastic components and process for plating _ | |
| CN104402533A (en) | Method for vacuum cladding of metal coating layer on silicon carbide surface | |
| KR910016950A (en) | Manufacturing method of composite material and manufacturing method of hydrothermal material and hydrothermal material | |
| CN101823903A (en) | Ceramic metalizing process | |
| CN109618505B (en) | Method for interconnecting through holes with high thickness-diameter ratio of directly copper-clad ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220325 |