CN114223059A - 发光二极管显示面板以及具有其的显示装置 - Google Patents

发光二极管显示面板以及具有其的显示装置 Download PDF

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Publication number
CN114223059A
CN114223059A CN202080056121.1A CN202080056121A CN114223059A CN 114223059 A CN114223059 A CN 114223059A CN 202080056121 A CN202080056121 A CN 202080056121A CN 114223059 A CN114223059 A CN 114223059A
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CN
China
Prior art keywords
led stack
type semiconductor
conductive type
layer
semiconductor layer
Prior art date
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Withdrawn
Application number
CN202080056121.1A
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English (en)
Chinese (zh)
Inventor
蔡钟炫
李剡劤
张成逵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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Filing date
Publication date
Priority claimed from US16/943,373 external-priority patent/US12176378B2/en
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of CN114223059A publication Critical patent/CN114223059A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
CN202080056121.1A 2019-08-07 2020-08-04 发光二极管显示面板以及具有其的显示装置 Withdrawn CN114223059A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962883773P 2019-08-07 2019-08-07
US62/883,773 2019-08-07
US16/943,373 US12176378B2 (en) 2019-08-07 2020-07-30 LED display panel and led display apparatus having the same
US16/943,373 2020-07-30
PCT/KR2020/010276 WO2021025436A1 (ko) 2019-08-07 2020-08-04 발광 다이오드 디스플레이 패널 및 그것을 갖는 디스플레이 장치

Publications (1)

Publication Number Publication Date
CN114223059A true CN114223059A (zh) 2022-03-22

Family

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Family Applications (2)

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CN202080056121.1A Withdrawn CN114223059A (zh) 2019-08-07 2020-08-04 发光二极管显示面板以及具有其的显示装置
CN202021596951.7U Active CN212517197U (zh) 2019-08-07 2020-08-04 发光二极管显示面板以及具有其的显示装置

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CN202021596951.7U Active CN212517197U (zh) 2019-08-07 2020-08-04 发光二极管显示面板以及具有其的显示装置

Country Status (5)

Country Link
US (1) US20250063877A1 (https=)
EP (1) EP4012765A4 (https=)
JP (2) JP7568711B2 (https=)
KR (1) KR20220044727A (https=)
CN (2) CN114223059A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116741762A (zh) * 2023-08-16 2023-09-12 江西兆驰半导体有限公司 一种堆叠式全彩Micro-LED芯片及其制备方法
WO2024260130A1 (zh) * 2023-06-21 2024-12-26 诺视科技(苏州)有限公司 像素单元及其制作方法、微显示屏、像素级分立器件
CN119630158A (zh) * 2023-09-12 2025-03-14 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN119836093A (zh) * 2023-10-11 2025-04-15 武汉华星光电半导体显示技术有限公司 一种显示装置
TWI883828B (zh) * 2024-02-20 2025-05-11 晶呈科技股份有限公司 垂直型發光二極體封裝結構及其製備方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220044727A (ko) * 2019-08-07 2022-04-11 서울바이오시스 주식회사 발광 다이오드 디스플레이 패널 및 그것을 갖는 디스플레이 장치
TWI820587B (zh) * 2021-04-09 2023-11-01 群創光電股份有限公司 電子裝置
CN115394762B (zh) * 2022-05-17 2024-07-09 诺视科技(苏州)有限公司 一种具有透明衬底的像素级分立器件及其制作方法
KR102822777B1 (ko) * 2022-12-15 2025-06-19 엘지전자 주식회사 발광 구조를 구비한 디스플레이 장치
CN115988932A (zh) * 2023-01-31 2023-04-18 安徽熙泰智能科技有限公司 一种量子点混合集成多色显示器及其制造方法
WO2025260882A1 (zh) * 2024-06-19 2025-12-26 诺视科技(苏州)有限公司 基于多层堆叠的微显示芯片及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012244A (ja) * 2013-07-01 2015-01-19 株式会社東芝 半導体発光素子
US20190165037A1 (en) * 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190189596A1 (en) * 2017-12-20 2019-06-20 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190198485A1 (en) * 2017-12-22 2019-06-27 Seoul Viosys Co., Ltd. Light emitting device with led stack for display and display apparatus having the same
CN212517197U (zh) * 2019-08-07 2021-02-09 首尔伟傲世有限公司 发光二极管显示面板以及具有其的显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160163940A1 (en) * 2014-12-05 2016-06-09 Industrial Technology Research Institute Package structure for light emitting device
US20160336482A1 (en) * 2015-05-12 2016-11-17 Epistar Corporation Light-emitting device
KR102513080B1 (ko) * 2016-04-04 2023-03-24 삼성전자주식회사 Led 광원 모듈 및 디스플레이 장치
JP2018049981A (ja) * 2016-09-23 2018-03-29 スタンレー電気株式会社 半導体発光装置、および、その製造方法
KR102503578B1 (ko) * 2017-06-30 2023-02-24 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
US11282981B2 (en) * 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US10886327B2 (en) * 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012244A (ja) * 2013-07-01 2015-01-19 株式会社東芝 半導体発光素子
US20190165037A1 (en) * 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190189596A1 (en) * 2017-12-20 2019-06-20 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190198485A1 (en) * 2017-12-22 2019-06-27 Seoul Viosys Co., Ltd. Light emitting device with led stack for display and display apparatus having the same
CN212517197U (zh) * 2019-08-07 2021-02-09 首尔伟傲世有限公司 发光二极管显示面板以及具有其的显示装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024260130A1 (zh) * 2023-06-21 2024-12-26 诺视科技(苏州)有限公司 像素单元及其制作方法、微显示屏、像素级分立器件
CN116741762A (zh) * 2023-08-16 2023-09-12 江西兆驰半导体有限公司 一种堆叠式全彩Micro-LED芯片及其制备方法
CN116741762B (zh) * 2023-08-16 2023-11-24 江西兆驰半导体有限公司 一种堆叠式全彩Micro-LED芯片及其制备方法
CN119630158A (zh) * 2023-09-12 2025-03-14 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN119836093A (zh) * 2023-10-11 2025-04-15 武汉华星光电半导体显示技术有限公司 一种显示装置
TWI883828B (zh) * 2024-02-20 2025-05-11 晶呈科技股份有限公司 垂直型發光二極體封裝結構及其製備方法

Also Published As

Publication number Publication date
JP2022543804A (ja) 2022-10-14
EP4012765A4 (en) 2023-09-06
JP7568711B2 (ja) 2024-10-16
EP4012765A1 (en) 2022-06-15
KR20220044727A (ko) 2022-04-11
US20250063877A1 (en) 2025-02-20
JP2025010153A (ja) 2025-01-20
JP7806164B2 (ja) 2026-01-26
CN212517197U (zh) 2021-02-09

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Application publication date: 20220322