CN114199170A - Chip coplanarity detection equipment - Google Patents

Abstract

The invention discloses a chip coplanarity detection device which comprises at least one bearing module and a detector. The bearing module comprises a bearing table and optical glass arranged on the bearing table. The optical glass is provided with a bearing plane and a light incident plane which are positioned on the opposite sides and an alignment pattern formed on the bearing plane. The bearing plane can be used for arranging a plurality of welding pads of at least one chip, so that part of the welding pads of at least one chip can be abutted against the bearing plane through gravity. The detector is arranged corresponding to the optical glass and can know the position of the bearing plane by detecting the alignment pattern so as to detect each welding pad and know the distance between the welding pad and the bearing plane. Therefore, the bearing plane of the optical glass is matched with gravity to stably provide a judgment reference plane required in the coplanarity test, and further, errors caused by the reference plane are effectively reduced.

Description

Chip coplanarity detection equipment

Technical Field

The invention relates to coplanarity detection equipment, in particular to chip coplanarity detection equipment.

Background

Although the conventional coplanarity detecting device can be used for detecting the coplanarity of a plurality of objects to be detected (such as solder balls), the conventional coplanarity detecting device calculates or selects a base plane (base plane) of the coplanarity according to information provided by the plurality of objects to be detected, so that the coplanarity result detected by the conventional coplanarity detecting device has a large error.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

The embodiment of the invention provides a chip coplanarity detection device, which can effectively overcome the defects possibly generated by the conventional coplanarity detection device.

The embodiment of the invention discloses a chip coplanarity detection device which comprises at least one bearing module and a detector. The bearing module comprises a bearing table and optical glass, the optical glass is arranged on the bearing table and provided with a bearing plane and a light incident plane which are positioned on the opposite sides, and the optical glass comprises a pair of bit patterns formed on the bearing plane; the bearing plane can be used for arranging a plurality of welding pads of at least one chip, so that part of the welding pads of at least one chip can be abutted against the bearing plane through gravity; a detector is arranged corresponding to the optical glass, the detector can know the position of the bearing plane by detecting the alignment pattern, and the detector can be used for detecting each welding pad to know the distance between the welding pad and the bearing plane.

Preferably, the carrier includes a first surface and a second surface on opposite sides, and the carrier is formed with a through hole penetrating from the first surface to the second surface, the optical glass is disposed on the first surface with the light incident surface, and the positions of the carrier plane and the alignment pattern correspond to the through hole, so that the detector can detect the alignment pattern and the plurality of pads disposed on the carrier plane through the through hole.

Preferably, the through hole of the bearing platform is long and defines a length direction, and the bearing plane can be used for arranging a plurality of chips along the length direction; the chip coplanarity detection device further comprises a transverse shifting mechanism, the detector is mounted on the transverse shifting mechanism, and the transverse shifting mechanism enables the detector to face the through hole and move along the length direction.

Preferably, at least one of the carrier modules includes a longitudinal transfer mechanism, and the carrier stage is mounted on the longitudinal transfer mechanism, so that the longitudinal transfer mechanism can move the carrier stage along a direction perpendicular to the longitudinal direction.

Preferably, the chip coplanarity detecting apparatus further includes a U-shaped frame, the lateral shifting mechanism and the detector are located inside the U-shaped frame, the number of the at least one carrying module is further limited to two, and the two carrying modules are respectively mounted at two end portions of the U-shaped frame.

Preferably, at least one of the carrier modules includes a positioning fixture detachably disposed on the carrier stage, and the positioning fixture is formed with at least one holding groove for accommodating at least one chip.

Preferably, the optical glass is clamped between the positioning jig and the bearing table.

Preferably, the positioning fixture is formed with an accommodating groove communicated with the at least one holding groove, and the optical glass is disposed in the accommodating groove.

Preferably, the optical glass has a transmittance of 90% or more with respect to visible light having a wavelength of 400 nm to 700 nm.

Preferably, the bearing plane of the optical glass is perpendicular to a plumb direction.

In summary, the chip coplanarity detection apparatus disclosed in the embodiments of the present invention uses the load-bearing plane of the optical glass in combination with gravity to stably provide a judgment reference plane required in the coplanarity test, thereby effectively reducing errors caused by the reference plane.

Furthermore, the detector can detect the position of the bearing plane by detecting the alignment pattern, and can be used for detecting each bonding pad to obtain the distance between the bonding pad and the bearing plane, so as to accurately measure the coplanarity of the bonding pads of any one chip.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

Fig. 1 is a schematic perspective view of a chip coplanarity detecting apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of fig. 1 along the sectional line II-II.

Fig. 3 is an enlarged schematic view of a portion III of fig. 2.

Fig. 4 is an enlarged schematic view of a portion IV of fig. 3.

Fig. 5 is a perspective view of another embodiment of fig. 1.

Fig. 6 is an enlarged schematic view of a carrier module of the chip coplanarity detecting apparatus according to the embodiment of the invention.

Fig. 7 is an enlarged view of fig. 6 from another viewing angle.

Fig. 8 is a partially exploded view of fig. 6.

Fig. 9 is an enlarged view of fig. 8 from another viewing angle.

Fig. 10 is an exploded view of fig. 8.

Fig. 11 is an enlarged view of fig. 10 from another angle.

Detailed Description

The following is a description of the embodiments of the invention relating to a chip coplanarity detecting apparatus, with specific embodiments, and those skilled in the art will understand the advantages and effects of the invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Fig. 1 to 11 show an embodiment of the present invention. As shown in fig. 1 to 4, the present embodiment discloses a chip coplanarity inspection apparatus 100, which utilizes gravity to inspect the coplanarity of a plurality of pads 201 of at least one chip 200. The apparatus 100 for detecting coplanarity of chips comprises a U-shaped support 1, two carrier modules 2 respectively mounted on two end portions 11 of the U-shaped support 1, a transverse transfer mechanism 3 located inside the U-shaped support 1, and a detector 4 mounted on the transverse transfer mechanism 3 and located inside the U-shaped support 1.

It should be noted that, although the chip coplanarity detecting apparatus 100 is described in the embodiment by including the above components, the invention is not limited thereto. For example, as shown in fig. 5, the number of the carrying modules 2 included in the chip coplanarity detecting apparatus 100 may be one, and the U-shaped bracket 1 is correspondingly adjusted to be an L-shaped bracket 1 a. In addition, in other embodiments not shown in the present invention, the chip coplanarity detecting apparatus 100 may omit the lateral transfer mechanism 3 so that the detector 4 does not move; alternatively, the chip coplanarity detecting apparatus 100 may omit the U-shaped holder 1 and the lateral transfer mechanism 3, and at least one of the carrier module 2 and the detector 4 may be mounted on another member.

Since the two carrier modules 2 shown in fig. 1 to 4 have substantially the same structure and the two carrier modules 2 are installed substantially symmetrically, for convenience of describing the present embodiment, the structure of a single carrier module 2 will be described first, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the chip coplanarity detecting apparatus 100 may also include a plurality of the carrier modules 2 with slightly different structures.

Referring to fig. 4 and fig. 6 to fig. 11, in the embodiment, the carrier module 2 includes a plate-shaped carrier table 21 (which may also be regarded as an additional circuit board), a longitudinal transfer mechanism 22 connected to the carrier table 21, an optical glass 23 installed on the carrier table 21, and a positioning fixture 24 detachably disposed on the carrier table 21, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier module 2 may omit or replace the longitudinal transferring mechanism 22 and/or the positioning fixture 24 with other components; alternatively, the carrier module 2 may be a carrier table 21 that is not plate-shaped.

In the embodiment, the susceptor 21 includes a first surface 211 and a second surface 212 on opposite sides, and the susceptor 21 is formed with a through hole 213 penetrating from the first surface 211 to the second surface 212. The through hole 213 of the carrier 21 is elongated and defines a length direction L, and the through hole 213 is preferably formed by recessing from an end of the carrier 21 away from the longitudinal transfer mechanism 22 (e.g., the right end of the carrier 21 in fig. 7).

It should be noted that, since the carrier 21 of the embodiment is non-light-transmissive, the carrier 21 is formed with the through hole 213 to facilitate the co-planarity detection of the chip by matching with other components, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier 21 may also be transparent and has no through hole 213 formed therein.

Further, the carrier 21 is attached to the vertical transfer mechanism 22 so that the vertical transfer mechanism 22 can move the carrier 21 in a direction perpendicular to the longitudinal direction L. The carrier 21 is mounted on the longitudinal transfer mechanism 22 at a position where the through hole 213 is not formed, so that the carrier 21 at the position where the through hole 213 is formed is suspended.

In the embodiment, the optical glass 23 is a transparent flat plate structure, and the optical glass 23 has a transmittance of 90% or more for visible light with a wavelength of 400 nm to 700 nm, but the invention is not limited thereto. That is, the glass having no specific optical condition is different from the optical glass 23 of the present embodiment. The optical glass 23 has a bearing plane 231 and an incident surface 232 on opposite sides, the incident surface 232 is also planar in the present embodiment, and the shape of the incident surface 232 is equal to that of the bearing plane 231, but the invention is not limited thereto.

The optical glass 23 is disposed on the first surface 211 of the susceptor 21 via the light incident surface 232, and the optical glass 23 preferably completely covers one side of the through hole 213 (e.g., the top side of the through hole 213 in fig. 8), but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the optical glass 23 may cover only a part of the through hole 213; alternatively, the optical glass 23 may be at least partially disposed in the through hole 213.

Furthermore, the bearing plane 231 can be used for disposing a plurality of pads 201 of at least one chip 200, so that a part of the pads 201 of at least one chip 200 can be abutted against the bearing plane 231 by gravity. That is, the chip coplanarity detecting apparatus 100 uses the bearing plane 231 of the optical glass 23 in combination with gravity to stably provide a reference plane (base plane) for determining the coplanarity during the coplanarity test, thereby effectively reducing the error caused by the reference plane.

In the present embodiment, the carrying plane 231 of the optical glass 23 is perpendicular to a plumb direction V, and the optical glass 23 is in an elongated structure parallel to the length direction L, so that the carrying plane 231 can be used for disposing a plurality of chips 200 along the length direction L.

In more detail, the optical glass 23 includes a pair of alignment patterns 233 formed on the supporting plane 231, and the positions (along the plumb direction V) of the supporting plane 231 and the alignment patterns 233 correspond to the through holes 213. In the embodiment, the alignment patterns 233 are illustrated as opaque films on the supporting plane 231, so as to facilitate providing the position of the supporting plane 231 precisely through the alignment patterns 233, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the alignment patterns 233 can also be a film with a light transmittance different from (or smaller than) that of the optical glass 23, which can also effectively provide the position of the supporting plane 231.

It should be noted that, although the optical glass 23 is illustrated as a flat glass in the embodiment, in other embodiments not shown in the present invention, the bearing plane 231 may only occupy a partial plate surface of the optical glass 23, and an area of the optical glass 23 outside the bearing plane 231 may be non-planar, but the alignment patterns 233 may not be formed in an area outside the bearing plane 231, so as to accurately provide the position of the bearing plane 231.

The positioning fixture 24 is disposed on the first surface 211 of the carrier 21, and the optical glass 23 is clamped between the positioning fixture 24 and the carrier 21. In the present embodiment, the positioning fixture 24 has a plurality of through-going holding grooves 241 formed along the length direction L from the top surface for respectively accommodating at least a plurality of chips 200.

Furthermore, the positioning fixture 24 is formed with a containing groove 242 communicating with the plurality of holding grooves 241 along the length direction L from the bottom surface, and the shape of the containing groove 242 corresponds to the shape of the optical glass 23, so that the optical glass 23 can be disposed in the containing groove 242, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the positioning fixture 24 may be formed with at least one holding groove 241 for receiving at least one chip 200 and a receiving groove 242 communicating with at least one holding groove 241, and the optical glass 23 is disposed in the receiving groove 242.

In more detail, in the present embodiment, the accommodating groove 242 penetrates through the positioning fixture 24 along the length direction L, and the width of the accommodating groove 242 is slightly larger than the width of the through hole 213, so as to facilitate the optical glass 23 to be clamped between the positioning fixture 24 and the carrying table 21. In another words, the through hole 213 of the carrier 21 faces a projection area formed by the orthographic projection of the positioning fixture 24, and is located in the accommodating groove 242 and covers the holding grooves 241.

In addition, the positioning fixture 24 is non-light-transmissive in the present embodiment, and the alignment pattern 233 of the optical glass 23 corresponds to a region of the positioning fixture 24 where the holding groove 241 is not formed along the plumb direction V. Furthermore, the thickness of the positioning fixture 24 is preferably slightly smaller than the thickness of any one of the chips 200, so as to facilitate the chips 200 to be taken out from the holding grooves 241 of the positioning fixture 24.

The detector 4 is disposed corresponding to the optical glass 23, so that the detector 4 can know the position of the carrying plane 231 by detecting the alignment patterns 233, and the detector 4 can be used to detect each of the pads 201 to know the distance between the pad and the carrying plane 231, thereby accurately measuring the coplanarity of the pads 201 of any one of the chips 200.

In more detail, in the present embodiment, the detector 4 is mounted on the lateral transfer mechanism 3, and the lateral transfer mechanism 3 can move the detector 4 along the longitudinal direction L while facing the through hole 213, but the present invention is not limited thereto. Furthermore, since the positions (both along the plumb direction V) of the supporting plane 231 and the alignment pattern 233 of the optical glass 23 correspond to the through holes 213, the detector 4 can detect the alignment pattern 233 and the plurality of pads 201 disposed on the supporting plane 231 through the through holes 213.

[ technical effects of embodiments of the present invention ]

In summary, the chip coplanarity detecting apparatus disclosed in the embodiment of the invention uses the bearing plane 231 of the optical glass 23 in combination with gravity to stably provide a judgment reference plane (i.e. using the bearing plane 231 as a reference plane) required in the coplanarity test, thereby effectively reducing errors caused by the reference plane.

Further, the detector 4 can know the position of the carrying plane 231 by detecting the alignment patterns 233, and the detector 4 can be used to detect each of the pads 201 to know the distance between the pad and the carrying plane 231, so as to accurately measure the coplanarity of the pads 201 of any one of the chips 200.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the invention.

Claims (10)

1. A chip coplanarity detecting apparatus, comprising:

at least one carrier module comprising:

a bearing table; and

the optical glass is arranged on the bearing table and provided with a bearing plane and a light incident plane which are positioned on the opposite sides, and the optical glass comprises a pair of bit patterns formed on the bearing plane; the bearing plane can be used for arranging a plurality of welding pads of at least one chip, so that part of the welding pads of at least one chip can be abutted against the bearing plane through gravity; and

and the detector is arranged corresponding to the optical glass, can know the position of the bearing plane by detecting the alignment pattern, and can be used for detecting each welding pad to know the distance between the welding pad and the bearing plane.

2. The apparatus of claim 1, wherein the stage includes a first surface and a second surface opposite to each other, and the stage is formed with a through hole penetrating from the first surface to the second surface, the optical glass is disposed on the first surface through the light incident surface, and the positions of the supporting plane and the alignment pattern correspond to the through hole, so that the detector can detect the alignment pattern and the pads disposed on the supporting plane through the through hole.

3. The apparatus for detecting coplanarity of chips according to claim 2, wherein said through hole of said carrier is elongated and defines a length direction, and said carrier plane is capable of disposing a plurality of said chips along said length direction; the chip coplanarity detection device further comprises a transverse transfer mechanism, wherein the detector is mounted on the transverse transfer mechanism, and the transverse transfer mechanism can enable the detector to face the through hole and move along the length direction.

4. The apparatus for detecting coplanarity of chips as claimed in claim 3, wherein at least one of said carrier modules includes a longitudinal transfer mechanism, and said carrier is mounted on said longitudinal transfer mechanism such that said longitudinal transfer mechanism can move said carrier along a direction perpendicular to said length direction.

5. The apparatus for detecting coplanarity of chips as claimed in claim 3, further comprising a U-shaped frame, wherein said lateral moving mechanism and said detector are disposed inside said U-shaped frame, the number of at least one of said carrier modules is further limited to two, and two of said carrier modules are respectively mounted on two end portions of said U-shaped frame.

6. The apparatus of claim 1, wherein at least one of the carrier modules comprises a positioning fixture detachably disposed on the carrier, and the positioning fixture has at least one holding groove for receiving at least one of the chips.

7. The apparatus for detecting coplanarity of chips according to claim 6, wherein said optical glass is clamped between said positioning fixture and said carrying table.

8. The apparatus of claim 7, wherein the positioning fixture has a receiving cavity communicating with at least one of the holding cavities, and the optical glass is disposed in the receiving cavity.

9. The apparatus for detecting coplanarity of chips according to claim 1, wherein said optical glass has a transmittance of 90% or more with respect to visible light having a wavelength of 400 nm to 700 nm.

10. Chip coplanarity detection device according to claim 1, characterized in that said bearing plane of said optical glass is perpendicular to a plumb direction.

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