TWM606467U - Chip co-planarity testing equipment - Google Patents

Abstract

The present invention discloses a chip coplanarity detection device, which includes at least one carrying module and a detector. The carrying module includes a carrying table and an optical glass installed on the carrying table. The optical glass has a bearing plane and a light incident surface on opposite sides, and a pair of patterns formed on the bearing plane. The carrying plane can be used to provide a plurality of bonding pads of at least one chip, so that part of the bonding pads of at least one chip can abut against the carrying plane by gravity. The detector is arranged corresponding to the optical glass and can know the position of the load-bearing plane by detecting the alignment pattern, and is used to detect each of the solder pads to know its relation to the load-bearing The spacing between the planes.

Description

Wafer coplanarity testing equipment

This creation relates to a coplanarity detection equipment, in particular to a wafer coplanarity detection equipment.

Although the existing coplanarity detection equipment can be used to detect the coplanarity of multiple test objects (such as solder balls), the existing coplanarity detection equipment calculates or The base plane for judging the coplanarity is selected, so the coplanarity result detected by the existing coplanarity detection device will have a larger error.

Therefore, the author believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, finally proposed a reasonable design and effective improvement of the above-mentioned shortcomings.

The inventive embodiment is to provide a wafer coplanarity inspection device, which can effectively improve the defects that may occur in the existing coplanarity inspection device.

This creative embodiment discloses a wafer coplanarity detection device, which includes: at least one carrying module, including: a carrying table; and an optical glass installed on the carrying table, and the optical glass has an opposite side A carrying plane and a light-incident surface of the optical glass, the optical glass includes a pair of patterns formed on the carrying plane; wherein the carrying plane can be used to set a plurality of bonding pads of at least one chip, so that At least a part of the bonding pad of the chip can abut against the carrying plane by gravity; and a detector corresponding to the optical glass arrangement, and the detector can detect the alignment The pattern is used to know the position of the carrying plane, and the detector can be used to detect each of the solder pads to know the distance between it and the carrying plane.

Preferably, the carrying table includes a first surface and a second surface on opposite sides, and the carrying table is formed with a through hole penetrating from the first surface to the second surface, the The optical glass is disposed on the first surface, and the position of the bearing plane and the alignment pattern corresponds to the perforation, so that the detector can detect the alignment pattern and the alignment pattern through the perforation A plurality of the solder pads arranged on the carrying plane.

Preferably, at least one of the load-bearing modules includes a positioning jig detachably disposed on the load-bearing platform, and the positioning jig is formed with at least one holding groove for accommodating at least one of the chips; The optical glass is clamped between the positioning jig and the carrying platform; the positioning jig is formed with an accommodation groove communicating with at least one of the holding grooves, and the optical glass is disposed in the accommodation In the slot.

In summary, the wafer coplanarity detection device disclosed in this creative embodiment uses the load-bearing plane of the optical glass with gravity to stably provide the judgment reference plane required in the coplanarity test. This effectively reduces the errors caused by the reference plane.

Furthermore, the detector can know the position of the carrying plane by detecting the alignment pattern, and the detector can be used to detect each of the solder pads to know its The distance between the supporting planes can then accurately measure the coplanarity of the multiple bonding pads of any one of the chips.

In order to have a better understanding of the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, but these descriptions and drawings are only used to illustrate this creation, and not for any protection scope of this creation. limit.

The following is a specific embodiment to illustrate the implementation of the "wafer coplanarity detection device" disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following embodiments will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to Figures 1 to 11, which are an embodiment of the creation. As shown in FIGS. 1 to 4, this embodiment discloses a wafer coplanarity detection device 100 that uses gravity to detect the coplanarity of a plurality of bonding pads 201 of at least one wafer 200. Wherein, the wafer coplanarity detection device 100 includes a U-shaped bracket 1, two load-bearing modules respectively mounted on the two end portions 11 of the U-shaped bracket 1, and an inner side of the U-shaped bracket 1. The lateral transfer mechanism 3, a detector 4 installed on the lateral transfer mechanism 3 and located inside the U-shaped bracket 1.

It should be noted that although the chip coplanarity detection device 100 is described in this embodiment by including the above-mentioned components, the present creation is not limited to this. For example, as shown in FIG. 5, the number of the carrying module 2 included in the wafer coplanarity detection apparatus 100 may be one, and the U-shaped bracket 1 is adjusted to an L-shaped bracket 1a. In addition, in other embodiments not shown in this creation, the wafer coplanarity detection device 100 can omit the lateral transfer mechanism 3 so that the detector 4 does not move; or, the The wafer coplanarity detection device 100 can also omit the U-shaped bracket 1 and the lateral transfer mechanism 3, and at least one of the carrier module 2 and the detector 4 are mounted on other components.

Since the two load-bearing modules 2 shown in FIGS. 1 to 4 have substantially the same structure, and the two load-bearing modules 2 are installed substantially symmetrically, in order to facilitate the description of this embodiment, the following will be described first The structure of the single carrier module 2 is not limited to this creation. For example, in other embodiments not shown in the present creation, the wafer coplanarity detection device 100 may also include a plurality of the carrier modules 2 with slightly different structures.

Please refer to FIGS. 4 and 6 to 11, the carrying module 2 in this embodiment includes a carrying platform 21 (also regarded as carrying plate) in a plate shape, and a carrying platform 21 connected to the carrying platform 21 The longitudinal transfer mechanism 22, an optical glass 23 installed on the carrying platform 21, and a positioning jig 24 detachably installed on the carrying platform 21, but the invention is not limited to this. For example, in other embodiments not shown in this creation, the carrying module 2 may omit or replace the longitudinal transfer mechanism 22 and/or the positioning fixture 24 with other components; or, the The carrying module 2 can also adopt a carrying platform 21 that is not plate-shaped.

In this embodiment, the carrying platform 21 includes a first surface 211 and a second surface 212 on opposite sides, and the carrying platform 21 is formed to penetrate from the first surface 211 to the second surface 212 A perforation 213 on the two surfaces 212. Wherein, the perforation 213 of the carrying platform 21 is elongated in this embodiment and defines a length direction L, and the perforation 213 is preferably from the carrying platform 21 away from the longitudinal transfer mechanism 22 One end (for example, the right end of the carrying platform 21 in FIG. 7) is formed by a recess.

It should be additionally noted that since the carrying table 21 of this embodiment is non-transparent, the carrying table 21 is formed with the perforation 213 to facilitate the co-planarity detection of the wafer with other components, but This creation is not limited to this. For example, in other embodiments not shown in the present creation, the carrying platform 21 may also be light-transmissive and the perforation 213 is not formed.

Furthermore, the carrying platform 21 is installed on the longitudinal transfer mechanism 22 so that the longitudinal transfer mechanism 22 can move the carrying platform 21 along a direction perpendicular to the length direction L. Wherein, the carrying platform 21 is installed in the longitudinal transfer mechanism 22 at a portion where the perforation 213 is not formed, so that the portion of the carrying platform 21 where the perforation 213 is formed is suspended.

The optical glass 23 is a transparent plate-shaped structure in this embodiment, and the optical glass 23 has a transmittance of more than 90% for visible light with a wavelength between 400 nm and 700 nm, but this creation does not This is limited. In other words, glass that does not have specific optical conditions is different from the optical glass 23 referred to in this embodiment. The optical glass 23 has a supporting plane 231 and a light incident surface 232 on opposite sides. The light incident surface 232 is also planar in this embodiment, and the shape of the light incident surface 232 is equivalent to The shape of the bearing plane 231 is not limited to this creation.

Wherein, the optical glass 23 is set on the first surface 211 of the carrying table 21 by the light incident surface 232, and the optical glass 23 preferably completely covers one side of the through hole 213 (For example: the top side of the perforation 213 in Figure 8), but this creation is not limited to this. For example, in other embodiments not shown in the present creation, the optical glass 23 may also cover only a part of the perforation 213; or, the optical glass 23 may also be at least partially disposed on the Inside perforation 213.

Furthermore, the carrying plane 231 can be used to provide a plurality of bonding pads 201 of at least one chip 200, so that a part of the bonding pads 201 of at least one chip 200 can abut against the carrying plane by gravity. 231. That is to say, the wafer coplanarity detection device 100 uses the load-bearing plane 231 of the optical glass 23 with gravity to stably provide the base plane required for the coplanarity test. This effectively reduces the errors caused by the reference plane.

In this embodiment, the carrying plane 231 of the optical glass 23 is perpendicular to a plumb direction V, and the optical glass 23 is a long strip structure parallel to the length direction L, so that the The supporting plane 231 can provide a plurality of the wafers 200 along the length direction L.

In more detail, the optical glass 23 includes an alignment pattern 233 formed on the carrying plane 231, and the position of the carrying plane 231 and the alignment pattern 233 (along the plumb direction V) Corresponds to the perforation 213. Wherein, the alignment pattern 233 in this embodiment is described as an opaque film located on the bearing plane 231, so as to facilitate the accurate provision of the bearing plane 231 through the alignment pattern 233 Location, but this creation is not limited to this. For example, in other embodiments not shown in this creation, the alignment pattern 233 can also be a film with a light transmittance different from (or less than) the optical glass 23, which can also effectively provide the The position of the bearing plane 231.

It should be additionally noted that although the optical glass 23 is illustrated as a flat glass in this embodiment, in other embodiments not shown in the present creation, the carrying plane 231 may only occupy the optical glass Part of the surface of the glass 23, and the area of the optical glass 23 outside the carrying plane 231 may be non-planar, but the alignment pattern 233 may not be formed in an area outside the carrying plane 231, according to The position of the bearing plane 231 is accurately provided.

The positioning jig 24 is disposed on the first surface 211 of the carrying table 21, and the optical glass 23 is clamped between the positioning jig 24 and the carrying table 21. In this embodiment, the positioning jig 24 has a plurality of through-shaped holding grooves 241 formed along the length direction L from the top surface of the positioning jig 24 for accommodating at least a plurality of the wafers 200 respectively.

Furthermore, from the bottom surface of the positioning jig 24, a receiving groove 242 communicating with a plurality of the holding grooves 241 is formed along the length direction L, and the receiving groove 242 has a shape corresponding to the optical glass 23, so that the optical glass 23 can be set in the accommodating groove 242, but the invention is not limited to this. For example, in other embodiments not shown in this creation, the positioning jig 24 may be formed with at least one holding groove 241 for accommodating at least one of the chips 200 and a holding groove 241 communicating with at least one of the holding grooves 241. The accommodating groove 242, and the optical glass 23 is disposed in the accommodating groove 242.

In more detail, the accommodating groove 242 penetrates the positioning jig 24 along the length direction L in this embodiment, and the width of the accommodating groove 242 is slightly larger than the width of the perforation 213 to facilitate The optical glass 23 is clamped between the positioning jig 24 and the carrying platform 21. To put it another way, the perforation 213 of the carrying platform 21 faces a projection area formed by the orthographic projection of the positioning fixture 24, which is located in the accommodating groove 242 and covers a plurality of the holding grooves 241 .

In addition, the positioning jig 24 is non-translucent in this embodiment, and the alignment pattern 233 of the optical glass 23 along the plumb direction V corresponds to the position where the holding groove 241 is not formed. The positioning fixture has 24 areas. Furthermore, the thickness of the positioning jig 24 is preferably slightly smaller than the thickness of any one of the wafers 200, so that the wafer 200 can be taken out from the holding groove 241 of the positioning jig 24.

The detector 4 is arranged corresponding to the optical glass 23, so that the detector 4 can know the position of the bearing plane 231 by detecting the alignment pattern 233, and the detector 4 4 can be used to detect each of the bonding pads 201 to know the distance between it and the carrying plane 231, and then accurately measure the coplanarity of the bonding pads 201 of any one of the chips 200 degree.

In more detail, and in this embodiment, the detector 4 is installed on the lateral transfer mechanism 3, and the lateral transfer mechanism 3 can make the detector 4 face the perforation 213 and Move along the length direction L, but this creation is not limited to this. Furthermore, since the positions of the supporting plane 231 and the alignment pattern 233 of the optical glass 23 (both along the plumb direction V) correspond to the perforation 213, the detector 4 can The alignment pattern 233 and the plurality of solder pads 201 disposed on the carrying plane 231 are detected through the through hole 213.

[Technical effects of this creative embodiment]

In summary, the wafer coplanarity detection device disclosed in this creative embodiment uses the load-bearing plane 231 of the optical glass 23 to match gravity to stably provide the judgment criterion required in the coplanarity test. (That is, take the bearing plane 231 as the reference surface), thereby effectively reducing errors caused by the reference surface.

Furthermore, the detector 4 can know the position of the carrying plane 231 by detecting the alignment pattern 233, and the detector 4 can be used to detect each of the solder pads 201 In order to know the distance between it and the carrying plane 231, the coplanarity of the bonding pads 201 of any one of the chips 200 can be accurately measured.

The content disclosed above is only a preferred and feasible embodiment of the creation, and does not limit the patent scope of this creation. Therefore, all equivalent technical changes made using this creation specification and schematic content are included in the patent scope of this creation Inside.

100: wafer coplanarity testing equipment 1: U-shaped bracket 11: End 1a: L-shaped bracket 2: Carrier module 21: Bearing platform 211: First Surface 212: second surface 213: Piercing 22: Longitudinal transfer mechanism 23: Optical glass 231: bearing plane 232: light incident surface 233: counterpoint pattern 24: positioning fixture 241: Holding Slot 242: Containment Slot 3: Lateral transfer mechanism 4: detector 200: chip 201: Pad V: plumb direction L: length direction

FIG. 1 is a three-dimensional schematic diagram of the wafer coplanarity detection device according to the creative embodiment.

2 is a schematic cross-sectional view of FIG. 1 along the line II-II.

FIG. 3 is an enlarged schematic diagram of part III of FIG. 2.

FIG. 4 is an enlarged schematic diagram of the part IV in FIG. 3.

Fig. 5 is a perspective schematic view of another form of Fig. 1.

FIG. 6 is an enlarged schematic diagram of the carrier module of the wafer coplanarity detection device according to the creative embodiment.

FIG. 7 is an enlarged schematic diagram of FIG. 6 from another perspective.

Fig. 8 is a partial exploded schematic view of Fig. 6.

FIG. 9 is an enlarged schematic diagram of FIG. 8 from another perspective.

Fig. 10 is an exploded schematic diagram of Fig. 8.

FIG. 11 is an enlarged schematic diagram of FIG. 10 from another perspective.

21: Bearing platform

211: First Surface

212: second surface

213: Piercing

23: Optical glass

231: bearing plane

232: light incident surface

233: counterpoint pattern

24: positioning fixture

241: Holding Slot

242: Containment Slot

4: detector

200: chip

V: plumb direction

L: length direction

Claims (10)

A wafer coplanarity detection equipment, which includes: At least one carrier module, including: A bearing platform; and An optical glass installed on the carrying table, and the optical glass has a carrying plane and a light incident surface on opposite sides, the optical glass includes a pair of patterns formed on the carrying plane; wherein The carrying plane can be used to provide a plurality of bonding pads of at least one chip, so that a part of the bonding pads of at least one chip can abut against the carrying plane by gravity; and A detector corresponding to the optical glass arrangement, the detector can know the position of the bearing plane by detecting the alignment pattern, and the detector can be used to detect each The distance between the solder pad and the carrying plane is known. The wafer coplanarity inspection device according to claim 1, wherein the carrier includes a first surface and a second surface on opposite sides, and the carrier is formed from the first surface A perforation penetrating to the second surface, the optical glass is disposed on the first surface with the light incident surface, and the position of the bearing plane and the alignment pattern corresponds to the perforation, so that The detector can detect the alignment pattern and the plurality of solder pads arranged on the carrying plane through the perforation. The wafer coplanarity detection device according to claim 2, wherein the perforation of the carrying table is elongated and defines a length direction, and the carrying plane can provide for a plurality of the wafers to be arranged along the length direction The wafer coplanarity detection equipment further includes a lateral transfer mechanism, the detector is installed in the lateral transfer mechanism, and the lateral transfer mechanism can make the detector face the through hole and Move along the length direction. The wafer coplanarity testing equipment according to claim 3, wherein at least one of the carrier modules includes a longitudinal transfer mechanism, and the carrier is installed on the longitudinal transfer mechanism to enable the longitudinal transfer The mechanism can make the carrying table move along a direction perpendicular to the length direction. The wafer coplanarity inspection device according to claim 3, wherein the wafer coplanarity inspection device further includes a U-shaped bracket, and the lateral transfer mechanism and the detector are located on the U-shaped bracket On the inside, the number of at least one bearing module is further limited to two, and the two bearing modules are respectively installed at the two end portions of the U-shaped bracket. The wafer coplanarity inspection device according to claim 1, wherein at least one of the carrier modules includes a positioning jig detachably disposed on the carrier, and the positioning jig is formed with at least one The holding groove is used for accommodating at least one chip. The wafer coplanarity inspection device according to claim 6, wherein the optical glass is clamped between the positioning jig and the carrying table. The wafer coplanarity detection device according to claim 7, wherein the positioning jig is formed with a containing groove communicating with at least one of the holding grooves, and the optical glass is disposed in the containing groove. The wafer coplanarity detection device according to claim 1, wherein the optical glass has a transmittance of more than 90% for visible light with a wavelength between 400 nanometers and 700 nanometers. The wafer coplanarity inspection device according to claim 1, wherein the bearing plane of the optical glass is perpendicular to a plumb direction.

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