CN114181644A - UV adhesive tape and preparation method thereof - Google Patents

UV adhesive tape and preparation method thereof Download PDF

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Publication number
CN114181644A
CN114181644A CN202111532838.1A CN202111532838A CN114181644A CN 114181644 A CN114181644 A CN 114181644A CN 202111532838 A CN202111532838 A CN 202111532838A CN 114181644 A CN114181644 A CN 114181644A
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Prior art keywords
sensitive adhesive
pressure
base material
tape
semi
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Inventor
牛建超
楼佳铭
李沛然
孙攀
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Shanghai Jingshen New Material Co ltd
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Shanghai Jingshen New Material Co ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241Polyolefin, e.g.rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245Vinyl resins, e.g. polyvinyl chloride [PVC]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a UV adhesive tape and a preparation method thereof, wherein the UV adhesive tape comprises a base material, a pressure-sensitive adhesive layer and an anti-reflection layer; the anti-reflection layer is of a first preset thickness and coated on one side surface of the base material; the pressure-sensitive adhesive layer is of a second preset thickness and is coated on the other side face of the base material; the base material is any one of PET, COP and SRF, PO and PVC materials with 70% -90% of light transmittance and 40% -60% of haze are selected relatively, so that the light transmittance of the UV adhesive tape is greatly improved and the haze is greatly reduced. The anti-reflection layer with the first thickness formed by siloxane can effectively improve the light transmittance of the UV adhesive tape, reduce the light reflectivity and increase the light transmittance. On the whole, the light transmittance of the UV adhesive tape is up to more than 96%, the haze is as low as less than 3%, the focusing difficulty of AOI optical automatic detection equipment during detection is reduced, the detection effect is improved, and the product yield is improved.

Description

UV adhesive tape and preparation method thereof
Technical Field
The invention relates to the technical field of cutting adhesive glue, in particular to a UV adhesive tape and a preparation method thereof.
Background
When the wafer or the filter is cut, the wafer or the filter is fixed by using a UV tape. The UV adhesive tape has high adhesive force, so that the wafer or the optical filter to be cut does not displace when being cut, the cutting smoothness is guaranteed, and the cutting effect is improved. After cutting, the adhesive force of the UV adhesive tape can be reduced by projecting a proper amount of ultraviolet rays, so that the UV adhesive tape is easy to peel off from the cut wafer, the cut glass sheet or the cut filter, the pickup property during crystal picking is improved, and the adverse effect of the ultraviolet rays on the wafer is reduced. Meanwhile, in the cutting process, AOI optical automatic detection equipment is used for carrying out online detection, and the AOI optical automatic detection equipment scans the wafer or the optical filter through a CCD camera of the AOI optical automatic detection equipment. Due to the fact that the light transmittance of the UV adhesive tape is low, the focusing difficulty of the CCD camera is increased, detection errors are often caused, and even the yield of products is reduced.
Therefore, how to increase the transmittance of the conventional UV tape to improve the detection effect is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention provides a UV adhesive tape and a preparation method thereof, aiming at solving the problem of low light transmittance of the traditional UV adhesive tape.
The UV adhesive tape comprises a base material, a pressure-sensitive adhesive layer and an anti-reflection layer;
the anti-reflection layer is of a first preset thickness and coated on one side surface of the base material;
the pressure-sensitive adhesive layer is of a second preset thickness and is coated on the other side face of the base material;
the base material is any one of PET, COP and SRF;
the material of the anti-reflection layer is siloxane.
In one embodiment, the first predetermined thickness is 200-400 nm;
the second predetermined thickness is 10-30 μm.
In one specific embodiment, the pressure-sensitive adhesive layer comprises the following raw materials in parts by weight:
20-60 parts of main resin, 10-40 parts of UV monomer, 0.5-10 parts of photoinitiator and 0.5-10 parts of cross-linking agent.
In one specific embodiment, the main resin is at least one of polyacrylic acid, polyacrylate and polyurethane acrylate, the molecular weight is 10-60 ten thousand, and the TG value is-30 ℃ to-10 ℃.
In one particular embodiment, the UV monomer is at least one of a urethane acrylate and an aliphatic urethane acrylate.
In one embodiment, the photoinitiator has an absorption wavelength of 200-420 nm.
In one embodiment, the crosslinking agent is at least one of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent.
In one specific embodiment, the adhesive further comprises a release film;
the release film is attached to one side of the pressure-sensitive adhesive layer far away from the base material.
The preparation method of the UV adhesive tape provided by any one of the above specific embodiments based on the same concept comprises the following steps:
coating of an antireflection layer: coating the anti-reflection solution on one side surface of the base material, and placing the base material in an oven for drying at the drying temperature of 90-120 ℃ to obtain a semi-finished product A;
coating of the pressure-sensitive adhesive layer: coating the pressure-sensitive adhesive liquid on the other side surface of the base material of the semi-finished product A, and placing the base material in an oven for drying at the drying temperature of 40-130 ℃ to obtain a semi-finished product B;
pasting a release film: sticking a release film on one side surface, far away from the base material, of the pressure-sensitive adhesive layer of the semi-finished product B to prepare a semi-finished product C;
curing: and (4) placing the semi-finished product C in a curing chamber for curing at the temperature of 20-70 ℃ for 24-240h to obtain the UV adhesive tape.
In one specific embodiment, siloxane is added into a solvent A, and the mixture is uniformly stirred to prepare an anti-reflection solution;
and sequentially adding the main resin, the UV monomer, the photoinitiator and the cross-linking agent into the solvent B, and uniformly stirring to obtain the pressure-sensitive adhesive solution.
The invention has the beneficial effects that: according to the UV adhesive tape, the pressure-sensitive adhesive layer is arranged, the pressure-sensitive adhesive layer can be directly contacted with the wafer or the optical filter, and has strong adhesion to the wafer or the optical filter, so that the position stability of the wafer or the optical filter is high. Meanwhile, the pressure-sensitive adhesive layer with the second preset thickness has stronger adhesive force to the release film, so that the release film is tightly attached to the substrate, the pressure-sensitive adhesive layer is well protected, and the possibility of spontaneous falling of the release film is reduced. The base material is any one of PET, COP and SRF, PO and PVC materials with 70% -90% of light transmittance and 40% -60% of haze are selected relatively, so that the light transmittance of the UV adhesive tape is greatly improved and the haze is greatly reduced. The anti-reflection layer with the first thickness can effectively improve the light transmittance of the UV adhesive tape, reduce the reflectivity of light and increase the transmittance of light. On the whole, the light transmittance of the UV adhesive tape is up to more than 96%, the haze is as low as less than 3%, the focusing difficulty of AOI optical automatic detection equipment during detection is reduced, the detection effect is improved, and the product yield is improved.
Drawings
FIG. 1 is a schematic structural view of an embodiment of a UV tape of the present invention;
FIG. 2 is a flow chart of a manufacturing process of an embodiment of the UV tape of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
Referring to fig. 1, as an embodiment of the present invention, the present invention provides a UV tape including a substrate 110, a pressure sensitive adhesive layer 130, and an anti-reflection layer 120. The anti-reflection layer 120 is coated on one side of the substrate 110 with a first predetermined thickness. The pressure sensitive adhesive layer 130 is coated on the other side of the substrate 110 to a second predetermined thickness. The material of the substrate 110 is any one of PET, COP, and SRF. The material of antireflective layer 120 is siloxane.
In this embodiment, the pressure sensitive adhesive layer 130 with the second predetermined thickness can directly contact with the wafer or the filter, and has a strong adhesive force to the wafer or the filter, so that the position stability of the wafer or the filter is high. Meanwhile, the pressure sensitive adhesive layer 130 with the second preset thickness has a strong adhesive force to the release film 140, so that the release film 140 is closely attached to the substrate 110 to form a good protection for the pressure sensitive adhesive layer 130, and the possibility of spontaneous falling of the release film 140 is reduced. When the UV tape is in use, the anti-reflection layer 120, the base material 110, and the pressure-sensitive adhesive layer 130 are sequentially disposed from top to bottom. The base material 110 is any one of PET, COP and SRF, PO and PVC materials with 70% -90% of light transmittance and 40% -60% of haze are selected relatively, so that the light transmittance of the UV adhesive tape is greatly improved and the haze is greatly reduced by the base material 110. Here, COP (Cyclo Olefin Polymer) is a cycloolefin polymer and is commercially available from Raynaud corporation. SRF (super retro film) is a super-birefringent PET film available from Toyo (TOYOBO). The anti-reflection layer 120 with the first thickness can effectively improve the light transmittance of the UV tape, reduce the reflectivity of light, and increase the transmittance of light. Specifically, the material of antireflection layer 120 is siloxane. On the whole, the light transmittance of the UV adhesive tape is up to more than 96%, the haze is as low as less than 3%, the focusing difficulty of AOI optical automatic detection equipment during detection is reduced, the detection effect is improved, and the product yield is improved.
In an embodiment of the invention, the first predetermined thickness is 200-400nm, so that the transmittance of the UV tape is further improved. The second predetermined thickness is 10-30 μm, so that the manufacturing cost is reduced, and the working performance of the pressure sensitive adhesive layer 130 is ensured, so that the pressure sensitive adhesive layer 130 has better adhesion to the release film 140, the wafer or the optical filter.
In a specific embodiment of the present invention, the pressure sensitive adhesive layer 130 comprises the following raw materials in parts by weight:
20-60 parts of main resin, 10-40 parts of UV monomer, 0.5-10 parts of photoinitiator and 0.5-10 parts of cross-linking agent, wherein the total is 100 parts. Wherein the main resin is at least one of tackifying resins. Specifically, the main resin is at least one of tackifying resins such as polyacrylic acid, polyacrylate and polyurethane acrylate, the molecular weight is 10-60 ten thousand, and the TG value is-30 ℃ to-10 ℃. In some embodiments, the molecular weight of the host resin is 40-60 ten thousand, the TG value is-25-20 ℃, compared with the traditional host resin, the TG value is higher, the resin hardness is larger, the molecular weight is relatively higher, and the host resin can resist the high temperature generated by laser or cutter wheel cutting in the manufacturing process. Meanwhile, hydrophobic groups are grafted on the molecular branch chains of the main resin, so that the water-resistant resin has good water resistance. The UV monomer is at least one of polyurethane acrylate and aliphatic polyurethane acrylate, and the functional group of the UV monomer is 6 functional group or 8 functional group. The larger functional group is selected, so that the contraction degree of the pressure-sensitive adhesive layer is larger when the pressure-sensitive adhesive layer receives ultraviolet illumination, and the UV adhesive tape and the attached object are easy to separate. The absorption wavelength of the photoinitiator is 200-420nm, and the range of the wavelength capable of being absorbed is wide. Specifically, the photoinitiator is an acetone-based photoinitiator or other type of photoinitiator. The cross-linking agent is at least one of isocyanate cross-linking agent and epoxy cross-linking agent, and the cross-linking agent and the main resin can construct an isocyanate system or an epoxy system. Therefore, the cohesive force of the pressure-sensitive adhesive layer can be effectively improved, and the strength of the pressure-sensitive adhesive layer is enhanced. On the whole, the pressure sensitive adhesive layer 130 has good adhesion to the release film 140, the wafer or the optical filter, has good water resistance, is not easy to remain on a stuck object, has little pollution to the stuck object, has little influence on light transmittance, and is not easy to generate smoke when being cut.
In an embodiment of the invention, the UV tape further includes a release film 140, and the release film 140 is attached to a side of the pressure sensitive adhesive layer 130 away from the substrate 110, so as to protect the pressure sensitive adhesive layer 130 of the UV tape when the UV tape is idle. Specifically, the release film 140 is made of PET or PE.
Referring to fig. 2, the present invention further provides a method for preparing a UV tape according to any one of the above embodiments, including the following steps:
s100, coating of an antireflection layer: and coating the anti-reflection solution on one side surface of the substrate 110, and drying in an oven at the drying temperature of 90-120 ℃ to obtain a semi-finished product A.
In the step, siloxane with the same volume as the solvent A is mixed and stirred uniformly to prepare the anti-reflection solution. Here, the solvent a is a mixture of water and propanol, ethanol, or isopropanol. And then coating the anti-reflection solution on one side surface of the substrate 110, wherein the thickness of the coating is 200-400nm, and drying in an oven at the temperature of 90-120 ℃ to obtain a semi-finished product A. Preferably, the drying temperature is 100-.
S200, coating of the pressure-sensitive adhesive layer: and coating the pressure-sensitive adhesive solution on the other side surface of the base material 110 of the semi-finished product A, and drying in an oven at the drying temperature of 40-130 ℃ to obtain a semi-finished product B.
In the step, 20-60 parts of main resin, 10-40 parts of UV monomer, 0.5-10 parts of photoinitiator and 0.5-10 parts of cross-linking agent are sequentially added into the solvent B, and the mixture is uniformly stirred to obtain the pressure-sensitive adhesive solution. Here, the solvent B is ethyl acetate, and the concentration of the pressure-sensitive adhesive liquid is selected according to the coating requirement. Then, the pressure sensitive adhesive solution is coated on the other side surface of the base material 110 of the semi-finished product A, the coating thickness is 10-30 mu m, and the semi-finished product B is prepared by drying the semi-finished product A in an oven at 40-130 ℃. Preferably, the drying temperature is 100-.
S300, pasting a release film: and (3) attaching a release film 140 to one side surface of the pressure-sensitive adhesive layer 130 of the semi-finished product B, which is far away from the substrate 110, to prepare a semi-finished product C.
In this step, before the release film 140 is attached to the semi-finished product B, the release film 140 is subjected to an antistatic treatment in advance to achieve a certain impedance. Then, a release film 140 is attached to the side of the pressure-sensitive adhesive layer 130 of the semi-finished product B away from the substrate 110. The release film 140 can form protection for the pressure sensitive adhesive layer 130. When the pressure-sensitive adhesive layer 130 is needed, the release film 140 is peeled off from the pressure-sensitive adhesive layer 130.
S400, curing: and (4) placing the semi-finished product C in a curing chamber for curing at the temperature of 20-70 ℃ for 24-240h to obtain the UV adhesive tape.
In the step, the semi-finished product C is cured, wherein the curing temperature is 20-70 ℃, preferably 40-50 ℃, and the curing time is 96-144 h. Therefore, the pressure-sensitive adhesive layer 130 has high chemical property stability and is favorable for storage and transportation.
Example 1
The material of the substrate 110 is COP, the thickness of the pressure-sensitive adhesive layer 130 is 20 μm, and the pressure-sensitive adhesive layer 130 comprises the following raw materials in parts by weight: 60 parts of polyacrylic acid (molecular weight is 50 ten thousand, TG value is-23 ℃), 30 parts of polyurethane acrylate, 5 parts of photoinitiator and 5 parts of cross-linking agent, and the thickness of the anti-reflection layer 120 is 50 nm.
Preparation of the UV adhesive tape: firstly, coating an anti-reflection solution on one side surface of a substrate 110, and placing the substrate in an oven for drying at the drying temperature of 110 ℃ to obtain a semi-finished product A. And then, coating the pressure-sensitive adhesive liquid on the other side surface of the base material 110 of the semi-finished product A, and placing the base material in an oven for drying at the drying temperature of 110 ℃ to obtain a semi-finished product B. And then, attaching a release film 140 to one side surface of the pressure-sensitive adhesive layer 130 of the semi-finished product B, which is far away from the substrate 110, to prepare a semi-finished product C. And finally, placing the semi-finished product C in a curing chamber for curing at the temperature of 50 ℃ for 120h to obtain the UV adhesive tape.
Example 2
The other experimental conditions were not changed, except that the thickness of the antireflection layer 120 was changed to 80nm as compared with example 1.
Example 3
In contrast to example 1, the thickness of the anti-reflection layer 120 was changed to 100nm, and the other experimental conditions were not changed.
Example 4
In contrast to example 1, the thickness of the anti-reflection layer 120 was changed to 150nm, and the other experimental conditions were not changed.
Example 5
In contrast to example 1, the thickness of the antireflection layer 120 was changed to 200nm, and the other experimental conditions were not changed.
Example 6
In contrast to example 1, the thickness of the anti-reflection layer 120 was only changed to 250nm, and the other experimental conditions were not changed.
Example 7
In contrast to example 1, the thickness of the anti-reflection layer 120 was changed to 300nm, and the other experimental conditions were not changed.
Example 8
In contrast to example 1, the thickness of the anti-reflection layer 120 was only changed to 400nm, and the other experimental conditions were not changed.
Example 9
In contrast to example 1, the thickness of the antireflection layer 120 was changed to 500nm, and the other experimental conditions were not changed.
Example 10
In contrast to example 1, the thickness of the anti-reflection layer 120 was changed to 600nm, and the other experimental conditions were not changed.
Example 11
In contrast to example 1, the thickness of the anti-reflection layer 120 was only changed to 700nm, and the other experimental conditions were not changed.
Example 12
In contrast to example 1, the thickness of the anti-reflection layer 120 was only changed to 800nm, and the other experimental conditions were not changed.
Example 13
In contrast to example 1, the substrate 110 was PET, the thickness of the anti-reflection layer 120 was 300nm, and other experimental conditions were unchanged.
Example 14
In contrast to example 1, SRF was used for substrate 110, and the thickness of anti-reflection layer 120 was changed to 300nm, without changing other experimental conditions.
Example 15
In contrast to example 1, the substrate 110 was made of PVC, the thickness of the anti-reflection layer 120 was changed to 0nm, and other experimental conditions were unchanged.
Example 16
In contrast to example 1, PO was selected as the substrate 110, the thickness of the anti-reflection layer 120 was changed to 0nm, and other experimental conditions were unchanged.
The UV tapes of examples 1-14 were tested for light transmittance and haze and the results are shown in Table 1:
Figure BDA0003412058010000071
Figure BDA0003412058010000081
TABLE 1
As can be seen from Table 1 above, the UV tapes prepared from examples 6-8 and examples 13-14 have a light transmittance of more than 96% and a haze of less than 2%, and the UV tapes prepared from examples 15-16 have a light transmittance of 82-88% and a haze of 40-55%, that is, when the thickness of anti-reflection layer 120 is 250-400nm and substrate 110 is PET, COP or SRF, the light transmittance of the UV tapes is more than 96% and the haze is less than 2%; when the thickness of anti-reflection layer 120 is 0nm and substrate 110 is PO or PVC, the transmittance of the UV tape is 82% and the haze is 55%. Therefore, by adding the anti-reflection layer 120 with a proper thickness and selecting a proper base material 110, the light transmittance can be greatly improved, the haze can be effectively reduced, the focusing difficulty during detection can be reduced, and the detection effect can be improved.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," "one specific embodiment," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic representation of the term does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the scope of the present invention by equivalent replacement or change according to the technical solution and the inventive concept of the present invention within the scope of the present disclosure.

Claims (10)

1. The UV adhesive tape is characterized by comprising a base material, a pressure-sensitive adhesive layer and an anti-reflection layer;
the anti-reflection layer is of a first preset thickness and coated on one side surface of the base material;
the pressure-sensitive adhesive layer is of a second preset thickness and is coated on the other side face of the base material;
the base material is any one of PET, COP and SRF;
the material of the anti-reflection layer is siloxane.
2. The UV tape of claim 1, wherein the first predetermined thickness is 200-400 nm;
the second preset thickness is 10-30 μm.
3. The UV tape of claim 1, wherein the pressure sensitive adhesive layer comprises the following raw materials in parts by weight:
20-60 parts of main resin, 10-40 parts of UV monomer, 0.5-10 parts of photoinitiator and 0.5-10 parts of cross-linking agent.
4. The UV tape according to claim 3, wherein the host resin is at least one of polyacrylic acid, polyacrylate and urethane acrylate, has a molecular weight of 10-60 ten thousand, and has a TG value of-30 ℃ to-10 ℃.
5. The UV tape of claim 3, wherein the UV monomer is at least one of a urethane acrylate and an aliphatic urethane acrylate.
6. The UV tape of claim 3, wherein the absorption wavelength of the photoinitiator is 200-420 nm.
7. The UV tape of claim 3, wherein the crosslinking agent is at least one of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent.
8. The UV tape of any one of claims 1 to 7, further comprising a release film;
the release film is attached to one side face, far away from the base material, of the pressure-sensitive adhesive layer.
9. A method of making the UV tape of any one of claims 1 to 8, comprising the steps of:
coating of the antireflection layer: coating the anti-reflection solution on one side surface of the base material, and drying in an oven at the drying temperature of 90-120 ℃ to obtain a semi-finished product A;
coating the pressure-sensitive adhesive layer: coating the pressure-sensitive adhesive liquid on the other side surface of the base material of the semi-finished product A, and placing the base material in an oven for drying at the drying temperature of 40-130 ℃ to obtain a semi-finished product B;
pasting a release film: attaching the release film to one side of the pressure-sensitive adhesive layer of the semi-finished product B, which is far away from the substrate, to prepare a semi-finished product C;
curing: and (3) placing the semi-finished product C in a curing chamber for curing at the temperature of 20-70 ℃ for 24-240h to obtain the UV adhesive tape.
10. The method for preparing the UV adhesive tape according to claim 9, wherein siloxane is added into the solvent A, and the anti-reflection solution is prepared by uniformly stirring;
and sequentially adding the main resin, the UV monomer, the photoinitiator and the cross-linking agent into the solvent B, and uniformly stirring to obtain the pressure-sensitive adhesive solution.
CN202111532838.1A 2021-12-15 2021-12-15 UV adhesive tape and preparation method thereof Pending CN114181644A (en)

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