CN113174213A - Process film for FPC (Flexible printed Circuit) manufacturing process and preparation method and application thereof - Google Patents
Process film for FPC (Flexible printed Circuit) manufacturing process and preparation method and application thereof Download PDFInfo
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- CN113174213A CN113174213A CN202110365331.5A CN202110365331A CN113174213A CN 113174213 A CN113174213 A CN 113174213A CN 202110365331 A CN202110365331 A CN 202110365331A CN 113174213 A CN113174213 A CN 113174213A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Abstract
The application relates to a process membrane for FPC processing procedure for laminate FPC to the module in the FPC processing procedure, include: the adhesive comprises a base material, a pressure-sensitive adhesive layer and a release film layer; one surface of the base material is a corona surface, the pressure-sensitive adhesive layer is coated on the corona surface of the base material, and the release film layer is compounded on the pressure-sensitive adhesive layer; the pressure-sensitive adhesive layer comprises main resin and at least one of UV monomer, photoinitiator and cross-linking agent. The FPC is attached to the FPC surface coating in the FPC manufacturing process, the FPC is fixedly supported in the module, and due to the high viscosity of the FPC, the FPC surface coating has high adhesiveness and adhesive force, and the fixation of the FPC in the module is effectively improved. In addition, the whole FPC manufacturing process can bear the high-temperature environment in the manufacturing process. Moreover, the process film for the FPC manufacturing procedure has good adhesion and no pollution to the FPC surface coating material, so that the process film can be applied to the whole FPC manufacturing procedure without influencing the FPC manufacturing procedure.
Description
Technical Field
The application relates to the technical field of semiconductor preparation, in particular to a process film for an FPC (flexible printed circuit) manufacturing process and a preparation method and application thereof.
Background
The FPC (Flexible Printed Circuit) is a Flexible Printed Circuit board which is made of a polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. In the related art, the FPC is usually directly attached to the module. However, because the whole volume of the FPC is small, the FPC is difficult to fix when being attached to the module, the attachment failure is easily caused, the module is damaged, and the attaching efficiency of the FPC on the module is low.
Disclosure of Invention
In view of this, the present application provides a process film for FPC manufacturing process, which can effectively improve the attaching efficiency of FPC on a module, thereby improving the yield of production line of FPC.
According to an aspect of the present application, a process film for FPC manufacturing process is provided for attaching FPC to a module in the FPC manufacturing process, including: the adhesive comprises a base material, a pressure-sensitive adhesive layer and a release film layer;
one surface of the base material is a corona surface, the pressure-sensitive adhesive layer is coated on the corona surface of the base material, and the release film layer is compounded on the pressure-sensitive adhesive layer;
the pressure-sensitive adhesive layer contains a main resin and at least one of a UV monomer, a photoinitiator and a cross-linking agent.
In one possible implementation manner, in the pressure-sensitive adhesive layer with the total mass parts of 100, the proportion of the main resin is 20-60 parts, the proportion of the UV monomer is 10-40 parts, the proportion of the photoinitiator is 0.5-10 parts, and the proportion of the crosslinking agent is 0.5-10 parts.
In one possible implementation, the host resin includes one or more combinations of polyacrylic acid, polyacrylate, urethane acrylate, tackifying resin, and the like.
In one possible implementation, the host resin has a molecular weight of 10 to 60 ten thousand and a TG value of-40 to-10 ℃.
In one possible implementation, the host resin has a molecular weight of 40 to 60 ten thousand and a TG value of-25 to-20 ℃.
In one possible implementation, the UV monomer includes one or more combinations of urethane acrylate and aliphatic urethane acrylate.
In one possible implementation, the photoinitiator has an absorption band in the range of 200nm to 420 nm; the cross-linking agent is one or a combination of more of isocyanates and epoxy.
In one possible implementation, the thickness of the pressure-sensitive adhesive layer is 15 μm to 40 μm.
According to another aspect of the present application, there is provided a method for preparing a process film for FPC manufacturing, comprising:
carrying out single-side corona treatment on a base material to enable one side of the base material to be a corona side;
respectively weighing a preset amount of main resin and at least one of UV monomer, photoinitiator and cross-linking agent in sequence, adding the weighed materials into a solvent, and uniformly stirring to obtain a pressure-sensitive adhesive solution;
coating the pressure-sensitive adhesive solution on the corona surface of the base material, and drying in a drying oven to obtain a pressure-sensitive adhesive layer; wherein the drying temperature is 40-130 ℃, and the drying time is … …;
taking the base material coated with the pressure-sensitive adhesive layer out of the oven, and compounding a release film on the pressure-sensitive adhesive layer to obtain a semi-finished film;
curing the semi-finished film to prepare the process film for the FPC manufacturing process;
wherein the curing temperature is 20-70 ℃, and the curing time is 1-10 days.
According to another aspect of the application, the application of the process film for the FPC manufacturing process is further provided, and the process film for the FPC manufacturing process is attached to the surface coating of the FPC in the FPC manufacturing process, so that the FPC is fixedly supported in a module.
Through adopting the process membrane for the FPC processing procedure of this application embodiment, through attaching the process membrane for the FPC processing procedure of this application embodiment in the FPC processing procedure on FPC surface coating, bear FPC fixed in the module, compare in the mode of directly laminating FPC to the module among the correlation technique, because its high viscous character, have higher adhesion and adhesion to FPC surface coating material (promptly, EMI material, electromagnetic interference material), effectively improved the fixed of FPC in the module, guaranteed the effective laminating of FPC in the module. In addition, the whole FPC manufacturing process can bear the high-temperature environment in the manufacturing process. Moreover, the process film for the FPC manufacturing procedure and the good adhesion and pollution-free property to the FPC surface coating material ensure that the process film can be applied to the whole FPC manufacturing procedure without influencing the FPC manufacturing procedure.
Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic cross-sectional view illustrating a process film for FPC manufacturing according to an embodiment of the present disclosure;
fig. 2 is a process flow chart of a process film preparation method for FPC manufacturing according to an embodiment of the present application.
Detailed Description
Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present application.
Fig. 1 is a schematic cross-sectional view illustrating a process film 100 for FPC manufacturing according to an embodiment of the present disclosure. As shown in fig. 1, the process film 100 for FPC manufacturing process according to the embodiment of the present disclosure has an overall layered structure, which can be used to attach to a surface coating of an FPC during the FPC manufacturing process to fix the FPC in a module. Specifically, the process film 100 for FPC manufacturing process includes: a substrate 110, a pressure sensitive adhesive layer 120, and a release film layer 130. One side of the substrate 110 is a corona side, the pressure sensitive adhesive layer 120 is coated on the corona side of the substrate 110, and the release film layer 130 is compounded on the pressure sensitive adhesive layer 120. The components of the pressure-sensitive adhesive layer 120 include a main resin, and at least one of a UV monomer, a photoinitiator, and a crosslinking agent.
Adopt process membrane 100 for the FPC processing procedure of this application embodiment, through attaching process membrane 100 for the FPC processing procedure of this application embodiment in the FPC processing procedure on FPC surface coating, bear FPC fixed in the module, compare in the mode of directly laminating FPC to the module among the correlation technique, because its high viscous character, have higher adhesion and adhesion to FPC surface coating material (promptly, EMI material, electromagnetic interference material), effectively improved the fixed of FPC in the module, guaranteed the effective laminating of FPC in the module. In addition, the whole FPC manufacturing process can bear the high-temperature environment in the manufacturing process. Moreover, the process film 100 for the FPC manufacturing process has good adhesion and no pollution to the FPC surface coating material, so that the process film can be applied to the whole FPC manufacturing process without influencing the FPC manufacturing process.
It should be noted that, in the process film 100 for FPC manufacturing process of the embodiment of the present application, the component ratio of the pressure-sensitive adhesive layer 120 may be prepared by the following ratio. That is, in the pressure-sensitive adhesive layer 120 of 100 parts by mass in total, the proportion of the host resin is 20 to 60 parts, the proportion of the UV monomer is 10 to 40 parts, the proportion of the photoinitiator is 0.5 to 10 parts, and the proportion of the crosslinking agent is 0.5 to 10 parts, totaling 100 parts.
More specifically, in one possible implementation, the ratio of the host resin may be 60 parts, the ratio of the UV monomer may be 30 parts, the ratio of the photoinitiator may be 4 parts, and the ratio of the crosslinking agent may be 6 parts in a total of 100 parts of the pressure-sensitive adhesive layer 120.
Further, the main body resin can be prepared by one or more of polyacrylic acid, polyacrylate, polyurethane acrylate, tackifying resin and other polymers. That is, the composition of the host resin in the pressure-sensitive adhesive layer 120 may include one or more of polyacrylic acid, polyacrylate, urethane acrylate, tackifying resin, and the like.
Meanwhile, the molecular weight of the main resin can be 10-60 ten thousand, and the TG value is-40 ℃ to-10 ℃. Preferably, the molecular weight of the host resin is 40 to 60 ten thousand, and the TG value is-25 to-20 ℃.
In addition, the composition of the UV monomer may include one or more of urethane acrylate and aliphatic urethane acrylate, and may further include other types of UV monomers, which are not illustrated herein. Preferably, the UV monomer can be prepared using a 6-functional monomer. Here, it can be understood by those skilled in the art that the 6-functional monomer refers to a monomer resin whose structure itself contains 6 functional groups.
Furthermore, in the process film 100 for FPC manufacturing process according to the embodiment of the present disclosure, the absorption band of the photoinitiator in the pressure-sensitive adhesive layer 120 may be selected according to the wavelength and energy used, and the photoinitiator may be selected in different types and addition amounts. In one possible implementation, the absorption band of the photoinitiator can be set between 200nm and 420 nm.
It should be further noted that, in the process film 100 for FPC manufacturing process according to the embodiment of the present application, the crosslinking agent in the pressure-sensitive adhesive layer 120 may be one or a combination of isocyanates and epoxies.
In addition, in one possible implementation, the thickness of the pressure sensitive adhesive layer 120 may be 15 μm to 40 μm, preferably 15 μm.
Correspondingly, the application also provides a preparation method of the process film 100 for the FPC manufacturing process, which is used for preparing any one of the process films 100 for the FPC manufacturing process. Specifically, referring to fig. 2, the method for preparing the process film 100 for FPC manufacturing process provided in the present application includes: step S100, after single-side corona treatment is carried out on the base material 110, standing is carried out for a first preset time. Here, the substrate 110 may be made of PET, PO, PVC, PP, or the like, and may be specifically adjusted according to the use requirement. Also, the thickness of the substrate 110 may be set to 50 μm. The corona treatment process parameters for substrate 110 may be set accordingly depending on the corona device and the requirements for surface energy. In one possible implementation, the power of the corona device may be specifically set to: 1.9 KW.
Then, through step S200, mixing the weighed main resin, UV monomer, photoinitiator, crosslinking agent and other components in sequence, adding the mixture into a solvent, stirring the mixture uniformly to obtain a pressure-sensitive adhesive solution, coating the pressure-sensitive adhesive solution on the corona surface of the substrate 110, and placing the substrate in a drying oven for drying to form the pressure-sensitive adhesive layer 120; wherein the drying temperature is 40-130 ℃, preferably, the drying temperature can be 100-110 ℃. The drying time is 3 min-5 min. Here, it should be further noted that when drying, it should be ensured that the air cleanliness in the drying box can reach a hundred-level purification degree.
Further, in step S300, a release film is laminated on the pressure sensitive adhesive layer 120 to obtain a semi-finished film, and the semi-finished film is cured to obtain the process film 100 for FPC manufacturing process; wherein the curing temperature for curing the semi-finished film is 20-70 ℃. Preferably, the aging temperature may be 40 ℃ to 50 ℃ and the aging time may be 1 day to 10 days (i.e., 24 hours to 240 hours), preferably 4 days to 6 days (i.e., 96 hours to 184 hours).
Meanwhile, the adopted release film can be subjected to antistatic treatment according to different use requirements so as to achieve different impedances. That is, when the release film is laminated on the pressure-sensitive adhesive layer 120, the release film is subjected to antistatic treatment to achieve a desired impedance and then laminated on the pressure-sensitive adhesive layer 120.
In order to more clearly illustrate the performance of the process film 100 for FPC manufacturing according to the present embodiment, an embodiment is illustrated below.
Example 1
In this embodiment, the preparation process of the process film 100 for FPC manufacturing is as follows:
first, a PET film is used as the base material 110, and one surface of the base material 110 is subjected to corona treatment so that one surface of the base material 110 becomes a corona surface. In the present embodiment, the thickness of the substrate 110 used is 50 μm, and the process parameters for performing the corona treatment on the substrate 110 are as follows: the power of the corona device was set to 1.9 KW.
The substrate 110 is allowed to stand for a certain period of time (standing time: 1 day to 2 days, i.e., 24 hours to 48 hours) after being subjected to corona treatment. Meanwhile, the material components for preparing the pressure-sensitive adhesive layer 120 are accurately weighed in sequence and added into the solvent to be uniformly stirred, so as to obtain the pressure-sensitive adhesive solution.
Specifically, in this embodiment, 60g of the resin as the main body of the pressure-sensitive adhesive layer 120 is weighed, and 30g, 4g and 6g of the UV monomer, the photoinitiator, the crosslinking agent and the like are respectively weighed, and then the mixture is added into the solvent and stirred until the mixture is uniformly mixed, so as to obtain the pressure-sensitive adhesive solution. Wherein the solvent is selected from EAC, and the content of the solvent is 90% of the main resin.
Then, the prepared pressure-sensitive adhesive solution was applied to the corona side of the substrate 110. The coating method is not limited in this embodiment, and any method of a coating process may be used. After the pressure sensitive adhesive solution is coated on the base material 110, the base material can be placed into an oven for drying. When the base material 110 coated with the pressure-sensitive adhesive liquid is dried, hundred-grade purified air is used as the drying atmosphere, the drying temperature is 110 ℃, and the drying time is 3 min. The pressure-sensitive adhesive layer 120 can be obtained by drying the pressure-sensitive adhesive solution on the substrate 110. In this embodiment, the thickness of the pressure-sensitive adhesive layer 120 is 15 μm.
And then taking the substrate 110 out of the oven, and compounding a release film on the pressure-sensitive adhesive layer 120 to protect the pressure-sensitive adhesive layer 120, so as to obtain a semi-finished film. In this embodiment, the thickness of the release film is 50 μm. Meanwhile, the release film needs to be antistatic before being laminated on the pressure-sensitive adhesive layer 120. Because the use requirements are different, the impedance requirements for the release film are different, so that the anti-static treatment process of the release film is not limited, and the anti-static treatment process can be flexibly set according to actual conditions.
After a release film is laminated on the pressure sensitive adhesive layer 120, the semi-finished film obtained by the current preparation process may be cured to finally obtain a finished film (i.e., the process film 100 for FPC manufacturing). In this embodiment, the curing process specifically includes: the curing temperature is 45 ℃, and the curing time is 4 days.
TABLE 1
The process film for FPC manufacturing process prepared in the above example 1 was subjected to performance parameters. It should be noted that, the pre-peel force and the post-peel force shown in table 1 were tested on the prepared process film for FPC manufacturing process by the test of national standard GB 2792-1998. Meanwhile, "1 #, 2# and 3# in table 1 are the first test, the second test and the third test, respectively, for the prepared process film under the same test conditions.
As is apparent from the test data (i.e., Table 1), the UV post-peel force of the process film for FPC manufacturing of the examples of the present application was substantially about 2099.74g/25mm, and the film had high adhesiveness and adhesive force. Meanwhile, after the film is attached to the surface of the FPC, no adhesive residue is generated on the EMI material within 15 days at 60 ℃, which effectively shows that the process film for the FPC manufacturing process of the embodiment of the application basically does not pollute the surface of an attached object.
In addition, the application also provides an application of the process film for the FPC manufacturing process, which is used for attaching any one of the process films for the FPC manufacturing process to the surface coating of the FPC in the FPC manufacturing process and fixing and bearing the FPC in the module. The process film for the FPC manufacturing process has high adhesiveness and adhesive force to the FPC surface coating material, so that the process film can be firmly attached to the FPC surface coating, and the FPC is fixedly supported in the module. In addition, the process film for the FPC manufacturing process can resist the high temperature of 60-90 ℃ in the manufacturing process, so that the FPC can be firmly attached to the module in the whole FPC manufacturing process. In addition, after the process film for the FPC manufacturing process is attached to the FPC surface coating, the surface of an attached object is not polluted in the whole circulation process (usually 3-60 days), so that the quality of the FPC is effectively guaranteed, and the production line yield of the FPC is finally guaranteed.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terms used herein were chosen in order to best explain the principles of the embodiments, the practical application, or technical improvements to the techniques in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. The utility model provides a process membrane is used to FPC processing procedure for laminate FPC to the module in the FPC processing procedure, include: the adhesive comprises a base material, a pressure-sensitive adhesive layer and a release film layer;
one surface of the base material is a corona surface, the pressure-sensitive adhesive layer is coated on the corona surface of the base material, and the release film layer is compounded on the pressure-sensitive adhesive layer;
the pressure-sensitive adhesive layer contains a main resin and at least one of a UV monomer, a photoinitiator and a cross-linking agent.
2. The process film for FPC manufacturing according to claim 1, wherein in the pressure-sensitive adhesive layer in 100 parts by mass in total, the proportion of the host resin is 20 to 60 parts, the proportion of the UV monomer is 10 to 40 parts, the proportion of the photoinitiator is 0.5 to 10 parts, and the proportion of the crosslinking agent is 0.5 to 10 parts.
3. The FPC processing film of claim 1, wherein the main body resin comprises one or more of polyacrylic acid, polyacrylate, urethane acrylate, tackifier resin, and the like.
4. The process film for FPC processing according to any one of claims 1 to 3, wherein the molecular weight of the host resin is 10 to 60 ten thousand, and TG value is-40 to-10 ℃.
5. The process film for FPC manufacturing process according to claim 4, wherein the molecular weight of the host resin is 40 to 60 ten thousand, and the TG value is-25 to-20 ℃.
6. The process film for FPC processing according to any one of claims 1 to 3, wherein the UV monomer comprises one or more combinations of urethane acrylate and aliphatic urethane acrylate.
7. The process film for FPC manufacturing process according to any one of claims 1 to 3, wherein the absorption band of the photoinitiator is from 200nm to 420 nm; the cross-linking agent is one or a combination of more of isocyanates and epoxy.
8. The process film for FPC processing according to any one of claims 1 to 3, wherein the thickness of the pressure-sensitive adhesive layer is 15 μm to 40 μm.
9. A method for preparing a process film for FPC manufacturing, comprising:
carrying out single-side corona treatment on a base material to enable one side of the base material to be a corona side;
respectively weighing a preset amount of main resin and at least one of UV monomer, photoinitiator and cross-linking agent in sequence, adding the weighed materials into a solvent, and uniformly stirring to obtain a pressure-sensitive adhesive solution;
coating the pressure-sensitive adhesive solution on the corona surface of the base material, and drying in a drying oven to obtain a pressure-sensitive adhesive layer; wherein the drying temperature is 40-130 ℃, and the drying time is … …;
taking the base material coated with the pressure-sensitive adhesive layer out of the oven, and compounding a release film on the pressure-sensitive adhesive layer to obtain a semi-finished film;
curing the semi-finished film to prepare the process film for the FPC manufacturing process;
wherein the curing temperature is 20-70 ℃, and the curing time is 1-10 days.
10. The use of the process film for FPC manufacturing process, which is characterized in that the process film for FPC manufacturing process is used for attaching the process film for FPC manufacturing process as claimed in any one of claims 1 to 8 to the surface coating of the FPC during the FPC manufacturing process, and the FPC is fixedly supported in a module.
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|---|---|---|---|---|
| CN114181644A (en) * | 2021-12-15 | 2022-03-15 | 上海精珅新材料有限公司 | UV adhesive tape and preparation method thereof |
| CN114672258A (en) * | 2022-03-10 | 2022-06-28 | 上海精珅新材料有限公司 | Protective film for manufacturing process or shipment of ultrathin flexible glass and preparation method thereof |
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| CN114181644A (en) * | 2021-12-15 | 2022-03-15 | 上海精珅新材料有限公司 | UV adhesive tape and preparation method thereof |
| CN114672258A (en) * | 2022-03-10 | 2022-06-28 | 上海精珅新材料有限公司 | Protective film for manufacturing process or shipment of ultrathin flexible glass and preparation method thereof |
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