KR20160073668A - Adhesive tape for component-embedded print circuit board and method for preparing the same - Google Patents

Abstract

The present invention relates to an adhesive tape for a component-embedded printed circuit board and a method for preparing the same. The adhesive tape comprises: a substrate film; a silicone adhesive layer formed on part of the substrate film; and a release film formed on the silicone adhesive layer, wherein the adhesive tape has a non-adhesive section of the substrate film which is free of the silicone adhesive layer, and the surface of the substrate film is treated to reinforce the surface tension thereof. Such adhesive tapes, according to the present invention, can maintain an excellent adhesiveness of the silicone without using a primer, reduce transfer of silicone oils, and facilitate peeling of the adhesive tape and simplify the peeling process, and even after the peeling, do not leave traces of the adhesive layer. Accordingly, the present invention can achieve and facilitate attachment of a component and removal of the film, stacking stability, and simplification and ease of processes.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive tape for a printed circuit board,

The present invention relates to a pressure-sensitive adhesive tape for an insert-type printed circuit board and a method of manufacturing the pressure-sensitive adhesive tape, and more specifically to a pressure-sensitive adhesive tape for an insert-type printed circuit board containing a silicone pressure-

In recent years, electronic products such as portable computers, smart phones, and DSLRs have been pursuing product development centered on a significant increase in performance in size and weight. Therefore, when designing a circuit board in this way, a lightweight and miniaturized substrate is desperately needed. In a conventional DIP (Dual In-Line) socket mounting type, surface mount type quad flat non-lead (QFN) Thin Small Out-line Package) and TQFP (Thin Quad Flat Package). Recently, embedded circuit board system, which is a device insertion type, has emerged as a final alternative. In the case of circuit boards widely used in IT electronic devices, passive elements such as resistors, capacitors and inductors, and active elements such as ICs, drivers, and APs are placed on circuit boards, The thickness and weight of the product increase. However, if the position of the various devices can not be arranged efficiently, the circuit error may easily occur due to the magnetic field interference between the devices. It is reality that we can not do. In the case of a device-embedded circuit board that emerges as an alternative, there is an advantage that a magnetic field interference hardly occurs even when the distance between devices is close to each other by inserting the device into an insulator substrate. Therefore, it is possible to design the arrangement of the device freely, and it is possible to achieve weight reduction and miniaturization by simplifying the circuit design. Also, since the thickness of the device does not affect the total thickness of the product, it is one of the most suitable manufacturing methods for thinning.

When manufacturing such a device-embedded printed circuit board, it is essential to use a high heat-resisting adhesive tape because it can expect a role of the adhesive tape to position the device and to fix it until it is bonded. However, in the case of the adhesive tape conventionally used, the transfer rate of silicone oil (about 30 to 50%) which is high due to the characteristics of the silicone pressure-sensitive adhesive was generated, Further, since it is difficult to easily peel off the adhesive tape after completion of the first lamination, the operator has to manually peel off the tape. In addition, due to the characteristics of the silicone adhesive, The coating of the primer to increase the bonding force is inevitable before the silicon pressure-sensitive adhesive layer is laminated.

Japanese Patent Laid-Open No. 2002-237683

In order to solve the above-described problems, the present invention provides a silicone adhesive composition which reduces the transfer rate of silicone oil, which is a disadvantage of the conventional silicone adhesive, and has excellent bonding force of silicon without using a primer, Heat-resistant self-adhesive tapes which are easy to peel off and remove the adhesive tape in a post-process and minimize the problem of transfer upon peeling, and a method for producing the same.

In order to solve the above-mentioned problems,

A silicone pressure-sensitive adhesive layer formed on a part of the base film; And

And a release film formed on the silicon pressure-sensitive adhesive layer,

And a non-adhesive portion that is a portion where the silicone pressure sensitive adhesive layer is not formed on the base film,

Wherein the base film is a surface tension reinforced surface-treated adhesive tape for an insert-type printed circuit board.

In one embodiment of the present invention, the base film may be at least one selected from the group consisting of polyimide, polyethylene naphthalate, and polyethylene terephthalate.

In one embodiment of the present invention, the silicon pressure-sensitive adhesive layer may include a silicone-based copolymer.

In one embodiment of the present invention, the silicone-based copolymer may include silicon gum and silicone resin.

In one embodiment of the present invention, the silicone resin may be included in an amount of 10 to 30 parts by weight based on the silicone rubber.

In one embodiment of the present invention, the silicone may be an organopolysiloxane having at least one functional group selected from the group consisting of blackphenyl, amino, epoxy, hydroxy, mercapto and carboxyl.

In an embodiment of the present invention, the silicone pressure sensitive adhesive layer may further comprise a crosslinking agent.

In one embodiment of the present invention, the crosslinking agent may be a polysiloxane having at least one functional group selected from the group consisting of Si-OH, Si-OR (wherein R is an alkyl group of C4 to C17) and Si-H.

In one embodiment of the present invention, the cross-linking agent may be contained in an amount of 0.3 to 1.5 parts by weight based on the silicon rubber.

In one embodiment of the present invention, the silicone pressure-sensitive adhesive layer comprises at least one organosilane selected from the group consisting of aminopropyltrimethoxysilane, aminoethylaminopropyltrimethoxysilane, and gamma -glycidoxypropyltrimethoxysiloxane As shown in FIG.

In one embodiment of the present invention, the organosilane may be contained in an amount of 0.2 to 5.0 parts by weight based on the silicon rubber.

In one embodiment of the present invention, the silicone pressure sensitive adhesive layer may be applied at a coverage of 1 to 10 g / m 2.

In one embodiment of the present invention, the surface tension strengthening treatment may be at least one of corona treatment and CO ₂ plasma treatment.

In one embodiment of the present invention, the adhesive tape may be peeled off using a part of the base film exposed to the non-adhesive portion.

Further, the present invention is a method for producing the above adhesive tape,

Surface-strengthening surface treatment of the base film;

Applying a silicone adhesive layer to a portion of the substrate film; And

And forming a release film on the silicon pressure-sensitive adhesive layer. The present invention also provides a method for manufacturing a pressure-sensitive adhesive tape for an insert-type printed circuit board.

In one embodiment of the present invention, when a silicone pressure-sensitive adhesive layer is applied to a part of the base film, a non-adhered portion where the silicone pressure-sensitive adhesive layer is not applied on the base film may be formed.

In one embodiment of the present invention, the step of applying the silicone pressure-sensitive adhesive layer to a part of the base film may be performed using a die coater and a simple flat plate having an oblique edge.

In one embodiment of the present invention, the ratio of the horizontal length to the vertical length of the oblique line may be 1/1 to 1 / 1.5.

In one embodiment of the present invention, the surface tension enhancing surface treatment may be at least one of corona treatment and CO ₂ plasma treatment.

In one embodiment of the present invention, the non-adhesive portion may be used to peel off the printed circuit board.

INDUSTRIAL APPLICABILITY According to the adhesive tape for a device-inserted type printed circuit board of the present invention and the method for producing the same, the bonding force of silicon is excellent without using a primer, the transfer rate of silicone oil is reduced, It is possible to simplify the adhesion, and there is no residue of the adhesive layer even after peeling, so that adhesion of the device and detachment of the film, stability in lamination, simplification of the process, and increase of process convenience can be achieved.

1 is a schematic view showing an adhesive tape for an insert-type printed circuit board according to an embodiment of the present invention.
FIG. 2 is a view illustrating peeling off the adhesive tape for a device-inserted type printed circuit board from a printed circuit board according to an embodiment of the present invention.
3 is a view showing a step of applying a silicon pressure-sensitive adhesive layer to a part of a base film using a die coater according to an embodiment of the present invention and a simple rate having a diagonal edge.

Hereinafter, preferred embodiments of the present invention will be described in detail in order to facilitate the present invention by those skilled in the art.

The present invention relates to a base film; A silicone pressure-sensitive adhesive layer formed on a part of the base film; And a release film formed on the silicon pressure-sensitive adhesive layer, wherein the substrate film has a non-adhesive portion on which the silicone pressure-sensitive adhesive layer is not formed, and the base film is surface- Thereby providing an adhesive tape.

In the present invention, the base film may be at least one selected from the group consisting of polyimide, polyethylene naphthalate, and polyethylene terephthalate, and may preferably be a polyimide film.

The base film is preferably a film having a high tensile strength, a low elongation, and a low moisture absorption rate, and preferably has a minimum shrinkage and curl phenomenon during heating and pressurizing processes.

For example, the polyimide film preferably has a strength of not less than 200 MPa in the MD direction and not less than 300 MPa in the TD direction, and an elongation of less than 100% in the MD and TD directions, and a moisture absorption rate of less than 5%. In particular, in the case of heat shrinkage, it is preferably 0.1% or less under the condition of 200 ° C for 2 hours.

In the present invention, the silicone pressure sensitive adhesive layer may include a silicone-based copolymer. The silicone-based copolymer is not particularly limited as long as heat resistance and out-gas control are ensured, but may preferably be a silicone-based copolymer including silicone gum and silicone resin.

The silicone may be an organopolysiloxane having at least one functional group selected from the group consisting of black phenyl, amino, epoxy, hydroxy, mercapto and carboxyl. Preferably vinylpolysiloxane and methylpolysiloxane containing the silicon black vinyl group.

The silicon black constitutes a main component of the silicone pressure sensitive adhesive of silicon and plays a key role in adhesive force and cohesion. The molecular weight when polymerizing the silicone gum is preferably from 500,000 to 2,000,000, and the molecular weight of less than 500,000 And a molecular weight of more than 2,000,000 may adversely affect the workability at the time of coating. Also, since there is a high probability that the unreacted monomers remain due to the high viscosity generated in the polymerization of the silicone black, it is preferable to use silicone gums in which the unreacted monomers are removed as much as possible through the negative pressure process. If a large amount of the unreacted monomer remains, silicon transferred to the surface around the monomer in the high-temperature process may deteriorate the adhesion of the surface of the circuit board to cause adhesion failure.

The silicone resin may be a three-dimensional structure of a methyl polysiloxane having a network structure. The silicone resin may increase the adhesion of the silicone copolymer. The molecular weight of the silicone resin is preferably 500 to 20,000, more preferably 1,000 to 5,000. If the molecular weight is less than 500, the stability of the resin itself is insufficient, which may lead to vaporization under high temperature conditions, which may lead to outgassing, which may lead to defective products. In the case of molecular weights exceeding 20000, The adhesive strength may not be increased but rather the adhesive strength may be lowered.

The silicone-based copolymer including the silicone gum and the silicone resin may include 10 to 30 parts by weight of the silicone resin relative to the silicone gum. If the content of the silicone resin is less than 10 parts by weight, the physical properties are insignificant. If the amount is more than 30 parts by weight, the silicone transfer ratio may increase during the high-temperature high-pressure process, which may adversely affect the substrate.

In the present invention, the silicone pressure sensitive adhesive layer may further comprise a crosslinking agent. In the present invention, the crosslinking agent enhances cohesion and durability when synthesizing a silicone copolymer, and is not particularly limited as long as it is a crosslinking agent having reactivity with a vinyl siloxane group. The crosslinking agent is not particularly limited, but may be a polysiloxane having at least one functional group selected from the group consisting of Si-OH, Si-OR (where R is a C4 to C17 alkyl group) and Si-H. Among them, it is most preferable to use a polysiloxane compound having no Si-H structure in the reaction and having various surface layers and good adhesion.

The crosslinking agent may be contained in an amount of 0.3 to 1.5 parts by weight based on the silicon rubber. When the amount is less than 0.3 part by weight, the pressure-sensitive adhesive transfer phenomenon may occur due to lack of crosslinking. If the amount is more than 1.5 parts by weight, unreacted crosslinking agent may cause a change with time.

Further, in the present invention, the silicone pressure sensitive adhesive layer may further include an organosilane for the purpose of increasing the bonding force to the surface of a substrate (e.g., polyimide). Specifically, in the present invention, the silicone pressure-sensitive adhesive layer further comprises at least one organosilane selected from the group consisting of aminopropyltrimethoxysilane, aminoethylaminopropyltrimethoxysilane, and gamma -glycidoxypropyltrimethoxysiloxane And preferably, the organosilane may be? -Glycidoxypropyltrimethoxysiloxane.

The alkoxysilane group contained in the organosilane is bonded to the methoxy or ethoxy group of the copolymer through a crosslinking reaction, and the epoxy moiety reacts with the adherend to which the adhesive is applied, for example, the imide group remaining on the polyimide surface, Thereby improving adhesion stability and preventing the pressure-sensitive adhesive transition in a high-temperature and high-pressure environment.

The organosilane may be included in an amount of 0.2 to 5.0 parts by weight based on the silicon rubber. If the content of the organosilane is less than 0.2 parts by weight, the bonding strength may not be sufficiently increased. If the content of the organosilane is more than 5.0 parts by weight, the coating film may become hard and cause problems in initial adhesion, And transferred to the surface of the circuit board at high temperature to increase the silicon transfer rate, which may lead to adhesion failure during substrate lamination.

In addition, a UV stabilizer, an antioxidant, etc. may be further added to the silicone pressure sensitive adhesive layer of the present invention depending on the purpose of use.

In the present invention, the silicone pressure-sensitive adhesive layer may be applied at a coverage of 1 to 10 g / m 2, and may be applied at a coverage of 2 to 5 g / m 2. If the coating amount is less than 1 g / m 2, the adhesion may be significantly lowered, which may cause problems in fixing the device. If the coating amount exceeds 10 g / m 2, the pressure-sensitive adhesive may be deformed due to high pressure during the high-

The method of applying the silicone pressure-sensitive adhesive layer in the present invention is not particularly limited as long as it is a coating method generally used in the art. For example, a die coater, a dip coater, a gravure roll coater, a comma coater, or the like can be used, and a die coater can be preferably used for managing the high-edge phenomenon of the non-adhered portion.

In the present invention, the surface tension enhancing surface treatment refers to a treatment for removing foreign substances such as oil and dust on the surface and for realizing surface irregularity or high polarity on the surface for the purpose of enhancing the adhesion between the surface and the coating material.

In the present invention, the surface tension may be enhanced to 38 to 45 Dyne, which is less than 35 dyne by the surface tension strengthening surface treatment.

In the present invention, the surface tension enhancing surface treatment may be at least one of a corona treatment and a CO ₂ plasma treatment, and may preferably be a corona treatment. The primer coating is applied to enhance the surface tension between the conventional substrate and the silicon pressure-sensitive adhesive layer. However, such a primer coating not only increases the manufacturing cost of the adhesive tape, but also causes the coating primer layer to adhere to the substrate . Therefore, in the present invention, one or more of the corona treatment and the CO ₂ plasma treatment are carried out without using a primer, in terms of cost and efficiency.

In the present invention, the release film is formed on the silicon pressure-sensitive adhesive layer. The releasing film is not particularly limited as far as it exhibits releasing property to the silicone pressure-sensitive adhesive, but it may be one treated with a fluorine treatment, an acrylic-silicone releasing agent, a paraffin wax releasing agent or the like. Specifically, in the present invention, it is preferable that the release film is produced at a drying temperature of 130 ° C or less by applying a fluorine-based solvent. Thermal shrinkage of the film during operation at a temperature higher than 130 ° C may cause lateral wrinkles and vertical wrinkles.

The release film is not particularly limited as long as the coating method commonly used in the art is used, but it is possible to form the release film by various methods such as gravure coating, Meyer bar coating, air knife coating and doctor knife coating, It can be achieved by applying it to a base film and drying and curing it by a heat treatment, an ultraviolet ray irradiation or the like.

In the present invention, the silicone pressure sensitive adhesive layer is formed on a part of the base film. By applying a silicone pressure-sensitive adhesive layer to only a part of the base film, a non-adhesive portion, which is the remaining portion to which the silicone pressure-sensitive adhesive layer is not applied, is formed.

In the present invention, the adhesive tape may be peeled off using a part of the base film exposed to the non-adhesive portion. 2 shows a state in which the machine clip 70 is fixed to the end of the non-adhered portion 40 and pulled in the peeling direction to peel off the adhesive tape 10 + 30 for the device-inserted type printed circuit board from the printed circuit board 60 . That is, the present invention can automate the peeling process of the adhesive tape which has been conventionally hand-operated only by including the non-adhesive portion.

Further, the present invention is a method for producing the above-mentioned pressure-sensitive adhesive tape, comprising the steps of: Applying a silicone adhesive layer to a portion of the substrate film; And forming a release film on the silicon pressure-sensitive adhesive layer. The present invention also provides a method of manufacturing an adhesive tape for an insert-type printed circuit board.

Hereinafter, the production method according to the present invention will be described in detail.

First, the base film is subjected to a surface tension strengthening surface treatment. The surface tension strengthening surface treatment is as described above, and may be performed on one side of the base film.

Then, a silicone adhesive layer is applied to a part of the base film.

When a silicone pressure sensitive adhesive layer is applied to a part of the base film, a non-adhesive portion is formed on the base film where the silicone pressure sensitive adhesive layer is not applied. The non-adhered portion thus formed can be used to easily peel off the adhesive tape from the printed circuit board.

The step of applying the silicone pressure-sensitive adhesive layer to a part of the base film preferably uses a simple coat having a die coater and a diagonal-shaped edge.

In the case of a product produced by a conventional adhesive coating method, a high-edge phenomenon inevitably occurs in which the pressure at the edge of the coating is caused by the influence of the viscosity of the pressure-sensitive adhesive, 3). The pressure of the pressure-sensitive adhesive is applied to both sides of the simple rate interface, and the discharge amount of the edge portion relatively increases, thereby causing a high-edge phenomenon. When a high-edge is generated, there is a risk that a large amount of residue may be generated due to pressure applied to the edge portion during a hot-press process of the substrate. If such a high-edge phenomenon is not controlled, the problem of the adhesive transfer at the edge portion becomes inevitable, and it is difficult to find meaning of the limited coating, that is, coating on a part of the substrate film. Accordingly, in the present invention, a method of controlling a high-edge phenomenon is to prevent a high-edge phenomenon by using a simple rate having a die coater and a diagonal edge. By applying the simplex shape to oblique lines, it is possible to distribute the pressure applied by the edge part to both sides, thereby applying a uniform thickness.

In the present invention, the ratio of the horizontal length to the vertical length of the oblique line may be 1/1 to 1 / 1.5. If the width of the oblique line is longer than the above range, the non-uniform thickness range is widened at the edge of the coating, and if the width is shorter than the above range, the height of the high-edge becomes high.

Next, a release film is formed on the silicon pressure-sensitive adhesive layer.

INDUSTRIAL APPLICABILITY According to the adhesive tape for a device-inserted type printed circuit board of the present invention and the method of manufacturing the same, when an element is inserted into a via formed on a printed circuit board, the element is placed on the adhesive tape and the semi- It is possible to easily embed the device in the circuit board and reduce the transfer rate of the silicone oil to about 5 to 15%. By coating the silicone adhesive on the limited area when the silicone adhesive is laminated, the non- It is possible to simplify the peeling process due to the easy removal, and there is no residue of the adhesive layer even after the peeling of the adhesive tape, so that the efficiency of the secondary bonding can be improved by shortening the washing process.

The present invention will be described in more detail through the following examples. However, the examples are for illustrating the present invention, and the scope of the present invention is not limited thereto.

[Examples 1 and 2]

A silicone pressure sensitive adhesive was coated on the top of the polyimide film with a slot die coater (80). this? One of the simplexes 70 used was one having two corners of a rectangular shape (Comparative Example 1) and one having two corners of a diagonal shape (Examples 1 and 2). This is shown in FIG. When coating the silicone adhesive, the edge thickness and the center thickness (center thickness) of the coating layer were measured, and the results are shown in Table 1 below.

Comparative Example 1 Example 1 Example 2 Simple rate processing right angle diagonal diagonal Horizontal / Vertical Length (mm) 0/0 7/10 10/13 Edge Thickness
/ Center thickness (占 퐉) 5.78 / 3.02 3.59 / 3.12 3.31 / 3.15 Thickness increase rate 91% 15% 5%

[Examples 3 and 4]

A corona treatment is performed on the upper surface of the polyimide film 10 as a kind of surface tension strengthening treatment 2 and a silicone adhesive is applied to the upper surface of the upper portion of the polyimide film 10 subjected to the surface tension strengthening treatment 20, Coating method to form the silicone pressure-sensitive adhesive layer 30, and at the same time, the non-adhesive portion 40 was exposed. A fluorine-modified polyethylene terephthalate film (50) was laminated on the silicon pressure-sensitive adhesive layer (30) to prepare an adhesive tape. The composition, content and application amount of the silicone-based pressure-sensitive adhesives of Examples 3 and 4 and Comparative Examples 2 to 4 were prepared in accordance with the following Table 2. A sectional view of the adhesive tape thus produced is shown in Fig.

adhesive additive adhesive
Application amount silicon
sword silicon
Resin SiH
Polysiloxane Aminopropyltrimethoxysilane γ-glycidoxypropyltrimethoxysiloxane ㎛ Example 3 100 20 One 2 - 3 Example 4 100 20 One - 2 3 Comparative Example 2 100 20 One - 0.1 3 Comparative Example 3 100 20 One - 8 3 Comparative Example 4 100 40 One - 2 3

[Experimental Example]

Basic properties and hot press physical properties were measured for Examples 3 and 4 and Comparative Examples 2 to 4. Each measurement method is as follows, and the results are shown in Table 3.

≪ Basic property measurement method >

* Deformed peel force and adhesion test (CKP-5000)

① Adhesive tape was cut into 25 mm width and 250 mm length in machine direction.

(2) The peel strength was measured while peeling at a peeling speed of 300 m / min using a peel test method using an adhesive force measuring device (CKP-5000).

③ Separation test The specimens were laminated to a glass or SUS plate which had been cleaned and dried by using automatic joining machine (2kg load) and stored at 25 ± 2 ℃ for 30 minutes.

④ Adhesive force was measured while peeling at a peeling speed of 300 m / min by a 180 ° peel test method using an adhesive force measuring device (CKP-5000).

≪ Hotpress property measurement method >

① Adhesive tape was cut into 300 mm width and 300 mm length in machine direction.

(2) The specimens were laminated to a Curcuit plate on which copper had been deposited using an automatic joining machine (2 kg load) and hot pressed at 5 MPa pressure for 30 minutes in a press machine in which the upper and lower plates were heated at 130 ± 5 ° C.

③ Peel test was carried out using a peel test method at a peeling speed of 300 m / min by using an adhesive force measuring device (CKP-5000), and it was confirmed whether or not residue was generated during peeling.

(4) A standard tape (Nitto 31B-rubber system) having a width of 25 mm and a length of 175 mm was lightly stuck on the copper evaporated plate which had been peeled off.

(5) The prepared sample was pressed twice using a FINAT test roller (2 kg load) at a speed of 10 mm / sec. After compression, the specimen was pressed between a flat metal plate or a glass plate at 70 g / cm ² at a temperature of 23 ± 2 ° C for 20 hours.

⑥ After storage, the pressure was removed and the test was carried out at 23 ± 2 ℃ for 4 hours.

(7) The test was carried out by fixing the test sample to the jig and peeling off the standard tape at a rate of 300 mm / min in the direction of 180 °. The measured value was written in g / 25 mm.

Contents Basic Properties Hot press properties Remarks Adhesive Properties
(JIS Z 0237) Release force
(FINAT-10) Residual adhesive residue Residual tack rate unit adhesiveness Release force Clear = C
Residue = Rs % gf / 25 mm gf / 25 mm Example 3 7.8 3.2 C 91 Example 4 15.5 4.4 C 88 Comparative Example 2 6.5 2.8 Rs 95 Separation of substrate and pressure-sensitive adhesive layer Comparative Example 3 48.5 7.9 C 55 Silicon transfer rate is high Comparative Example 4 31.5 16.8 Rs 62

10 polyimide film
20 Surface Tension Reinforcement
30 silicone pressure sensitive adhesive layer
40 non-adhesive portion
50 release film
60 printed circuit board
70 Simplex
80 slot die

Claims (20)

A base film;
A silicone pressure-sensitive adhesive layer formed on a part of the base film; And
And a release film formed on the silicon pressure-sensitive adhesive layer,
And a non-adhesive portion that is a portion where the silicone pressure sensitive adhesive layer is not formed on the base film,
Wherein the base film is a surface tension reinforced surface-treated adhesive tape for an insert-type printed circuit board. The method according to claim 1,
Wherein the base film is at least one selected from the group consisting of polyimide, polyethylene naphthalate and polyethylene terephthalate. The method according to claim 1,
Wherein the silicone pressure-sensitive adhesive layer comprises a silicone-based copolymer. The method of claim 3,
Wherein the silicone-based copolymer comprises silicon gum and a silicone resin. 5. The method of claim 4,
Wherein the silicone resin is contained in an amount of 10 to 30 parts by weight based on the silicone rubber. 5. The method of claim 4,
Wherein said organopolysiloxane is an organopolysiloxane having at least one functional group selected from the group consisting of silicon blackphenyl, amino, epoxy, hydroxy, mercapto and carboxyl. The method according to claim 1,
Wherein the silicone pressure sensitive adhesive layer further comprises a crosslinking agent. 8. The method of claim 7,
Wherein the crosslinking agent is a polysiloxane having at least one functional group selected from the group consisting of Si-OH, Si-OR (wherein R is a C4 to C17 alkyl group) and Si-H, 8. The method of claim 7,
Wherein the crosslinking agent is contained in an amount of 0.3 to 1.5 parts by weight based on the silicone rubber. The method according to claim 1,
Wherein the silicone pressure sensitive adhesive layer further comprises at least one organosilane selected from the group consisting of aminopropyltrimethoxysilane, aminoethylaminopropyltrimethoxysilane and? -Glycidoxypropyltrimethoxysiloxane. 11. The method of claim 10,
Wherein the organosilane is contained in an amount of 0.2 to 5.0 parts by weight based on the silicone rubber. The method according to claim 1,
Wherein the silicone pressure sensitive adhesive layer is applied in an application amount of 1 to 10 g / m < 2 >. The method according to claim 1,
Wherein the surface tension enhancing surface treatment is at least one of a corona treatment and a CO ₂ plasma treatment. The method according to claim 1,
And the adhesive tape is peeled off using a part of the base film exposed to the non-adhesive portion. A method for producing an adhesive tape according to any one of claims 1 to 14,
Surface-strengthening surface treatment of the base film;
Applying a silicone adhesive layer to a portion of the substrate film; And
And forming a release film on the silicon pressure-sensitive adhesive layer. 16. The method of claim 15,
Wherein when a silicone pressure sensitive adhesive layer is applied to a part of the base film, a non-adhesive portion which is a portion of the base film not coated with the silicone pressure sensitive adhesive layer is formed. 16. The method of claim 15,
Wherein the step of applying the silicone pressure-sensitive adhesive layer to a part of the base film uses a simple coat having a die coater and oblique edges. 18. The method of claim 17,
Wherein the simple rate is a ratio of a transverse length / transverse length of a slanting line of 1/1 to 1 / 1.5. 16. The method of claim 15,
Wherein the surface tension enhancing surface treatment is at least one of a corona treatment and a CO ₂ plasma treatment. 17. The method of claim 16,
And peeling the adhesive tape from the printed circuit board using the non-adhesive portion.

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