WO2015119320A1 - Adhesive composition and adhesive tape comprising same for manufacturing electronic part - Google Patents

Adhesive composition and adhesive tape comprising same for manufacturing electronic part Download PDF

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Publication number
WO2015119320A1
WO2015119320A1 PCT/KR2014/001247 KR2014001247W WO2015119320A1 WO 2015119320 A1 WO2015119320 A1 WO 2015119320A1 KR 2014001247 W KR2014001247 W KR 2014001247W WO 2015119320 A1 WO2015119320 A1 WO 2015119320A1
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Prior art keywords
weight
adhesive tape
parts
adhesive composition
pressure
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PCT/KR2014/001247
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French (fr)
Korean (ko)
Inventor
전경연
전해상
김성진
최성환
Original Assignee
도레이첨단소재 주식회사
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Priority to CN201480072106.0A priority Critical patent/CN105874025A/en
Publication of WO2015119320A1 publication Critical patent/WO2015119320A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape for manufacturing an electronic component including the same, and more particularly, to a pressure-sensitive adhesive composition and an electronic device comprising the pressure-sensitive adhesive composition to prevent the resin bag from leaking toward the die or the lead frame in the resin encapsulation process during the electronic component manufacturing process.
  • the present invention relates to an adhesive tape for component manufacturing.
  • QFN Quad Flat Non-lead
  • QFP Quad Flat Non-lead
  • Japanese Patent Application Laid-Open No. 2002-338910 discloses a silicon-based adhesive sheet, but in the case of silicon-based adhesives, there is an advantage in that heat resistance and adhesion are excellent, but a silicon monomer (monomer) is transferred to an adherend and subsequently packaged. There was a problem that it is likely to remain in the interior, which may lower the package reliability.
  • Japanese Patent Laid-Open No. 2003-165961 produced a silicone pressure-sensitive adhesive sheet to which a filler was added. The addition of a filler has the advantage of preventing the mold flash by securing the modulus of the adhesive even at high temperature, but there was a limit to sufficiently increase the adhesive force due to the addition of the filler.
  • the present inventors constituted a heat-resistant acrylic pressure-sensitive adhesive containing two or more thermosetting agents to excellent the imprint characteristics and adhesive strength at room temperature, and secure the shear stress (Shear strength) at 20 °C / 10mm or more at 180 °C resin encapsulation in the resin encapsulation process It was confirmed that the leak can be prevented and came to complete the present invention.
  • an object of the present invention is to provide a pressure-sensitive adhesive composition to prevent the resin bag from leaking toward the die or the lead frame in the resin encapsulation step of the electronic component manufacturing process and the electronic component manufacturing comprising the same It is to provide an adhesive tape.
  • the said object is achieved by the adhesive composition characterized by including at least 2 thermosetting agents.
  • thermosetting agent is characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent.
  • the method further comprises an acrylic copolymer, an energy ray-curable acrylic oligomer, and an energy ray initiator.
  • 0.1 to 20 parts by weight of the isocyanate-based heat curing agent, 0.1 to 30 parts by weight of the melamine-based heat curing agent, and 0.1 to 30 parts by weight of the energy ray-curable acrylic oligomer, based on 100 parts by weight of the acrylic copolymer It is characterized in that it comprises 0.05 to 15 parts by weight of the energy ray initiator relative to 100 weight of the energy ray-curable acrylic oligomer.
  • a pressure-sensitive adhesive tape for producing an electronic component comprising a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition described above on at least one surface of the base film and the base film.
  • the thickness of the pressure-sensitive adhesive layer is characterized in that 1 ⁇ m ⁇ 100 ⁇ m.
  • the adhesive tape is characterized in that the shear stress (Shear Strength) at 180 °C 20gf / 10mm or more.
  • the adhesive strength at room temperature of the adhesive tape is characterized in that 50gf / inch or more.
  • the pencil hardness of the adhesive tape is characterized in that less than 2B.
  • the curing rate according to the temperature has excellent effects such as excellent adhesion to the substrate at room temperature and high shear stress at 180 °C to prevent the die (pushing) die due to the EMC injection pressure. .
  • the resin encapsulation step in the resin encapsulation step of the electronic component manufacturing process can prevent mold-flash leaking toward the die or the lead frame.
  • FIG. 1 is a schematic cross-sectional view of a structure of an adhesive tape for manufacturing an electronic component according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a mold-flash phenomenon.
  • FIG 3 is a view showing a method for measuring the shear stress of the adhesive tape according to an embodiment of the present invention.
  • the pressure-sensitive adhesive composition according to the invention is characterized in that it comprises at least two thermosetting agents.
  • the adhesive tape for manufacturing an electronic component according to the present invention is characterized in that it comprises a pressure-sensitive adhesive layer coated with a pressure-sensitive adhesive composition on at least one surface of the base film and the base film.
  • the adhesive tape according to the present invention is a pressure-sensitive adhesive layer formed on one surface of the base film 11 and the base film 11 ( 12).
  • the adhesive layer 12 may be configured on both sides.
  • the base film examples include polyester films such as polyimide films, polyethylene terephthalate films, polyethylene naphthalate films, and polybutylene terephthalate films.
  • the base film has a thickness of usually 10 ⁇ 100 ⁇ m.
  • the base film may be subjected to conventional physical or chemical surface treatments such as mat treatment, corona discharge treatment, primer treatment, and crosslinking treatment in order to increase adhesion to the pressure-sensitive adhesive layer, retention, and the like.
  • the acrylic copolymer of the pressure-sensitive adhesive composition according to the present invention is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (Meth) acrylate, butyl (meth) acrylate, octyl (meth) acrylate, etc. are mentioned.
  • the weight average molecular weight of the acrylic copolymer is preferably 400,000 to 4,000,000 g / mol, more preferably 500,000 to 3,000,000 g / mol.
  • the acrylic copolymer has a weight average molecular weight of more than 4,000,000, mixing is not performed properly, and thus it may be difficult to obtain uniform physical properties and cause problems such as deterioration of coating properties.
  • the weight average molecular weight is less than 400,000, the cohesive force of the pressure-sensitive adhesive layer obtained after coating may be insufficient, leaving residue on the adherend.
  • thermosetting agent of the pressure-sensitive adhesive composition according to the present invention is used for forming a crosslinked structure of the pressure-sensitive adhesive composition.
  • specific examples of the thermosetting agent for such use include melamine, isocyanate, poly (urea-formaldehyde), aryl isocyanate, and the like.
  • the amount of the thermosetting compound is preferably used in a ratio of 0.2 to 50 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
  • the pressure-sensitive adhesive composition according to the present invention is characterized in that it comprises at least two thermosetting agents and the thermosetting agent is characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent.
  • the thermosetting agent is characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent.
  • the isocyanate-based thermosetting agent exhibits rapid reactivity even at room temperature, and the melamine-based curing agent has a characteristic that the reaction proceeds slowly at about 160 ° C. or more.
  • the primary curing at 110 °C by the isocyanate thermosetting agent at the time of film production but hardly proceeds in the case of melamine-based curing agent can secure sufficient adhesion at room temperature.
  • the adhesive film is attached to the package and goes through a molding process of 180 ° C. Since sufficient adhesive force and imprint property between the adhesive film and the package are secured at room temperature, EMC does not easily penetrate even at high temperature, and thus less mold flash occurs. Secondary hardening by the used melamine-based curing agent proceeds, and after the process is completed, the package surface can be peeled off without residue. Therefore, by mixing at least two curing agents of the thermosetting agent it is possible to control the curing rate according to the temperature. In this case, preferably, 0.1 to 20 parts by weight of isocyanate-based thermosetting agent and 0.1 to 30 parts by weight of melamine-based thermosetting agent are used based on 100 parts by weight of the acrylic copolymer.
  • Energy ray curing agent energy ray curing type acrylic oligomer
  • the energy ray-curable acrylic oligomer of the pressure-sensitive adhesive composition according to the present invention is a component that is crosslinked as radicals are generated in the molecular chain with strong energy rays such as UV, EB, and radiation.
  • Such energy ray-curable acrylic oligomers include aromatic urethane acrylates, aliphatic urethane acrylates, polyester acrylates, epoxy acrylates, and acrylic oligomers. ), Silicone diacrylate (silicone diacrylate), silicon hexaacrylate (silicone hexaacrylate) and phenyl novolacacrylate (phenyl novolacacrylate) is preferably at least one selected from the group consisting of.
  • the energy curable compound is used in a ratio of 0.1 to 30 parts by weight, preferably 1 to 20 parts by weight, based on 100 parts by weight of the acrylic copolymer.
  • the crosslinking structure is not properly formed, so that the internal cohesion is lowered. If the content exceeds 30 parts by weight, the crosslinking progresses a lot and the adhesive force is lowered so that it does not adhere to the adherend.
  • the photoinitiator of the pressure-sensitive adhesive composition according to the present invention is used to initiate the curing of the energy ray-curable acrylic oligomer, and such photoinitiators include phenyl glyoxylate-based and acyl phosphine oxides, which are photoinitiators advantageous for surface curing. oxide) photoinitiator may be used one or more photoinitiators selected from the group consisting of.
  • the photoinitiator is usually used in a ratio of 0.05 to 15 parts by weight, preferably 1 to 10 parts by weight based on 100 parts by weight of the energy ray-curable acrylic oligomer. When the content is less than 0.05 parts by weight, the curing of the energy ray-curable acrylic oligomer is not initiated. When the content is more than 15 parts by weight, the curing of the energy ray-curable acrylic oligomer is initiated and the remaining amount may not affect the adhesive properties.
  • the adhesive tape for manufacturing an electronic component according to the present invention is characterized by including a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition on at least one surface of the base film and the base film.
  • the thickness of an adhesive layer is 1 micrometer-100 micrometers. If the thickness is less than 1 ⁇ m may not properly express the adhesive function in the adherend at room temperature. If the thickness exceeds 100 ⁇ m hardening is not made enough to the inside may leave a residue on the surface of the adherend.
  • the adhesive tape is characterized in that the adhesive force at room temperature more than 50gf / inch. If the adhesive force is less than 50gf / in, the adhesive force between the pressure-sensitive adhesive layer and the die may be low, and the tape may drop during the movement of the lead frame after lamination.
  • the adhesive tape is characterized in that the pencil hardness of 2B or less at room temperature. If the pencil hardness is above B at room temperature, when the lead frame and the adhesive tape lamination, the imprint (press marks) may not be sufficiently formed, so the adhesive tape may easily fall or move.
  • the adhesive tape includes a shear stress (Shhear strength) at 180 °C 20gf / 10mm or more.
  • shear stress is less than 20 gf / 10mm at 180 ° C, there is a possibility that mold flash may occur due to EMC penetration between the lead frame and the adhesive interface due to EMC injection pressure in the resin encapsulation process.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of a phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin
  • 0.03 part by weight of an acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour
  • isocyanate 5 parts by weight of the thermosetting agent Dow Corning, CE138
  • 1.5 parts by weight (based on solids) of the melamine-based thermosetting agent Samwon, SM-20
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) film with a thickness of about 6 ⁇ m, dried at 110 ° C. for 5 minutes (thermal curing), and then energy-saved at about 500 W using a UV irradiation device. After proceeding with the UV (UV) curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • a polyimide film SSC Kolon, LN100 25 ⁇ m
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) film with a thickness of about 6 ⁇ m, dried at 110 ° C. for 5 minutes (thermal curing), and then energy-saved at about 500 W using a UV irradiation device. After proceeding with the UV (UV) curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • a polyimide film SSC Kolon, LN100 25 ⁇ m
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 130 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After the (UV) hardening, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 24 ° C. for 24 hours to prepare an adhesive tape.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 160 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • EA ethyl acetate
  • acrylic copolymer Samwon, AT5100
  • 3 parts by weight of phenyl novolac acrylate SK Cytec, EB9656: Mw 500 to 5000
  • CYTEC, DAROCUR TPO acyl phosphine-based photoinitiator
  • the pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 ⁇ m) with a thickness of about 6 ⁇ m and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 ⁇ m PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
  • the adhesive tape was cut into a length of 1 inch and a length of 15 cm in the longitudinal direction, and then subjected to lamination at room temperature reciprocating twice using a 2 kg roller on Cu-foil. Thereafter, the 180 ° adhesive force was measured at 300 mm / min using a universal testing machine (UTM).
  • UPM universal testing machine
  • Adhesive tape on the lead frame (Cu) Lamination was performed twice at room temperature using a 2 kg roller. Thereafter, the adhesive tape was peeled off, and the imprint intensity of the adhesive surface was observed under a microscope, and evaluated according to the criteria of Table 2 below.
  • Adhesive tape on the lead frame (Cu) Lamination was performed twice at room temperature using a 2 kg roller. After the die attach process simulation (Oven, ramp-up 180 °C x 2hr), wire bonding simulation (Hotplate, 220 °C x 30min) was performed, followed by 180 °C x 3min EMC Molding. Then, after peeling off the adhesive tape, the penetration of the lead frame die (Die) was observed through the microscope whether the EMC.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides an adhesive composition comprising at least two thermal curing agents and an adhesive tape for manufacturing an electronic part using the same. The present invention has excellent adhesive strength with a substrate at room temperature and high sheer stress at 180℃ through control of the curing rate depending on the temperature, thereby preventing a phenomenon in which a die is pushed by the EMC injection pressure. Therefore, the present invention has an advantage of preventing mold-flash in which the resin encapsulation leaks into a die or a lead frame in a resin encapsulation process during an electronic part manufacturing process.

Description

점착제 조성물과 이를 포함하는 전자부품 제조용 점착테이프Adhesive composition and adhesive tape for manufacturing electronic component comprising same
본 발명은 점착제 조성물과 이를 포함하는 전자부품 제조용 점착테이프에 관한 것으로서, 보다 상세하게는 전자부품 제조 공정 중 수지봉지 공정에서 수지 봉지가 다이 또는 리드프레임 쪽으로 새어나가지 않도록 하는 점착제 조성물과 이를 포함하는 전자부품 제조용 점착테이프에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape for manufacturing an electronic component including the same, and more particularly, to a pressure-sensitive adhesive composition and an electronic device comprising the pressure-sensitive adhesive composition to prevent the resin bag from leaking toward the die or the lead frame in the resin encapsulation process during the electronic component manufacturing process. The present invention relates to an adhesive tape for component manufacturing.
최근, 전자정보시스템의 고성능화, 경박단소화 추세에 따라 반도체 패키지의 고집적화 기술이 진행되고 있다. 반도체 패키지 기술은 표면실장, Area Array실장, 3차원 실장의 추세로 기술 혁신이 진행되고 있는데 그 중에서도 Area Array실장인 QFN (Quad Flat Non-lead) 패키지는 리드(Lead)가 없어 기존의 QFP(Quad Flat Package)와 같이 리드를 가진 패키지보다 현저하게 작고 얇게 제조할 수 있으며 회로기판에서 차지하는 면적도 작다는 장점이 있다. Recently, in accordance with the trend of high performance and light and small size of electronic information systems, high integration technology of semiconductor packages has been advanced. The semiconductor package technology is undergoing technological innovation with the trend of surface mounting, area array mounting, and 3D mounting. Among them, QFN (Quad Flat Non-lead) package, which is an area array mounting, has no lead, and thus, conventional QFP (Quad) It can be manufactured significantly smaller and thinner than a package with a lead, such as a flat package, and has an advantage of smaller area on a circuit board.
이러한 QFN 제조공정 과정에서는 다이점착공정(Die-attach) 및 와이어본딩(Wire-bonding)이 된 리드프레임(Leadframe)을 몰딩틀 안에서 밀봉수지를 사용하여 봉지하는 밀봉수지봉지 공정(EMC Molding)이 있는데, 이 때 리드프레임 반대편에 점착테이프를 라미네이션함으로써 수지봉지가 리드프레임 또는 다이 표면으로 노출되는 몰드플래쉬(Mold-flash) 현상을 방지한다(도 2 참조). 따라서 이 때 점착테이프와 리드프레임 사이의 점착강도가 우수해야 수지봉지가 노출되는 문제를 막을 수 있다.In the QFN manufacturing process, there is an EMS molding process that seals a lead frame, which is a die-attach process and a wire-bonding, using a sealing resin in a molding frame. At this time, by laminating the adhesive tape on the opposite side of the lead frame to prevent the mold-flash phenomenon that the resin bag is exposed to the lead frame or the die surface (see Fig. 2). Therefore, at this time, the adhesive strength between the adhesive tape and the lead frame should be excellent to prevent the resin bag from being exposed.
이러한 종래의 기술로는 일본 공개특허공보 특개2002-338910호가 있는데, 여기서 실리콘계 점착시트를 제조하였으나, 실리콘계의 경우 내열성 및 밀착성이 우수하다는 장점이 있으나 피착재에 실리콘 모노머(monomer)가 전사되어 추후 패키지 내에 남을 가능성이 높아 패키지 신뢰성을 저하시킬 수 있는 문제가 있었다. 또한 일본 공개특허공보 특개2003-165961호에서는 필러를 첨가한 실리콘계 점착시트를 제조하였다. 필러를 첨가함으로써 고온에서도 점착제의 모듈러스를 확보하여 몰드플래쉬를 방지할 수 있다는 장점이 있으나 필러 첨가로 인해 점착력을 충분히 증가시키는데 한계가 있었다.Japanese Patent Application Laid-Open No. 2002-338910 discloses a silicon-based adhesive sheet, but in the case of silicon-based adhesives, there is an advantage in that heat resistance and adhesion are excellent, but a silicon monomer (monomer) is transferred to an adherend and subsequently packaged. There was a problem that it is likely to remain in the interior, which may lower the package reliability. In addition, Japanese Patent Laid-Open No. 2003-165961 produced a silicone pressure-sensitive adhesive sheet to which a filler was added. The addition of a filler has the advantage of preventing the mold flash by securing the modulus of the adhesive even at high temperature, but there was a limit to sufficiently increase the adhesive force due to the addition of the filler.
이에 본 발명자들은 2가지 이상의 열경화제를 포함하는 내열 아크릴 점착제를 구성하여 상온에서 Imprint 특성 및 점착력이 우수하고 180℃에서 20gf/10mm 이상의 전단응력(Shear strength)을 확보함으로써 수지 봉지 공정 중에서 수지 봉지가 새어나가는 것을 방지할 수 있음을 확인하고 본 발명을 완성하기에 이르렀다.Accordingly, the present inventors constituted a heat-resistant acrylic pressure-sensitive adhesive containing two or more thermosetting agents to excellent the imprint characteristics and adhesive strength at room temperature, and secure the shear stress (Shear strength) at 20 ℃ / 10mm or more at 180 ℃ resin encapsulation in the resin encapsulation process It was confirmed that the leak can be prevented and came to complete the present invention.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출한 것으로서, 본 발명의 목적은 전자부품 제조 공정 중 수지봉지 공정에서 수지 봉지가 다이 또는 리드프레임 쪽으로 새어나가지 않도록 하는 점착제 조성물과 이를 포함하는 전자부품 제조용 점착테이프를 제공하고자 하는 것이다.The present invention has been made to solve the above problems, an object of the present invention is to provide a pressure-sensitive adhesive composition to prevent the resin bag from leaking toward the die or the lead frame in the resin encapsulation step of the electronic component manufacturing process and the electronic component manufacturing comprising the same It is to provide an adhesive tape.
본 발명의 상기 및 다른 목적과 이점은 바람직한 실시예를 설명한 하기의 설명으로부터 보다 분명해 질 것이다.These and other objects and advantages of the present invention will become more apparent from the following description of preferred embodiments.
상기 목적은, 적어도 2가지의 열경화제를 포함하는 것을 특징으로 하는 점착제 조성물에 의해 달성된다.The said object is achieved by the adhesive composition characterized by including at least 2 thermosetting agents.
여기서, 상기 열경화제는 이소시아네이트계 열경화제 및 멜라민계 열경화제를 포함하는 것을 특징으로 한다.Here, the thermosetting agent is characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent.
바람직하게는, 아크릴계 공중합체, 에너지선 경화형 아크릴계 올리고머 및 에너지선 개시제를 더 포함하는 것을 특징으로 한다.Preferably, the method further comprises an acrylic copolymer, an energy ray-curable acrylic oligomer, and an energy ray initiator.
바람직하게는, 상기 아크릴계 공중합체 100 중량부에 대하여 상기 이소시아네이트계 열경화제 0.1 ~ 20 중량부, 상기 멜라민계 열경화제 0.1 ~ 30 중량부, 상기 에너지선 경화형 아크릴계 올리고머 0.1 ~ 30 중량부를 포함하고, 상기 에너지선 경화형 아크릴계 올리고머 100중량 대비 상기 에너지선 개시제 0.05 내지 15 중량부를 포함하는 것을 특징으로 한다.Preferably, 0.1 to 20 parts by weight of the isocyanate-based heat curing agent, 0.1 to 30 parts by weight of the melamine-based heat curing agent, and 0.1 to 30 parts by weight of the energy ray-curable acrylic oligomer, based on 100 parts by weight of the acrylic copolymer, It is characterized in that it comprises 0.05 to 15 parts by weight of the energy ray initiator relative to 100 weight of the energy ray-curable acrylic oligomer.
또한 상기 목적은, 기재필름과 상기 기재필름의 적어도 일면에 상술한 점착제 조성물로 도포된 점착제층을 포함하는 것을 특징으로 하는 전자부품 제조용 점착테이프에 의해 달성된다.In addition, the above object is achieved by a pressure-sensitive adhesive tape for producing an electronic component, comprising a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition described above on at least one surface of the base film and the base film.
여기서, 상기 점착제층의 두께는 1㎛ ~ 100㎛인 것을 특징으로 한다.Here, the thickness of the pressure-sensitive adhesive layer is characterized in that 1㎛ ~ 100㎛.
바람직하게는, 상기 점착테이프는 180℃에서 전단응력(Shear Strength)이 20gf/10mm 이상인 것을 특징으로 한다.Preferably, the adhesive tape is characterized in that the shear stress (Shear Strength) at 180 ℃ 20gf / 10mm or more.
바람직하게는, 상기 점착테이프의 상온 점착력은 50gf/inch 이상인 것을 것을 특징으로한다.Preferably, the adhesive strength at room temperature of the adhesive tape is characterized in that 50gf / inch or more.
바람직하게는, 상기 점착테이프의 연필경도는 2B 이하인 것을 특징으로 한다.Preferably, the pencil hardness of the adhesive tape is characterized in that less than 2B.
본 발명에 따르면, 온도에 따라 경화속도를 조절함으로써 상온에서는 기재와 점착력이 우수하고 180℃에서 전단응력이 높아 EMC 주입압력에 의해 다이(Die)가 밀리는 현상을 방지할 수 있는 등의 효과를 가진다. According to the present invention, by controlling the curing rate according to the temperature has excellent effects such as excellent adhesion to the substrate at room temperature and high shear stress at 180 ℃ to prevent the die (pushing) die due to the EMC injection pressure. .
따라서 본 발명에 따르면 전자부품 제조 공정 중 수지봉지공정에서 수지봉지가 다이 또는 리드프레임 쪽으로 새어나가는 몰드플래쉬(Mold-flash)를 방지할 수 있는 등의 효과를 가진다.Therefore, according to the present invention, the resin encapsulation step in the resin encapsulation step of the electronic component manufacturing process can prevent mold-flash leaking toward the die or the lead frame.
도 1은 본 발명의 일 실시예에 따른 전자부품 제조용 점착테이프의 구조에 대한 모식적 단면도이다.1 is a schematic cross-sectional view of a structure of an adhesive tape for manufacturing an electronic component according to an embodiment of the present invention.
도 2는 몰드플래쉬(Mold-flash) 현상에 대한 모식적 단면도이다. 2 is a schematic cross-sectional view of a mold-flash phenomenon.
도 3은 본 발명의 일 실시예에 따른 점착테이프의 전단응력을 측정하는 방법을 도시한 도면이다.3 is a view showing a method for measuring the shear stress of the adhesive tape according to an embodiment of the present invention.
이하, 본 발명의 실시예와 도면을 참조하여 본 발명을 상세히 설명한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위해 예시적으로 제시한 것일 뿐, 본 발명의 범위가 이들 실시예에 의해 제한되지 않는다는 것은 당업계에서 통상의 지식을 가지는 자에 있어서 자명할 것이다.Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention. These examples are only presented by way of example only to more specifically describe the present invention, it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .
달리 정의되지 않는 한, 본 명세서에서 사용되는 모든 기술적 및 과학적 용어는 본 발명이 속하는 기술 분야의 숙련자에 의해 통상적으로 이해되는 바와 동일한 의미를 갖는다. 상충되는 경우, 정의를 포함하는 본 명세서가 우선할 것이다.Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
본 명세서에서 설명되는 것과 유사하거나 동등한 방법 및 재료가 본 발명의 실시 또는 시험에 사용될 수 있지만, 적합한 방법 및 재료가 본 명세서에 기재된다.Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.
달리 기술되지 않는다면, 모든 백분율, 부, 비 등은 중량 기준이다. 또한 양, 농도, 또는 다른 값 또는 파라미터가 범위, 바람직한 범위 또는 바람직한 상한치와 바람직한 하한치의 목록 중 어느 하나로 주어질 경우, 이것은 범위가 별도로 개시되는 지에 관계없이 임의의 상한 범위 한계치 또는 바람직한 값과 임의의 하한 범위 한계치 또는 바람직한 값의 임의의 쌍으로부터 형성된 모든 범위를 구체적으로 개시하는 것으로 이해되어야 한다. 수치 값의 범위가 본 명세서에서 언급될 경우, 달리 기술되지 않는다면, 그 범위는 그 종점 및 그 범위 내의 모든 정수와 분수를 포함하는 것으로 의도된다. 본 발명의 범주는 범위를 정의할 때 언급되는 특정 값으로 한정되지 않는 것으로 의도된다.Unless stated otherwise, all percentages, parts, ratios, etc., are by weight. In addition, if an amount, concentration, or other value or parameter is given in any of a range, a preferred range or a list of preferred upper and preferred lower limits, this means that any upper range limit or preferred value and any lower limit, regardless of whether a range is disclosed separately It is to be understood that this disclosure specifically discloses all ranges formed from any pair of range limits or preferred values. When a range of numerical values is mentioned herein, unless stated otherwise, the range is intended to include the endpoint and all integers and fractions within that range. It is intended that the scope of the invention not be limited to the particular values mentioned when defining the range.
용어 "약"이라는 용어가 값 또는 범위의 종점을 기술하는 데 사용될 때, 본 개시 내용은 언급된 특정의 값 또는 종점을 포함하는 것으로 이해되어야 한다.When the term “about” is used to describe an endpoint of a value or range, it is to be understood that the present disclosure includes the specific value or endpoint mentioned.
본 명세서에 사용된 바와 같이, "포함하다(comprise)", "포함하는(comprising)", "구비하다(include)", "구비하는(including) ", "함유하는(containing)", "~을 특징으로 하는(characterized by)", "갖는다(has)", "갖는(having)"이라는 용어들 또는 이들의 임의의 기타 변형은 배타적이지 않은 포함을 커버하고자 한다. 예를 들어, 요소들의 목록을 포함하는 공정, 방법, 용품, 또는 기구는 반드시 그러한 요소만으로 제한되지는 않고, 명확하게 열거되지 않거나 그러한 공정, 방법, 용품, 또는 기구에 내재적인 다른 요소를 포함할 수도 있다. 또한, 명백히 반대로 기술되지 않는다면, "또는"은 포괄적인 '또는'을 말하며 배타적인 '또는'을 말하는 것은 아니다.As used herein, "comprise", "comprising", "include", "including", "containing", "~" The terms "characterized by", "has", "having" or any other variation thereof are intended to cover non-exclusive inclusion. For example, a process, method, article, or apparatus that includes a list of elements is not necessarily limited to such elements and may not be explicitly listed or include other elements inherent to such process, method, article, or apparatus. It may be. Also, unless expressly stated to the contrary, "or" refers to an inclusive 'or' and not an exclusive 'or'.
출원인이 "포함하는"과 같은 개방형 용어로 발명 또는 그 일부를 정의한 경우, 달리 명시되지 않는다면 그 설명이 "본질적으로 이루어진"이라는 용어를 이용하여 그러한 발명을 설명하는 것으로도 해석되어야 함이 쉽게 이해되어야 한다.Where an applicant defines an invention or part thereof in an open term such as "comprising", it should be readily understood that the description should also be construed as describing the invention using the term "consisting essentially of" unless otherwise specified. do.
본 발명에 따른 점착제 조성물은 적어도 2가지의 열경화제를 포함하는 것을 특징으로 한다. 또한 본 발명에 따른 전자부품 제조용 점착테이프는 기재필름과 기재필름의 적어도 일면에 점착제 조성물로 도포된 점착제층을 포함하는 것을 특징으로 한다. The pressure-sensitive adhesive composition according to the invention is characterized in that it comprises at least two thermosetting agents. In addition, the adhesive tape for manufacturing an electronic component according to the present invention is characterized in that it comprises a pressure-sensitive adhesive layer coated with a pressure-sensitive adhesive composition on at least one surface of the base film and the base film.
이하, 본 발명의 구성요소에 대해 도면을 이용하여 차례로 설명한다. 본 발명의 일 실시예에 따른 전자부품 제조용 점착테이프의 구조에 대한 모식적 단면도인 도 1로부터, 본 발명에 따른 점착테이프는 기재필름(11)과 기재필름(11)의 일면에 형성된 점착제층(12)으로 구성된다. 또한 양면에 첨착제층(12)이 구성될 수 있음은 당연하다.EMBODIMENT OF THE INVENTION Hereinafter, the component of this invention is demonstrated in order using drawing. 1 is a schematic cross-sectional view of the structure of the adhesive tape for manufacturing an electronic component according to an embodiment of the present invention, the adhesive tape according to the present invention is a pressure-sensitive adhesive layer formed on one surface of the base film 11 and the base film 11 ( 12). In addition, the adhesive layer 12 may be configured on both sides.
1. 기재필름1. Base Film
기재필름은 폴리이미드 필름, 폴리에틸렌테레프탈레이트 필름, 폴리에틸렌나프탈레이트 필름 및 폴리부틸렌테레프탈레이트 필름 같은 폴리에스테르 필름 등을 들 수 있다. 상기 기재필름의 두께는 통상 10 ~ 100㎛인 것을 포함한다. 또한 상기 기재필름은 점착제층과의 밀착성, 유지성 등을 높이기 위해서 매트처리, 코로나 방전처리, 프라이머 처리 및 가교결합 처리와 같은 통상적인 물리 또는 화학적인 표면처리가 실시될 수 있다.Examples of the base film include polyester films such as polyimide films, polyethylene terephthalate films, polyethylene naphthalate films, and polybutylene terephthalate films. The base film has a thickness of usually 10 ~ 100㎛. In addition, the base film may be subjected to conventional physical or chemical surface treatments such as mat treatment, corona discharge treatment, primer treatment, and crosslinking treatment in order to increase adhesion to the pressure-sensitive adhesive layer, retention, and the like.
2. 점착제 조성물2. Adhesive composition
2-1. 아크릴 공중합체2-1. Acrylic copolymer
본 발명에 따른 점착제 조성물의 아크릴계 공중합체는 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, 프로필 (메타)아크릴레이트, 부틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 옥틸 (메타)아크릴레이트, 부틸 (메타)아크릴레이트 또는 옥틸 (메타)아크릴레이트 등이 있다.The acrylic copolymer of the pressure-sensitive adhesive composition according to the present invention is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (Meth) acrylate, butyl (meth) acrylate, octyl (meth) acrylate, etc. are mentioned.
아크릴계 공중합체의 중량평균분자량은 바람직하게는 400,000 ~ 4,000,000g/mol, 더욱 바람직하게는 500,000 ~ 3,000,000g/mol 이다. 상기 아크릴계 공중합체는 중량평균분자량이 4,000,000을 초과하는 경우 혼합이 제대로 이루어지지 않아 균일한 물성을 얻기 힘들고 코팅성의 저하와 같은 문제를 야기할 수 있다. 반대로 중량평균분자량이 400,000에 미달하는 경우 코팅 후 수득된 점착제층의 내부 응집력이 부족하여 피착재에 잔사를 남길 수 있다.The weight average molecular weight of the acrylic copolymer is preferably 400,000 to 4,000,000 g / mol, more preferably 500,000 to 3,000,000 g / mol. When the acrylic copolymer has a weight average molecular weight of more than 4,000,000, mixing is not performed properly, and thus it may be difficult to obtain uniform physical properties and cause problems such as deterioration of coating properties. On the contrary, when the weight average molecular weight is less than 400,000, the cohesive force of the pressure-sensitive adhesive layer obtained after coating may be insufficient, leaving residue on the adherend.
2-2. 열경화제2-2. Thermosetting agent
본 발명에 따른 점착제 조성물의 열경화제는 점착제 조성물의 가교구조를 형성하는 용도로 사용된다. 이러한 용도의 열경화제로서는, 구체적으로 멜라민(melamine), 이소시아네이트(isocyanate), 폴리(우레아-포름알데히드) (poly(urea-formaldehyde)), 아릴이소시아네이트(aryl isocyanate) 등을 들 수 있다. 열경화제형 화합물의 양은 아크릴계 공중합체 100 중량부에 대해 0.2 내지 50 중량부의 비율로 사용되는 것이 바람직하다.The thermosetting agent of the pressure-sensitive adhesive composition according to the present invention is used for forming a crosslinked structure of the pressure-sensitive adhesive composition. Specific examples of the thermosetting agent for such use include melamine, isocyanate, poly (urea-formaldehyde), aryl isocyanate, and the like. The amount of the thermosetting compound is preferably used in a ratio of 0.2 to 50 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
본 발명에 따른 점착제 조성물은 적어도 2가지의 열경화제를 포함하는 것을 특징으로 하고 상기 열경화제는 이소시아네이트계 열경화제 및 멜라민계 열경화제를 포함하는 것을 특징으로 한다. 본 발명에서는 열경화제를 2종 이상 혼합하여 사용함으로써 점착제의 물성을 제어할 수 있게 되는 것이다. 이소시아네이트계 열경화제의 경우 상온에서도 빠른 반응성을 나타내며 멜라민계 경화제의 경우 약 160℃ 이상에서 느리게 반응이 진행되는 특성을 갖는다. 따라서 필름 제조 시 110℃에서 이소시아네이트 열경화제에 의해 1차 경화가 진행되지만 멜라민계 경화제의 경우 경화가 거의 진행되지 않으므로 상온에서 충분한 점착력을 확보할 수 있다. 이후 점착필름은 패키지 내에 부착되어 180℃의 몰딩공정을 거치는데 상온에서 점착필름과 패키지 간의 충분한 점착력과 Imprint 특성을 확보하였기 때문에 고온에서도 EMC가 쉽게 침투되지 않아 몰드플래쉬 발생이 적고, 이 때 미반응된 멜라민계 경화제에 의한 2차 경화가 진행되어 공정이 끝난 후 패키지면에 잔사 없이 박리가능하게 된다. 그러므로 열경화제 중 적어도 두 가지 경화제를 혼합함으로써 온도에 따라 경화속도를 제어할 수 있게 되는 것이다. 이 경우 바람직하게는, 아크릴계 공중합체 100 중량부에 대하여 이소시아네이트계 열경화제 0.1 ~ 20 중량부와 멜라민계 열경화제 0.1 ~ 30 중량부를 사용하는 것이다.The pressure-sensitive adhesive composition according to the present invention is characterized in that it comprises at least two thermosetting agents and the thermosetting agent is characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent. In the present invention, it is possible to control the physical properties of the pressure-sensitive adhesive by using a mixture of two or more types of thermosetting agents. The isocyanate-based thermosetting agent exhibits rapid reactivity even at room temperature, and the melamine-based curing agent has a characteristic that the reaction proceeds slowly at about 160 ° C. or more. Therefore, the primary curing at 110 ℃ by the isocyanate thermosetting agent at the time of film production, but hardly proceeds in the case of melamine-based curing agent can secure sufficient adhesion at room temperature. After that, the adhesive film is attached to the package and goes through a molding process of 180 ° C. Since sufficient adhesive force and imprint property between the adhesive film and the package are secured at room temperature, EMC does not easily penetrate even at high temperature, and thus less mold flash occurs. Secondary hardening by the used melamine-based curing agent proceeds, and after the process is completed, the package surface can be peeled off without residue. Therefore, by mixing at least two curing agents of the thermosetting agent it is possible to control the curing rate according to the temperature. In this case, preferably, 0.1 to 20 parts by weight of isocyanate-based thermosetting agent and 0.1 to 30 parts by weight of melamine-based thermosetting agent are used based on 100 parts by weight of the acrylic copolymer.
2-3. 에너지선 경화제(에너지선 경화형 아크릴계 올리고머)2-3. Energy ray curing agent (energy ray curing type acrylic oligomer)
본 발명에 따른 점착제 조성물의 에너지선 경화형 아크릴계 올리고머는 UV, EB, 방사선 등의 강한 에너지선으로 분자쇄에 라디칼이 생성됨에 따라 가교화되는 성분이다.The energy ray-curable acrylic oligomer of the pressure-sensitive adhesive composition according to the present invention is a component that is crosslinked as radicals are generated in the molecular chain with strong energy rays such as UV, EB, and radiation.
이러한 에너지선 경화형 아크릴계 올리고머로서는 아로마틱 우레탄아크릴레이트(aromatic urethane acrylate), 알리파틱 우레탄아크릴레이트(aliphatic urethane acrylate), 폴리에스터 아크릴레이트(polyester acrylate), 에폭시 아크릴레이트(epoxy acrylate), 아크릴릭 올리고머(acrylic oligomer), 실리콘 다이아크릴레이트(silicone diacrylate), 실리콘 헥사아크릴레이트(silicone hexaacrylate) 및 페닐 노블락아크릴레이트(phenyl novolacacrylate)로 구성된 군으로부터 선택되는 하나 이상인 것이 바람직하다. 에너지 경화형 화합물은 아크릴계 공중합체 100 중량부에 대해 0.1 내지 30 중량부, 바람직하게는 1 내지 20 중량부의 비율로 사용된다. 함량이 1 중량부 미만인 경우 가교 구조가 제대로 형성되지 않아 내부 응집력이 낮아지고, 30 중량부를 초과하는 경우에는 가교화가 많이 진행되어 점착력이 낮아져서 피착재에 붙지 않으므로 바람직하지 않다.Such energy ray-curable acrylic oligomers include aromatic urethane acrylates, aliphatic urethane acrylates, polyester acrylates, epoxy acrylates, and acrylic oligomers. ), Silicone diacrylate (silicone diacrylate), silicon hexaacrylate (silicone hexaacrylate) and phenyl novolacacrylate (phenyl novolacacrylate) is preferably at least one selected from the group consisting of. The energy curable compound is used in a ratio of 0.1 to 30 parts by weight, preferably 1 to 20 parts by weight, based on 100 parts by weight of the acrylic copolymer. If the content is less than 1 part by weight, the crosslinking structure is not properly formed, so that the internal cohesion is lowered. If the content exceeds 30 parts by weight, the crosslinking progresses a lot and the adhesive force is lowered so that it does not adhere to the adherend.
2-4. 광 개시제2-4. Photoinitiator
본 발명에 따른 점착제 조성물의 광개시제는 에너지선 경화형 아크릴계 올리고머의 경화를 개시하기 위해 사용하며, 이러한 광개시제로는 표면 경화에 유리한 광개시제인 페닐 글리옥실레이트(phenyl glyoxylate)계 및 아실 포스핀 옥사이드(acyl phosphine oxide)계 광개시제로 구성된 군으로부터 선택되는 하나 이상의 광개시제가 사용될 수 있다. 광개시제는 상기 에너지선 경화형 아크릴계 올리고머 100 중량부에 대해 통상적으로 0.05 내지 15 중량부, 바람직하게는 1 내지 10 중량부의 비율로 사용된다. 함량이 0.05 중량부 미만인 경우 에너지선 경화형 아크릴계 올리고머의 경화가 개시되지 않으며 15 중량부를 초과하는 경우에는 에너지선 경화형 아크릴계 올리고머의 경화가 개시되고 남은 잔량이 점착 물성에 영향을 줄 수 있으므로 바람직하지 않다.The photoinitiator of the pressure-sensitive adhesive composition according to the present invention is used to initiate the curing of the energy ray-curable acrylic oligomer, and such photoinitiators include phenyl glyoxylate-based and acyl phosphine oxides, which are photoinitiators advantageous for surface curing. oxide) photoinitiator may be used one or more photoinitiators selected from the group consisting of. The photoinitiator is usually used in a ratio of 0.05 to 15 parts by weight, preferably 1 to 10 parts by weight based on 100 parts by weight of the energy ray-curable acrylic oligomer. When the content is less than 0.05 parts by weight, the curing of the energy ray-curable acrylic oligomer is not initiated. When the content is more than 15 parts by weight, the curing of the energy ray-curable acrylic oligomer is initiated and the remaining amount may not affect the adhesive properties.
3. 점착테이프3. Adhesive tape
본 발명에 따른 전자부품 제조용 점착테이프는 기재필름과 기재필름의 적어도 일면에 상술한 점착제 조성물로 도포된 점착제층을 포함하는 것을 특징으로 한다.The adhesive tape for manufacturing an electronic component according to the present invention is characterized by including a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition on at least one surface of the base film and the base film.
점착제층의 두께는 1㎛ ~ 100㎛인 것이 바람직하다. 두께가 1㎛ 미만인 경우 상온에서 피착재에 점착 기능을 제대로 발현하지 못할 수 있다. 두께가 100㎛을 초과하는 경우 경화가 내부까지 충분히 이루어지지 않아 피착재 면에 잔사를 남길 수 있다.It is preferable that the thickness of an adhesive layer is 1 micrometer-100 micrometers. If the thickness is less than 1㎛ may not properly express the adhesive function in the adherend at room temperature. If the thickness exceeds 100㎛ hardening is not made enough to the inside may leave a residue on the surface of the adherend.
또한 점착테이프는 상온에서 점착력이 50gf/inch 이상인 것을 특징으로 한다. 점착력이 50gf/in 미만일 경우 점착제층과 다이의 점착력이 낮아 라미네이션 후 리드프레임 이동 시 테이프가 떨어질 수 있다.In addition, the adhesive tape is characterized in that the adhesive force at room temperature more than 50gf / inch. If the adhesive force is less than 50gf / in, the adhesive force between the pressure-sensitive adhesive layer and the die may be low, and the tape may drop during the movement of the lead frame after lamination.
또한 점착테이프는 상온에서 연필경도가 2B 이하인 것을 특징으로 한다. 상온에서 연필경도가 B 이상일 경우 리드프레임과 점착테이프 라미네이션 시, Imprint(눌림 자국)가 충분히 형성되지 않아 점착테이프가 쉽게 떨어지거나 움직일 수 있다.In addition, the adhesive tape is characterized in that the pencil hardness of 2B or less at room temperature. If the pencil hardness is above B at room temperature, when the lead frame and the adhesive tape lamination, the imprint (press marks) may not be sufficiently formed, so the adhesive tape may easily fall or move.
또한 점착테이프는 180℃에서 전단응력(Shear strength)이 20gf/10mm 이상인 것을 포함한다. 180℃에서 전단응력(Shear strength)이 20gf/10mm 미만일 경우 수지봉지공정에서 EMC 주입 압력에 의해 리드프레임과 점착제 계면 사이로 EMC가 침투하여 몰드플래쉬가 발생할 가능성이 있다.In addition, the adhesive tape includes a shear stress (Shhear strength) at 180 ℃ 20gf / 10mm or more. When shear stress is less than 20 gf / 10mm at 180 ° C, there is a possibility that mold flash may occur due to EMC penetration between the lead frame and the adhesive interface due to EMC injection pressure in the resin encapsulation process.
이하, 실시예와 비교예를 통하여 본 발명의 구성 및 그에 따른 효과를 보다 상세히 설명하고자 한다. 그러나, 본 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것이며, 본 발명의 범위가 이들 실시예에 한정되는 것은 아니다.Hereinafter, the configuration and effects of the present invention will be described in more detail with reference to Examples and Comparative Examples. However, this embodiment is intended to illustrate the present invention in more detail, and the scope of the present invention is not limited to these examples.
<실시예 1><Example 1>
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 3중량부와 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 3 parts by weight of a thermosetting agent (Dow Corning, CE138) and 1.5 parts by weight (based on solids) of melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<실시예 2><Example 2>
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) ５　중량부와 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of a phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of an acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 5 parts by weight of the thermosetting agent (Dow Corning, CE138) and 1.5 parts by weight (based on solids) of the melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛) 필름의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) film with a thickness of about 6 μm, dried at 110 ° C. for 5 minutes (thermal curing), and then energy-saved at about 500 W using a UV irradiation device. After proceeding with the UV (UV) curing, a 38㎛ PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<실시예 3><Example 3>
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 3중량부와 멜라민계 열경화제(삼원, SM-20) 3중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 3 parts by weight of a thermosetting agent (Dow Corning, CE138) and 3 parts by weight (based on solids) of melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛) 필름의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) film with a thickness of about 6 μm, dried at 110 ° C. for 5 minutes (thermal curing), and then energy-saved at about 500 W using a UV irradiation device. After proceeding with the UV (UV) curing, a 38㎛ PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<실시예 ４><Example 4>
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 3중량부와 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 3 parts by weight of a thermosetting agent (Dow Corning, CE138) and 1.5 parts by weight (based on solids) of melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 130℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 50℃에서 ２４시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 130 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After the (UV) hardening, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated, and aged at 24 ° C. for 24 hours to prepare an adhesive tape.
<실시예 ５><Example 5>
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 3중량부, 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준) 및 유기산계　열경화　촉진제（삼원，Ａ－２０） 0.1중량부를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 3 hours by weight of thermosetting agent (Dow Corning, CE138), 1.5 parts by weight of melamine type thermosetting agent (Samwon, SM-20) (based on solids) and 0.1 parts by weight of organic acid-based thermosetting accelerator (Samwon, A-20) Further stirring.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<비교예 1>Comparative Example 1
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 0.05중량부와 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 0.05 parts by weight of a thermosetting agent (Dow Corning, CE138) and 1.5 parts by weight (based on solids) of melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 160℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 160 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<비교예 2> Comparative Example 2
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) ４０중량부와 멜라민계 열경화제(삼원, SM-20) 1.5 중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다. 70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 40 parts by weight of a thermosetting agent (Dow Corning, CE138) and 1.5 parts by weight (based on solids) of the melamine-based thermosetting agent (Samwon, SM-20) were added and stirred for an additional 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
<비교예 3> Comparative Example 3
아크릴계 공중합체(삼원, AT5100) 100 중량부(고형분 기준)에 대하여 에틸아세테이트(EA) 70 중량부를 투입하고 1시간 교반하였다. 이 후 에너지선 경화형 올리고머 수지인 페닐노볼락아크릴레이트(SK Cytec, EB9656: Mw 500~5000) 3 중량부, 아실 포스파인계 광개시제(CYTEC, DAROCUR TPO) 0.03 중량부를 혼합하여 1시간 교반하고, 이소시아네이트 열경화제(다우코닝, CE138) 3　중량부, 멜라민계 열경화제(삼원, SM-20) 45중량부(고형분 기준)를 투입하여 1시간 추가 교반하였다.70 parts by weight of ethyl acetate (EA) was added to 100 parts by weight (based on solids) of the acrylic copolymer (Samwon, AT5100), followed by stirring for 1 hour. Thereafter, 3 parts by weight of phenyl novolac acrylate (SK Cytec, EB9656: Mw 500 to 5000), which is an energy ray-curable oligomer resin, and 0.03 part by weight of acyl phosphine-based photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour, and isocyanate 3 parts by weight of a thermosetting agent (Dow Corning, CE138) and 45 parts by weight (based on solids) of the melamine-based thermosetting agent (Samwon, SM-20) were added, followed by further stirring for 1 hour.
상기 점착제 조성물을 폴리이미드 필름(SKC 코오롱, LN100 25㎛)의 일면에 약 6㎛ 두께로 도포하여 110℃에서 5분간 건조한 후(열 경화), UV 조사 장치를 이용하여 약 500W의 광량으로 에너지선(UV) 경화를 진행한 후 38㎛의 PET 필름(도레이첨단소재 주식회사, XP3BR)을 합지한 후 45℃에서 48시간 숙성하여 점착테이프를 제조하였다.The pressure-sensitive adhesive composition was applied to one surface of a polyimide film (SKC Kolon, LN100 25 μm) with a thickness of about 6 μm and dried at 110 ° C. for 5 minutes (thermal curing), using an UV irradiation device with an energy beam of about 500 W. After UV curing, a 38 μm PET film (Toray Advanced Materials Co., Ltd., XP3BR) was laminated and aged at 45 ° C. for 48 hours to prepare an adhesive tape.
상기 실시예 1 내지 5 및 비교예 1 내지 4에 따른 점착테이프를 사용하여 다음과 같은 실험예를 통해 물성을 측정하고 그 결과를 다음 표 3에 나타내었다.Physical properties of the adhesive tapes according to Examples 1 to 5 and Comparative Examples 1 to 4 were measured through the following experimental examples, and the results are shown in Table 3 below.
[실험예]Experimental Example
1. 상온 점착력1. Room temperature adhesion
점착테이프를 길이방향으로 폭 1 inch, 길이 15cm로 자른 후, Cu-foil 위에 2kg 롤러를 이용하여 상온 왕복 2회 라미네이션을 실시하였다. 이 후, 만능재료시험기(UTM)를 이용하여 300mm/min 속도로 180°점착력을 측정하였다.The adhesive tape was cut into a length of 1 inch and a length of 15 cm in the longitudinal direction, and then subjected to lamination at room temperature reciprocating twice using a 2 kg roller on Cu-foil. Thereafter, the 180 ° adhesive force was measured at 300 mm / min using a universal testing machine (UTM).
2. 연필경도2. Pencil Hardness
점착테이프를 점착면이 위로 오게 고정시킨 후, 연필 끝부분이 직각이 되도록 연마한 후, 45°각도로 지지대에 고정한다. 1kg 하중을 걸어 100mm/min의 속도로 5회 그은 후, 하기 표 1과 같은 기준으로 판정하였다.After fixing the adhesive tape with the adhesive face up, polish the pencil tip at right angles and fix it to the support at an angle of 45 °. After applying a 1 kg load and drawing 5 times at a speed of 100 mm / min, it was determined based on the criteria as shown in Table 1 below.
표 1
판정구분 표기 판정 방법
이상 + 연필 긋기 5회 중 긁힘 발생 없음
기준 연필 긋기 5회 중 1~2회 긁힘 발생
이하 - 연필 긋기 5회 중 3회 이상 긁힘 발생
Table 1
Judgment Mark Judgment method
More than + No scratches during 5 pencil strokes
standard Scratches occur 1-2 times out of 5 times
Below - Scratch more than 3 times out of 5 times
3. Shear Strength (전단응력)3. Shear Strength
점착테이프를 길이방향으로 폭 10mm, 길이 15cm로 자른 후, 도 3과 같이 Cu-foil면과 10mm가 겹치도록 2kg 롤러를 이용하여 상온 왕복 2회 라미네이션을 실시하였다. 이 후, 만능재료시험기(UTM)를 이용하여 180℃에서 100mm/min 속도로 전단응력을 실시하였다.After the adhesive tape was cut into a width of 10 mm and a length of 15 cm in the longitudinal direction, lamination was performed twice at room temperature using a 2 kg roller to overlap the Cu-foil surface with 10 mm as shown in FIG. 3. Thereafter, shear stress was performed at a rate of 100 mm / min at 180 ° C. using a universal testing machine (UTM).
4.Imprint 평가4.Imprint evaluation
리드프레임(Cu)에 점착테이프를 2kg 롤러를 이용하여 상온 왕복 2회 라미네이션을 실시하였다. 이후 점착테이프를 박리하여 점착면의 Imprint 강도를 현미경으로 관찰하여 하기 표 2의 기준으로 평가하였다.Adhesive tape on the lead frame (Cu) Lamination was performed twice at room temperature using a 2 kg roller. Thereafter, the adhesive tape was peeled off, and the imprint intensity of the adhesive surface was observed under a microscope, and evaluated according to the criteria of Table 2 below.
표 2
판정구분 판정 방법
강 Imprint(눌림자국)이 매우 선명
중 Imprint(눌림자국)이 나타남
약 Imprint(눌림자국)이 거의 나타나지 않음
TABLE 2
Judgment Judgment method
River Imprint is very clear
medium Imprint appears
about Imprint rarely appears
5. 몰드플래쉬 평가5. Mold Flash Evaluation
리드프레임(Cu)에 점착테이프를 2kg 롤러를 이용하여 상온 왕복 2회 라미네이션을 실시하였다. 이후 다이 어태치 공정 모사(Oven, ramp-up 180℃ x 2hr), 와이어본딩 모사(Hotplate, 220℃ x 30min)를 실시한 후 180℃ x 3min EMC Molding을 실시하였다. 이후 점착테이프를 박리하고 난 후, 리드프레임 다이(Die) 표면에 EMC 침투여부를 현미경을 통해 관찰하였다.Adhesive tape on the lead frame (Cu) Lamination was performed twice at room temperature using a 2 kg roller. After the die attach process simulation (Oven, ramp-up 180 ℃ x 2hr), wire bonding simulation (Hotplate, 220 ℃ x 30min) was performed, followed by 180 ℃ x 3min EMC Molding. Then, after peeling off the adhesive tape, the penetration of the lead frame die (Die) was observed through the microscope whether the EMC.
표 3
상온점착력[gf/inch] 연필경도 Imprint강도 전단응력@180℃[gf/10mm] 몰드플래쉬 발생여부
실시예 1 80 2B 강 50 없음
실시예 2 65 2B 강 45 없음
실시예 3 70 2B 강 40 없음
실시예 4 75 2B 강 36 없음
실시예 5 55 2B 강 34 없음
비교예 1 미경화
비교예 2 10 B 약 35 발생
비교예 3 35 B 중 5 발생
TABLE 3
Room temperature adhesion force [gf / inch] Pencil hardness Imprint strength Shear stress @ 180 ℃ [gf / 10mm] Mold flash occurrence
Example 1 80 2B River 50 none
Example 2 65 2B River 45 none
Example 3 70 2B River 40 none
Example 4 75 2B River 36 none
Example 5 55 2B River 34 none
Comparative Example 1 Uncured
Comparative Example 2 10 B about 35 Occur
Comparative Example 3 35 B medium 5 Occur
상기 표 1에서 확인할 수 있는 바와 같이, 본 발명의 실시예 1 내지 실시예 5에 따른 점착제 조성물과 이를 포함하는 전자부품 제조용 점착테이프는 모든 주요 요구 특성들에 대해서 만족한 결과를 가짐을 확인할 수 있다. 그러나 비교예 1의 경우, 이소시아네이트 경화제의 함량이 너무 작아 경화되지 않았다. 비교예 2의 경우 이소시아네이트 경화제를 과량 투입한 결과, 상온 점착력이 현저히 낮아져 리드프레임에 라미네이션이 제대로 이루지지 않았으며 연필경도도 한 단계 높아 다량 몰드플래쉬가 발생하였다. 또한 비교예 3의 경우 멜라민계 열경화제를 다량 사용한 결과, 고온 전단응력이 현저히 낮아져 다량 몰드플래쉬가 발생하였다.As can be seen in Table 1, it can be seen that the pressure-sensitive adhesive composition according to Examples 1 to 5 of the present invention and the pressure-sensitive adhesive tape for manufacturing an electronic component including the same have satisfactory results for all main required properties. . However, in the case of Comparative Example 1, the content of the isocyanate curing agent is too small to cure. In the case of Comparative Example 2, as an excessive amount of isocyanate curing agent, the room temperature adhesive strength was significantly lowered, lamination was not properly achieved in the lead frame, and pencil hardness was also increased by one step to generate a large amount of mold flash. In addition, in the case of Comparative Example 3 using a large amount of the melamine-based thermosetting agent, the high temperature shear stress was significantly lowered, a large amount of mold flash occurred.
본 명세서에서는 본 발명자들이 수행한 다양한 실시예 가운데 몇 개의 예만을 들어 설명하는 것이나 본 발명의 기술적 사상은 이에 한정하거나 제한되지 않고, 당업자에 의해 변형되어 다양하게 실시될 수 있음은 물론이다. In the present specification, only a few examples of various embodiments performed by the present inventors are described, but the technical idea of the present invention is not limited thereto, but may be variously modified and implemented by those skilled in the art.

Claims (9)

  1. 적어도 2가지의 열경화제를 포함하는 것을 특징으로 하는, 점착제 조성물. At least two thermosetting agents, characterized in that the pressure-sensitive adhesive composition.
  2. 제1항에 있어서,The method of claim 1,
    상기 열경화제는 이소시아네이트계 열경화제 및 멜라민계 열경화제를 포함하는 것을 특징으로 하는, 점착제 조성물. The thermosetting agent is an adhesive composition, characterized in that it comprises an isocyanate-based thermosetting agent and melamine-based thermosetting agent.
  3. 제1항에 있어서,The method of claim 1,
    아크릴계 공중합체, 에너지선 경화형 아크릴계 올리고머 및 에너지선 개시제를 더 포함하는 것을 특징으로 하는, 점착제 조성물. An adhesive composition, characterized in that it further comprises an acrylic copolymer, an energy ray-curable acrylic oligomer, and an energy ray initiator.
  4. 제3항에 있어서,The method of claim 3,
    상기 아크릴계 공중합체 100 중량부에 대하여 상기 이소시아네이트계 열경화제 0.1 ~ 20 중량부, 상기 멜라민계 열경화제 0.1 ~ 30 중량부, 상기 에너지선 경화형 아크릴계 올리고머 0.1 ~ 30 중량부를 포함하고, 상기 에너지선 경화형 아크릴계 올리고머 100중량 대비 상기 에너지선 개시제 0.05 내지 15 중량부를 포함하는 것을 특징으로 하는, 점착제 조성물.0.1 to 20 parts by weight of the isocyanate-based thermosetting agent, 0.1 to 30 parts by weight of the melamine-based thermosetting agent, and 0.1 to 30 parts by weight of the energy ray-curable acrylic oligomer, and the energy ray-curable acrylic based on 100 parts by weight of the acrylic copolymer. The pressure-sensitive adhesive composition, characterized in that it comprises 0.05 to 15 parts by weight of the energy ray initiator relative to 100 weight of the oligomer.
  5. 기재필름과,Base film,
    상기 기재필름의 적어도 일면에 제1항 내지 제4항 중 어느 한 항에 따른 점착제 조성물로 도포된 점착제층을 포함하는 것을 특징으로 하는, 전자부품 제조용 점착테이프.Adhesive tape for manufacturing an electronic component, characterized in that it comprises an adhesive layer coated with the adhesive composition according to any one of claims 1 to 4 on at least one surface of the base film.
  6. 제5항에 있어서,The method of claim 5,
    상기 점착제층의 두께는 1㎛ ~ 100㎛인 것을 특징으로 하는, 전자부품 제조용 점착테이프. The adhesive tape for producing electronic components, characterized in that the thickness of the pressure-sensitive adhesive layer is 1㎛ ~ 100㎛.
  7. 제5항에 있어서,The method of claim 5,
    상기 점착테이프는 180℃에서 전단응력(Shear Strength)이 20gf/10mm 이상인 것을 특징으로 하는, 전자부품 제조용 점착테이프. The adhesive tape is an adhesive tape for electronic component manufacturing, characterized in that the shear stress (Shhear Strength) at 180 ℃ 20gf / 10mm or more.
  8. 제5항에 있어서,The method of claim 5,
    상기 점착테이프의 상온 점착력은 50gf/inch 이상인 것을 것을 특징으로 하는, 전자부품 제조용 점착테이프.The adhesive tape at room temperature of the adhesive tape is 50gf / inch or more, the adhesive tape for electronic component manufacturing.
  9. 제5항에 있어서,The method of claim 5,
    상기 점착테이프의 연필경도는 2B 이하인 것을 특징으로 하는, 전자부품 제조용 점착테이프.Pencil hardness of the adhesive tape is 2B or less, characterized in that the adhesive tape for electronic component manufacturing.
PCT/KR2014/001247 2014-02-06 2014-02-17 Adhesive composition and adhesive tape comprising same for manufacturing electronic part WO2015119320A1 (en)

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US11827021B2 (en) 2019-02-06 2023-11-28 Hewlett-Packard Development Company, L.P. Applying mold chase structure to end portion of fluid ejection die

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