CN114156393B - Mini-LED and manufacturing method thereof - Google Patents
Mini-LED and manufacturing method thereof Download PDFInfo
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- CN114156393B CN114156393B CN202111425596.6A CN202111425596A CN114156393B CN 114156393 B CN114156393 B CN 114156393B CN 202111425596 A CN202111425596 A CN 202111425596A CN 114156393 B CN114156393 B CN 114156393B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000002390 adhesive tape Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000005192 partition Methods 0.000 claims abstract description 36
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 50
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000002787 reinforcement Effects 0.000 description 9
- 238000007789 sealing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
The application relates to a mini-LED, which relates to the field of display technology and comprises a bottom plate, wherein a plurality of reflecting adhesive tapes are fixedly arranged on the bottom plate, the surface of the bottom plate is divided into a plurality of reinforcing unit partitions by the plurality of reflecting adhesive tapes, a substrate and a light-emitting chip are arranged in each reinforcing unit partition, the light-emitting chip is fixedly arranged on the surface of the substrate, one side of the substrate, which is far away from the light-emitting chip, is fixedly connected on the bottom plate, and the light-emitting chip is used for irradiating light rays on the reflecting adhesive tapes. The application also relates to a manufacturing method of the mini-LED. The application has the effect of improving the light-emitting brightness of the mini-LED.
Description
Technical Field
The application relates to the field of display technology, in particular to a mini-LED and a manufacturing method thereof.
Background
The mini-LED is a mini light-emitting diode with the chip size below 80 microns. mini-LEDs are often used in the market for LCD display backlight sources, are ultra-thin, small-sized chip products, have a light emitting effect comparable to OLED products, and have a competitive advantage over OLED in terms of material cost.
The common mini-LED comprises a bottom plate, a substrate and a light emitting chip, wherein the bottom plate is in a flat plate shape, the substrate is fixedly arranged on one side of the bottom plate, the light emitting chip is positioned on one side of the substrate away from the bottom plate and fixedly connected with the substrate, one side of the substrate away from the bottom plate is coated with a layer of uniform sealing glue, the light emitting chip is embedded in the surface of the sealing glue, and the light of the light emitting chip is parallel to the surface of the sealing glue. When the LED lamp is used, the base plate supplies power to the light-emitting chip on the substrate, and the light-emitting chip emits light to enable the mini-LED to emit light.
With respect to the related art, the inventor considers that the sealing glue on the substrate is coated into a flat surface, so that the sealing glue is not beneficial to light reflection, and the light-emitting brightness of the mini-LED is reduced.
Disclosure of Invention
In order to improve the light-emitting brightness of a mini-LED, the application provides a mini-LED and a manufacturing method thereof.
In a first aspect, the application provides a mini-LED, which adopts the following technical scheme:
the utility model provides a mini-LED, includes the bottom plate, fixedly provided with a plurality of reflection adhesive tape on the bottom plate, a plurality of reflection adhesive tape divide into a plurality of reinforcement unit subregion with the bottom plate surface, is provided with base plate and luminescent chip in the reinforcement unit subregion, and luminescent chip is fixed to be set up on the base plate surface, and one side fixed connection that luminescent chip was kept away from to the base plate is on the bottom plate, and luminescent chip is used for shining light on reflection adhesive tape.
By adopting the technical scheme, the bottom plate is divided into a plurality of reinforcement unit partitions by the reflective adhesive tape, the substrate and the light-emitting chip are arranged in the reinforcement unit partitions, the light-emitting chip in the reinforcement unit partition emits light parallel to the surface of the substrate, the light propagates along the surface of the substrate and irradiates on the reflective adhesive tape, the reflective adhesive tape reflects the light, so that the light is continuously reflected in the reinforcement unit partitions surrounded by the reflective adhesive tape, and the light is reflected for multiple times, so that the brightness of the light in the reinforcement unit partitions is improved, and the light utilization rate is increased; the substrates in the reinforced unit subareas are connected into a whole through the plurality of reflecting adhesive tapes, the plurality of reflecting adhesive tapes form an interactive network, and the intersecting reflecting adhesive tapes can be mutually pulled, so that the substrates are not easy to warp, and the flatness of the reinforced unit subareas is improved; the flatness of the substrate and the reflection adhesive tape are improved, so that the light rays of the light-emitting chip can be reflected, the light-emitting effect in each reinforced unit area is more uniform, and the light-emitting effect of the whole mini-LED is uniform.
Optionally, glue grooves corresponding to the reflective adhesive tapes one by one are formed in the bottom plate, and the reflective adhesive tapes are located in the glue grooves and extend out of the glue grooves.
By adopting the technical scheme, the reflective adhesive tape is fixedly arranged in the adhesive groove formed in the bottom plate, so that the contact area between the reflective adhesive tape and the bottom plate is increased, and the connection strength of the reflective adhesive tape and the bottom plate is improved; simultaneously, the reflection adhesive tape and the adhesive tape groove are in a clamping state, so that the reflection adhesive tape is not easy to bend along the extending direction of the reflection adhesive tape, the reflection adhesive tape is in a more stable state, the reflection of the reflection adhesive tape to light is more stable, and the stability of the luminous effect in the reinforced unit partition is improved.
Optionally, the base plate is kept away from the coating of one side of bottom plate and is had the reflector layer, and the base plate is close to the fixed aluminum plate that is provided with of one side of bottom plate, aluminum plate and bottom plate fixed connection.
By adopting the technical scheme, the light reflecting layer is coated on one side of the substrate far away from the bottom plate, so that the light reflected by the reflecting adhesive tape is secondarily reflected on the light reflecting layer, the intensity of the light is further improved, the luminous brightness in the reinforced unit area is further improved, and the light distribution is more uniform due to the sufficient reflection of the light, and the luminous uniformity of the mini-LED is further improved; the substrate and the bottom plate are connected by adopting the aluminum plate, so that the conductivity of the substrate and the bottom plate is improved, and the light-emitting chip on the substrate has a stable current source.
Optionally, the reflective adhesive tape and the reflective layer are both formed by curing white adhesive.
By adopting the technical scheme, the white glue has the advantages of good reflection performance, high bonding strength, quick solidification and good toughness and durability, the reflective adhesive tape and the reflective layer are manufactured by adopting the white glue, the manufacturing difficulty of the reflective adhesive tape and the reflective layer is reduced on the premise that the reflective adhesive tape and the reflective layer have the reflective performance, and the overall strength of the mini-LED is improved, so that the mini-LED is more durable.
Optionally, the light emitting chips are provided with a plurality of light emitting chips, and the plurality of light emitting chips are arranged in a staggered manner.
Through adopting above-mentioned technical scheme, a plurality of light emitting chip is the dislocation and arranges for the light of light emitting chip emission is difficult for being blocked by adjacent light emitting chip, makes the light that light emitting chip sent can fully shine on the reflection adhesive tape, has further improved the utilization ratio of light, has improved the light luminance in the reinforcement unit subregion, and then has strengthened mini-LED's luminance.
Optionally, the distance between the centers of the two adjacent light emitting chips is P, the shortest distance between the centers of the light emitting chips and the central line of the reflective adhesive tape is L, and the distance between the reflective adhesive tape and the substrate is X, wherein X is less than P-2L.
By adopting the technical scheme, the optimal design value is calculated based on the light efficiency, the distance X of the reflecting adhesive tape higher than the substrate is smaller than the distance P of the centers of two adjacent light emitting chips by subtracting the shortest distance L between the centers of the two light emitting chips and the center line of the reflecting adhesive tape, and when X meets X < P-2L, the light efficiency of the mini-LED is in an optimal state.
Optionally, the bottom plate is made of electrolytic lead-pressing zinc-plating materials or aluminum materials.
Through adopting above-mentioned technical scheme, the bottom plate material adopts electrolysis plumbous galvanized material or aluminum product, has improved the conductivity and the heat dissipation of bottom plate, and then has improved the conductive property of bottom plate for the luminescence chip has stable current source, makes mini-LED be difficult for making luminescence chip's electric current unstable because of generating heat, thereby influences luminous effect.
Optionally, the depth of the glue groove is 0.2mm-0.3mm.
Through adopting above-mentioned technical scheme, with the degree of depth size limit of gluey groove in 0.2mm-0.3mm, under the prerequisite that satisfies reflection adhesive tape and bottom plate joint strength, reduced the thickness of bottom plate for the bottom plate can realize the slim, and then reduced mini-LED's whole thickness, make mini-LED realize thinning design.
Optionally, the part of the reflecting adhesive tape exceeding the reflecting layer is provided with a convex hull with a circular arc cross section, and the highest point of the convex hull is higher than the highest point of the light emitting chip.
By adopting the technical scheme, the part of the reflecting adhesive tape exceeding the reflecting layer is arranged into the arc shape, so that the reflecting adhesive tape is easy to reflect light out of the reinforced unit partition, the light emitting effect of the mini-LED is more high, and meanwhile, the reflection of the light in the reinforced unit partition is not easy to be influenced, so that the light can be uniformly and consistently irradiated out of the reinforced unit partition, and the light emitting effect of the mini-LED is more uniform and consistent; because the convex hull is higher than the light emitting chip, the convex hull surrounding the light emitting chip can protect the light emitting chip from being extruded easily, so that the light emitting chip is in a safe state, and the service life of the mini-LED is prolonged.
In a second aspect, the application provides a method for manufacturing a mini-LED, which adopts the following technical scheme:
a manufacturing method of a mini-LED comprises the following steps:
manufacturing a bottom plate: preparing a bottom plate;
and (3) line manufacturing: manufacturing a circuit and a bonding pad on a bottom plate;
placing a jig: placing a dispensing jig on the bottom plate, and enabling the dispensing jig to avoid a bonding pad on the bottom plate;
curing the reflective adhesive tape: filling white glue in a glue dispensing jig, and solidifying the white glue to form a plurality of reflecting adhesive tapes, wherein the plurality of reflecting adhesive tapes divide the bottom plate into a plurality of reinforcing unit areas;
and (3) mounting a light emitting chip: the light-emitting chip is fixedly connected to the surface of the substrate, the light-emitting chip and the substrate are placed in the reinforced unit partition, one side, far away from the light-emitting chip, of the substrate is fixedly connected with the bottom plate, and light rays of the light-emitting chip can irradiate on the reflecting adhesive tape.
Through adopting above-mentioned technical scheme, solidify the white glue and form a plurality of reflection adhesive tape in the point gum smelting tool, a plurality of reflection adhesive tape divide into a plurality of enhancement unit subregion with the base plate, again with the fixed connection of light emitting chip on the surface of base plate, then place the base plate of fixed connection light emitting chip in the enhancement unit subregion, and make the base plate keep away from one side and the bottom plate fixed connection of light emitting chip, make the light of light emitting chip can shine on the reflection adhesive tape simultaneously, thereby accomplish the manufacturing of mini-LED, through the reflection of reflection adhesive tape to light, make the luminance of mini-LED highlight more, luminous effect is more even unanimous, mutual traction through the reflection adhesive tape, make the difficult emergence warpage phenomenon of base plate.
In summary, the present application includes at least one of the following beneficial technical effects:
the light of the light-emitting chip can be reflected by the reflective adhesive tapes through arranging the plurality of reflective adhesive tapes on the bottom plate, so that the brightness of light emitted by the mini-LED and the utilization rate of light efficiency are improved;
under the mutual traction of the reflective adhesive tapes, the substrate is not easy to warp, the flatness of the substrate is ensured, and the light-emitting brightness of the mini-LED is not easy to be influenced due to the warp of the substrate;
white glue is uniformly coated on one side of the substrate far away from the bottom plate to form a reflecting layer, and the reflecting layer further improves the light reflecting capability of the light emitting chip, so that the light emitting brightness of the mini-LED is higher.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present application;
FIG. 2 is a cross-sectional view intended to illustrate the internal assembly relationship;
fig. 3 is an enlarged view at a in fig. 1.
Reference numerals illustrate: 1. a bottom plate; 11. a glue groove; 2. strengthening unit partition; 21. a substrate; 211. an aluminum plate; 212. a light reflecting layer; 22. a light emitting chip; 3. a reflective adhesive tape; 31. and (5) convex hull.
Detailed Description
The application is described in further detail below with reference to fig. 1-3.
The embodiment of the application discloses a mini-LED.
Referring to fig. 1, a mini-LED includes a base plate 1, a plurality of reflective adhesive tapes 3 are fixedly disposed on the base plate 1, the base plate 1 is divided into a plurality of reinforced unit partitions 2 by the plurality of reflective adhesive tapes 3, a light emitting chip 22 is disposed in the reinforced unit partitions 2, and the light emitting chip 22 is used for irradiating light onto the reflective adhesive tapes 3. When the light emitting device is used, the light emitting chip 22 emits light and irradiates the light onto the reflecting adhesive tape 3, the reflecting adhesive tape 3 reflects the light, the intensity of the light in the reinforced unit area 2 and the utilization rate of the light effect are improved, and the light emitting brightness of the mini-LED is further improved.
Referring to fig. 1 and 2, the base plate 1 has a rectangular plate shape, and the base plate 1 is made of electrolytic lead-plated zinc material or aluminum material. Glue groove 11 has been seted up to bottom plate 1 one side, and glue groove 11 all is provided with a plurality of along the length direction and the width direction of bottom plate 1, and the distance of two adjacent glue grooves 11 equals, and a plurality of glue groove 11 along bottom plate 1 length direction all communicates with a plurality of glue groove 11 along bottom plate 1 width direction, and glue groove 11 is the rectangle, and the degree of depth is 0.2mm-0.3mm.
Referring to fig. 2, the reflective adhesive tape 3 is located in the adhesive groove 11 and extends out of the notch of the adhesive groove 11, the reflective adhesive tape 3 corresponds to the adhesive groove 11 one by one, the reflective adhesive tape 3 is rectangular, one end of the reflective adhesive tape 3 located outside the adhesive groove 11 is provided with a convex hull 31, the convex hull 31 is integrally connected with the reflective adhesive tape 3 and is arc-shaped, and the reflective adhesive tape 3 and the convex hull 31 are formed by curing white adhesive.
When the reflective adhesive tape 3 is used, white adhesive is coated in the adhesive groove 11 and is solidified by the white adhesive, one end of the reflective adhesive tape 3 is positioned in the adhesive groove 11, the contact area between the reflective adhesive tape 3 and the adhesive groove 11 is increased, the connection strength between the reflective adhesive tape 3 and the bottom plate 1 is improved, and meanwhile, the adhesive groove 11 enables the reflective adhesive tape 3 to be difficult to bend in the use process, so that the reflective adhesive tape 3 is in a stable state in the use process.
Referring to fig. 1 and 2, a reinforcing unit partition 2 surrounded by a reflective adhesive tape 3 is a rectangular space, a substrate 21 is further disposed in the reinforcing unit partition 2, the substrate 21 is rectangular plate-shaped and is adapted to the reinforcing unit partition 2, and one side of the substrate 21 is fixedly connected with a light emitting chip 22. The light emitting chips 22 are arranged on the substrate 21 in a plurality, and are staggered along the length direction and the width direction of the bottom plate 1, and the arrangement modes of the light emitting chips 22 in the plurality of reinforcing unit partitions 2 are consistent. The highest point of the convex hull 31 is higher than the highest point of the light emitting chip 22.
Referring to fig. 2, an aluminum plate 211 is fixedly disposed on a side of the substrate 21 away from the light emitting chip 22, the aluminum plate 211 has a rectangular plate shape, and a side of the aluminum plate 211 away from the substrate 21 is fixedly connected with the bottom plate 1.
When the LED lamp is used, current is transmitted from the bottom plate 1 to the aluminum plate 211 and then transmitted from the aluminum plate 211 to the substrate 21, so that the light emitting chip 22 on the substrate 21 emits light parallel to the plane of the substrate 21, the light emitting chip 22 is arranged in a staggered mode, the light of the light emitting chip 22 directly irradiates on the convex hull 31 of the reflecting adhesive tape 3, the convex hull 31 reflects the light, the light is reflected for multiple times in the reinforcing unit partition 2 enclosed by the reflecting adhesive tape 3, the light in the reinforcing unit partition 2 is further reinforced, the light utilization rate is improved, and the light is more uniform in the reinforcing unit partition 2 due to reflection of the light, so that the light emitting brightness and the light emitting uniformity of the mini-LED are improved.
Referring to fig. 2 and 3, the distance between the centers of two adjacent light emitting chips 22 is P, the shortest distance between the centers of the light emitting chips 22 and the center line of the convex hull 31 is L, the distance between the convex hull 31 and the substrate 21 is X, and X satisfies X < P-2L.
When the LED light source is used, according to the optimal calculated design value of the light efficiency, the distance X of the convex hull 31 higher than the substrate 21 is smaller than the shortest distance L between the center of the adjacent two light emitting chips 22 and the center line of the convex hull 31, and when X is less than P-2L, the light efficiency in each reinforcement unit partition 2 is in an optimal state, so that the mini-LEDs are in a high-brightness state.
Referring to fig. 2, a reflective layer 212 is uniformly coated on a side of the substrate 21 far from the bottom plate 1, the reflective layer 212 is formed by curing white glue, the reflective layer 212 is fixedly connected with the reflective adhesive tape 3, and a side of the reflective layer 212 far from the bottom plate 1 is flush with the bottom end of the convex hull 31.
When the light-reflecting layer 212 coated on the substrate 21 can further reflect the light rays in the reinforced unit partition 2, so that the light efficiency utilization rate in the reinforced unit partition 2 is further improved, the light rays in the reinforced unit partition 2 are more high, the overall light-emitting brightness of the mini-LED is further enhanced, and the overall light-emitting effect of the mini-LED is more uniform; meanwhile, the reflective layer 212 is fixedly connected with the reflective adhesive tape 3, so that the reflective layer 212 is easy to keep flatness under the mutual traction of the mutually-intersected reflective adhesive tapes 3, the reflective adhesive tapes 3 improve the flatness of the substrate 21, and the substrate 21 is not easy to warp so as to influence the reflection of the light-emitting chip 22.
The implementation principle of the mini-LED of the embodiment of the application is as follows: after the light-emitting chip 22 is electrified, the light-emitting chip 22 which is arranged in a staggered manner emits light, the light irradiates the convex hulls 31 of the reflecting adhesive tapes 3, the convex hulls 31 surrounding the light-emitting chip 22 reflect the light for multiple times, meanwhile, the light-reflecting layer 212 further reflects the light, the convex hulls 31 and the light-reflecting layer 212 act together, so that the light of the light-emitting chip 22 is enhanced in the reinforcing unit partition 2, the brightness of the reinforcing unit partition 2 is higher, the emitted light is more uniform, and meanwhile, the light is reflected and utilized, so that the utilization rate of the light is improved, and the illumination brightness, the light efficiency utilization rate and the uniformity of light emission of the mini-LED are improved; meanwhile, the reflective adhesive tapes 3 which are arranged in a crossing way enable the substrate 21 to be difficult to warp, the flatness of the substrate 21 is improved, and the substrate 21 of the mini-LED is difficult to influence the light-emitting effect of the mini-LED due to the flatness in the use process of the mini-LED.
The embodiment also discloses a manufacturing method of the mini-LED.
A manufacturing method of a mini-LED comprises the following steps:
manufacturing a bottom plate 1: preparing a plate made of electrolytic lead-pressing zinc-plated materials or aluminum materials, and arranging a plurality of glue grooves 11 with the length direction or the width direction of 0.2mm-0.3mm on the plate to finish the manufacture of the bottom plate 1;
and (3) line manufacturing: manufacturing lines and bonding pads on the bottom plate 1;
placing a jig: placing a dispensing jig at the notch of the glue groove 11 of the bottom plate 1, and enabling the dispensing jig to avoid a bonding pad on the bottom plate 1;
curing the reflective adhesive tape 3: filling white glue in the glue groove 11 and the dispensing jig, solidifying the white glue to form a reflecting adhesive tape 3, forming a convex hull 31 in a circular arc shape at one end of the reflecting adhesive tape 3 far away from the glue groove 11, and dividing the bottom plate 1 into a plurality of reinforcing unit partitions 2 by a plurality of reflecting adhesive tapes 3;
mounting the light emitting chip 22: a plurality of light-emitting chips 22 are welded on the surface of a base plate 21 in a staggered manner, an aluminum plate 211 is adhered to one side of the base plate 21 far away from the light-emitting chips 22, then the base plate 21 is placed in a reinforced unit partition 2 and fixedly connected with the base plate 1 through the aluminum plate 211, and meanwhile, the highest point of the light-emitting chips 22 is lower than the highest point of the convex hull 31;
curing the retroreflective layer 212: the side of the substrate 21 far from the bottom plate 1 is uniformly coated with white glue, the white glue is solidified to form a reflecting layer 212, and the reflecting layer 212 is fixedly connected with the reflecting adhesive tape 3.
In the manufacturing process, firstly, an electrolytic lead-pressing zinc-plated material or aluminum material is manufactured into a thin plate shape, the thin plate is used as a bottom plate 1 of a mini-LED, a glue groove 11 along the length direction and the width direction of the bottom plate 1 is formed on the bottom plate 1, the glue groove 11 along the length direction of the bottom plate 1 is communicated with the glue groove 11 along the width direction of the bottom plate 1, and then a circuit of a light-emitting chip 22 and a bonding pad connected with the light-emitting chip 22 are manufactured on the bottom plate 1; placing a dispensing jig on the notch of the glue groove 11 of the bottom plate 1, filling white glue in the glue groove 11 and the dispensing jig, solidifying the white glue to form a reflective adhesive tape 3, and dividing the bottom plate 1 into a plurality of reinforced unit partitions 2 by a plurality of reflective adhesive tapes 3; then, a plurality of light-emitting chips 22 are welded on one side of the substrate 21, and the light-emitting chips 22 are arranged in a staggered manner along the length direction and the width direction of the bottom plate 1, so that the phenomenon that the adjacent light-emitting chips 22 mutually block light is difficult to occur; fixedly connecting an aluminum plate 211 on one side of the substrate 21 far away from the light-emitting chip 22, placing the substrate 21 in the reinforced unit partition 2, and then adhering the aluminum plate 211 on the bottom plate 1 to realize the fixed connection between the substrate 21 and the bottom plate 1; then evenly coat one deck white glue in the side that the base plate 21 kept away from bottom plate 1 and form reflector layer 212, reflector layer 212 and reflection adhesive tape 3 fixed connection to make reflection adhesive tape 3 and base plate 21 form a whole through reflector layer 212, make the mini-LED who makes the completion have more bright light efficiency, more efficient light efficiency utilization ratio and more stable roughness.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (8)
1. The mini-LED is characterized by comprising a base plate (1), wherein a plurality of reflecting adhesive tapes (3) are fixedly arranged on the base plate (1), the surfaces of the base plate (1) are divided into a plurality of reinforcing unit partitions (2) by the plurality of reflecting adhesive tapes (3), a base plate (21) and a light-emitting chip (22) are arranged in each reinforcing unit partition (2), the light-emitting chip (22) is fixedly arranged on the surface of the base plate (21), one side, far away from the light-emitting chip (22), of the base plate (21) is fixedly connected onto the base plate (1), and the light-emitting chip (22) is used for irradiating light rays on the reflecting adhesive tapes (3);
the light emitting chips (22) are arranged in a plurality, and the light emitting chips (22) are arranged in a staggered mode;
the distance between the centers of two adjacent light emitting chips (22) is P, the shortest distance between the centers of the light emitting chips (22) and the central line of the reflecting adhesive tape (3) is L, and the distance between the reflecting adhesive tape (3) and the substrate (21) is X, wherein X is less than P-2L.
2. The mini-LED according to claim 1, wherein the bottom plate (1) is provided with glue grooves (11) corresponding to the reflective glue strips (3) one by one, the reflective glue strips (3) are located in the glue grooves (11) and extend out of the glue grooves (11).
3. The mini-LED according to claim 1, wherein a reflecting layer (212) is coated on one side of the substrate (21) far away from the bottom plate (1), an aluminum plate (211) is fixedly arranged on one side of the substrate (21) near the bottom plate (1), and the aluminum plate (211) is fixedly connected with the bottom plate (1).
4. A mini-LED according to claim 3, wherein the reflective tape (3) and the reflective layer (212) are cured from white glue.
5. A mini-LED according to claim 1, characterized in that the base plate (1) is made of electrolytic lead-plated zinc material or aluminum material.
6. A mini-LED according to claim 2, characterized in that the glue groove (11) has a depth of 0.2mm-0.3mm.
7. A mini-LED according to claim 3, wherein the part of the reflective adhesive tape (3) beyond the reflective layer (212) is a convex hull (31) with a circular arc cross section, and the highest point height of the convex hull (31) is higher than the highest point height of the light emitting chip (22).
8. The method of manufacturing a mini-LED according to any one of claims 1 to 7, comprising the steps of:
manufacturing a bottom plate (1): preparing a bottom plate (1);
and (3) line manufacturing: manufacturing lines and bonding pads on a bottom plate (1);
placing a jig: placing a dispensing jig on the bottom plate (1), and enabling the dispensing jig to avoid a bonding pad on the bottom plate (1);
curing the reflective adhesive tape (3): filling white glue in a glue dispensing jig, and solidifying the white glue to form a plurality of reflecting adhesive tapes (3), wherein the plurality of reflecting adhesive tapes (3) divide the bottom plate (1) into a plurality of reinforcing unit partitions (2);
mounting a light emitting chip (22): the light-emitting chip (22) is fixedly connected to the surface of the substrate (21), the light-emitting chip (22) and the substrate (21) are placed in the reinforced unit partition (2), one side, far away from the light-emitting chip (22), of the substrate (21) is fixedly connected with the bottom plate (1), and light rays of the light-emitting chip (22) can irradiate on the reflecting adhesive tape (3).
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| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| CN108019625A (en) * | 2018-01-12 | 2018-05-11 | 安徽芯瑞达科技股份有限公司 | A kind of down straight aphototropism mode set matrix light source |
| CN109830590A (en) * | 2019-02-03 | 2019-05-31 | 泉州三安半导体科技有限公司 | Light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| CN108019625A (en) * | 2018-01-12 | 2018-05-11 | 安徽芯瑞达科技股份有限公司 | A kind of down straight aphototropism mode set matrix light source |
| CN109830590A (en) * | 2019-02-03 | 2019-05-31 | 泉州三安半导体科技有限公司 | Light emitting device |
| WO2020155530A1 (en) * | 2019-02-03 | 2020-08-06 | 泉州三安半导体科技有限公司 | Light-emitting device |
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