CN114156363B - 一种硫化锑光电晶体管及其制备方法 - Google Patents
一种硫化锑光电晶体管及其制备方法 Download PDFInfo
- Publication number
- CN114156363B CN114156363B CN202111140053.XA CN202111140053A CN114156363B CN 114156363 B CN114156363 B CN 114156363B CN 202111140053 A CN202111140053 A CN 202111140053A CN 114156363 B CN114156363 B CN 114156363B
- Authority
- CN
- China
- Prior art keywords
- layer
- electrode
- metal electrode
- type
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910010413 TiO 2 Inorganic materials 0.000 claims abstract description 26
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000031700 light absorption Effects 0.000 claims abstract description 8
- 230000001105 regulatory effect Effects 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 238000002207 thermal evaporation Methods 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000000137 annealing Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000001276 controlling effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 41
- 239000010408 film Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- 239000010409 thin film Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0623—Sulfides, selenides or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1258—Spray pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/109—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN heterojunction type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
本发明涉及一种硫化锑光电晶体管及其制备方法,所述光电晶体管自下而上依次包括衬底、吸光PN结和表面金属电极,所述衬底包括重掺杂Si栅极和设于其上的SiO2层,所述吸光PN结包括N型TiO2层和设于其上的P型Sb2S3吸光层,所述表面金属电极为源、漏金属电极。该光电晶体管有利于利用栅极电压调控光、电信号,而且结构简单,制造成本低。
Description
技术领域
本发明属于光电晶体管领域,具体涉及一种硫化锑光电晶体管及其制备方法。
背景技术
硫化锑(Sb2S3)是一种具有单一稳定相的二元半导体化合物,可以避免其它二次相的形成,是三维薄膜光电探测器的常用材料。特别是,Sb2S3具有1.7 eV~1.8 eV的禁带,在可见光范围内吸收系数高达105cm−1,具有丰富和环保的组分元素,以及优良的空气稳定性,因此在太阳能电池及光电探测器中获得了广泛的关注。光电晶体管由于其简单的制备方法,开关速度快等优点,已经成为薄膜光电探测器的重点关注对象。目前的光电晶体管多数是以一层光吸收层作为导电沟道,栅压直接作用在沟道上,分离载流子,而在另一种重要的薄膜光电二极管中,其内建电场也具有分离载流子的作用,两者都能提升探测器的性能。目前缺乏一种基于硫化锑薄膜的光电晶体管能综合栅压分离载流子和内建电场分离载流子两种作用的器件。利用栅极电压调控PN结,可以增强载流子分离能力,提升光电流,增强光响应能力,还可以实现自身的开关。栅压调控电信号与栅压调控PN结的结合可以显著改善器件的光探测能力和电开关能力,拓宽硫化锑薄膜探测器的应用范围,并且有望用于高灵敏度、快速响应的器件上。
发明内容
本发明的目的在于提供一种硫化锑光电晶体管及其制备方法,该光电晶体管有利于利用栅极电压调控光、电信号,而且结构简单,制造成本低。
为实现上述目的,本发明采用的技术方案是:一种硫化锑光电晶体管,所述光电晶体管自下而上依次包括衬底、吸光PN结和表面金属电极,所述衬底包括重掺杂Si栅极和设于其上的SiO2层,所述吸光PN结包括N型TiO2层和设于其上的P型Sb2S3吸光层,所述表面金属电极为源、漏金属电极。
进一步地,所述光电晶体管为三端无源器件,三端分别为源极、漏极和栅极,器件的光电响应电流通过栅极电压调控。
进一步地,上表面的源极、漏极施加的工作电压为-5 V ~ 5 V,下表面的栅极施加的工作电压为-20 V ~ 20 V。
进一步地,所述衬底为重掺P型Si/SiO2片,其中,Si栅极为重掺杂的P型Si,SiO2层为绝缘介质层,SiO2层的厚度为50 nm ~ 100 nm。
进一步地,所述N型TiO2层为PN结区中的N型层,厚度为60 nm ~ 120 nm。
进一步地,所述P型Sb2S3吸光层为Sb2S3薄膜,厚度为200 nm ~ 500 nm。
进一步地,所述源、漏金属电极之间的宽度为50 μm ~ 200 μm,源、漏金属电极的长度为200 μm ~ 2000 μm,源、漏金属电极的厚度为50 nm ~ 150 nm。
进一步地,所述源、漏金属电极的材质为铝、银或金。
本发明还提供了所述硫化锑光电晶体管的制备方法,包括以下步骤:
(1)制备衬底:获取Si/SiO2片,并将其切成设定边长的正方形,分别使用去离子水、丙酮、无水乙醇进行超声清洗,用氮气吹干;
(2)喷涂法制备N型TiO2层:将原料C16H28O6Ti与无水乙醇按照体积比为1:9混合并搅拌均匀作为前驱体溶液;采用喷涂法在玻璃衬底上制备TiO2薄膜,在450 ºC下喷涂6 ~12次,然后500 ºC退火30分钟,冷却后获得TiO2薄膜,厚度为60 nm ~ 120 nm;
(3)真空法制备P型Sb2S3吸光层:采用快速热蒸发法在所述TiO2层上沉积硫化锑薄膜,厚度为200 nm ~ 500 nm;蒸发温度为500 ℃ ~ 600 ℃,时间为20 s ~ 40 s;结晶温度为300 ℃ ~ 350 ℃;
(4)制备源、漏金属电极:采用热蒸发法在所述硫化锑薄膜上制备源、漏金属电极,厚度为50 nm ~ 150 nm,蒸发时的真空度为10-4Pa,其电极采用条状掩膜板,电极间距50 μm~ 200 μm。
与现有技术相比,本发明具有以下有益效果:
(1)本发明的主体材料Sb2S3和TiO2不仅元素储量丰富,无需任何提纯工艺,而且具有高的稳定性,在空气中长时间不变质。
(2)本发明的每一层材料都可以大规模制备,有潜力应用于阵列化光电成像,而且可以与现代硅工艺匹配,可融入集成电路之中,具有商业价值。
(3)本发明结构新颖,将栅极调控作用与PN结调控作用合二为一。
(4)本发明能够利用栅极电压调控PN结耗尽层宽度,提升晶体管对光信号的响应;
(5)本发明能够利用栅极电压调控电信号,实现自身的开关。
附图说明
图1是本发明实施例的硫化锑光电晶体管的结构示意图;
图2是本发明实施例3中光电晶体管的界面SEM形貌;
图3是本发明实施例3中硫化锑光电晶体管在不同栅压下的电流-时间输出曲线;
图4是本发明实施例3中硫化锑光电晶体管的电开关曲线。
图中:1-重掺杂P型Si栅极、2-SiO2绝缘层、3-TiO2层、4-Sb2S3吸光层、5-源漏金属电极。
具体实施方式
下面结合附图及实施例对本发明做进一步说明。
应该指出,以下详细说明都是示例性的,旨在对本申请提供进一步的说明。除非另有指明,本文使用的所有技术和科学术语具有与本申请所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本申请的示例性实施方式。如在这里所使用的,除非上下文另外明确指出,否则单数形式也意图包括复数形式,此外,还应当理解的是,当在本说明书中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
如图1所示,本实施例提供了一种硫化锑光电晶体管,所述光电晶体管自下而上依次包括衬底、吸光PN结和表面金属电极,衬底包括重掺杂Si栅极1和设于其上的SiO2层2,吸光PN结包括N型TiO2层3和设于其上的P型Sb2S3吸光层4,表面金属电极为源、漏金属电极5。
其中,光电晶体管为三端无源器件,三端分别为源极、漏极和栅极,器件的光电响应电流通过栅极电压调控。上表面的源极、漏极施加的工作电压为-5 V ~ 5 V,下表面的栅极施加的工作电压为-20 V ~ 20 V。
衬底为重掺P型Si/SiO2片,其中,Si栅极为重掺杂的P型Si,SiO2层为绝缘介质层,SiO2层的厚度为50 nm ~ 100 nm。
N型TiO2层为PN结区中的N型层,厚度为60 nm ~ 120 nm。P型Sb2S3吸光层为Sb2S3薄膜,厚度为200 nm ~ 500 nm。
源极、漏极都为金属电极,其材质为Al、Ag、Au等。源、漏金属电极之间的宽度为50μm ~ 200 μm,源、漏金属电极的长度为200 μm ~ 2000 μm,源、漏金属电极的厚度为50 nm~ 150 nm。
下面以多个实施例作进一步详述。
实施例1
硫化锑光电晶体管结构为:硅(重掺P型)/氧化硅(50 nm)/氧化钛(60 nm)/硫化锑(500 nm)/金。
硫化锑光电晶体管的栅极1为导电的P型掺杂Si片。绝缘层2为不导电的氧化硅,其厚度为50 nm。氧化钛3,其厚度为60 nm。晶体管的吸光层4为硫化锑薄膜,厚度为500 nm。源漏金属电极5为金电极。其制备方法:
(1)玻璃衬底清洗:将Si/SiO2片切成边长为2 cm的正方形,分别使用去离子水、丙酮、无水乙醇超声清洗,用氮气吹干。
(2)TiO2层制备:将原料C16H28O6Ti与无水乙醇按照体积比为1:9混合并搅拌均匀作为前驱体溶液。采用喷涂法在玻璃衬底上制备TiO2薄膜,在 450 ºC下喷涂6次,然后500 ℃退火30分钟,冷却后获得TiO2薄膜,厚度为60 nm。
(3)硫化锑层制备:采用快速热蒸发法在上述TiO2层上沉积500 nm硫化锑薄膜。蒸发温度为500 ℃,时间为40 s;结晶温度为300℃。
(4)金属电极的制备:在上述硫化锑薄膜上采用热蒸发法制备铝、银、金等,厚度为120 nm,蒸发时的真空度为10-4Pa,其电极采用条状掩膜板,电极间距200 μm。
实施例2
硫化锑光电晶体管结构为:硅(重掺P型)/氧化硅(100 nm)/氧化钛(60 nm)/硫化锑(500 nm)/金。
硫化锑光电晶体管的栅极1为导电的P型掺杂Si片。绝缘层2为不导电的氧化硅,其厚度为100 nm。氧化钛3,其厚度为60 nm。晶体管的吸光层4为硫化锑薄膜,厚度为500 nm。源漏金属电极5为金电极。其制备方法:
(1)玻璃衬底清洗:与上述实施例1相同。
(2)TiO2层制备:与上述实施例1相同。
(3)硫化锑层制备:与上述实施例1相同。
(4)金属电极的制备:与上述实施例1相同。
实施例3
硫化锑光电晶体管结构为:硅(重掺P型)/氧化硅(100 nm)/氧化钛(60 nm)/硫化锑(300 nm)/金。
硫化锑光电晶体管的栅极1为导电的P型掺杂Si片。绝缘层2为不导电的氧化硅,其厚度为100 nm。氧化钛3,其厚度为120 nm。晶体管的吸光层4为硫化锑薄膜,厚度为500 nm。源漏金属电极5为金电极。其制备方法:
(1)玻璃衬底清洗:与上述实施例1相同。
(2)TiO2层制备:与上述实施例1相同。
(3)硫化锑层制备:采用快速热蒸发法在上述功能层上沉积300 nm硫化锑薄膜。蒸发温度为500 ℃,时间为25 s;结晶温度为300 ℃。
(4)金属电极的制备:与上述实施例1相同。
制备得到的硫化锑光电晶体管的截面扫描电镜图如图2所示,硫化锑薄膜在整个截面上是均匀分布的,而且覆盖致密,从截面可看出氧化硅、氧化钛、硫化锑分层明显,无相互扩散的现象。图3是硫化锑光电晶体管输出的电流-时间的变化关系图。其中源漏电压为1V,光波长为530 nm,光功率为3.3 mW/cm2。从图中可以看出,光电流明显出现了随光照周期变化的趋势,且其响应随周期稳定变化,重复性良好,在同类器件中处于较高水平。图4是硫化锑光电晶体管转移曲线。其中源漏电压为1V。从图中可以看出,光电晶体管在负栅压下,使得PN结正偏,耗尽区变窄,硫化锑内的空穴浓度变大,电流变大,处于开启状态;正栅压下,PN结反偏,耗尽区变宽,硫化锑内的空穴浓度变小,电流变小,处于关闭状态。开关比约为10倍,且表现出P沟道晶体管的特性。随着栅极电压的不同,输出电流表现出稳定的趋势:负栅压使输出电流变大,正栅压使输出电流变小。说明此硫化锑光电晶体管实现了栅极对光、电信号的调制作用。
以上所述,仅是本发明的较佳实施例而已,并非是对本发明作其它形式的限制,任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更或改型为等同变化的等效实施例。但是凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与改型,仍属于本发明技术方案的保护范围。
Claims (3)
1.一种硫化锑光电晶体管,其特征在于,所述光电晶体管自下而上依次包括衬底、吸光PN结和表面金属电极,所述衬底包括重掺杂Si栅极和设于其上的SiO2层,所述吸光PN结包括N型TiO2层和设于其上的P型Sb2S3吸光层,所述表面金属电极为源、漏金属电极;
所述光电晶体管为三端无源器件,三端分别为源极、漏极和栅极,器件的光电响应电流通过栅极电压调控;
上表面的源极、漏极施加的工作电压为-5V~5V,下表面的栅极施加的工作电压为-20V~20V;
所述衬底为重掺P型Si/SiO2片,其中,Si栅极为重掺杂的P型Si,SiO2层为绝缘介质层,SiO2层的厚度为50nm~100nm;
所述N型TiO2层为PN结区中的N型层,厚度为60nm~120nm;
所述P型Sb2S3吸光层为Sb2S3薄膜,厚度为200nm~500nm;
所述源、漏金属电极之间的宽度为50μm~200μm,源、漏金属电极的长度为200μm~2000μm,源、漏金属电极的厚度为50nm~150nm。
2.根据权利要求1所述的一种硫化锑光电晶体管,其特征在于,所述源、漏金属电极的材质为铝、银或金。
3.一种如权利要求1-2任一项所述硫化锑光电晶体管的制备方法,其特征在于,包括以下步骤:
(1)制备衬底:获取Si/SiO2片,并将其切成设定边长的正方形,分别使用去离子水、丙酮、无水乙醇进行超声清洗,用氮气吹干;
(2)喷涂法制备N型TiO2层:将原料C16H28O6Ti与无水乙醇按照体积比为1:9混合并搅拌均匀作为前驱体溶液;采用喷涂法在玻璃衬底上制备TiO2薄膜,在450℃下喷涂6~12次,然后500℃退火30分钟,冷却后获得TiO2薄膜,厚度为60nm~120nm;
(3)真空法制备P型Sb2S3吸光层:采用快速热蒸发法在所述TiO2层上沉积硫化锑薄膜,厚度为200nm~500nm;蒸发温度为500℃~600℃,时间为20s~40s;结晶温度为300℃~350℃;
(4)制备源、漏金属电极:采用热蒸发法在所述硫化锑薄膜上制备源、漏金属电极,厚度为50nm~150nm,蒸发时的真空度为10-4Pa,其电极采用条状掩膜板,电极间距50μm~200μm。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111140053.XA CN114156363B (zh) | 2021-09-28 | 2021-09-28 | 一种硫化锑光电晶体管及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111140053.XA CN114156363B (zh) | 2021-09-28 | 2021-09-28 | 一种硫化锑光电晶体管及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114156363A CN114156363A (zh) | 2022-03-08 |
CN114156363B true CN114156363B (zh) | 2024-04-30 |
Family
ID=80462686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111140053.XA Active CN114156363B (zh) | 2021-09-28 | 2021-09-28 | 一种硫化锑光电晶体管及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114156363B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299118A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN107068797A (zh) * | 2017-04-11 | 2017-08-18 | 重庆文理学院 | 薄膜太阳能电池及其制备方法 |
CN107819044A (zh) * | 2017-10-24 | 2018-03-20 | 三峡大学 | 一种硫化锑基光电探测器的制备方法 |
CN111893512A (zh) * | 2020-08-10 | 2020-11-06 | 浙江大学 | 一种硫化锑基异质结光阴极及其制备方法和用途 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103943661A (zh) * | 2014-04-15 | 2014-07-23 | 京东方科技集团股份有限公司 | 一种显示装置及其制作方法 |
-
2021
- 2021-09-28 CN CN202111140053.XA patent/CN114156363B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299118A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN107068797A (zh) * | 2017-04-11 | 2017-08-18 | 重庆文理学院 | 薄膜太阳能电池及其制备方法 |
CN107819044A (zh) * | 2017-10-24 | 2018-03-20 | 三峡大学 | 一种硫化锑基光电探测器的制备方法 |
CN111893512A (zh) * | 2020-08-10 | 2020-11-06 | 浙江大学 | 一种硫化锑基异质结光阴极及其制备方法和用途 |
Non-Patent Citations (1)
Title |
---|
"Influence of external electric fields on photoluminescence and charge carrier dynamics of π-conjugated polymer P3HT in the multilayer films with heterojunctions to TiO2 and Sb2S3";Toshifumi Iimori et al.;《Applied Energy materials》;第1卷;第6136-第6151页 * |
Also Published As
Publication number | Publication date |
---|---|
CN114156363A (zh) | 2022-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108281554B (zh) | 一种量子点结构光电探测器及其制备方法 | |
KR101052030B1 (ko) | 전자기 방사 컨버터 | |
US20090217967A1 (en) | Porous silicon quantum dot photodetector | |
KR20120034965A (ko) | 태양 전지 | |
CN111952384B (zh) | 光电探测器及其制备方法 | |
US20110214736A1 (en) | Photodiode, image sensor and solar cell | |
CN111628020B (zh) | 一种基于TMDCs横向PIN同质结的光电二极管及制备方法 | |
US4024558A (en) | Photovoltaic heterojunction device employing a glassy amorphous material as an active layer | |
CN114156363B (zh) | 一种硫化锑光电晶体管及其制备方法 | |
CN108493206B (zh) | 一种提高量子效率的cmos图像传感器 | |
CN113178497B (zh) | 一种基于量子点的紫外探测器及制作方法 | |
CN115332376A (zh) | 红外光电探测器及制备方法 | |
JP3606886B2 (ja) | 太陽電池及びその製造方法 | |
CN110896115B (zh) | 光电晶体管、红外探测器和光电晶体管的制作方法 | |
CN114899266B (zh) | 基于二硫化钼/锗异质结的pin型光电探测器及其制备方法 | |
IL46896A (en) | Semiconductive device | |
CN210325858U (zh) | 基于Au修饰MoS2电极的钙钛矿/石墨烯杂化光电探测器 | |
CN217361602U (zh) | 一种基于新型三元材料的异质结光电探测器 | |
KR101976673B1 (ko) | 실리콘 태양전지 | |
CN218277720U (zh) | 一种基于钙钛矿纳米线径向结的光电探测器 | |
CN111509076B (zh) | 一种具有低暗电流的自驱动型光电探测器及其制备方法 | |
JPS6249754B2 (zh) | ||
KR101846337B1 (ko) | 태양전지 및 이의 제조방법 | |
KR20110039777A (ko) | 태양전지 및 이의 제조방법 | |
JPH07231108A (ja) | 太陽電池 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |