CN114153279A - Computer case with modular structure and server - Google Patents
Computer case with modular structure and server Download PDFInfo
- Publication number
- CN114153279A CN114153279A CN202111343741.6A CN202111343741A CN114153279A CN 114153279 A CN114153279 A CN 114153279A CN 202111343741 A CN202111343741 A CN 202111343741A CN 114153279 A CN114153279 A CN 114153279A
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- upper cover
- heat dissipation
- base
- heat
- cover
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 88
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 15
- 239000000498 cooling water Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000011161 development Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 6
- 238000012827 research and development Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention provides a computer case and a server with a modular structure, wherein the case comprises: the computer comprises a base, wherein each equipment board card of a computer is fixed in the base; the inner upper cover covers the top of the base so that the base and the inner upper cover form a closed space; the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover; and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece. By using the scheme of the invention, the standardized development of products can be facilitated, the development period and the cost of the products can be reduced, and the efficiency is improved.
Description
Technical Field
The present invention relates to the field of computers, and more particularly to a computer chassis and server having a modular structure.
Background
With the gradual maturity of technologies such as artificial intelligence, 5G, Internet of things and the like, the computing power demand continuously extends to the edge from the data center, and edge computing develops rapidly, becoming a core ring of cloud frontier system. The edge computing server equipment is different from the traditional general server, has more various configurations and higher customization characteristics, and has the defects of different part types and different heat dissipation power of the whole machine, so that the structural difference of the equipment chassis is very large. At present, aiming at the requirements of edge computing server equipment, one-to-one case customized design is mostly adopted, which brings the problems of large product research and development investment and long research and development period, and is not convenient for the product to carry out standardized development.
Disclosure of Invention
In view of this, an embodiment of the present invention provides a computer case and a server with a modular structure, which can facilitate standardized development of products, reduce development cycle and cost of the products, and improve efficiency.
In view of the above object, an aspect of the embodiments of the present invention provides a computer case having a modular structure, including:
the computer comprises a base, wherein each equipment board card of a computer is fixed in the base;
the inner upper cover covers the top of the base so that the base and the inner upper cover form a closed space;
the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover;
and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece.
According to one embodiment of the invention, the bottom of the inner upper cover is provided with a plurality of heat conduction bosses, and each heat conduction boss is in board contact with each device in the base when the inner upper cover covers the base.
According to one embodiment of the invention, the heat dissipation upper cover is configured as a natural heat dissipation upper cover which comprises uniformly distributed heat dissipation fins and fastener mounting holes.
According to one embodiment of the invention, the heat dissipation upper cover is configured as an air-cooling heat dissipation upper cover, the air-cooling heat dissipation upper cover comprises heat dissipation fins, a plurality of fans and fastener mounting holes, the fans are uniformly distributed on the air-cooling heat dissipation upper cover, and the heat dissipation fins are uniformly arranged in the areas, where the fans are not arranged, of the air-cooling heat dissipation upper cover.
According to one embodiment of the invention, the heat dissipation upper cover is configured as a water-cooling heat dissipation upper cover which is configured as a sealed box body structure, the box body structure comprises a water inlet hole, a water outlet hole and a fastener mounting hole, and the water inlet hole and the water outlet hole are connected to a water pump and a cooling water source which are arranged outside.
In another aspect of the embodiments of the present invention, there is also provided a server including a computer chassis having a modular structure, the chassis including:
the computer comprises a base, wherein each equipment board card of a computer is fixed in the base;
the inner upper cover covers the top of the base so that the base and the inner upper cover form a closed space;
the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover;
and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece.
According to one embodiment of the invention, the bottom of the inner upper cover is provided with a plurality of heat conduction bosses, and each heat conduction boss is in board contact with each device in the base when the inner upper cover covers the base.
According to one embodiment of the invention, the heat dissipation upper cover is configured as a natural heat dissipation upper cover which comprises uniformly distributed heat dissipation fins and fastener mounting holes.
According to one embodiment of the invention, the heat dissipation upper cover is configured as an air-cooling heat dissipation upper cover, the air-cooling heat dissipation upper cover comprises heat dissipation fins, a plurality of fans and fastener mounting holes, the fans are uniformly distributed on the air-cooling heat dissipation upper cover, and the heat dissipation fins are uniformly arranged in the areas, where the fans are not arranged, of the air-cooling heat dissipation upper cover.
According to one embodiment of the invention, the heat dissipation upper cover is configured as a water-cooling heat dissipation upper cover which is configured as a sealed box body structure, the box body structure comprises a water inlet hole, a water outlet hole and a fastener mounting hole, and the water inlet hole and the water outlet hole are connected to a water pump and a cooling water source which are arranged outside.
The invention has the following beneficial technical effects: according to the computer case with the modular structure provided by the embodiment of the invention, through arranging the base, each equipment board card of the computer is fixed in the base; the inner upper cover covers the top of the base so that the base and the inner upper cover form a closed space; the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover; the heat dissipation upper cover is arranged on the upper portion of the heat conduction plate, and the technical scheme that the heat dissipation upper cover is fixed with the inner upper cover through the fastening piece can facilitate the standardized development of products, reduce the research and development period and the cost of the products and improve the efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is an exploded view of a computer chassis having a modular architecture in accordance with one embodiment of the present invention;
FIG. 2 is a schematic view of a heat dissipating upper cover according to an embodiment of the present invention;
FIG. 3 is a schematic view of a heat dissipating upper cover according to an embodiment of the present invention;
FIG. 4 is a schematic view of a heat dissipating upper cover according to one embodiment of the present invention;
fig. 5 is a schematic view of an inner cover according to an embodiment of the present invention.
Detailed Description
Embodiments of the present disclosure are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various and alternative forms. The figures are not necessarily to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. As one of ordinary skill in the art will appreciate, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desirable for certain specific applications or implementations.
In view of the above objects, a first aspect of embodiments of the present invention provides an embodiment of a computer chassis having a modular structure. Fig. 1 shows a schematic view of the enclosure.
As shown in fig. 1, the chassis may include:
each equipment board card of a computer is fixed in the base 1. The base 1 can adopt a chassis form in the prior art, and various equipment board cards required to be used by a computer are arranged in the chassis.
And an inner upper cover 2, wherein the inner upper cover 2 covers the top of the base 1 to form a closed space between the base 1 and the inner upper cover 2. The inner upper cover 2 is usually made of a material with good thermal conductivity, a plurality of heat conduction bosses 13 (refer to fig. 5) can be arranged on one surface of the inner upper cover 2, when the inner upper cover 2 covers the base 1, the heat conduction bosses 13 are positioned inside the base 1 and are in contact with various components needing heat dissipation, and therefore the heat conduction bosses 13 can be movably connected with the inner upper cover 2, namely, the positions of the heat conduction bosses 13 can be adjusted according to the positions of the heat dissipation components in the base 1, and the number of the heat conduction bosses 13 can also be adjusted according to the number of the heat dissipation components in the base 1. The heat conduction boss 13 is made of a material with good heat conduction performance, and the heat conduction boss 13 needs to be tightly attached to the inner upper cover 2 so that heat of the heat conduction boss 13 can be well transferred to the inner upper cover 2. In some embodiments, the heat conducting boss 13 is integral with the inner cover 2, i.e. the heat conducting boss 13 is made when the inner cover 2 is machined. In some embodiments, a waterproof rubber ring is further disposed between the inner upper cover 2 and the base 1, that is, when the inner upper cover 2 covers the base 1, the inner upper cover 2 and the base 1 are sealed by the waterproof rubber ring, so that the liquid flows into the case through the inner upper cover in the manner of a liquid.
Still include heat-conducting plate 3, heat-conducting plate 3 sets up on inside upper cover 2 upper portion and closely laminates with inside upper cover 2. The heat conducting plate 3 is made of a material with good heat conducting property, the heat conducting plate 3 arranged between the inner upper cover 2 and the heat dissipation upper cover 4 is used for filling a contact gap, and the heat conducted to the inner upper cover 2 is ensured to be quickly transferred to the heat dissipation upper cover 4, wherein the heat conducting plate can be replaced by any material with good heat conducting property. In some embodiments, the heat conducting plate 3 can be integrated with the inner upper cover 2, so that the heat in the chassis can be better transferred.
And a heat-dissipating upper cover 4, the heat-dissipating upper cover 4 being disposed on the upper portion of the heat-conducting plate 3 and fixed to the inner upper cover 2 via a fastening member 5. The fasteners 5 may be screws, bolts, or the like. In some embodiments, as shown in fig. 2, the heat dissipation upper cover 4 is configured as a natural heat dissipation upper cover, the natural heat dissipation upper cover includes uniformly distributed heat dissipation fins 8 and fastener mounting holes 6, and the heat dissipation fins 8 can be processed by CNC machining, aluminum profile extrusion or die casting, and the like. In some embodiments, as shown in fig. 3, the heat dissipation upper cover 4 is configured as an air-cooled heat dissipation upper cover, the air-cooled heat dissipation upper cover includes heat dissipation fins 9, a plurality of fans 7 and fastener mounting holes 6, the fans 7 are uniformly distributed on the air-cooled heat dissipation upper cover, the heat dissipation fins 9 are uniformly arranged in the areas of the air-cooled heat dissipation upper cover where the fans 7 are not arranged, and the heat dissipation fins 9 can be further grooved to facilitate air circulation. In some embodiments, as shown in fig. 4, the heat dissipating upper cover 4 is configured as a water cooling upper cover configured as a sealed case structure 10, the case structure 10 includes a water inlet hole 11, a water outlet hole 12 and a fastener mounting hole, and the water inlet hole 11 and the water outlet hole 12 are connected to an external water pump and a cooling water source. The heat dissipation upper cover 4 and the inner upper cover 2 are detachably connected, so that the heat dissipation upper cover 4 can be replaced according to different heating power consumptions of the computing equipment, under a common condition, the highest heat dissipation capability is the liquid cooling upper cover, the air cooling upper cover is the second time, and the natural heat dissipation case is mainly used for dealing with the heating equipment with lower power consumption. Except that the heat dissipation upper cover is replaceable, the rest parts in the chassis are shared.
By the technical scheme, the standardized development of products can be facilitated, the research and development period and the cost of the products can be reduced, and the efficiency is improved.
In a preferred embodiment of the present invention, as shown in fig. 5, a plurality of heat conducting bosses 13 are disposed on the bottom of the inner cover 2, and each heat conducting boss 13 is in board contact with each device in the base 1 when the inner cover 2 covers the base. The inner upper cover 2 is usually made of a material with good thermal conductivity, a plurality of heat conduction bosses 13 can be arranged on one surface of the inner upper cover 2, when the inner upper cover 2 covers the base 1, the heat conduction bosses 13 are positioned inside the base 1 and are in contact with various parts needing heat dissipation, and therefore the heat conduction bosses 13 can be movably connected with the inner upper cover 2, namely the positions of the heat conduction bosses 13 can be adjusted according to the positions of the heat dissipation parts in the base 1, and the number of the heat conduction bosses 13 can also be adjusted according to the number of the heat dissipation parts in the base 1. The heat conduction boss 13 is made of a material with good heat conduction performance, and the heat conduction boss 13 needs to be tightly attached to the inner upper cover 2 so that heat of the heat conduction boss 13 can be well transferred to the inner upper cover 2. In some embodiments, the heat conducting boss 13 is integral with the inner cover 2, i.e. the heat conducting boss 13 is made when the inner cover 2 is machined.
In a preferred embodiment of the present invention, the heat-dissipating upper cover is configured as a natural heat-dissipating upper cover including uniformly distributed heat-dissipating fins and fastener mounting holes.
In a preferred embodiment of the present invention, the heat dissipation upper cover is configured as an air-cooled heat dissipation upper cover, the air-cooled heat dissipation upper cover includes heat dissipation fins, a plurality of fans, and fastener mounting holes, the fans are uniformly distributed on the air-cooled heat dissipation upper cover, and the areas of the air-cooled heat dissipation upper cover where no fan is disposed are uniformly provided with the heat dissipation fins.
In a preferred embodiment of the present invention, the heat radiating upper cover is configured as a water-cooled heat radiating upper cover configured as a sealed case structure including a water inlet hole, a water outlet hole, and a fastener mounting hole, the water inlet hole and the water outlet hole being connected to an external water pump and a cooling water source.
According to the invention, through the structure and the heat dissipation design, the computer equipment case is designed to be the upper cover which is convenient to replace, so that the standardized development of products is facilitated, the research and development period and the cost of the products can be reduced, and the efficiency is improved. And the case can be designed to be waterproof, so that the problem of equipment scrapping caused by water inflow of the wooden board can be avoided.
In view of the above object, a second aspect of the embodiments of the present invention provides a server, including a computer chassis having a modular structure, the chassis including:
the computer comprises a base, wherein each equipment board card of a computer is fixed in the base;
the inner upper cover covers the top of the base so that the base and the inner upper cover form a closed space;
the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover;
and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece.
In a preferred embodiment of the present invention, a plurality of heat conducting bosses are disposed on the bottom of the inner cover, and each heat conducting boss is in board contact with each device in the base when the inner cover covers the base.
In a preferred embodiment of the present invention, the heat-dissipating upper cover is configured as a natural heat-dissipating upper cover including uniformly distributed heat-dissipating fins and fastener mounting holes.
In a preferred embodiment of the present invention, the heat dissipation upper cover is configured as an air-cooled heat dissipation upper cover, the air-cooled heat dissipation upper cover includes heat dissipation fins, a plurality of fans, and fastener mounting holes, the fans are uniformly distributed on the air-cooled heat dissipation upper cover, and the areas of the air-cooled heat dissipation upper cover where no fan is disposed are uniformly provided with the heat dissipation fins.
In a preferred embodiment of the present invention, the heat radiating upper cover is configured as a water-cooled heat radiating upper cover configured as a sealed case structure including a water inlet hole, a water outlet hole, and a fastener mounting hole, the water inlet hole and the water outlet hole being connected to an external water pump and a cooling water source.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The embodiments described above, particularly any "preferred" embodiments, are possible examples of implementations and are presented merely to clearly understand the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the technology described herein. All such modifications are intended to be included within the scope of this disclosure and protected by the following claims.
Claims (10)
1. A computer chassis having a modular structure, comprising:
the computer comprises a base, wherein each equipment board card of a computer is fixed in the base;
an inner upper cover covering the top of the base to form a closed space with the base;
the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover;
and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece.
2. The chassis of claim 1, wherein a plurality of heat conducting bosses are disposed on a bottom of the inner cover, each heat conducting boss being in board contact with a respective device in the base when the inner cover is covering the base.
3. The chassis of claim 1, wherein the heat dissipating upper cover is configured as a natural heat dissipating upper cover comprising evenly distributed heat dissipating fins and fastener mounting holes.
4. The chassis of claim 1, wherein the heat dissipation top cover is configured as an air-cooled heat dissipation top cover, the air-cooled heat dissipation top cover comprises heat dissipation fins, a plurality of fans, and fastener mounting holes, the fans are evenly distributed on the air-cooled heat dissipation top cover, and the areas of the air-cooled heat dissipation top cover where no fan is located are evenly provided with the heat dissipation fins.
5. The chassis of claim 1, wherein the heat dissipating upper cover is configured as a water cooling upper cover configured as a sealed box structure, the box structure including a water inlet hole, a water outlet hole, and fastener mounting holes, the water inlet hole and the water outlet hole being connected to a peripheral water pump and a cooling water source.
6. A server, comprising a computer chassis having a modular structure, the chassis comprising:
the computer comprises a base, wherein each equipment board card of a computer is fixed in the base;
an inner upper cover covering the top of the base to form a closed space with the base;
the heat conducting plate is arranged on the upper part of the inner upper cover and is tightly attached to the inner upper cover;
and the heat dissipation upper cover is arranged on the upper part of the heat conduction plate and is fixed with the inner upper cover through a fastening piece.
7. The server according to claim 6, wherein a plurality of heat conducting bosses are provided on a bottom of the inner cover, each heat conducting boss being in board contact with a respective device in the base when the inner cover is covered on the base.
8. The server according to claim 6, wherein the heat-dissipating upper cover is configured as a natural heat-dissipating upper cover that includes evenly distributed heat-dissipating fins and fastener mounting holes.
9. The server according to claim 6, wherein the heat dissipation upper cover is configured as an air-cooled heat dissipation upper cover, the air-cooled heat dissipation upper cover comprises heat dissipation fins, a plurality of fans and fastener mounting holes, the fans are evenly distributed on the air-cooled heat dissipation upper cover, and the areas of the air-cooled heat dissipation upper cover where the fans are not arranged are evenly provided with the heat dissipation fins.
10. The server according to claim 6, wherein the heat dissipating upper cover is configured as a water cooling upper cover configured as a sealed box structure including inlet holes, outlet holes and fastener mounting holes, the inlet holes and the outlet holes being connected to an external water pump and a cooling water source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111343741.6A CN114153279A (en) | 2021-11-13 | 2021-11-13 | Computer case with modular structure and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111343741.6A CN114153279A (en) | 2021-11-13 | 2021-11-13 | Computer case with modular structure and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114153279A true CN114153279A (en) | 2022-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111343741.6A Pending CN114153279A (en) | 2021-11-13 | 2021-11-13 | Computer case with modular structure and server |
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| Country | Link |
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| CN (1) | CN114153279A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6725682B2 (en) * | 2001-07-13 | 2004-04-27 | Coolit Systems Inc. | Computer cooling apparatus |
| US20050270741A1 (en) * | 2004-06-02 | 2005-12-08 | Wang Chin W | Large-area planar heat dissipation structure |
| CN112714600A (en) * | 2020-12-30 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Edge server and control cabinet |
| WO2021151130A1 (en) * | 2020-01-27 | 2021-08-05 | 4Motec Gmbh & Co Kg | Heat dissipation device |
| CN113608594A (en) * | 2021-06-30 | 2021-11-05 | 苏州浪潮智能科技有限公司 | Hardware equipment, temperature control method and device |
-
2021
- 2021-11-13 CN CN202111343741.6A patent/CN114153279A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6725682B2 (en) * | 2001-07-13 | 2004-04-27 | Coolit Systems Inc. | Computer cooling apparatus |
| US20050270741A1 (en) * | 2004-06-02 | 2005-12-08 | Wang Chin W | Large-area planar heat dissipation structure |
| WO2021151130A1 (en) * | 2020-01-27 | 2021-08-05 | 4Motec Gmbh & Co Kg | Heat dissipation device |
| CN112714600A (en) * | 2020-12-30 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Edge server and control cabinet |
| CN113608594A (en) * | 2021-06-30 | 2021-11-05 | 苏州浪潮智能科技有限公司 | Hardware equipment, temperature control method and device |
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Application publication date: 20220308 |