CN113608594A - Hardware equipment, temperature control method and device - Google Patents
Hardware equipment, temperature control method and device Download PDFInfo
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- CN113608594A CN113608594A CN202110741871.9A CN202110741871A CN113608594A CN 113608594 A CN113608594 A CN 113608594A CN 202110741871 A CN202110741871 A CN 202110741871A CN 113608594 A CN113608594 A CN 113608594A
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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Abstract
The application discloses hardware equipment, a temperature control method and a temperature control device, and particularly the hardware equipment comprises a heat dissipation upper cover, a TEC and a temperature control target device, wherein the heat dissipation upper cover is used for dissipating heat conducted by a first contact surface on the TEC in the running process of the hardware equipment; the TEC is used for absorbing heat to the temperature control target device by utilizing the second contact surface and conducting the heat to the heat dissipation upper cover through the first contact surface in the running process of the hardware equipment; and when the temperature control target device is started, the heat generated by the TEC is conducted to the temperature control target device through the second contact surface. Therefore, wide-range environmental temperature adaptability of the hardware equipment can be realized, and the deployment requirement of the hardware equipment in severe environment is met. And the TEC is utilized to realize the heating and radiating functions at the same time, so that the integration of the whole machine is convenient to realize, and a special heating device is not required to be additionally designed outside the hardware equipment.
Description
Technical Field
The present disclosure relates to the field of temperature control technologies, and in particular, to a hardware device, a temperature control method and an apparatus.
Background
In many practical scenarios, for a hardware device such as a server, temperature control is usually required during startup and operation of the hardware device. For example, with the large-scale deployment of 5G, applications of Artificial Intelligence (AI) and Internet of Things (IoT) are continuously on the ground, and while the world of everything is coming into the Internet, massive data is also accompanied by a need for data processing and transmission methods with large bandwidth, low delay and high security level, for this reason, edge computing is in force, and the edge computing server is the most important hardware device and carrier for edge computing, and is continuously on the ground in fields such as industrial Internet, smart traffic and automatic driving. Various complex edge computing scenes put higher requirements on heat dissipation and structural design of an edge server, such as human-computer coexistence requirements, ultra-wide loop temperature adaptability, extremely high power consumption density and the like.
For hardware equipment such as an edge computing server, stable operation in an environment temperature of minus 40 ℃ to minus 70 ℃ needs to be guaranteed when the hardware equipment is deployed outdoors. In practical application scenarios, consumer-grade devices in part of hardware equipment do not meet low-temperature starting, so that self-starting is guaranteed by heating through a self-heating device at low temperature, and meanwhile, good heat dissipation of the whole machine is guaranteed under a high-temperature condition, performance degradation is avoided, and service life is shortened.
Disclosure of Invention
The embodiment of the application provides a hardware device, a temperature control method and a temperature control device, so as to effectively control the temperature of the hardware device in the starting and/or running process.
In a first aspect, an embodiment of the present application provides a hardware device, where the hardware device includes a heat dissipation upper cover, a thermoelectric cooler TEC and a temperature control target device, where the TEC includes a first contact surface and a second contact surface opposite to each other, and the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
the heat dissipation upper cover is used for dissipating heat conducted by the first contact surface in the running process of the hardware equipment;
the TEC is used for absorbing heat of the temperature control target device by utilizing the second contact surface and conducting the heat to the heat dissipation upper cover through the first contact surface in the operation process of the hardware equipment; and when the temperature control target device is started, the heat generated by the TEC is conducted to the temperature control target device through the second contact surface.
In a possible embodiment, the TEC includes a first electrode and a second electrode, and when the first electrode is a positive electrode and the second electrode is a negative electrode, the TEC absorbs heat to the temperature control target device by using the second contact surface; and when the first electrode is a negative electrode and the second electrode is a positive electrode, heating the temperature control target device by using the second contact surface.
In a possible implementation manner, when the temperature of the environment in which the hardware device is located is lower than a first threshold, the first electrode is a negative electrode, and the second electrode is a positive electrode; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
In a possible embodiment, the heat dissipation upper cover dissipates heat conducted by the first contact surface through liquid cooling or air cooling.
In a possible embodiment, the second contact surface fills the contact gap when contacting the temperature control target device through a heat conducting material, the heat conducting material including any one or more of a heat conducting pad, a heat conducting silicone grease, a heat conducting gel, a heat conducting phase change material, and a heat conducting graphite sheet.
In one possible implementation, the hardware device includes an edge computing hardware device.
In a second aspect, an embodiment of the present application provides a temperature control method, including:
when the hardware equipment runs, absorbing heat to a temperature control target device in the hardware equipment by using a second contact surface on a thermoelectric cooler TEC (thermoelectric cooler) included in the hardware equipment, and conducting the heat to a heat dissipation upper cover in the hardware equipment through a first contact surface on the TEC, wherein the TEC comprises the first contact surface and the second contact surface which are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
when the temperature control target device is started, the second contact surface is utilized to conduct the heat generated by the TEC to the temperature control target device.
In one possible embodiment, the TEC comprises a first electrode and a second electrode;
then, said absorbing heat with the second contact surface on the TEC of the hardware device includes, including:
when the first electrode is a positive electrode and the second electrode is a negative electrode, the second contact surface is used for absorbing heat to the temperature control target device;
the conducting heat generated by the TEC to the temperature control target device by using the second contact surface comprises:
and when the first electrode is a negative electrode and the second electrode is a positive electrode, the second contact surface is utilized to conduct the heat generated by the TEC to the temperature control target device.
In a possible implementation manner, when the temperature of the environment in which the hardware device is located is lower than a first threshold, the first electrode is a negative electrode, and the second electrode is a positive electrode; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
In a possible embodiment, the heat dissipation upper cover dissipates heat conducted by the first contact surface through liquid cooling or air cooling.
In a possible embodiment, the second contact surface fills the contact gap when contacting the temperature control target device through a heat conducting material, the heat conducting material including any one or more of a heat conducting pad, a heat conducting silicone grease, a heat conducting gel, a heat conducting phase change material, and a heat conducting graphite sheet.
In one possible implementation, the hardware device includes an edge computing hardware device.
In a third aspect, an embodiment of the present application provides a temperature control apparatus, including:
the first control unit is used for absorbing heat of a temperature control target device in the hardware equipment by using a second contact surface on a thermoelectric cooler TEC included in the hardware equipment when the hardware equipment runs, and conducting the heat to a heat dissipation upper cover in the hardware equipment through a first contact surface on the TEC, wherein the TEC comprises the first contact surface and the second contact surface which are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
and the second control unit is used for conducting the heat generated by the TEC to the temperature control target device by utilizing the second contact surface when the temperature control target device is started.
In one possible embodiment, the TEC comprises a first electrode and a second electrode;
the first control unit is specifically configured to, when the first electrode is a positive electrode and the second electrode is a negative electrode, absorb heat to the temperature control target device by using the second contact surface;
the second control unit is specifically configured to, when the first electrode is a negative electrode and the second electrode is a positive electrode, conduct heat generated by the TEC to the temperature control target device by using the second contact surface.
In a possible implementation manner, when the temperature of the environment in which the hardware device is located is lower than a first threshold, the first electrode is a negative electrode, and the second electrode is a positive electrode; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
In a possible embodiment, the heat dissipation upper cover dissipates heat conducted by the first contact surface through liquid cooling or air cooling.
In a possible embodiment, the second contact surface fills the contact gap when contacting the temperature control target device through a heat conducting material, the heat conducting material including any one or more of a heat conducting pad, a heat conducting silicone grease, a heat conducting gel, a heat conducting phase change material, and a heat conducting graphite sheet.
In one possible implementation, the hardware device includes an edge computing hardware device.
In the foregoing implementation manner of the embodiment of the present application, a hardware device includes a heat dissipation upper cover, a TEC and a temperature control target device, where the TEC includes a first contact surface and a second contact surface that are opposite to each other, and the first contact surface is in contact with the heat dissipation upper cover and the second contact surface is in contact with the temperature control target device; the heat dissipation upper cover is used for dissipating heat conducted by the first contact surface in the running process of the hardware equipment; the TEC is used for absorbing heat of the temperature control target device by utilizing the second contact surface and conducting the heat to the heat dissipation upper cover through the first contact surface in the operation process of the hardware equipment; and when the temperature control target device is started, the heat generated by the TEC is conducted to the temperature control target device through the second contact surface. In the process of controlling the temperature of the temperature control target device in the hardware equipment, when the temperature of the temperature control target device is higher, the second contact surface on the TEC can be used for absorbing heat to the temperature control target device so as to reduce the temperature of the temperature control target device, thereby avoiding the temperature control target device from being damaged due to overhigh temperature in the operation process; when the temperature of the temperature control target device is low, for example, the hardware device is in a low temperature environment, the second contact surface on the TEC may be used to heat the temperature control target device to increase the temperature of the temperature control target device, so that the temperature of the temperature control target device reaches the temperature required for starting the temperature control target device. Therefore, wide-range environmental temperature adaptability of the hardware equipment can be realized, and the deployment requirement of the hardware equipment in severe environment is met. And the TEC is utilized to realize the heating and radiating functions at the same time, so that the integration of the whole machine is convenient to realize, and a special heating device is not required to be additionally designed outside the hardware equipment.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic structural diagram of a hardware device in an embodiment of the present application;
FIG. 2 is a schematic view of TEC operation principle;
FIG. 3 is a schematic diagram of the connection between the hardware device 100 and the CDU200 according to the embodiment of the present application;
fig. 4 is a schematic structural diagram of a heat dissipation cover 101 according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of another heat dissipation cover 101 in the embodiment of the present application;
FIG. 6 is a schematic flow chart illustrating a temperature control method according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a temperature control device according to an embodiment of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, various non-limiting embodiments accompanying the present application examples are described below with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 shows a schematic structural diagram of a hardware device in an embodiment of the present application. As shown in fig. 1, the hardware device 100 may include a heat dissipating upper cover 101, a Thermoelectric Cooler (TEC) 102, and a temperature controlled target device 103. In practical applications, the temperature control target device may be, for example, a Printed Circuit Board (PCB), an integrated chip, and the like, which is not limited in this embodiment.
In some examples, hardware device 100 may be a server, such as an edge computing server, storage server, or the like; alternatively, the hardware device 100 may also be a terminal device, such as a terminal of a notebook computer. In the present embodiment, the specific implementation form of the hardware device 100 is not limited.
The heat dissipation upper cover can perform heat transfer with the temperature control target device 103 through the TEC 102. Specifically, the TEC102 may include a first contact surface and a second contact surface opposite to each other, and the first contact surface may be in contact with the heat dissipation cover 101, and the second contact surface may be in contact with the temperature control target device 103. In practical application, the gaps between the contact surfaces of the TEC102 and the temperature control target device 103 and the heat dissipation upper cover 101 are filled with heat conductive materials to eliminate the gaps between the contact surfaces. Illustratively, the contact gap existing when the TEC102 makes contact with the heat dissipating upper cover 101 and the temperature control target device 103 may be filled by a heat conductive material, such as any one or more of a heat conductive pad, a heat conductive silicone grease, a heat conductive gel, a heat conductive phase change material, and a heat conductive graphite sheet. In practical applications, other heat conductive materials may be used to fill the gap, which is not limited in this embodiment.
In a further possible embodiment, the hardware apparatus 100 may further include a chassis 104, where the chassis 104 may be used to support and protect the heat dissipation cover 101, the TEC102, the temperature control target device 103, and the like. It should be noted that the structure of the hardware device 100 shown in fig. 1 is only an example, and in practical applications, the hardware device 100 may further include more constituent elements, such as a control panel, an Input/Output (I/O) interface for connecting the elements, and the like, which is not limited in this embodiment.
In practical application scenarios, the temperature control target device 103 in the hardware apparatus 100 may have higher requirements for its environment when being started up than other devices in the hardware apparatus 100. For example, the heat dissipation upper cover 101 and the chassis 104 in the hardware device 100 may be adapted to an ambient temperature of-40 ℃ to-70 ℃, and the temperature control target device 103 may be required to be at an ambient temperature of not lower than 0 ℃ when being started. For this reason, in this embodiment, during the startup of the hardware device 100, the temperature control target device 103 is started up along with the startup of the hardware device 100, and at this time, the TEC102 may generate heat and conduct the generated heat to the temperature control target device 103 through the second contact surface, so as to heat the temperature control target device 103.
For example, the TEC102 may heat the temperature control target device 103 when the hardware device 100 satisfies a certain temperature condition. Specifically, when the temperature of the environment in which the hardware device 100 is located is lower than a first threshold (e.g., 0 ℃), the TEC102 may generate heat and heat the temperature control target device 103 using the second contact surface. When the temperature of the environment in which the hardware device 100 is located is not lower than the first threshold, the temperature of the environment in which the temperature control target device 103 is located may also be generally not lower than the first threshold, and at this time, the temperature control target device 103 may be normally started in the environment, and therefore, the TEC102 may not generate heat to heat the temperature control target device 103.
During the completion of the start-up and the operation of the temperature control target device 103, heat is generally continuously generated, so that the temperature of the temperature control target device 103 may be continuously increased during the operation. At this time, since the temperature of the temperature control target device 103 is excessively high, some damage is generally caused to the temperature control target device 103. Based on this, the hardware device 100 can dissipate heat of the temperature control target device 103 through the heat dissipation upper cover 101 and the TEC 102.
In a specific implementation, during an operation process of the hardware device 100, the second contact surface on the TEC102 may be adjusted from a heat releasing surface to a heat absorbing surface, so that the second contact surface may absorb heat of the temperature control target device 103 and conduct the heat to the heat dissipating upper cover 101 through the first contact surface, so that the heat dissipating upper cover 101 performs a heat dissipating process on the heat conducted from the first contact surface.
For example, the TEC102 may heat the temperature control target device 103 when the temperature control target device 103 satisfies a certain temperature condition. Specifically, when the current temperature of the temperature control target device 103 is higher than a second threshold (e.g., 35 ℃), the TEC102 may absorb heat to the temperature control target device 103 by using the second contact surface to avoid the temperature of the temperature control target device 103 being too high. When the temperature of the temperature control target device 103 is within the first threshold value and the second threshold value, the TEC102 may not absorb heat (or may not heat) to the temperature control target device 103. In an example, the TEC102 may monitor the temperature of the temperature control target device 103 through a preset temperature sensor, so that measures such as heating, non-processing, or heat absorption may be taken to control the temperature of the temperature control target device 103 according to a temperature range in which the temperature control target device 103 is located.
In this embodiment, the TEC102 controls the temperature control target device 103 to absorb heat and release heat through the second contact surface, which may be implemented by a controller integrated in the TEC102, or may be implemented by a controller separately configured in the hardware device 100 to correspondingly control the TEC to absorb heat and release heat of the temperature control target device 103. This embodiment is not limited to this.
The TEC102 can realize heat absorption and heat release of the temperature control target device 103 by using a peltier effect of a semiconductor material. Specifically, refer to the schematic diagram of the TEC working principle shown in fig. 2. TEC102 may include two different semiconductor materials, semiconductor material P and semiconductor material N. The semiconductor material P and the semiconductor material N may be connected in series through corresponding conductors, and the TEC102 may make a contact surface with the heat dissipation upper cover 101 and the temperature control target device 103 through corresponding insulators, as shown in fig. 2.
Meanwhile, the TEC102 includes two electrodes, namely a first electrode and a second electrode. When the two electrodes are connected to direct current, if the temperature control target device 103 is started at a low temperature (the temperature is lower than the first threshold), the first electrode may be connected to the positive electrode, and the second electrode may be connected to the negative electrode. At this time, the second contact surface side absorbs heat due to the discharge, so that after the second contact surface contacts the temperature control target device 103, part of the heat on the temperature control target device 103 can be absorbed by the second contact surface, and the temperature of the temperature control target device 103 can be lowered. Meanwhile, the side of the first contact surface releases heat due to charging, so that the heat released by the first contact surface can be dissipated by the heat dissipation upper cover 101 after the first contact surface contacts the heat dissipation upper cover 101.
When the temperature of the temperature-controlled target device 103 is high (the temperature is higher than the second threshold) during operation, the first electrode may be connected to the negative electrode, and the second electrode may be connected to the positive electrode. At this time, the second contact surface is charged to release heat, so that the temperature of the temperature control target device 103 can be raised by the heat released from the second contact surface. At the same time, the first contact surface side discharges to absorb heat.
In this embodiment, the heat dissipation upper cover 101 may dissipate heat conducted by the first contact surface, and for example, the heat dissipation upper cover 101 may implement heat dissipation through a liquid cooling or air cooling technique.
For example, when the heat dissipation upper cover 101 performs heat dissipation through liquid cooling, as shown in fig. 3, the hardware device 100 may be connected to a liquid Cooling Distribution Unit (CDU) 200 through a pipeline 201, a cooling liquid may flow through the pipeline 201, and the cooling liquid may take away heat in the hardware device 100 during flowing through the hardware device 100, so as to achieve heat dissipation of the hardware device 100. In this case, the hardware device 100 may further include an adapter 105 for connecting with the pipeline 201, so that the refrigerant fluid in the pipeline 201 may flow into the hardware device 100 from one adapter 105 and flow out of the hardware device 100 from another adapter 105. The pipe 201 may be any one or more of a rubber hose, a Fluorinated Ethylene Propylene (FEP) pipe, and a Polytetrafluoroethylene (PTFE) pipe, for example. Of course, the pipeline 201 may also be implemented by other ways, and this embodiment does not limit this.
As an example, the heat dissipating upper cover 101 may be configured as shown in fig. 4, and the heat dissipating upper cover 101 may include a flow passage 1011, and the refrigerant fluid flowing into the adapter 105 may flow through the flow passage. Meanwhile, the heat dissipating upper cover 101 further includes a heat conducting boss 1012 therein, and the heat dissipating upper cover 101 may contact the first contact surface on the TEC102 through the heat conducting boss 1012. In this manner, as the refrigeration liquid flows in the flow channel 1011, heat conducted from the first contact surface to the thermally conductive boss 1012 may be absorbed and carried away from the hardware device 100 as the refrigeration liquid exits the hardware device 100.
In practical applications, the flow channel 1011 can be designed according to the specific arrangement and position of the device, and the arrangement and position of the flow channel 1011 in the heat dissipation upper cover 101 shown in fig. 4 are only used as an exemplary illustration. In addition, the processing method of the runner 1011 includes, but is not limited to, Computer Numerical Control (CNC), tooth forming, and the like. The welding process used for the top cover of the heat sink 101 includes, but is not limited to, vacuum brazing, friction stir welding, diffusion welding, argon arc welding, and the like.
Alternatively, a pair of leakage detection lines may be attached around the laid pipeline 201 and at key positions in the hardware device 100 to perform leakage monitoring and timely alarm if necessary.
When the heat dissipating upper cover 101 dissipates heat by air cooling, as shown in fig. 5, the heat conducting boss 1012, the fan 1013, and the panel 1014 may be included in the heat dissipating upper cover 101. When the fan 1013 operates, the disturbance of the fan can increase the air flow around the fins of the upper cover, so that the heat transferred to the fins and the air around the fins perform high-efficiency heat exchange, thereby enhancing the heat exchange capability of the heat dissipation upper cover 101, and the heat is taken out of the hardware device 100 along with the air flow, thereby cooling the hardware device, that is, cooling the temperature control target device 103. The panel 1014 may be configured with an operation key for the hardware device 100, so that the hardware device 100 can perform relevant operations through the operation key.
Of course, the heat dissipation upper cover 101 shown in fig. 4 and fig. 5 is only used as some exemplary illustrations, and in practical applications, the heat dissipation upper cover 101 may also implement heat dissipation for the hardware device 100 by using other refrigeration technologies, which is not limited in this embodiment.
In this embodiment, in the process of controlling the temperature of the temperature control target device 103 in the hardware device 100, when the temperature of the temperature control target device 103 is high, the second contact surface on the TEC102 may be used to absorb heat to the temperature control target device 103, so as to reduce the temperature of the temperature control target device 103, thereby preventing the temperature control target device 103 from being damaged due to over-high temperature during the operation; when the temperature of the temperature control target device 103 is low, such as the hardware device 100 is in a low temperature environment, the temperature control target device 103 may be heated by using the second contact surface on the TEC102 to increase the temperature of the temperature control target device 103, so as to achieve that the temperature of the temperature control target device 103 reaches the temperature required for starting. Thus, wide-range environmental temperature adaptability of the hardware device 100 can be realized, and the deployment requirement of the hardware device 100 in a severe environment is met. Moreover, the TEC102 is utilized to realize the heating and heat dissipation functions at the same time, so that the integration of the whole device is facilitated, and a special heating device does not need to be added to the outside of the hardware device 100.
In addition, the embodiment of the application also provides a temperature control method. Referring to fig. 6, fig. 6 is a flow chart illustrating a temperature control method according to an embodiment of the present application, which may be applied to the winner device 100, and may specifically include:
s601: when the hardware device 100 is operated, a second contact surface on the TEC102 included in the hardware device 100 is used to absorb heat to the temperature control target device 103 in the hardware device 100, and the heat is conducted to the heat dissipation upper cover 101 in the hardware device 100 through a first contact surface on the TEC102, where the TEC102 includes a first contact surface and a second contact surface opposite to each other, the first contact surface is in contact with the heat dissipation upper cover 101, and the second contact surface is in contact with the temperature control target device 103.
In practical application, the gaps between the contact surfaces of the TEC102 and the temperature control target device 103 and the heat dissipation upper cover 101 are filled with heat conductive materials to eliminate the gaps between the contact surfaces. Illustratively, the contact gap existing when the TEC102 makes contact with the heat dissipating upper cover 101 and the temperature control target device 103 may be filled by a heat conductive material, such as any one or more of a heat conductive pad, a heat conductive silicone grease, a heat conductive gel, a heat conductive phase change material, and a heat conductive graphite sheet. In practical applications, other heat conductive materials may be used to fill the gap, which is not limited in this embodiment.
During operation of the temperature control target device 103, heat is generally generated continuously, so that the temperature of the temperature control target device 103 may be continuously increased during operation. At this time, since the temperature of the temperature control target device 103 is excessively high, some damage is generally caused to the temperature control target device 103. Based on this, the hardware device 100 can dissipate heat of the temperature control target device 103 through the heat dissipation upper cover 101 and the TEC 102.
In a specific implementation, in the operation process of the hardware device 100, the second contact surface on the TEC102 may be a heat absorbing surface, so that the second contact surface may absorb heat of the temperature control target device 103 and conduct the heat to the heat dissipation upper cover 101 through the first contact surface, so that the heat conducted from the first contact surface is dissipated by the heat dissipation upper cover 101.
S602: when the temperature control target device 103 is activated, the heat generated by the TEC102 is conducted to the temperature control target device 103 using the second contact surface.
In practical application scenarios, the temperature control target device 103 in the hardware apparatus 100 may have higher requirements for its environment when being started up than other devices in the hardware apparatus 100. For example, the temperature control target device 103 may be required to be located at an ambient temperature of not lower than 0 ℃ when being started, and the hardware device 100 may be currently located at an ambient temperature of lower than 0 ℃. For this reason, in this embodiment, during the startup of the hardware device 100, the temperature control target device 103 is started up along with the startup of the hardware device 100, and at this time, the TEC102 may generate heat and conduct the generated heat to the temperature control target device 103 through the second contact surface, so as to heat the temperature control target device 103.
For a specific implementation principle of switching the second contact surface on the TEC102 between the heat absorbing surface and the heat releasing surface, reference may be made to the description of the relevant parts of the foregoing embodiments, which is not described herein again.
In one possible embodiment, the heat dissipating cover 101 can dissipate heat conducted by the first contact surface through liquid cooling or air cooling. Of course, in practical applications, the heat dissipation cover 101 may also implement heat dissipation for the hardware device 100 by other means.
In one possible implementation, hardware device 100 may be a server, such as an edge computing server, storage memory, or the like; alternatively, the hardware device 100 may also be a terminal device, such as a terminal of a notebook computer. In the present embodiment, the specific implementation form of the hardware device 100 is not limited.
In addition, the embodiment of the application also provides a temperature control device. Referring to fig. 7, fig. 7 is a schematic structural diagram illustrating a temperature control device 300 according to an embodiment of the present application, including:
a first control unit 701, configured to, when a hardware device is in operation, utilize a second contact surface on a TEC of a thermoelectric cooler included in the hardware device to absorb heat to a temperature control target device in the hardware device, and conduct the heat to a heat dissipation upper cover in the hardware device through a first contact surface on the TEC, where the TEC includes the first contact surface and the second contact surface that are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
a second control unit 702, configured to conduct the heat generated by the TEC to the temperature control target device by using the second contact surface when the temperature control target device is started.
In one possible embodiment, the TEC comprises a first electrode and a second electrode;
then, the first control unit 701 is specifically configured to, when the first electrode is a positive electrode and the second electrode is a negative electrode, absorb heat to the temperature control target device by using the second contact surface;
the second control unit 702 is specifically configured to, when the first electrode is a negative electrode and the second electrode is a positive electrode, utilize the second contact surface to conduct heat generated by the TEC to the temperature control target device.
In a possible implementation manner, when the temperature of the environment in which the hardware device is located is lower than a first threshold, the first electrode is a negative electrode, and the second electrode is a positive electrode; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
In a possible embodiment, the heat dissipation upper cover dissipates heat conducted by the first contact surface through liquid cooling or air cooling.
In a possible embodiment, the second contact surface fills the contact gap when contacting the temperature control target device through a heat conducting material, the heat conducting material including any one or more of a heat conducting pad, a heat conducting silicone grease, a heat conducting gel, a heat conducting phase change material, and a heat conducting graphite sheet.
In one possible implementation, the hardware device includes an edge computing hardware device.
It should be noted that, for the contents of information interaction, execution process, and the like between the modules and units of the apparatus, since the same concept is based on the method embodiment in the embodiment of the present application, the technical effect brought by the contents is the same as that of the method embodiment in the embodiment of the present application, and specific contents may refer to the description in the foregoing method embodiment in the embodiment of the present application, and are not described herein again.
In the names of "first contact surface", "first control unit", "first electrode", etc., the "first" mentioned in the embodiments of the present application is used only for name identification, and does not represent the first in sequence. The same applies to "second" etc.
As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that all or part of the steps in the above embodiment methods can be implemented by software plus a general hardware platform. Based on such understanding, the technical solution of the present application may be embodied in the form of a software product, which may be stored in a storage medium, such as a read-only memory (ROM)/RAM, a magnetic disk, an optical disk, or the like, and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network communication device such as a router) to execute the method according to the embodiments or some parts of the embodiments of the present application.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to some descriptions of the method embodiment for relevant points. The above-described embodiments of the apparatus are merely illustrative, and the modules described as separate parts may or may not be physically separate, and the parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
The above description is only an exemplary embodiment of the present application, and is not intended to limit the scope of the present application.
Claims (10)
1. A hardware device is characterized by comprising a heat dissipation upper cover, a thermoelectric cooler TEC and a temperature control target device, wherein the TEC comprises a first contact surface and a second contact surface which are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
the heat dissipation upper cover is used for dissipating heat conducted by the first contact surface in the running process of the hardware equipment;
the TEC is used for absorbing heat of the temperature control target device by utilizing the second contact surface and conducting the heat to the heat dissipation upper cover through the first contact surface in the operation process of the hardware equipment; and when the temperature control target device is started, the heat generated by the TEC is conducted to the temperature control target device through the second contact surface.
2. The hardware device of claim 1, wherein the TEC comprises a first electrode and a second electrode, and when the first electrode is a positive electrode and the second electrode is a negative electrode, the second contact surface is used to absorb heat to the temperature control target device; and when the first electrode is a negative electrode and the second electrode is a positive electrode, heating the temperature control target device by using the second contact surface.
3. The hardware device of claim 2, wherein when the temperature of the environment in which the hardware device is located is lower than a first threshold, the first electrode is a negative electrode, and the second electrode is a positive electrode; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
4. The hardware device of claim 1, wherein the heat dissipation cover is configured to dissipate heat conducted by the first contact surface by liquid cooling or air cooling.
5. The hardware device of any of claims 1 to 4, wherein the second contact surface fills a contact gap when in contact with the temperature control target device by a thermally conductive material comprising any one or more of a thermally conductive pad, a thermally conductive silicone grease, a thermally conductive gel, a thermally conductive phase change material, a thermally conductive graphite sheet.
6. The hardware device of any of claims 1 to 5, wherein the hardware device comprises an edge computing hardware device.
7. A method of temperature control, the method comprising:
when the hardware equipment runs, absorbing heat to a temperature control target device in the hardware equipment by using a second contact surface on a thermoelectric cooler TEC (thermoelectric cooler) included in the hardware equipment, and conducting the heat to a heat dissipation upper cover in the hardware equipment through a first contact surface on the TEC, wherein the TEC comprises the first contact surface and the second contact surface which are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
when the temperature control target device is started, the second contact surface is utilized to conduct the heat generated by the TEC to the temperature control target device.
8. The method of claim 7, wherein the TEC comprises a first electrode and a second electrode;
then, said absorbing heat with the second contact surface on the TEC of the hardware device includes, including:
when the first electrode is a positive electrode and the second electrode is a negative electrode, the second contact surface is used for absorbing heat to the temperature control target device;
the conducting heat generated by the TEC to the temperature control target device by using the second contact surface comprises:
and when the first electrode is a negative electrode and the second electrode is a positive electrode, the second contact surface is utilized to conduct the heat generated by the TEC to the temperature control target device.
9. The method of claim 8, wherein the first electrode is a negative electrode and the second electrode is a positive electrode when the temperature of the environment in which the hardware device is located is below a first threshold; when the temperature of the environment where the hardware device is located is higher than a second threshold, the first electrode is a positive electrode, the second electrode is a negative electrode, and the second threshold is greater than the first threshold.
10. A temperature control apparatus, characterized in that the apparatus comprises:
the first control unit is used for absorbing heat of a temperature control target device in the hardware equipment by using a second contact surface on a thermoelectric cooler TEC included in the hardware equipment when the hardware equipment runs, and conducting the heat to a heat dissipation upper cover in the hardware equipment through a first contact surface on the TEC, wherein the TEC comprises the first contact surface and the second contact surface which are opposite, the first contact surface is in contact with the heat dissipation upper cover, and the second contact surface is in contact with the temperature control target device;
and the second control unit is used for conducting the heat generated by the TEC to the temperature control target device by utilizing the second contact surface when the temperature control target device is started.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110741871.9A CN113608594A (en) | 2021-06-30 | 2021-06-30 | Hardware equipment, temperature control method and device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110741871.9A CN113608594A (en) | 2021-06-30 | 2021-06-30 | Hardware equipment, temperature control method and device |
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| CN113608594A true CN113608594A (en) | 2021-11-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114153279A (en) * | 2021-11-13 | 2022-03-08 | 苏州浪潮智能科技有限公司 | Computer case with modular structure and server |
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2021
- 2021-06-30 CN CN202110741871.9A patent/CN113608594A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114153279A (en) * | 2021-11-13 | 2022-03-08 | 苏州浪潮智能科技有限公司 | Computer case with modular structure and server |
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Application publication date: 20211105 |