CN114146950A - Sorting method of LED wafers - Google Patents
Sorting method of LED wafers Download PDFInfo
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- CN114146950A CN114146950A CN202111198697.4A CN202111198697A CN114146950A CN 114146950 A CN114146950 A CN 114146950A CN 202111198697 A CN202111198697 A CN 202111198697A CN 114146950 A CN114146950 A CN 114146950A
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000013078 crystal Substances 0.000 claims abstract description 115
- 230000014759 maintenance of location Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000638 solvent extraction Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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Abstract
The application discloses a method for sorting LED wafers, which comprises the following steps: dividing an LED wafer into a plurality of blocks, wherein the LED crystal grains on the blocks are divided into reserved crystal grains and grabbed crystal grains, the photoelectric property and the number of the reserved crystal grains meet preset requirements, and the photoelectric property and the number of the grabbed crystal grains do not meet the preset requirements, wherein the number of the reserved crystal grains is greater than that of the grabbed crystal grains, the photoelectric property of the reserved crystal grains on the same block is in the same grade, and the photoelectric properties of the reserved crystal grains on different blocks are in different grades; removing the grabbing crystal grains on the block; and transferring the reserved crystal grains on the block to form a finished square piece. The sorting device is high in sorting efficiency, low in cost and suitable for large-batch generation.
Description
Technical Field
The application relates to the technical field of light emitting diodes, in particular to a method for sorting LED wafers.
Background
After the LED wafer is tested for the electrical and optical characteristics, the sorting equipment grabs the crystal grains on the LED wafer to a new blue film one by one according to the grade of the crystal grains to be sorted. Specifically, the crystal grains to be sorted are also placed on the blue film, and when the sorting equipment is used for sorting, the crystal grains to be sorted on the blue film are jacked up by a thimble, and then the crystal grains to be sorted are grabbed onto a new blue film by a grabbing mechanism. Wherein, the thimble only jacks one crystal grain at a time.
However, as the size of the die is smaller and smaller, the number of the die on the wafer can be up to 150000, and the sorting equipment needs 6-7 hours to complete the sorting, which is not favorable for large-scale operation.
In addition, as the number of crystal grains on the wafer with the same size becomes larger, the number of times of jacking the thimble of the sorting equipment is also increased, so that the blue film is easy to jack and deform, and the grabbing mechanism is easy to grab wrong crystal grains.
Disclosure of Invention
The technical problem to be solved by the application is to provide a method for sorting LED wafers, which is high in sorting efficiency, low in cost and suitable for mass production.
The technical problem to be solved by the application is to provide a method for sorting LED wafers, which is high in sorting precision and effectively solves the problems of missed grabbing and mistaken grabbing.
The technical problem to be solved by the present application is to provide a method for sorting LED wafers, including:
dividing an LED wafer into a plurality of blocks, wherein the LED crystal grains on the blocks are divided into reserved crystal grains and grabbed crystal grains, the photoelectric property and the number of the reserved crystal grains meet preset requirements, and the photoelectric property and the number of the grabbed crystal grains do not meet the preset requirements, wherein the number of the reserved crystal grains is greater than that of the grabbed crystal grains, the photoelectric property of the reserved crystal grains on the same block is in the same grade, and the photoelectric properties of the reserved crystal grains on different blocks are in different grades;
removing the grabbing crystal grains on the block;
and transferring the reserved crystal grains on the block to form a finished square piece.
As an improvement of the above scheme, the method for dividing the LED wafer into a plurality of blocks includes:
grading the LED crystal grains which are subjected to the photoelectric test on the LED wafer to obtain a sorted document;
acquiring position information of the LED crystal grains;
and partitioning the LED wafer according to the sorting document and the position information to form the block.
As an improvement of the above scheme, the sorting document includes photoelectric parameter information, level classification information, and sorting level information, the photoelectric parameter information at least includes a wavelength parameter, a voltage parameter, and a brightness parameter of the LED dies, and the level classification information includes the number of levels and the number of LED dies corresponding to each level; wherein the content of the first and second substances,
LED crystal grains with photoelectric parameter information in the same preset range are classified into the same grade, the LED crystal grains have multiple grades, and the photoelectric parameter information of the LED crystal grains with different grades is in different preset ranges;
the number of the LED crystal grains in the same grade is several.
As an improvement of the above scheme, a plurality of retention levels are selected from a plurality of levels according to the number of LED dies, wherein the number of LED dies for the retention level reaches a preset value, and the number of blocks is equal to the number of retention levels.
As an improvement of the above scheme, each block has only one retention level, the LED dies corresponding to the retention level are retention dies, and the remaining LED dies are capture dies.
As an improvement of the above scheme, the sorting level information includes BIN information, where the LED dies of the retention level are set to 151 BINs or more, and the other LED dies are set to any one or more of 1 to 150 BINs.
As an improvement of the scheme, the position of the LED crystal grain is set according to the XY-axis coordinates so as to obtain the position information of the LED crystal grain.
As an improvement of the above solution, the method for removing the grabbed dies on the block includes:
and grabbing the grabbed crystal grains by using a sorting device.
As an improvement of the above scheme, after the grabbed crystal grains on the block are removed, the reserved crystal grains on the block are filmed on the substrate to form the finished square piece.
As an improvement of the scheme, the LED crystal grains on the finished square chip belong to the same grade.
The application has the following beneficial effects:
the LED wafer is divided into a plurality of blocks according to the photoelectric performance and the crystal grain number of the LED crystal grains, the grabbing crystal grains with the photoelectric performance not meeting requirements and the small number of the LED crystal grains are picked away, the photoelectric performance and the large number of the keeping crystal grains are kept, and compared with a method for grabbing the LED crystal grains with the photoelectric parameters meeting requirements onto a new blue film, the keeping crystal grains after the partition can be directly transferred to different blue films to form finished product square sheets, a grabbing mechanism is not needed to grab and arrange the finished product square sheets onto the new blue film, the grabbing times of the sorting equipment are effectively reduced, and the sorting efficiency is improved.
The sorting method is a brand-new sorting method, and the LED wafer is divided into a plurality of parts, so that LED crystal grains of various grades can be reserved as reserved crystal grains, the sorting efficiency is further improved, and the cost is reduced.
This application remains the LED crystalline grain that a large amount is many, snatchs LED crystalline grain that a small amount to new blue membrane on, can reduce the jack-up number of times of thimble like this, improves the precision of snatching the mechanism to improve the sorting precision, solve the problem of lou grabbing, mistakenly grabbing.
The sorting logic of this application can realize multiple shipment demand, realizes quick flowing water, reaches few sorting facilities, the requirement of high output.
Drawings
Fig. 1 is a schematic structural diagram of an LED wafer in an embodiment of the present application;
FIG. 2 is a schematic diagram of a first block division of an LED wafer according to an embodiment of the present invention;
FIG. 3 is a second block division of an LED wafer according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the block of FIG. 2 after removal of the capture die;
fig. 5 is a schematic diagram of the block in fig. 3 after the capture die is removed.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
The application provides a sorting method of an LED wafer, which comprises the following steps:
s1, dividing the LED wafer into a plurality of blocks, wherein the LED crystal grains on the blocks are divided into reserved crystal grains and grabbed crystal grains, the photoelectric property and the number of the reserved crystal grains meet preset requirements, and the photoelectric property and the number of the grabbed crystal grains do not meet the preset requirements, wherein the number of the reserved crystal grains is larger than that of the grabbed crystal grains, the photoelectric property of the reserved crystal grains on the same block is in the same grade, and the photoelectric property of the reserved crystal grains on different blocks is in different grades;
specifically, the method for dividing the LED wafer into the plurality of blocks comprises the following steps:
s11, grading the LED crystal grains which are subjected to the photoelectric test on the LED wafer to obtain a sorted document;
the sorting document comprises photoelectric parameter information, grade sorting information and sorting grade information, wherein the photoelectric parameter information at least comprises wavelength parameters, voltage parameters and brightness parameters of the LED crystal grains, and the grade sorting information comprises the number of grades and the number of LED crystal grains corresponding to each grade; LED crystal grains with photoelectric parameter information in the same preset range are divided into the same grade, the LED crystal grains have multiple grades, and the photoelectric parameter information of the LED crystal grains with different grades is in different preset ranges; the number of the LED crystal grains in the same grade is several.
Selecting a plurality of reservation grades from a plurality of grades according to the number of the LED crystal grains, wherein the number of the LED crystal grains of the reservation grades reaches a preset value, and the number of the blocks is equal to the number of the reservation grades.
Specifically, each block has only one retention grade, the LED dies corresponding to the retention grade are retention dies, and the rest LED dies are capture dies.
The sorting grade information includes BIN information, wherein the LED crystal grains with the reserved grade are set to be 151BIN or above, and other LED crystal grains are set to be any one or more of 1-150 BIN.
The existing sorting equipment can only set 150 BINs, wherein one BIN is a sorting grade, if the sorting grade is set to 151 BINs, the sorting equipment does not grab the LED crystal grains with the number of 151 BINs or more, the LED crystal grains with the number of 151 BINs or more are remained on an LED wafer, and the LED crystal grains with the number of 1-150 BINs are grabbed onto a new blue film.
For example, after the LED wafer is subjected to the photoelectric test, the LED dies are classified into 150 levels according to the photoelectric parameters, wherein the number of the dies of level 1, level 2, level 3, and level 4 is greater than a preset value (for example, 100), the level 1, level 2, level 3, and level 4 are selected as the reserved level, the number of the reserved level is 4, the LED wafer is correspondingly classified into 4 blocks, wherein the number of the LEDs of level 1 on the block 1 is the largest, the level 1 is the reserved level on the block 1, the LED dies of level 1 on the block 1 are the reserved dies, and the rest of the LED dies are the capture dies. In addition, the number of LEDs of level 2 on block 2 is the largest, then level 2 is the reserved level on block 2, the LED dies of level 2 on block 2 are reserved dies, and the rest of LED dies are capture dies, wherein the LED dies of level 1 are the reserved dies on block 1, but the capture dies on block 2.
S12, acquiring the position information of the LED crystal grains;
and setting the position of the LED crystal grain according to the XY axis coordinates to obtain the position information.
And S13, partitioning the LED wafer according to the sorting document and the position information to form the block.
Referring to fig. 1, after the LED wafer in fig. 1 is subjected to the optoelectronic test, the LED dies are classified into 5 levels, which include:
grade 1, the number of grains is 97, and the photoelectric parameters are: the wavelength of 462-466nm, the brightness of 3.0-3.4 and the VF of 2.9-3.4;
grade 2, the number of grains is 75, and the photoelectric parameters are as follows: the wavelength is 466-470nm, the brightness is 3.0-3.4, and the VF is 2.9-3.4;
grade 3, the number of grains is 85, and the photoelectric parameters are as follows: the wavelength is 466-470nm, the brightness is 3.4-3.8, and the VF is 2.9-3.4;
grade 4, the number of grains is 57, and the photoelectric parameters are: the wavelength of 462-466nm, the brightness of 3.4-3.8 and the VF of 2.9-3.4;
grade 5, number of grains 22, bad grade.
The poor grade means that the LED crystal grains are poor crystal grains, and have the problems of electric leakage, defects and the like.
Setting the number of the crystal grains with the reserved grade to be 50, wherein the number of the LED crystal grains with the grade 1, the grade 2, the grade 3 and the grade 4 is respectively more than or equal to 50, selecting the grade 1, the grade 2, the grade 3 and the grade 4 as the reserved grade, setting the positions of the LED crystal grains according to XY axis coordinates, and dividing the LED wafer into 4 blocks comprising a block 1, a block 2, a block 3 and a block 4, as shown in FIG. 2; the number of LED dies of level 1 on block 1 is the largest, the number of LED dies of level 2 on block 2 is the largest, the number of LED dies of level 3 on block 3 is the largest, and the number of LED dies of level 4 on block 4 is the largest, wherein a portion of LED dies of level 1 may be distributed over area 2, block 3 and block 4, with LED dies of level 1 acting as reserved dies on block, but acting as grabbed dies on block 2, block 3 and block 4.
The existing sorting equipment can only set 150 BINs, wherein one BIN is a sorting grade, if the sorting grade is set to 151 BINs, the sorting equipment does not grab the 151 BINs, and the 151 BINs are kept on the LED wafer.
The present application sets a rank 1 on Block 1 to 151BIN, a bad rank to 149BIN, and other ranks to any of 1-148 BIN, such as rank 2 to 157BIN, rank 3 to 156BIN, and rank 4 to 155 BIN. Similarly, rank 2 on tile 2 is set to 152BIN, the bad rank is set to 149BIN, and the other ranks are set to any of 1-148 BINs, such as rank 1 to 154BIN, rank 3 to 156BIN, and rank 4 to 155 BIN. Similarly, rank 3 on tile 3 is set to 153BIN, the bad rank is set to 149BIN, and the other ranks are set to any of 1-148 BINs, such as rank 1 to 154BIN, rank 2 to 157BIN, and rank 4 to 155 BIN. Similarly, rank 4 on tile 4 is set to 154BIN, the bad rank is set to 149BIN, and the other ranks are set to any of 1-148 BINs, such as rank 1 to 154BIN, rank 2 to 157BIN, and rank 3 to 156 BIN.
In other embodiments of the present application, if the grades of the LED dies further include:
class 6, photovoltaic parameters: the wavelength is 470-472nm, the brightness is 3.0-3.4, and the VF is 2.9-3.4;
class 7, photovoltaic parameters: the wavelength is 470-472nm, the brightness is 3.4-3.8, and the VF is 2.9-3.4;
class 8, photovoltaic parameters: the wavelength of 472-;
and the number of the LED crystal grains of the grade 6, the grade 7 and the grade 8 is less than 100, the LED crystal grains corresponding to the grade 6, the grade 7 and the grade 8 are taken as grabbing crystal grains, and the grade is set to be any BIN in 1-148 BIN, for example, the grade 6 is set to be 1BIN, the grade 7 is set to be 2BIN, the grade 8 is set to be 3BIN, and the like.
Specifically, the sorting level information is BIN information.
In the above example, if the number of dies with reserved levels is set to be 70, wherein the number of LED dies with level 1, level 2 and level 3 is respectively greater than or equal to 70, then level 1, level 2 and level 3 are selected as reserved levels, the positions of the LED dies are set according to the XY axis coordinates, and the LED wafer is divided into 3 blocks, including block 1, block 2 and block 3, as shown in fig. 3; wherein the number of LED dies of level 1 on block 1 is the largest, the number of LED dies of level 2 on block 2 is the largest, and the number of LED dies of level 3 on block 3 is the largest, wherein a portion of the LED dies of level 1 may be distributed in area 2 and block 3, with the LED dies of level 1 acting as reserved dies on the block, but acting as grabbed dies on block 2 and block 3.
The present application sets a rank 1 on Block 1 to 151BIN, a bad rank to 149BIN, and other ranks to any of 1-148 BIN, such as rank 2 to 157BIN, rank 3 to 156BIN, and rank 4 to 155 BIN. Similarly, rank 2 on tile 2 is set to 152BIN, the bad rank is set to 149BIN, and the other ranks are set to any of 1-148 BINs, such as rank 1 to 154BIN, rank 3 to 156BIN, and rank 4 to 155 BIN. Similarly, rank 3 on tile 3 is set to 153BIN, the bad rank is set to 149BIN, and the other ranks are set to any of 1-148 BINs, such as rank 1 to 154BIN, rank 2 to 157BIN, and rank 4 to 155 BIN.
S2, removing the grabbing crystal grains on the block;
specifically, the method for removing the capture die on the block includes: and grabbing the grabbed crystal grains by using a sorting device.
And the sorting equipment is used for grabbing the grabbed crystal grains on the LED wafer according to the sorting document and the position information and sorting the grabbed crystal grains.
Preferably, the sorting device grabs the grains by blocks. For example, the capture die on block 1 is captured first, and then the capture die on block 2, the capture die on block 3, and the capture die on block 4 are captured in sequence. For another example, the capture die on block 4 is captured first, and then the capture die on block 1, the capture die on block 2, and the capture die on block 3 are captured in sequence.
In the above example, the LED die of level 4 on block 1 in fig. 2 is grabbed to the new blue film 1, the LED die of level 3 is grabbed to the new blue film 2, the LED die of level 2 is grabbed to the new blue film 3, the LED die with bad die is grabbed to the new blue film 4, and after all the grabbed dies are grabbed, the remaining LED dies on block 1 are the LED dies of level 1, that is, the remaining dies are the reserved dies; similarly, the remaining LED dies on block 2 are class 2 LED dies, the remaining LED dies on block 3 are class 3 LED dies, and the remaining LED dies on block 4 are class 4 LED dies, as shown in fig. 4.
In the above example, the LED die of level 4 on block 1 in fig. 3 is captured to a new blue film, the LED die of level 3 is captured to another blue film, the LED with bad die is captured to another blue film, and after all captured dies are captured, the remaining LED dies on block 1 are the LED dies of level 1, that is, the remaining dies are the reserved dies; similarly, the remaining LED dies on block 2 are class 2 LED dies and the remaining LED dies on block 3 are class 3 LED dies, as shown in fig. 5.
And S3, transferring the reserved crystal grains on the block to form a finished square piece.
Specifically, after the grabbed crystal grains on the block are removed, the reserved crystal grains on the block are turned over to be coated on the base material, so that the finished square sheet is formed. And the LED crystal grains on the finished square sheet have the same grade.
The substrate is preferably a blue film. In other embodiments of the present application, the substrate may also be other films, such as plastic films, metal films, and the like.
In this step, the level 1 LED die on block 2 is grabbed as a grabbing die onto a new blue film, and the level 1 LED die on the blue film can also be transferred onto a finished piece of level 1 LED die by flipping the film.
In the conventional sorting method, LED dies on an LED wafer are grabbed onto a blue film one by one according to a grade to form the finished square piece.
The traditional separation method is changed, the LED crystal grains with large quantity are reserved, the LED crystal grains with small quantity are grabbed onto the new blue film, all the LED crystal grains do not need to be grabbed, the grabbing times of the separation equipment can be reduced, and the separation efficiency is improved.
The sorting method is a brand-new sorting method, and the LED wafer is divided into a plurality of parts, so that LED crystal grains of various grades can be reserved as reserved crystal grains, the sorting efficiency is further improved, and the cost is reduced.
This application remains the LED crystalline grain that a large amount is many, snatchs LED crystalline grain that a small amount to new blue membrane on, can reduce the jack-up number of times of thimble like this, improves the precision of snatching the mechanism to improve the sorting precision, solve the problem of lou grabbing, mistakenly grabbing.
The sorting logic of this application can realize multiple shipment demand, realizes quick flowing water, reaches few sorting facilities, the requirement of high output.
The above disclosure is only one preferred embodiment of the present application, and certainly does not limit the scope of the present application, which is therefore intended to cover all modifications and equivalents of the claims.
Claims (10)
1. A sorting method of an LED wafer is characterized by comprising the following steps:
dividing an LED wafer into a plurality of blocks, wherein the LED crystal grains on the blocks are divided into reserved crystal grains and grabbed crystal grains, the photoelectric property and the number of the reserved crystal grains meet preset requirements, and the photoelectric property and the number of the grabbed crystal grains do not meet the preset requirements, wherein the number of the reserved crystal grains is greater than that of the grabbed crystal grains, the photoelectric property of the reserved crystal grains on the same block is in the same grade, and the photoelectric properties of the reserved crystal grains on different blocks are in different grades;
removing the grabbing crystal grains on the block;
and transferring the reserved crystal grains on the block to form a finished square piece.
2. The method for sorting the LED wafer as claimed in claim 1, wherein the method for dividing the LED wafer into the plurality of blocks comprises:
grading the LED crystal grains which are subjected to the photoelectric test on the LED wafer to obtain a sorted document;
acquiring position information of the LED crystal grains;
and partitioning the LED wafer according to the sorting document and the position information to form the block.
3. The method for sorting the LED wafer according to claim 2, wherein the sorting document comprises photoelectric parameter information, grade classification information and sorting grade information, the photoelectric parameter information at least comprises a wavelength parameter, a voltage parameter and a brightness parameter of the LED dies, and the grade classification information comprises the number of grades and the number of LED dies corresponding to each grade; wherein the content of the first and second substances,
LED crystal grains with photoelectric parameter information in the same preset range are classified into the same grade, the LED crystal grains have multiple grades, and the photoelectric parameter information of the LED crystal grains with different grades is in different preset ranges;
the number of the LED crystal grains in the same grade is several.
4. The method for sorting the LED wafers as claimed in claim 3, wherein a number of reserved levels is selected from a plurality of levels according to the number of LED dies, wherein the number of LED dies of the reserved levels reaches a preset value, and the number of blocks is equal to the number of reserved levels.
5. The method for sorting the LED wafers as claimed in claim 4, wherein each block has only one reserved grade, the LED dies corresponding to the reserved grade are reserved dies, and the rest of the LED dies are capture dies.
6. The method for sorting the LED wafer according to claim 3, wherein the sorting level information includes BIN information, wherein the LED dies of the retention level are set to 151BIN or more, and the other LED dies are set to any one or more of 1-150 BIN.
7. The method for sorting the LED wafer of claim 2, wherein the positions of the LED dies are set according to XY-axis coordinates to obtain the position information of the LED dies.
8. The method for sorting the LED wafer according to claim 1, wherein the method for removing the grabbed dies on the block comprises:
and grabbing the grabbed crystal grains by using a sorting device.
9. The method for sorting the LED wafer of claim 1 or 8, wherein after the grabbed dies on the block are removed, the remaining dies on the block are flipped over to a substrate to form the finished square piece.
10. The method for sorting the LED wafers of claim 9, wherein the LED dies on the finished dice are of the same class.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114669496A (en) * | 2022-04-24 | 2022-06-28 | 江西兆驰半导体有限公司 | LED chip sorting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210697A (en) * | 2000-01-25 | 2001-08-03 | Shibaura Mechatronics Corp | Pellet pickup equipment and pellet-bonding equipment |
| US20030224557A1 (en) * | 2002-05-31 | 2003-12-04 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
| CN104637833A (en) * | 2013-11-12 | 2015-05-20 | 旺矽科技股份有限公司 | Crystal grain selection method and bad crystal map generation method |
| CN112582294A (en) * | 2020-12-09 | 2021-03-30 | 苏州芯聚半导体有限公司 | Method and apparatus for positioning and removing micro light emitting diode crystal grain |
-
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210697A (en) * | 2000-01-25 | 2001-08-03 | Shibaura Mechatronics Corp | Pellet pickup equipment and pellet-bonding equipment |
| US20030224557A1 (en) * | 2002-05-31 | 2003-12-04 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
| CN104637833A (en) * | 2013-11-12 | 2015-05-20 | 旺矽科技股份有限公司 | Crystal grain selection method and bad crystal map generation method |
| CN112582294A (en) * | 2020-12-09 | 2021-03-30 | 苏州芯聚半导体有限公司 | Method and apparatus for positioning and removing micro light emitting diode crystal grain |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114669496A (en) * | 2022-04-24 | 2022-06-28 | 江西兆驰半导体有限公司 | LED chip sorting method |
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