CN114131487B - Wafer scribing machine for computer mainboard processing - Google Patents
Wafer scribing machine for computer mainboard processing Download PDFInfo
- Publication number
- CN114131487B CN114131487B CN202111289663.6A CN202111289663A CN114131487B CN 114131487 B CN114131487 B CN 114131487B CN 202111289663 A CN202111289663 A CN 202111289663A CN 114131487 B CN114131487 B CN 114131487B
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- water
- hole
- wheel
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention relates to the technical field of computer component processing, and discloses a wafer scribing machine for computer mainboard processing, which comprises a grinding wheel, wherein water cavities are respectively and fixedly arranged on two sides of the grinding wheel, a circulation hole is formed in the grinding wheel, the circulation hole horizontally penetrates through the grinding wheel, the water cavities on the two sides of the grinding wheel are mutually communicated through the circulation hole, a jet hole is formed in the cavity wall of the water cavity, and the jet hole is communicated with the water cavities. According to the invention, through the arrangement of the jet hole, water sprayed out of the jet hole is fully and continuously contacted with the wheel blade of the grinding wheel, so that the phenomenon that water flow sprayed out of an original device is only contacted with a certain area of the wheel blade of the grinding wheel for cooling is avoided, and thus the cooling effect is reduced.
Description
Technical Field
The invention relates to the technical field of computer part processing, in particular to a wafer scribing machine for computer mainboard processing.
Background
The computer main board is also called system board, it is one of the most important parts of computer, the chip group is the core of main board, the wafer is divided into a certain number of silicon chips by wafer dicing machine when the existing chip is made, then the silicon chips are printed by other devices to obtain the chip finally.
Some current wafer scriber are at the during operation, it cuts the wafer through high-speed pivoted emery wheel, and simultaneously, water jet equipment is installed with the position of emery wheel advancing direction in both sides around the emery wheel, make the emery wheel when cutting the wafer, water jet equipment of both sides carries out axial injection rivers to the emery wheel around, the epaxial water jet equipment of emery wheel advancing direction carries out radial injection rivers to the emery wheel, thereby cool off the emery wheel, but at above-mentioned in-process, because when the emery wheel rotates at a high speed, water jet equipment is to emery wheel axial and radial injection rivers, and then axial and radial resistance are applyed to the rotation process of emery wheel, make the slew velocity of emery wheel receive the influence, thereby influence the cutting effect of emery wheel to the wafer.
Disclosure of Invention
Aiming at the defects of the existing wafer scribing machine in the use process in the background technology, the invention provides the wafer scribing machine for processing the computer mainboard, which has the advantage of preventing a water jet device from applying resistance to a grinding wheel so as to influence the cutting effect of the grinding wheel on a wafer, and solves the technical problems in the background technology.
The invention provides the following technical scheme: the utility model provides a wafer scribing machine for computer mainboard processing, includes the emery wheel, the both sides of emery wheel are fixed mounting respectively has the water cavity, the opening has been seted up to the inside of emery wheel, the opening level runs through the emery wheel, the water cavity of emery wheel both sides communicates each other through the opening, the jet hole has been seted up in the chamber wall in water cavity, jet hole and water cavity intercommunication, the export orientation of jet hole is parallel arrangement with the wheel blade face of emery wheel, the left side fixed mounting of emery wheel has the pivot, the left end of pivot runs through the water cavity of emery wheel left side position, the right side position the right side fixed mounting in water cavity has the seat of rotating, the right side movable mounting who rotates the seat has high-pressure water pipe, high-pressure water pipe and the relative motion of seat of rotating, high-pressure water pipe and water cavity intercommunication.
Preferably, a pressurizing hole is formed in the wall of the water cavity, the diameter of the pressurizing hole is gradually reduced from inside to outside, the pressurizing hole and the jet hole jointly form a through hole structure, and the through hole structure is communicated with the water cavity.
Preferably, the through hole structure is arranged obliquely.
Preferably, the jet holes are distributed equidistantly on the circumferential side inside the water chamber.
Preferably, the side surface of the grinding wheel is positioned in the cavity of the water cavity.
The invention has the following beneficial effects:
1. according to the invention, through the arrangement of the jet hole and the grinding wheel, the outlet direction of the jet hole is parallel to the blade surface of the grinding wheel, so that the water flow sprayed out of the jet hole can be in parallel contact with the blade surface of the wheel, and further, the phenomenon that when the water flow of the original device is in contact with the blade surface of the grinding wheel, resistance is applied to the rotation process of the grinding wheel, and the cutting effect of the grinding wheel on the wafer is influenced is avoided.
2. According to the invention, through the arrangement of the jet hole and the water cavity, water sprayed out of the jet hole is subjected to the throwing force exerted by the grinding wheel, meanwhile, as the jet hole is obliquely arranged, when the thrown water flow contacts the position to be cut on the wafer, thrust is exerted on the silicon powder adhered to the surface of the area, and further the silicon powder leaves the area to be cut of the grinding wheel, so that the silicon powder is prevented from being driven and adhered to the surface of the area to be cut of the grinding wheel due to the flow of cooling accumulated water on the surface of the wafer, the grinding wheel is contacted with the silicon powder, and the abrasion of the grinding wheel is intensified, and the cutting effect of the wafer is influenced.
3. According to the invention, through the arrangement of the jet hole, water sprayed out of the jet hole is fully and continuously contacted with the wheel blade of the grinding wheel, so that the phenomenon that water flow sprayed out of an original device is only contacted with a certain area of the wheel blade of the grinding wheel for cooling is avoided, and thus the cooling effect is reduced.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic view of the structure of the present invention showing the flow direction of water;
FIG. 3 is a schematic side view of a jet hole of the present invention.
In the figure: 1. a grinding wheel; 2. a water chamber; 3. a flow-through hole; 4. a jet hole; 5. a pressurizing hole; 6. a rotating shaft; 7. a rotating seat; 8. a high pressure water pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a wafer dicing saw for computer motherboard treatment comprises a grinding wheel 1, wherein water cavities 2 are respectively and fixedly installed on two sides of the grinding wheel 1, a circulation hole 3 is formed in the grinding wheel 1 and located in the cavity of the water cavity 2, the circulation hole 3 horizontally penetrates through the grinding wheel 1, the circulation hole 3 is communicated with the water cavities 2 on two sides of the grinding wheel 1, a jet hole 4 is formed in the outer side of the inner side of the water cavity 2, the jet hole 4 is communicated with the water cavity 2, the outlet of the jet hole 4 faces to the blade surface of the grinding wheel 1 and is arranged in parallel, a rotating shaft 6 is fixedly installed on the left side of the grinding wheel 1, the left end of the rotating shaft 6 penetrates through the water cavity 2 on the left side of the grinding wheel 1, the left end of the rotating shaft 6 is fixedly connected with an output shaft of a motor, a rotating seat 7 is fixedly installed on the right side of the water cavity 2 on the right side of the grinding wheel 1, a high-pressure water pipe 8 is movably installed on the right side of the rotating seat 7, the high-pressure water pipe 8 moves relative to the rotating seat 7, the high-pressure water pipe 8 is communicated with the water cavities 2, when high-pressure water is introduced into the water cavity 2 through the high-pressure water pipe 8, the water cavities 2 on two sides of the grinding wheel 1 are filled with high-pressure water through the circulating hole 3, then the grinding wheel 1 is driven by the motor to rotate at a high speed, so that the grinding wheel 1 drives the water cavities 2 to rotate at a high speed, water in the water cavities 2 is subjected to the pressure of continuous water input by the subsequent high-pressure water pipe 8 and the throwing force generated when the grinding wheel 1 rotates, and then is sprayed to the blade surface of the grinding wheel 1 through the jet holes 4, because the outlet directions of the jet holes 4 are parallel to the blade surface of the grinding wheel 1, the water sprayed out of the jet holes 4 can not generate resistance to the rotation of the grinding wheel 1, thereby preventing the resistance from being applied to the rotation process of the grinding wheel 1 when the water of the original device is in contact with the blade surface of the grinding wheel 1, the cutting effect of the grinding wheel 1 on a wafer from being influenced, and simultaneously, because the outlet directions of the jet holes 4 are parallel to the blade surface of the grinding wheel 1, and the jet hole 4 is closer to the wheel blade of the grinding wheel 1, so that water flow sprayed from the jet hole 4 can reach the position where the wheel blade is contacted with the wafer more quickly, the cooling of the grinding wheel 1 is accelerated, and the cooling efficiency of the grinding wheel 1 is improved.
Please refer to fig. 2, the inside position that is located jet hole 4 inboard of water cavity 2 has seted up pressure boost hole 5, the diameter of pressure boost hole 5 is for reducing gradually the setting from inside to outside, pressure boost hole 5 constitutes the through-hole structure jointly with jet hole 4, this through-hole structure and water cavity 2 intercommunication, setting through pressure boost hole 5, when making the water in water cavity 2 through pressure boost hole 5, can further increase pressure, finally make rivers from jet hole 4 spun dynamics stronger, make rivers can be radial, fully contact the wheel cutting edge face of emery wheel 1, and then improve the cooling effect.
Referring to fig. 3, the through hole structure is obliquely arranged, so that water in the water chamber 2 can enter the through hole structure more easily when rotating, and meanwhile, after the water flow discharged from the jet hole 4 contacts the blade of the grinding wheel 1, the water flow can contact the front side of the operation area of the grinding wheel 1 on the surface of the wafer, so as to apply thrust to the silicon powder adhered to the front side area, so that the silicon powder leaves the current position, and the grinding wheel 1 is prevented from contacting the silicon powder in the operation process, thereby aggravating the wear of the grinding wheel 1 and affecting the cutting effect of the wafer, and later, when the moving mechanism drives the grinding wheel 1 to cut the next position on the surface of the wafer, the water flow can apply a shoveling thrust to the silicon powder adhered to the surface of the wafer due to the flow of cooling accumulated water on the surface of the wafer, so that the silicon powder leaves the area to be cut by the grinding wheel 1, and aggravating the wear of the grinding wheel 1 is avoided.
Referring to fig. 3, the jet holes 4 are equidistantly distributed on the circumferential side inside the water chamber 2, so that each region of the wheel blade surface of the grinding wheel 1 is fully contacted with water flow, and the water flow sprayed by the original device is prevented from being contacted with a certain region of the wheel blade of the grinding wheel 1 to reduce the temperature, thereby reducing the cooling effect.
Referring to fig. 2, the side surface of the grinding wheel 1 is located in the cavity of the water cavity 2, the water in the water cavity 2 cools the side surface of the grinding wheel 1, and the side surface of the grinding wheel 1 is continuously cooled through the water cavity 2 filled with water, so that a part of heat generated by the edge of the grinding wheel 1 is transferred to the side surface of the grinding wheel 1 and then is carried away by the water in the water cavity 2, and the cooling effect of the grinding wheel 1 is further improved.
The use method (working principle) of the invention is as follows:
when the silicon wafer cutting device works, the motor drives the grinding wheel 1 to rotate at a high speed, meanwhile, the high-pressure water pipe 8 continuously introduces high-pressure water into the water cavity 2, then the grinding wheel 1 is driven by the moving mechanism to cut a wafer, in the process that the grinding wheel 1 cuts the wafer, the water cavity 2 is filled with the high-pressure water through the circulation hole 3, then the high-pressure water passes through the pressurization hole 5 and the jet hole 4 and is finally sprayed to the blade face of the grinding wheel 1, the sprayed water cools and cools the blade of the grinding wheel 1, then the water flow on the blade face of the grinding wheel 1 is thrown away by the grinding wheel 1 and is thrown to the front side of the running area of the grinding wheel 1, the thrown water flow exerts thrust on the silicon powder adhered to the surface of the area, so that the silicon powder leaves the current position, then when the moving mechanism drives the grinding wheel 1 to cut the next position of the surface of the wafer, the thrown water flow can exert shovel on the surface of the silicon powder adhered to the surface of the wafer due to the flow of cooling accumulated water along with the surface of the wafer, so that the silicon powder leaves the area to be cut by the grinding wheel 1, and finally, when the surface of the wafer is cut, the wafer is stopped, and the water pipe 8 is taken off, and the water supply is intensified, and the water supply is finished.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a wafer scribing machine for computer motherboard handles, includes emery wheel (1), its characterized in that: the grinding wheel is characterized in that water cavities (2) are fixedly arranged on two sides of the grinding wheel (1) respectively, circulation holes (3) are formed in the grinding wheel (1), the circulation holes (3) penetrate through the grinding wheel (1) horizontally, the water cavities (2) on two sides of the grinding wheel (1) are communicated with one another through the circulation holes (3), jet holes (4) are formed in the cavity wall of the water cavity (2), the jet holes (4) are communicated with the water cavities (2), the outlet orientation of the jet holes (4) is parallel to the wheel blade face of the grinding wheel (1), a rotating shaft (6) is fixedly arranged on the left side of the grinding wheel (1), the left end of the rotating shaft (6) penetrates through the water cavities (2) on the left side of the grinding wheel (1), the right side of the water cavities (2) is fixedly provided with a rotating seat (7), a high-pressure water pipe (8) is movably arranged on the right side of the rotating seat (7), the high-pressure water pipe (8) and the rotating seat (7) move relatively, and the high-pressure water pipe (8) is communicated with the water cavities (2).
2. The dicing saw according to claim 1, wherein: pressure boost hole (5) have been seted up in the chamber wall of water cavity (2), the diameter of pressure boost hole (5) is for reducing gradually the setting from inside to outside, pressure boost hole (5) constitute the through-hole structure jointly with jet orifice (4), the through-hole structure communicates with water cavity (2).
3. The dicing saw according to claim 2, wherein: the through hole structure is arranged in an inclined mode.
4. The dicing saw according to claim 1, wherein: the jet holes (4) are distributed on the circumferential side in the water cavity (2) at equal intervals.
5. The dicing saw according to claim 1, wherein: the side surface of the grinding wheel (1) is positioned in the cavity body of the water cavity (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111289663.6A CN114131487B (en) | 2021-11-02 | 2021-11-02 | Wafer scribing machine for computer mainboard processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111289663.6A CN114131487B (en) | 2021-11-02 | 2021-11-02 | Wafer scribing machine for computer mainboard processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114131487A CN114131487A (en) | 2022-03-04 |
| CN114131487B true CN114131487B (en) | 2023-03-17 |
Family
ID=80392093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111289663.6A Active CN114131487B (en) | 2021-11-02 | 2021-11-02 | Wafer scribing machine for computer mainboard processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114131487B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118269240A (en) * | 2022-12-30 | 2024-07-02 | 桂林磨院材料科技有限公司 | Composite functional pressing plate of semiconductor dicing blade |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2119068A1 (en) * | 1971-04-20 | 1972-10-26 | Maag-Zahnräder & - Maschinen AG, Zürich (Schweiz) | Device on a grinding machine for cooling and cleaning the grinding wheel by means of liquid jets |
| JP3238339B2 (en) * | 1996-12-03 | 2001-12-10 | 三菱重工業株式会社 | Rolling roll grinding equipment |
| JP2007125867A (en) * | 2005-10-31 | 2007-05-24 | Kazumasa Onishi | Disk-shaped blade and cutting apparatus |
| CN109848875B (en) * | 2018-12-17 | 2020-06-09 | 湘潭大学 | Autonomous jet internal cooling grinding wheel |
| CN112658818B (en) * | 2020-12-19 | 2022-04-08 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
-
2021
- 2021-11-02 CN CN202111289663.6A patent/CN114131487B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN114131487A (en) | 2022-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Bianchi et al. | Evaluating the effect of the compressed air wheel cleaning in grinding the AISI 4340 steel with CBN and MQL with water | |
| US3258804A (en) | Centerless finishing machine | |
| CN114131487B (en) | Wafer scribing machine for computer mainboard processing | |
| CN206746879U (en) | A kind of catalyst module spray equipment | |
| CN110293482B (en) | Method for dressing circular arc diamond grinding wheel | |
| CN108393741A (en) | A kind of nitrogen stream penetrates hard turning processing unit (plant) and cutting process | |
| CN206998447U (en) | A kind of cooling control system with more recanalization cooling effectiveness | |
| CN201214200Y (en) | Automatic blanking machine of bearing ring centreless grinder | |
| CN115780905A (en) | Guide cooling device and method for circular saw blade | |
| JP6178753B2 (en) | Hobbing machine | |
| CN103128864B (en) | A kind of thrust bearing and electro spindle | |
| CN107470977A (en) | A kind of numerical control horizontal circular saw bench main shaft and the cooling system of sawing | |
| CN111843045A (en) | Cooling liquid shunting and radiating cutting machine | |
| CN112846929A (en) | Cooling device for cooling shaft core of electric spindle | |
| KR101986741B1 (en) | High Spindle Device having Turning machine for Boring | |
| SE432896B (en) | SWITCHING TOOL WITH A TURNABLE, CIRCLE SIZE HAPPENS | |
| CN206029588U (en) | Be applied to internal cooling main shaft mechanism that five metals polish with a waterstone machine | |
| JPH0425309A (en) | Cutting method and device therefore | |
| CN104060060B (en) | Heat treated refrigerating unit | |
| CN204052927U (en) | A kind of high speed pulsating turning machining device | |
| CN207359404U (en) | A kind of pellet device of degradation master batch | |
| CN208019559U (en) | A kind of automatic tracking mechanism of nozzle of numerical control helical bevel gear gear grinding machines | |
| CN206925381U (en) | Hydraulic pressure chipless peeler | |
| CN206998448U (en) | A kind of cooling controller based on real-time tool temperature automatic temperature-control | |
| CN207480354U (en) | A kind of burnishing device for metallic piston bar |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |