CN114131217A - Multi-size super-thick glass laser hole cutting equipment - Google Patents
Multi-size super-thick glass laser hole cutting equipment Download PDFInfo
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- CN114131217A CN114131217A CN202111620777.4A CN202111620777A CN114131217A CN 114131217 A CN114131217 A CN 114131217A CN 202111620777 A CN202111620777 A CN 202111620777A CN 114131217 A CN114131217 A CN 114131217A
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- 239000011521 glass Substances 0.000 title claims abstract description 121
- 238000005520 cutting process Methods 0.000 title claims abstract description 63
- 238000012545 processing Methods 0.000 claims abstract description 58
- 230000000712 assembly Effects 0.000 claims abstract description 46
- 238000000429 assembly Methods 0.000 claims abstract description 46
- 238000013519 translation Methods 0.000 claims abstract description 25
- 230000033001 locomotion Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 32
- 238000006073 displacement reaction Methods 0.000 claims description 30
- 239000000428 dust Substances 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 5
- 238000000034 method Methods 0.000 description 4
- 238000003672 processing method Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention relates to the field of glass laser hole cutting, in particular to multi-size ultra-thick glass laser hole cutting equipment, wherein the top surface of a base is provided with a plurality of groups of roller assemblies, the roller assemblies are used for driving glass to move along the X direction of the top surface of the base, the top surface of the base is provided with X-direction driving assemblies, two groups of portal frames are respectively arranged on the X-direction driving assemblies, Y-direction translation assemblies are respectively arranged on the portal frames, the Z-direction translation assemblies are arranged on the moving ends of the Y-direction translation assemblies, the Y-direction translation assemblies can drive the Z-direction movement assemblies to move along the Y direction, a laser processing system is arranged at the moving ends of the Z-direction movement assemblies, and the laser processing system can enable the processing ends to move in a three-dimensional space and carry out three-dimensional laser hole cutting processing on ultra-thick glass. This hole cutting equipment, to the high glass that passes through that many sizes, hole site are discrete, thickness differ, equipment can automatic adjustment portal frame, laser instrument, cylinder position and glass processing position, realizes the glass processing of arbitrary size, model, hole site.
Description
Technical Field
The invention relates to the field of glass laser hole cutting, in particular to laser hole cutting equipment for multi-size super-thick glass.
Background
Thick glass has good physical, mechanical and optical properties, has a huge application space, and is widely used as industrial and building materials. The method has good market prospect in the fields of aerospace, automobiles, electronic products, bathrooms, high-end furniture and the like. However, since this kind of glass is a brittle and hard material and has high requirements for processing, the traditional processing method has many disadvantages due to its unsatisfactory effect, and patent CN206999336U discloses a mechanical drilling processing device with a supporting plate and a pressing plate device, which aims to prevent the glass from bursting during cutting, but this still cannot solve the disadvantages of the traditional processing method, such as low efficiency, low yield, and limited type of processing hole. The laser processing has the characteristics of high energy density, no cutting force, high cutting speed and the like, and compared with the traditional processing mode, the laser processing method can improve the efficiency and the yield and has the advantage that the processing hole position is not limited by equipment.
With the continuous maturity of glass laser hole cutting technology, higher demands are made on the efficiency and cost of glass laser hole cutting in the industry. Patent CN113185107A has proposed that set up multiple processing modes such as laser drilling, edging on an equipment, make glass work piece can accomplish multiple type processing on an equipment, but this equipment can only practice thrift certain space on the assembly line, when the glass processing demand that faces many sizes, hole site are discrete, thickness are different, still can't avoid needing manual input parameter, easily produces the condition that the parameter error leads to unsatisfied processing demand or even damage equipment.
At the present stage, laser hole cutting equipment on the market can only be processed to the glass hole site of single type and size after putting into service, and these equipment often can only be to the single demand of single type glass, and when processing multiple type glass, certain limitation occasionally when the processing demand is comparatively complicated, can't switch over automatically between the different processing demands, more can not keep away the barrier according to the processing demand is automatic. At present, no equipment on the market can automatically adapt to the requirements of different types and sizes of glass and various hole cutting, and the processing is automatically switched on line between the requirements of various types and sizes of glass and hole positions and completed.
Disclosure of Invention
In order to solve the problems, the multi-size super-thick glass laser hole cutting equipment provided by the invention is oriented to high-transparency glass with multiple sizes, discrete hole sites and different thicknesses, and can automatically adjust the positions of a portal frame, a laser, a roller and a glass processing position, so that the high-precision processing of glass with any size and type and hole site is realized.
In order to achieve the purpose, the invention adopts the technical scheme that:
a multi-size super-thick glass laser hole cutting device comprises a base, an X-direction driving component, a portal frame, a Y-direction translation component, a Z-direction moving component, a roller component and a laser processing system,
wherein the middle part of the base is hollow, the top surface of the base is provided with a plurality of groups of roller assemblies, the roller assemblies are used for driving the glass to move along the X direction of the top surface of the base, the top surface of the base is provided with an X-direction driving assembly, two groups of portal frames are respectively arranged on the X-direction driving components, the portal frames can be driven by the X-direction driving components to move along the X direction, the portal frames extend along the Y direction, each portal frame is provided with a Y-direction translation assembly, the Z-direction moving component is arranged on the moving end of the Y-direction translation component, the Y-direction translation component can drive the Z-direction moving component to move along the Y direction, the laser processing system is arranged at the moving end of the Z-direction moving assembly, and the processing end of the laser processing system can be driven by the X-direction driving assembly, the Y-direction translation assembly and the Z-direction moving assembly to move in a three-dimensional space and perform three-dimensional laser hole cutting processing on the super-thick glass.
Preferably, the roller assemblies comprise a plurality of groups of movable roller assemblies and fixed roller assemblies, wherein the number of the movable roller assemblies is eight, the fixed roller assemblies are arranged at the initial section and the final section of each roller assembly, the eight groups of movable roller assemblies are arranged at intervals, and the fixed roller assemblies are arranged between the four groups of movable roller assemblies at two sides.
Preferably, the movable roller assembly comprises a support frame, a support cylinder and a servo motor, the extending end of the support cylinder is connected with the movable end of the support frame, a roller spanning the hollow area in the middle of the base is arranged on the support frame, the support cylinder can drive the roller to move on the movable end of the support frame in a certain range along the X direction, and the power end of the servo motor is connected with the roller to drive the roller to rotate in a servo mode.
Preferably, the multi-size ultra-thick glass laser hole cutting equipment further comprises a signal transmitting and collecting system, the signal transmitting and collecting system comprises laser displacement sensors, three laser displacement sensors are arranged at the moving end of each Z-direction moving assembly, the laser displacement sensors can move to the positions, such as the edge of the glass workpiece, equal to the glass in height through the Y-direction moving assembly and the Z-direction moving assembly, two reference edge displacement sensors are further arranged on the reference edge of the base, the two reference edge displacement sensors are matched with the six laser displacement sensors and used for obtaining a difference value between the actual position and the preset position of the glass through measuring the actual distance between the two reference edge displacement sensors and the glass, and the offset distance and the offset angle of the whole glass can be calculated through the difference value to determine the actual hole cutting position.
Preferably, a photoelectric switch is further installed below the portal frame, a detection surface of the photoelectric switch faces the direction of the roller assembly, 2 photoelectric switches are arranged in the transmission direction of the roller, in addition, in the conveying direction of the roller assembly, when the glass conveyed on the roller assembly passes through the first photoelectric switch, the roller assembly is decelerated, and when the glass conveyed on the roller assembly passes through the first photoelectric switch, the roller assembly stops.
Preferably, two install the laser processing system respectively on the portal frame, the laser processing system includes mounting panel, laser instrument, power supply box, speculum, galvanometer and field lens all connect the removal end at Z to the removal subassembly through the mounting panel, power supply box and laser instrument electric connection, the high frequency pulse laser that the power that the laser instrument provided through the power supply incasement can send, speculum, galvanometer and field lens are in proper order installed in the exit end the place ahead of laser instrument, speculum, galvanometer and field lens can be with the high frequency pulse laser reflection that the laser instrument sent and focus on its below is treated processing glass, and move to the removal subassembly through X to drive assembly, Y to translation subassembly and Z, make the laser instrument realize that three-dimensional motion carries out the stereotomy to glass.
Preferably, the three-dimensional moving assembly and the material receiving hopper are arranged below the hollow part of the base, the material receiving hopper is arranged at the moving end of the three-dimensional moving assembly, and the material receiving hopper can be driven by the three-dimensional moving assembly to move to the position right below the glass hole cutting position along with the laser in the synchronous three-dimensional direction to collect the excess materials.
Preferably, the bottom of the side wall of the receiving hopper is provided with an opening respectively, wherein the opening of the side wall is connected with a dust collector, and the dust collector absorbs dust formed in the hole cutting process through the receiving hopper.
Preferably, the below of three-dimensional removal subassembly is equipped with clout conveyer, and clout conveyer's direction of delivery end is equipped with the clout fill, connect the hole clout of cutting that the hopper was collected to fall into clout conveyer through connecing hopper bottom opening, send the clout to the clout fill on one side and clear up through clout conveyer.
Preferably, the motor is a servo motor.
The beneficial effects of the invention are as follows:
this hole cutting equipment adopts distributing type telecontrol equipment, drives the laser instrument and moves to plane optional position, realizes the arbitrary hole site of super thick glass and processes this hole cutting equipment integration and connect material dust pelletizing system, to processing back waste material and glass powder unified collection processing, extension device life realizes processing place dustlessness. Meanwhile, an intelligent distribution regulation and control system is carried to regulate and control the movement positions of the double gantries, the rollers and the lasers on line, so that the on-line switching of glass with multiple sizes, hole sites and thicknesses is realized, the labor is saved, the cost is saved, and the production efficiency is improved. The laser hole cutting component is carried, the processing requirement of holes with any shapes is met, and the bottleneck of industry development is broken through.
Drawings
FIG. 1 is a schematic diagram of the laser hole cutting equipment for multi-size super-thick glass according to the present invention.
FIG. 2 is a schematic view of a glass conveying system in the multi-sized ultra-thick glass laser hole-cutting apparatus according to the present invention.
FIG. 3 is a schematic diagram of a signal emission and collection system in the multi-size ultra-thick glass laser hole cutting device of the present invention.
FIG. 4 is a schematic view of a laser processing system in the multi-sized ultra-thick glass laser hole-cutting apparatus according to the present invention.
FIG. 5 is a schematic view of a waste collection system in the multi-sized ultra-thick glass laser hole-cutting apparatus according to the present invention.
The reference numerals include:
1-a portal frame, 2-a reference edge displacement sensor, 3-a moving roller component, 4-a fixed roller component, 5-an air cylinder, 6-a glass workpiece, 7-a laser displacement sensor, 8-a photoelectric switch, 9-a power box, 10-a reflector, 11-a galvanometer, 12-a flat field lens, 13-a receiving hopper, 14-a remainder conveying belt, 15-a remainder hopper, a 16-X direction driving component and a 17-Y direction translation component.
Detailed Description
In order to make the purpose, technical solution and advantages of the present technical solution more clear, the present technical solution is further described in detail below with reference to specific embodiments. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present teachings.
As shown in fig. 1, the multi-dimensional ultra-thick glass laser hole cutting apparatus provided in this embodiment includes a base, an X-direction driving assembly 16, a gantry 1, a Y-direction translation assembly 17, a Z-direction moving assembly, two sets of roller assemblies and a laser processing system, wherein the base has a hollow middle portion, the top surface of the base is provided with the roller assemblies, the roller assemblies are provided with a plurality of sets, the roller assemblies are used for driving a glass workpiece 6 to move along the X direction of the top surface of the base, the top surface of the base is provided with the X-direction driving assembly 16, the gantry 1 is provided with two sets of gantry 1 and respectively installed on the X-direction driving assembly 16, the gantry 1 can be driven by the X-direction driving assembly 16 to move along the X direction, the gantry 1 extends along the Y direction, each gantry 1 is provided with a Y-direction translation assembly 17, the Z-direction moving assembly is installed on a moving end of the Y-direction translation assembly 17, the Y-direction translation assembly 17 can drive the Z-direction moving assembly to move along the Y direction, the laser processing system is arranged at the moving end of the Z-direction moving assembly, and the laser processing system can be driven by the X-direction driving assembly 16, the Y-direction translation assembly 17 and the Z-direction moving assembly to enable the processing end to move in a three-dimensional space and carry out three-dimensional laser hole cutting processing on the ultra-thick glass. The roller assembly comprises a plurality of groups of movable roller assemblies 3 and fixed roller assemblies 4, wherein the movable roller assemblies 3 are eight groups, the fixed roller assemblies 4 are arranged on the initial section and the final section of each roller assembly, the eight groups of movable roller assemblies 3 are arranged at intervals, and the fixed roller assemblies 4 are arranged between the four groups of movable roller assemblies 3 on two sides. The movable roller component 3 comprises a support frame, a support cylinder 5 and a servo motor, the extending end of the support cylinder 5 is connected with the movable end of the support frame, a roller spanning the hollow area in the middle of the base is arranged on the support frame, the support cylinder 5 can drive the roller to move in a certain range on the movable end of the support frame along the X direction, and the power end of the servo motor is connected with the roller to drive the roller to rotate in a servo mode.
As shown in fig. 2, a base is composed of a plurality of support legs, a stand column and a cross beam, a working platform is arranged on the base, eight cylindrical movable roller assemblies 3 and a plurality of fixed roller assemblies 4 are uniformly arranged on the working platform, a support frame is arranged on each movable roller assembly 3, the movable roller assemblies are fastened with a support cylinder 5 and a negative pressure suction cup together, the movable roller assemblies 3 can be controlled to move in a certain range in the X direction through the expansion and contraction of the cylinders 5, and a servo motor and a support cross beam for driving a roller to rotate are arranged on the movable roller assemblies 3 and the fixed roller assemblies 4 and matched with a conveying device. The glass workpiece 6 is stably transported to a laser processing area through the roller assembly, and the position detection and the laser hole cutting work are carried out on the glass.
As shown in fig. 3, the multi-size ultra-thick glass laser hole cutting device further comprises a signal emission and collection system, the signal emission and collection system comprises laser displacement sensors 7, three laser displacement sensors 7 are arranged at the moving end of each Z-direction moving assembly, the laser displacement sensors 7 can move to the positions, such as the edge of the glass workpiece 6, equal to the height of the glass workpiece 6, through the Y-direction moving assembly 17 and the Z-direction moving assembly, two reference edge displacement sensors 2 are further arranged on the reference edge of the base, the two reference edge displacement sensors 2 are matched with the six laser displacement sensors 7 and used for obtaining the difference value between the actual position of the glass workpiece 6 and the preset position through measuring the actual distance between the glass workpiece and the actual position, and the offset distance and the offset angle of the whole glass workpiece 6 can be calculated through the difference value, and the actual hole cutting position can be determined.
Two portal frames 1 which are built on the working platform and extend along the Y direction are respectively provided with a tow chain component in the X direction and a linear guide rail in the X direction on the platforms at two ends of the portal frames 1, so that the two portal frames 1 can respectively move along the X direction. Three laser displacement sensors 7 are respectively arranged on the two portal frames 1, the laser displacement sensors 7 can move to the positions, such as the edge of the glass workpiece 6, equal to the glass in height through a Y-direction translation assembly 17 and a Z-direction movement assembly, two reference edge displacement sensors 2 are arranged on the reference edges of the platform, and position errors generated in the transportation process of the glass workpiece 6 can be measured through data obtained by the eight displacement sensors. The Z-direction moving assembly is preferably a lift motor.
The lower part of the portal frame 1 is also provided with a photoelectric switch 8, the detection surface of the photoelectric switch 8 faces the direction of the roller assembly, 2 photoelectric switches 8 are arranged in the transmission direction of the roller, in addition, in the conveying direction of the roller assembly, the roller assembly is decelerated when the glass workpiece 6 conveyed on the roller assembly passes through the first photoelectric switch 8, and the roller assembly stops when the glass workpiece 6 conveyed on the roller assembly passes through the first photoelectric switch 8.
As shown in fig. 4, two portal frames 1 are respectively provided with a laser processing system, the laser processing system comprises a mounting plate, a laser, a power box 9, a reflector 10, a galvanometer and a field lens 12, the power box 9, the reflector 10, the galvanometer and the field lens 12 are all connected with the moving end of the Z-direction moving component through the mounting plate, the power box 9 is electrically connected with the laser, the laser can emit high-frequency pulse laser through a power supply provided in the power box 9, the reflector 10, the galvanometer and the field lens 12 are sequentially arranged in front of the emitting end of the laser, the reflector 10, the galvanometer and the field lens 12 can reflect and focus the high-frequency pulse laser emitted by the laser on a glass workpiece 6 to be processed below the laser, and the glass workpiece 6 is cut in a three-dimensional manner by the laser through the movement of the X-direction driving component 16, the Y-direction translation component 17 and the Z-direction moving component.
As shown in fig. 5, a three-dimensional moving assembly and a receiving hopper 13 are arranged below the hollow part of the base, the receiving hopper 13 is arranged at the moving end of the three-dimensional moving assembly, and the receiving hopper 13 can be driven by the three-dimensional moving assembly to move to the position right below the hole cutting position of the glass workpiece 6 along with the synchronous three-dimensional direction of the laser to collect the excess materials.
The bottom of the side wall of the material receiving hopper 13 is provided with an opening respectively, wherein the opening of the side wall is connected with a dust collector, and the dust collector absorbs dust formed in the hole cutting process through the material receiving hopper 13.
The lower part of the three-dimensional moving assembly is provided with a residual material conveying belt 14, the tail end of the conveying direction of the residual material conveying belt 14 is provided with a residual material hopper 15, the hole cutting residual material collected by the receiving hopper 13 falls into the residual material conveying belt 14 through an opening at the bottom of the receiving hopper 13, and the residual material is conveyed into the residual material hopper 15 along one side through the residual material conveying belt 14 and is cleaned.
Specifically, a receiving hopper 13 and a residual material conveying belt 14 are installed in a lower framework of the working platform, two receiving hoppers 13 corresponding to the laser processing device are respectively connected to the three-dimensional moving assembly, each receiving hopper 13 is provided with a lifting motor, and through the devices, a dust collecting pipe on the dust collecting pipe can be moved to the position right below the hole cutting position of the glass workpiece 6 along the three-dimensional direction to convey the residual material. Connect hopper 13 to have two openings in side and bottom respectively, wherein the opening of side is connected with the dust catcher, the opening of bottom then directly faces the clout conveyer 14 of equipment bottom, the dust that the cut hole in-process formed etc. can be because the dust catcher is by the opening suction of side, and the clout of great piece then can directly drop to clout conveyer 14 from the opening of bottom on, the motor through drive clout conveyer 14 makes the belt through rotating, send the clout to clout fill 15 in along one side and clear up.
In combination with the above, before the glass workpiece 6 is transported, the two-dimensional code of the glass workpiece 6 is generated by inputting the size and the hole cutting position of the glass in advance, after the glass workpiece 6 enters the processing link, the position for transmitting the glass workpiece 6 is planned by identifying the two-dimensional code on the glass workpiece 6, the contraction of the air cylinder 5 in the movable roller assembly 3 is adjusted, and the position of the portal frame 1, the position of the laser displacement sensor 7 and the position of the laser are driven by the control motor to the planned position of the intelligent control system of the device. The glass workpiece 6 is transferred to a processing position at a high speed through the movable roller assembly 3 and the fixed roller assembly 4 in the glass transfer system, when the glass passes through the position of the first photoelectric switch 8, the roller assembly is changed from the high speed to the low speed, when the glass passes through the position of the second photoelectric switch 8, the roller assembly stops rotating instantly, and the glass workpiece 6 also stops at a preset position. After the glass workpiece 6 reaches the preset position, six laser displacement sensors 7 installed on the portal frame 1 are driven by the lifting motor to move downwards to the edge of the glass workpiece 6 and keep the same height with the glass workpiece 6, the difference value between the actual position of the glass workpiece 6 and the preset position can be obtained by measuring the actual distance between the actual position and the glass workpiece 6, the offset distance and the offset angle of the whole glass workpiece 6 can be calculated through the difference value, and the actual hole cutting position can be determined.
After the actual hole cutting position is determined, the position of the laser processing device is readjusted by controlling the motor, the three-dimensional moving assembly drives the dust collecting pipe to move along the XY direction translation assembly, the material receiving hopper 13 is conveyed to the position right below the hole cutting position, and the dust collecting pipe is lifted to move upwards to keep a closer distance with the glass workpiece 6. The laser is focused at the processing position to form a focus, and the hole cutting of the thick glass workpiece 6 is realized by the movement of the laser according to a specified track from the lower surface of the processing position of the glass workpiece 6. When the hole cutting is started, the dust collector is started, dust and small glass powder particles are sucked out from the side opening of the receiving hopper 13 by the dust collector, and large waste materials directly fall from the receiving hopper 13 to the residual material conveying belt 14 at the bottom of the device due to gravity. After the hole cutting of the glass workpiece 6 is completed, the glass conveying system is started again, and the completed glass workpiece 6 is conveyed out of the equipment. After the repeated operation is completed, more excess materials can be collected on the excess material conveying belt 14, the excess material motor is controlled to drive the excess material conveying belt 14 to rotate, and the excess materials are cleaned in the excess material collecting excess material hopper 15.
The foregoing is only a preferred embodiment of the present invention, and many variations in the specific embodiments and applications of the invention may be made by those skilled in the art without departing from the spirit of the invention, which falls within the scope of the claims of this patent.
Claims (10)
1. The utility model provides a many sizes super thick glass laser spot facing work equipment which characterized in that: comprises a base, an X-direction driving component, a portal frame, a Y-direction translation component, a Z-direction moving component, a roller component and a laser processing system,
wherein the middle part of the base is hollow, the top surface of the base is provided with a plurality of groups of roller assemblies, the roller assemblies are used for driving the glass to move along the X direction of the top surface of the base, the top surface of the base is provided with an X-direction driving assembly, two groups of portal frames are respectively arranged on the X-direction driving components, the portal frames can be driven by the X-direction driving components to move along the X direction, the portal frames extend along the Y direction, each portal frame is provided with a Y-direction translation assembly, the Z-direction moving component is arranged on the moving end of the Y-direction translation component, the Y-direction translation component can drive the Z-direction moving component to move along the Y direction, the laser processing system is arranged at the moving end of the Z-direction moving assembly, and the processing end of the laser processing system can be driven by the X-direction driving assembly, the Y-direction translation assembly and the Z-direction moving assembly to move in a three-dimensional space and perform three-dimensional laser hole cutting processing on the super-thick glass.
2. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 1, wherein: the roller assembly comprises a plurality of groups of movable roller assemblies and fixed roller assemblies, wherein the movable roller assemblies are eight groups, the fixed roller assemblies are arranged on the initial section and the tail section of each roller assembly, the eight groups of movable roller assemblies are arranged at intervals, and the fixed roller assemblies are arranged between the four groups of movable roller assemblies on the two sides.
3. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 2, wherein: the movable roller assembly comprises a support frame, a support cylinder and a motor, wherein the extending end of the support cylinder is connected with the movable end of the support frame, a roller spanning the hollow area in the middle of the base is arranged on the support frame, the support cylinder can drive the roller to move in a certain range on the movable end of the support frame along the X direction, and the power end of the motor is connected with the roller to drive the roller to rotate in a servo mode.
4. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 1, wherein: the multi-size super-thick glass laser hole cutting equipment further comprises a signal transmitting and collecting system, wherein the signal transmitting and collecting system comprises laser displacement sensors, each laser displacement sensor is arranged on the moving end of the Z-direction moving assembly, the laser displacement sensors can move to the positions, such as the edge of a glass workpiece, of the glass workpiece, the height of the glass workpiece is equal to that of the glass workpiece, the laser displacement sensors can move to the moving end of the Z-direction moving assembly through the Y-direction moving assembly and the Z-direction moving assembly, two reference edge displacement sensors are arranged on the reference edge of the base, the two reference edge displacement sensors are matched with the six laser displacement sensors, the difference value between the actual position of the glass workpiece and the preset position can be obtained through measuring the actual distance between the two reference edge displacement sensors and the six laser displacement sensors, the integral offset distance and the offset angle of the glass can be calculated through the difference value, and the actual hole cutting position can be determined.
5. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 1, wherein: the gantry type glass conveying device is characterized in that a photoelectric switch is further installed below the gantry, a detection surface of the photoelectric switch faces the direction of the roller assembly, 2 photoelectric switches are arranged in the transmission direction of the roller, in addition, in the conveying direction of the roller assembly, the roller assembly is decelerated when the glass conveyed on the roller assembly passes through a first photoelectric switch, and the roller assembly stops when the glass conveyed on the roller assembly passes through the first photoelectric switch.
6. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 1, wherein: two install the laser processing system on the portal frame respectively, the laser processing system includes mounting panel, laser instrument, power supply box, speculum, mirror and plano mirror that shakes, power supply box, speculum, mirror and plano mirror all connect the removal end at Z to the removal subassembly through the mounting panel, power supply box and laser instrument electric connection, the high frequency pulse laser that the power that the laser instrument provided can send through the power supply incasement, speculum, mirror and plano mirror are in proper order installs in the exit end the place ahead at the laser instrument, speculum, mirror and plano mirror can be with the high frequency pulse laser reflection that the laser instrument sent and focus on its below treats processing glass, and move to the removal subassembly to drive assembly, Y through X, to translation subassembly and Z, make the laser instrument realize that three-dimensional motion carries out the stereotomy to glass.
7. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 1, wherein: the utility model discloses a glass hole cutting machine, including base, solid removal subassembly and material receiving hopper, the removal end of solid removal subassembly is installed to the material receiving hopper, the below of the fretwork of base is equipped with the solid removal subassembly and connects the hopper, connect the hopper to install at the removal end of solid removal subassembly, should connect the hopper to remove to glass under the hole cutting position along with the synchronous three-dimensional direction of laser device by the drive of solid removal subassembly and collect the clout.
8. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 7, wherein: the bottom of the side wall of the material receiving hopper is provided with an opening respectively, wherein the opening of the side wall is connected with a dust collector, and the dust collector absorbs dust formed in the hole cutting process through the material receiving hopper.
9. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 8, wherein: the three-dimensional below that removes the subassembly is equipped with clout conveyer belt, and clout conveyer belt's direction of delivery end is equipped with the clout fill, connect the hole clout of cutting that the hopper was collected to fall into clout conveyer belt through connecing hopper bottom opening, send the clout to the clout fill in and clear up on one side through clout conveyer belt.
10. The multi-size ultra-thick glass laser hole-cutting apparatus according to claim 3, wherein: the motor is a servo motor.
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| CN202111620777.4A CN114131217A (en) | 2021-12-28 | 2021-12-28 | Multi-size super-thick glass laser hole cutting equipment |
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| CN202111620777.4A CN114131217A (en) | 2021-12-28 | 2021-12-28 | Multi-size super-thick glass laser hole cutting equipment |
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