CN114106712A - Cavity filter conductive adhesive bonding process - Google Patents
Cavity filter conductive adhesive bonding process Download PDFInfo
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- CN114106712A CN114106712A CN202111516128.XA CN202111516128A CN114106712A CN 114106712 A CN114106712 A CN 114106712A CN 202111516128 A CN202111516128 A CN 202111516128A CN 114106712 A CN114106712 A CN 114106712A
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- conductive adhesive
- cavity filter
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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Abstract
The invention discloses a cavity filter conductive adhesive bonding process, which comprises the following steps: cutting the top end of the microstrip line into a chute, and cleaning the redundant substances of the microwave assembly shell and the cavity filter; taking the two-component conductive adhesive out of the refrigerator, heating, and uniformly stirring; weighing according to the mass ratio requirement, and stirring and mixing uniformly; uniformly coating the conductive adhesive on the corresponding positions of the microwave component shell and the cavity filter in advance; installing the cavity filter coated with the conductive adhesive into a shell of the microwave assembly; cleaning the overflowing conductive adhesive, and filling gaps on two sides of the cavity filter and the microwave assembly shell with the conductive adhesive; selecting process parameters according to the curing characteristics of the conductive adhesive and placing the conductive adhesive into an oven for curing; and welding the inner conductor of the glass insulator to interconnect the inner conductor with the microstrip line in the microwave assembly, and cleaning the soldering flux generated by welding. The cavity filter can meet the requirements of high stopband rejection degree, high grounding performance and the like of the cavity filter, greatly reduces the debugging difficulty of the microwave assembly, has strong operability, and can be reworked and repaired for many times.
Description
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to a cavity filter conductive adhesive bonding process for a microwave assembly.
Background
The cavity filter is a microwave filter adopting a resonant cavity structure. One cavity can be equivalent to an inductor and a capacitor connected in parallel, so that a resonant level is formed, and the microwave filtering function is realized. Compared with other types of filters such as LC filters, dielectric filters, crystal filters, microstrip filters and the like, the cavity filter has the advantages of firm structure, stable and reliable performance, high Q value and good heat dissipation performance, and has very wide application in the fields of microwave components and the like because the high-end parasitic passband is far.
The conductive adhesive bonding process is an epoxy resin bonding process, and is to adopt a resin adhesive doped with metals such as gold, silver and the like to be coated between a packaging body or a chip and the like, select specific curing parameters according to the material characteristics of the conductive adhesive, and finally form a good electrical and thermal conductor. In a microwave module, a chip, a carrier, a substrate, and the like are generally bonded using a conductive adhesive. According to the application, ABLEBOND 84-1A, EPO-TEK H20E, DAD-87 and the like are commonly used at present.
At present, a screw fastening mode is generally used as an assembly process of a cavity filter in a microwave component shell, and inner conductors of glass insulators at two ends of the cavity filter are welded to a microstrip line, so that a microwave filtering function is realized. At present, a part of filters in China begin to use a conductive adhesive bonding process. However, since a certain gap inevitably exists between the microwave module housing and the cavity filter, the radio frequency signal is coupled through the gap, which results in poor isolation, reduced stop band rejection, and affected grounding performance of the filter. For example, in patent CN1037367713B (manufacturing and processing method of front end module of K2 band receiver), CN109673104B (processing method of excitation signal module used in frequency synthesizer), etc., only the outer ring is coated with conductive adhesive, and the process used in the above patent can not meet the requirements for complex components and products with high index requirements such as grounding and suppression.
Therefore, in order to solve the problems in the assembly of such a cavity filter, an assembly process of the cavity filter for the microwave module is urgently needed, so that the requirements of high stop band rejection degree, high grounding performance and the like of the cavity filter are met, and the debugging difficulty of the microwave module is reduced.
Disclosure of Invention
The invention aims to provide a process for bonding a conductive adhesive of a cavity filter, which is used for meeting the requirements of high stopband rejection degree, high grounding performance and the like of the cavity filter and reducing the debugging difficulty of a microwave assembly.
The technical solution for realizing the purpose of the invention is as follows: a cavity filter conductive adhesive bonding process comprises the following steps:
step 1, cutting a chute at the top end of a microstrip line, and cleaning redundant substances of a microwave assembly shell and a cavity filter;
step 2, taking the two-component conductive adhesive out of the refrigerator and returning the temperature;
step 3, respectively stirring the component A and the component B of the double-component conductive adhesive uniformly;
8, selecting process parameters according to the curing characteristics of the conductive adhesive and placing the conductive adhesive into an oven for curing;
step 9, after the solidification is finished, welding the glass insulator inner conductor to interconnect the inner conductor and the microstrip line in the microwave assembly;
and step 10, cleaning the soldering flux generated by welding.
Further, the microstrip line in the step 1 is a Rogers 5880 board, and the thickness is 0.254 mm;
the microwave assembly shell is made of 6061 aluminum alloy, and the surface treatment mode is as follows: plating nickel to form a bottom at the welding position of the microstrip line, wherein the thickness of the bottom is 5 mu m, plating gold on the surface of the bottom, the thickness of the bottom is 0.5 mu m, and conducting oxidation is carried out on the rest non-welding positions by using natural color;
the housing of the cavity filter is made of H62 brass, and the surface of the cavity filter is subjected to silver plating treatment;
and cutting the top end of the microstrip line into a chute with the thickness of 0.1-0.15 mm by using a scalpel, wherein the cutting chute is used for observing whether excess exists below a glass insulator of the cavity filter.
Further, the conductive adhesive in step 2 is a low-temperature cured DAD-40 conductive adhesive, and comprises the following components: the main resin adopts epoxy resin or amine curing agent; the filler adopts flake silver powder; the temperature rising time is 15-30 minutes.
Further, the stirring modes in the step 3 and the step 4 are both as follows: stirring was performed using a tungsten needle.
Further, the mass ratio of the component A to the component B of the two-component conductive adhesive in the step 4 is 1:1, and the weighing tool is an analytical balance.
Further, the corresponding positions of the cavity filter and the microwave component housing in step 5 are respectively: uniformly coating the conductive adhesive which is uniformly stirred and mixed on the corresponding position of the shell of the microwave assembly in advance, wherein the coating height of the conductive adhesive is 3.5-4 mm; coating the area on two sides of the end face of the cavity filter, wherein the coating amount is required to be 2-3 mm away from the center of the glass insulator; the coating is coated at the corner of the side surface of the cavity filter, and the length of the coating is 5 mm. By adopting the process method and the coating parameters in the step, the requirement of the cavity filter on high grounding performance can be met.
Further, the fastening mode in step 6 is to mount and fasten by using M1.6 countersunk head screws.
Further, the conductive adhesive is cleaned by using non-woven fabrics in the step 7; filling up the conducting resin mode with the both sides gap of cavity filter and microwave subassembly casing and gluing for using manual point gum machine to carry out the point, the parameter is glued to the point: the type of the needle head is that a screw port 27G is transparent, and the outer diameter is 0.4 mm; dispensing pressure is 40psi, and dispensing time is 2-3 s. Through the step, the signal of the cavity filter can be ensured not to be leaked, and the requirement of high stop band rejection degree is met.
Further, the curing parameters in step 8 are: the temperature is 100 ℃ and the time is 60 minutes.
Further, the welding mode in step 9 is: soldering with electric iron with solder wire of 0.5mm length, and Sn-37 Pb.
Compared with the prior art, the invention has the following remarkable advantages:
(1) the cavity filter can meet the requirements of high stopband rejection degree, high grounding performance and the like of the cavity filter, and greatly reduces the debugging difficulty of the microwave assembly;
(2) the invention has simple process and strong operability, can be reworked and repaired for many times, and can complete the bonding process of the conductive adhesive without using complex tools, equipment and the like;
(3) the invention has strong universality, and the process can meet the bonding process of other filters such as LC filters, dielectric filters and the like.
Drawings
Fig. 1 is a flow chart of the bonding process of the cavity filter conductive adhesive of the present invention.
Fig. 2 is a cross-sectional view of the cavity filter conductive adhesive bonding process according to the present invention.
Fig. 3 is a schematic diagram of the position of the microwave assembly housing where the conductive adhesive is coated according to the present invention.
Fig. 4 is a schematic diagram of the coating position of the cavity filter conductive adhesive according to the present invention.
Fig. 5 is a schematic diagram of the coating position of the cavity filter conductive adhesive according to the present invention.
Reference numerals:
the novel micro-strip line filter comprises a 1-cavity filter, a 2-glass insulator, a 3-solder wire, a 4-M1.6 countersunk head screw, a 5-micro-strip line, a 6-microwave component shell and 7-conductive adhesive.
Detailed Description
With reference to fig. 1, the invention relates to a cavity filter conductive adhesive bonding process, which comprises the following steps:
step 1, cutting a chute at the top end of a microstrip line 5, and cleaning the redundant substances of a microwave assembly shell 6 and a cavity filter 1;
step 2, taking the two-component DAD-40 conductive adhesive 7 out of the refrigerator and returning to the temperature;
step 3, uniformly stirring the two-component DAD-40 conductive adhesive 7;
8, selecting process parameters according to the curing characteristics of the conductive adhesive 7 and putting the conductive adhesive into an oven for curing;
step 9, after the solidification is finished, welding the inner conductor of the glass insulator 2 to interconnect the inner conductor with the microstrip line 5 in the microwave assembly;
and step 10, cleaning the soldering flux generated by welding.
Further, the microwave assembly housing 6 in step 1 is made of 6061 aluminum alloy, and the surface treatment mode is as follows: plating nickel to form a bottom at the welding position of the microstrip line, wherein the thickness of the bottom is 5 mu m, plating gold on the surface of the bottom, the thickness of the bottom is 0.5 mu m, and conducting oxidation is carried out on the rest non-welding positions by using natural color;
h62 brass is used as a shell material of the cavity filter 1, and silver plating treatment is carried out on the surface of the shell material; the inner conductor of the glass insulator 2 is made of kovar material and is subjected to surface gold plating treatment
The microstrip line 5 is a Rogers 5880 board, has the thickness of 0.254mm, and is welded into the microwave assembly shell 6 by solder paste reflow;
the top end of the microstrip line 5 is cut into a chute with the diameter of about 0.1-0.15 mm by using a scalpel, and the novel scheme of the invention for cutting the chute aims at facilitating observation of existence of excess under the glass insulator 2 and ensuring the assembly quality;
further, the conductive adhesive 7 in the step 2 is a low-temperature curing conductive adhesive, and the DAD-40 is widely used in the invention due to the fact that the conductive adhesive can be repaired for multiple times. The main components are divided into two categories: 1) host resins (epoxy/amine curing agents); 2) fillers (plate-like silver powder). The temperature rising time is 15-30 minutes.
Further, the stirring manner of the conductive adhesive 7 in the step 3 is as follows: the mixture is stirred uniformly along the same direction by using a tungsten needle or other tools.
Further, the conductive adhesive 7 in the step 4 is prepared in the following manner: mixing according to the mass ratio of 1:1 by using an analytical balance, and uniformly mixing and stirring by using tools such as a tungsten needle and the like.
Further, the coating mode in step 5 is as follows: a tungsten needle or the like is used to coat the conductive paste 7 on the surface of the microwave module case 6 and the cavity filter 1.
Further, the fastening manner in step 6 is: fastening is performed using M1.6 countersunk head screws 4.
Further, the manner of cleaning the overflowing conductive adhesive 7 in step 7 is as follows: erasing the conductive adhesive 7 overflowing from the surface by using non-woven fabric;
the process for filling the conductive adhesive 7 comprises the following steps: dispensing by using a manual dispenser, wherein the type of a needle head is screw 27G transparent, and the outer diameter is 0.4 mm; the dispensing pressure was 40psi and the dispensing time was determined by the dispensing length.
Further, the curing parameters in step 8 are that the curing temperature is 100 ℃ and the curing time is 60 minutes.
Further, the inner conductor of the solder glass insulator 2 described in step 9 is formed by: the solder wire 3 with a length of about 0.5mm is soldered by using an electric soldering iron.
Further, the method for cleaning the soldering flux in step 10 is as follows: the flux was wiped with an alcohol cotton ball.
The invention is further described with reference to the following drawings and specific examples.
Examples
As shown in fig. 2, the microwave assembly housing 6 used in the present embodiment is made of 6061 aluminum alloy, and the surface treatment method is as follows: the welding position of the microstrip line is primed by nickel plating, the thickness is 5 mu m, then gold is plated on the surface of the microstrip line, the thickness is 0.5 mu m, and the rest non-welding positions are oxidized by natural color conduction. In the cavity filter 1 used in this embodiment, H62 brass is used as a housing material, and surface silver plating is performed; the inner conductor of the glass insulator 2 is made of kovar material and is subjected to surface gold plating treatment. The conductive adhesive used in the embodiment is a low-temperature curing conductive adhesive, the model is DAD-40, and the main components are divided into two types: 1) host resins (epoxy/amine curing agents); 2) fillers (plate-like silver powder). This embodiment uses the soldering iron to weld 3 the solder wires of length about 0.5mm for glass insulator 2 forms the interconnection with microstrip line 5, and the solder wire composition is: sn-37 Pb.
As shown in fig. 3, for the bonding of the lower part of the glass insulator 2 of the cavity filter 1, a tungsten needle or other tools is used to uniformly coat the conductive adhesive 7 on the corresponding position of the microwave assembly housing 6 in advance, and the coating height of the conductive adhesive 7 is 3.5-4 mm.
As shown in fig. 4, a proper amount of conductive adhesive 7 is picked up by a tungsten needle or other tools and uniformly coated on the two sides of the end surface of the cavity filter 1, and as shown by the hatched portion of the single oblique line in the figure, the coating amount of the conductive adhesive 7 is required to be 2-3 mm away from the center of the glass insulator 2. In addition, for the gap between the microwave component housing 6 and the cavity filter 1, glue dispensing and gap plugging are required to be performed by using a glue dispenser.
As shown in fig. 5, the corner of the cavity filter 1 on the side is coated with a conductive paste 7 with a length of about 5 mm.
The implementation steps of the cavity filter conductive adhesive bonding process of the embodiment are as follows:
(1) cutting the top end of the microstrip line 5 into a chute with the thickness of about 0.1-0.15 mm, and cleaning the microwave assembly shell 6 and the redundant substances of the cavity filter 1.
(2) And taking the two-component DAD-40 conductive adhesive 7 out of the refrigerator and returning the temperature for 15-30 minutes.
(3) The two-component DAD-40 conductive adhesive 7 is uniformly stirred by using a tool such as a tungsten needle and the like.
(4) And (3) weighing the conductive adhesive 7 by using an analytical balance according to the requirement of the mass ratio of 1:1, and stirring and mixing uniformly.
(5) As shown in FIG. 3, a tungsten needle or other tools are used to uniformly coat the conductive adhesive 7 on the corresponding position of the microwave module housing 6 in advance, and the coating height of the conductive adhesive 7 is 3.5-4 mm.
(6) As shown in fig. 4, a proper amount of conductive adhesive 7 is picked up by a tungsten needle or other tools and uniformly coated on the two sides of the end surface of the cavity filter 1, and as shown by the hatched portion of the single oblique line in the figure, the coating amount of the conductive adhesive 7 is required to be 2-3 mm away from the center of the glass insulator 2.
(7) As shown in fig. 5, the corner of the cavity filter 1 on the side is coated with a conductive paste 7 with a length of about 5 mm.
(8) The cavity filter 1 coated with the conductive paste 7 is mounted in the microwave assembly housing 6 with M1.6 countersunk screws 4.
(9) And cleaning the overflowing conductive adhesive 7 by using non-woven fabrics, and filling gaps on two sides of the cavity filter 1 and the microwave component shell 6 with the conductive adhesive 7 by using a manual dispenser. The dispensing parameters are as follows: the type of the needle head is that a screw port 27G is transparent, and the outer diameter is 0.4 mm; dispensing pressure is 40psi, and dispensing time is 2-3 s.
(10) Selecting technological parameters according to the curing characteristics of the conductive adhesive 7, and putting the conductive adhesive into an oven for curing, wherein the curing parameters are as follows: the temperature is 100 ℃, and the curing time is 60 minutes.
(11) An electric soldering iron is used for welding the inner conductor of the glass insulator 2, so that the inner conductor is interconnected with the microstrip line 5 in the microwave assembly. The welding materials are as follows: a solder wire with a length of 0.5mm, and the component is Sn-37 Pb.
(12) Cleaning the soldering flux generated by welding by using an alcohol cotton ball.
The cavity filter conductive adhesive bonding process can be completed through the 12 steps, the requirements of high stopband rejection degree, high grounding performance and the like of the cavity filter can be met, and the debugging difficulty of the microwave assembly is greatly reduced. The process has extremely strong operability, can be reworked and repaired for many times, and has a great guiding function on other similar products (such as LC filters and dielectric filters).
Claims (10)
1. A cavity filter conductive adhesive bonding process is characterized by comprising the following steps:
step 1, cutting a chute at the top end of a microstrip line, and cleaning redundant substances of a microwave assembly shell and a cavity filter;
step 2, taking the two-component conductive adhesive out of the refrigerator and returning the temperature;
step 3, respectively stirring the component A and the component B of the double-component conductive adhesive uniformly;
step 4, weighing the components A and B according to the mass ratio of the two-component conductive adhesive, and uniformly stirring and mixing;
step 5, coating, stirring and mixing uniformly conductive adhesive on corresponding positions of the cavity filter and the microwave assembly shell;
step 6, fastening the cavity filter coated with the conductive adhesive into the shell of the microwave assembly;
step 7, cleaning the overflowing conductive adhesive, and filling gaps on two sides of the cavity filter and the microwave component shell with the conductive adhesive;
8, selecting process parameters according to the curing characteristics of the conductive adhesive and placing the conductive adhesive into an oven for curing;
step 9, after the solidification is finished, welding the glass insulator inner conductor to interconnect the inner conductor and the microstrip line in the microwave assembly;
and step 10, cleaning the soldering flux generated by welding.
2. The cavity filter conductive adhesive bonding process of claim 1, wherein: the microstrip line in the step 1 is a Rogers 5880 board, and the thickness is 0.254 mm;
the microwave assembly shell is made of 6061 aluminum alloy, and the surface treatment mode is as follows: plating nickel to form a bottom at the welding position of the microstrip line, wherein the thickness of the bottom is 5 mu m, plating gold on the surface of the bottom, the thickness of the bottom is 0.5 mu m, and conducting oxidation is carried out on the rest non-welding positions by using natural color;
the housing of the cavity filter is made of H62 brass, and the surface of the cavity filter is subjected to silver plating treatment;
and cutting the top end of the microstrip line into a chute with the thickness of 0.1-0.15 mm by using a scalpel, wherein the cutting chute is used for observing whether excess exists below a glass insulator of the cavity filter.
3. The cavity filter conductive adhesive bonding process of claim 1, wherein: the conductive adhesive in the step 2 is a low-temperature cured DAD-40 conductive adhesive, and comprises the following components: the main resin adopts epoxy resin or amine curing agent; the filler adopts flake silver powder; the temperature rising time is 15-30 minutes.
4. The cavity filter conductive adhesive bonding process of claim 1, wherein: the stirring modes in the step 3 and the step 4 are as follows: stirring was performed using a tungsten needle.
5. The cavity filter conductive adhesive bonding process of claim 1, wherein: and 4, the mass ratio of the component A to the component B of the two-component conductive adhesive is 1:1, and the weighing tool is an analytical balance.
6. The cavity filter conductive adhesive bonding process of claim 1, wherein: the corresponding positions of the cavity filter and the microwave component shell in the step 5 are respectively as follows: uniformly coating the conductive adhesive which is uniformly stirred and mixed on the corresponding position of the shell of the microwave assembly in advance, wherein the coating height of the conductive adhesive is 3.5-4 mm; coating the area on two sides of the end face of the cavity filter, wherein the coating amount is required to be 2-3 mm away from the center of the glass insulator; the coating is coated at the corner of the side surface of the cavity filter, and the length of the coating is 5 mm.
7. The cavity filter conductive adhesive bonding process of claim 1, wherein: the fastening mode in the step 6 is to use M1.6 countersunk head screws for mounting and fastening.
8. The cavity filter conductive adhesive bonding process of claim 1, wherein: the conductive adhesive is cleaned by using non-woven fabrics in the step 7; filling up the conducting resin mode with the both sides gap of cavity filter and microwave subassembly casing and gluing for using manual point gum machine to carry out the point, the parameter is glued to the point: the type of the needle head is that a screw port 27G is transparent, and the outer diameter is 0.4 mm; dispensing pressure is 40psi, and dispensing time is 2-3 s.
9. The cavity filter conductive adhesive bonding process of claim 1, wherein: the curing parameters in step 8 are: the temperature is 100 ℃ and the time is 60 minutes.
10. The cavity filter conductive adhesive bonding process of claim 1, wherein: the welding mode in the step 9 is as follows: soldering with electric iron with solder wire of 0.5mm length, and Sn-37 Pb.
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| CN202111516128.XA CN114106712B (en) | 2021-12-06 | 2021-12-06 | Cavity filter conductive adhesive bonding process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202171471U (en) * | 2011-08-24 | 2012-03-21 | 贵州航天风华精密设备有限公司 | Device for inspecting superfluous objects in spacecraft cabin body |
| CN204376844U (en) * | 2015-02-10 | 2015-06-03 | 北京中讯四方科技股份有限公司 | The outer high far-end of band suppresses high LC filter |
| CN110763688A (en) * | 2019-11-01 | 2020-02-07 | 沈阳航空航天大学 | System and method for detecting blind hole surplus objects |
| CN111430850A (en) * | 2020-03-31 | 2020-07-17 | 北京无线电计量测试研究所 | Coaxial microstrip-to-coaxial connector applicable to cavity filter and assembling method |
-
2021
- 2021-12-06 CN CN202111516128.XA patent/CN114106712B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202171471U (en) * | 2011-08-24 | 2012-03-21 | 贵州航天风华精密设备有限公司 | Device for inspecting superfluous objects in spacecraft cabin body |
| CN204376844U (en) * | 2015-02-10 | 2015-06-03 | 北京中讯四方科技股份有限公司 | The outer high far-end of band suppresses high LC filter |
| CN110763688A (en) * | 2019-11-01 | 2020-02-07 | 沈阳航空航天大学 | System and method for detecting blind hole surplus objects |
| CN111430850A (en) * | 2020-03-31 | 2020-07-17 | 北京无线电计量测试研究所 | Coaxial microstrip-to-coaxial connector applicable to cavity filter and assembling method |
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| CN114106712B (en) | 2023-10-13 |
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