CN117241494A - High-reliability radio frequency LC filter assembly method - Google Patents
High-reliability radio frequency LC filter assembly method Download PDFInfo
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- CN117241494A CN117241494A CN202311199986.5A CN202311199986A CN117241494A CN 117241494 A CN117241494 A CN 117241494A CN 202311199986 A CN202311199986 A CN 202311199986A CN 117241494 A CN117241494 A CN 117241494A
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- chip capacitor
- filter
- radio frequency
- ltcc substrate
- assembling
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000003990 capacitor Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000002791 soaking Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 239000003292 glue Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The invention relates to the field of radio frequency LC filter manufacturing, in particular to a high-reliability radio frequency LC filter assembling method; the method comprises the steps of obtaining an LTCC substrate with a metal surrounding frame; dispensing an adhesive between two adjacent bonding pads for mounting the chip capacitor; sucking the chip capacitor by a vacuum sucking pen, placing the chip capacitor at the dispensing position of the adhesive, and enabling the chip capacitor to be contacted with the two adjacent bonding pads simultaneously; pre-fixing an inductance coil on the LTCC substrate after the chip capacitor is bonded; after the pre-fixing is finished, a solder paste is smeared on a bonding pad used for installing the chip capacitor and the inductance coil on the LTCC substrate by using a glue dispenser; finally, welding and assembling the device through a reflow oven; the invention solves the problems of difficult manual welding operation, low efficiency, poor consistency and the like of the radio frequency LC filter of the metal surrounding frame shell, does not need complex fixed tooling design in the whole welding process, can realize high-reliability product assembly, and is beneficial to batch production of the radio frequency LC filter.
Description
Technical Field
The invention relates to the field of radio frequency LC filter manufacturing, in particular to a high-reliability radio frequency LC filter assembling method.
Background
The radio frequency LC filter has wide relative bandwidth coverage range, can simultaneously give consideration to indexes such as small group delay fluctuation, small insertion loss, high reliability and the like, and is widely applied to the fields of aviation, aerospace, navigation, communication, remote sensing and telemetry and the like. The conventional assembly method of the rf LC filter is to manually weld elements such as a capacitor and an inductor on a printed board, then reflow-weld the welded printed board, and finally assemble a housing. The product has relatively complex procedures, and the phenomena of warp deformation of the printed board, falling off of the bonding pad and the like can also occur due to repeated thermal shock in the element welding process, so that the phenomenon of loose adhesion between the printed board and the shell in the later stage when the printed board is arranged in the shell is caused, and the reliability of the product in the later stage is affected. In addition, due to the separation structure of the product shell and the printed board, the volume and the size of the product are relatively large, which is not beneficial to the realization of miniaturization of the product.
In recent years, along with the continuous high-speed growth of the electronic industry at home and abroad, the electronic component industry is driven to develop vigorously, the demand for miniaturization and integration of products is becoming stronger, the radio frequency LC filter based on the LTCC cavity structure is generated, and the radio frequency LC filter based on the LTCC cavity structure is different from the traditional radio frequency LC filter in that the metal cavity is filled for packaging after the components are welded on a printed board, and the radio frequency LC filter based on the LTCC cavity structure adopts an LTCC substrate and a metal surrounding frame to realize integrated structural design, so that the volume size of the manufactured products can be greatly reduced. When the radio frequency LC filter based on the LTCC cavity structure is designed, circuit wires are directly buried in the LTCC substrate, and a printed board is not required to be manufactured additionally, so that the size of a product can be effectively reduced, and the problem of reliability of secondary assembly of the printed board and a shell of the conventional LC filter is also avoided.
However, due to the problems of cavity depth, component density and the like, the LTCC cavity structure is basically manufactured by manual welding by skilled technical workers, has higher welding technical requirements on operators, has poor consistency of assembled finished products, is difficult to ensure production efficiency and product quality, and is not beneficial to batch production.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention aims to provide a high-reliability radio frequency LC filter assembly method for completing the assembly and manufacture of an LC filter based on an LTCC cavity structure.
The scheme provided by the invention comprises the following steps:
s1, obtaining an LTCC substrate with a metal surrounding frame;
s2, aiming at two adjacent bonding pads used for mounting the chip capacitor on the LTCC substrate, and dispensing an adhesive at the central positions of the two adjacent bonding pads by using a dispenser;
s3, sucking the chip capacitor by using a vacuum suction pen, placing the chip capacitor at the position of the adhesive coated in the step S2, and lightly pressing to enable the chip capacitor to be contacted with two adjacent bonding pads simultaneously;
s4, pre-fixing the inductance coil on the LTCC substrate after the chip capacitor is bonded;
s5, after the pre-fixing is finished, using a dispenser to paint soldering paste on a bonding pad on the LTCC substrate for mounting the chip capacitor and the inductance coil;
s6, placing the product obtained in the step S5 into a reflow oven for welding and assembling the device.
Further, the metal surrounding frame is welded on the LTCC to obtain the LTCC substrate with the metal surrounding frame in the step S1, wherein the length and width of the metal surrounding frame are consistent with those of the LTCC, and metal lines are buried in the LTCC substrate.
Further, the step S4 of pre-fixing the inductor includes:
s11, aiming at two adjacent bonding pads on the LTCC substrate for installing the inductance coil;
s12, placing the inductance coil between the two adjacent bonding pads by using tweezers;
s13, applying current and pressure to the inductance coil pins through a chopper to enable the contact surface metal of the inductance coil pins and the bonding pads to be melted locally, and achieving pre-fixing of the inductance coils.
Further, step S1 further includes: and cleaning the LTCC substrate by absolute ethyl alcohol and naturally airing.
Further, in step S2, an adhesive is dispensed between two adjacent bonding pads using a dispensing syringe.
Further, the welded and assembled product is placed into a cleaning agent for soaking, and then is placed into an oven for baking and drying.
Further, the soaking time is 3-5 min, the oven temperature is 85 ℃ and the baking time is 10min. Further, the baked and dried product is subjected to cover plate encapsulation in a parallel sealing welding mode.
Further, after the cover plate is packaged, silicone rubber is coated on the gap between the inductance coil and the LTCC substrate with the metal surrounding frame in a spot coating mode for reinforcement.
The invention has the beneficial effects that:
compared with the prior art, the assembly method solves the problems of low manual welding efficiency, poor consistency and the like, the welding process does not need complex fixed tooling design, the skill requirement on assembly staff is low, the production efficiency and quality of the product can be well ensured, and the mass production of the radio frequency LC filter is facilitated.
Drawings
FIG. 1 is a flow chart of an assembly method of the present invention;
FIG. 2 is an assembled schematic view of an embodiment of the present invention;
fig. 3 shows an LTCC substrate with a metal frame according to an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The LC filter based on the LTCC cavity structure is difficult to ensure production efficiency and product quality due to the reasons of cavity depth, component density, inductance coil assembly and the like, the assembly of the chip capacitor and the inductance coil is carried out in a manual welding mode, the welding technical requirements on operators are high, the consistency of assembled finished products is poor, and the mass production is not facilitated. In order to solve the problems, the invention provides a high-reliability radio frequency LC filter assembly method which is more efficient and quick without complex fixed tools.
A highly reliable method of assembling a radio frequency LC filter, as shown in fig. 1, comprising the steps of:
s1, obtaining the LTCC substrate with the metal surrounding frame.
Specifically, as shown in fig. 3, welding a metal surrounding frame on an LTCC to obtain an LTCC substrate with a metal surrounding frame in step S1, where the LTCC substrate with a metal surrounding frame forms an LTCC cavity structure; the length and width of the metal surrounding frame are consistent with those of the LTCC, and metal lines are buried in the LTCC substrate.
Specifically, after the LTCC substrate with the metal surrounding frame is obtained, absolute ethyl alcohol is adopted to clean the LTCC substrate, and the LTCC substrate is naturally dried and then used for subsequent operation.
S2, firstly, mounting a chip capacitor on an LTCC substrate: two adjacent bonding pads on the LTCC substrate for mounting the chip capacitor are aimed, and an adhesive is dispensed between the two adjacent bonding pads.
Specifically, two adjacent bonding pads are required for mounting each chip capacitor, and as shown in fig. 2, the adhesive dispensing needle tube is mainly used for dispensing adhesive at the central position of the two adjacent bonding pads, and the dispensing position allows for deviation of about 0.5mm and deviation of about 0.5 mm.
Specifically, the glue drop diameter of the glue dispensing needle tube is determined according to the packaging size of the mounted chip capacitor. If a chip capacitor with the external dimension of 0603 is adopted, the diameter of the glue drop is 0.6-0.8 mm; if the chip capacitor with the outline dimension of 0805 is adopted, the diameter of the glue drop is 0.8-1 mm.
S3, sucking the chip capacitor by using a vacuum suction pen, placing the chip capacitor at the dispensing position of the adhesive, and enabling the chip capacitor to be contacted with the two adjacent bonding pads simultaneously.
Specifically, in the mounting process, the chip capacitor is ensured to be fully contacted with the adhesive, and generally, the contact area between the end of the chip capacitor and two bonding pads at the corresponding mounting position is maintained to be not less than 80%.
S4, processing according to the technical requirements specified by the adhesive, ensuring that the used adhesive is fully cured, and finishing the mounting of the chip capacitor on the LTCC substrate; and pre-fixing the inductance coil on the LTCC substrate after the chip capacitor is bonded.
Specifically, the pre-fixing of the inductor in step S4 includes:
s11, aiming at two adjacent bonding pads on the LTCC substrate for installing the inductance coil;
s12, placing the inductance coil between the two adjacent bonding pads by using tweezers;
s13, respectively welding two pins of the inductance coil on the two adjacent bonding pads by adopting a resistance spot welder.
The pre-fixing of the inductance coil mainly utilizes instantaneous current to generate local high heat on the interface between the inductance pin and the bonding pad, so that the interface metal of the inductance pin and the bonding pad is melted and then combined, and the inductance coil is fixed on the bonding pad of the LTCC substrate. The inductance coil pins should be pre-tin-lined, so that the melting point of the surface material is reduced, and the fixing reliability is improved.
S5, after the pre-fixing is completed, a proper amount of solder paste is smeared on a bonding pad for mounting the chip capacitor and the inductance coil on the LTCC substrate by using a glue dispenser, so that the solder paste can fully cover the part to be welded.
S6, placing the product obtained in the step S5 into a reflow oven, and melting, wetting and spreading the solder, so that the welding assembly of the LC filter is realized, and the assembly result is shown in figure 2.
In particular, the reflow temperature profile should be matched to the solder paste selected, and the peak temperature is typically 40-60 degrees C higher than the melting point of the solder paste
Specifically, the welded and assembled product is placed into a cleaning agent for soaking, and then is placed into an oven for baking and drying.
Specifically, the soaking time is 3-5 min, the oven temperature is 85 ℃ and the baking time is 10min.
Specifically, silicone rubber is coated on the gap between the inductance coil and the LTCC surrounding frame for reinforcement.
Specifically, the baked and dried product is subjected to cover plate encapsulation in a parallel sealing welding mode.
The invention optimizes the assembly process of the radio frequency LC filter by referring to the lead bonding mode of the hybrid integrated circuit. Wire bonding (wire bonding), also known as wire bonding, is the use of metal filaments to connect the electrode pads of the bare chip with the input/output leads of the electronic package or with metal wire pads on the substrate. The connection process is generally carried out by means of a bonding tool (riving knife) by means of energy such as heat, pressure, ultrasound, etc. The process has definite requirements on the material and wire diameter of the bonding wire (gold wire, silicon aluminum wire and the like, and the diameter is less than or equal to 50 microns). Because the inductance coil is mostly formed by winding copper wires with the diameter larger than 0.1mm, the lead bonding process of the hybrid circuit cannot realize reliable connection between the inductance coil pins and the substrate, and cannot be directly applied to the welding assembly process of the LC filter.
Therefore, the invention uses the lead bonding technology in the manufacturing process of the hybrid integrated circuit to place the pins of the inductance coil on the corresponding bonding pads by using tweezers, and applies the current and the pressure to the pins of the inductance coil through the chopper, so that the contact surface metal of the pins and the bonding pads of the LTCC substrate is locally melted, thereby realizing the pre-fixing of the inductance coil and ensuring the positioning in the assembly process of the LC filter in the later stage. And the solder in the subsequent reflow soldering process is melted, so that the inductance coil and the LTCC substrate bonding pad can be fully wrapped, and reliable interconnection of the inductance coil and the LTCC substrate is ensured.
The invention uses the lead bonding mode to realize the pre-fixing of the inductance coil through resistance spot welding (current and pressure), realizes the fixing of the capacitor through dispensing, and realizes the assembly of the radio frequency LC filter with a high-reliability LTCC cavity structure through subsequent dispensing of solder paste and reflow soldering.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "rotated," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A highly reliable method of assembling a radio frequency LC filter, characterized by assembling an LC filter based on an LTCC cavity structure, comprising the steps of:
s1, obtaining an LTCC substrate with a metal surrounding frame;
s2, aiming at two adjacent bonding pads used for mounting the chip capacitor on the LTCC substrate, and dispensing an adhesive at the central positions of the two adjacent bonding pads by using a dispenser;
s3, sucking the chip capacitor by using a vacuum suction pen, placing the chip capacitor at the position of the adhesive coated in the step S2, and lightly pressing to enable the chip capacitor to be contacted with two adjacent bonding pads simultaneously;
s4, pre-fixing the inductance coil on the LTCC substrate after the chip capacitor is bonded;
s5, after the pre-fixing is finished, using a dispenser to paint soldering paste on a bonding pad on the LTCC substrate for mounting the chip capacitor and the inductance coil;
s6, placing the product obtained in the step S5 into a reflow oven for welding and assembling.
2. The method for assembling a highly reliable radio frequency LC filter according to claim 1, wherein the metal enclosure is welded on the LTCC to obtain the LTCC substrate with the metal enclosure in step S1, wherein the length and width of the metal enclosure are consistent with the length and width of the LTCC, and metal lines are embedded in the LTCC substrate.
3. The method of assembling a highly reliable rf LC filter of claim 1, wherein step S4 of pre-fixing the inductor comprises:
s11, aiming at two adjacent bonding pads on the LTCC substrate for installing the inductance coil;
s12, placing the inductance coil between the two adjacent bonding pads by using tweezers;
s13, applying current and pressure to the inductance coil pins through a chopper to enable the contact surface metal of the inductance coil pins and the bonding pads to be melted locally, and achieving pre-fixing of the inductance coils.
4. The method of assembling a highly reliable rf LC filter of claim 1, wherein step S1 further comprises: and cleaning the LTCC substrate by absolute ethyl alcohol and naturally airing.
5. The method of assembling a highly reliable rf LC filter of claim 1, wherein step S2 uses a dispensing needle to dispense adhesive between two adjacent pads.
6. The method for assembling a highly reliable radio frequency LC filter according to claim 1, wherein the welded and assembled product is immersed in a cleaning agent and then baked in an oven.
7. The method for assembling a highly reliable radio frequency LC filter according to claim 6, wherein the soaking time is 3 to 5 minutes, the oven temperature is 85 ℃, and the baking time is 10 minutes.
8. The method of assembling a highly reliable radio frequency LC filter of claim 6, wherein the baked and dried product is subjected to a cover plate package by means of parallel soldering.
9. The method of claim 8, wherein after the cover plate is encapsulated, silicone rubber is applied to the gap between the inductor coil and the LTCC substrate with the metal surrounding frame for reinforcement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311199986.5A CN117241494A (en) | 2023-09-15 | 2023-09-15 | High-reliability radio frequency LC filter assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311199986.5A CN117241494A (en) | 2023-09-15 | 2023-09-15 | High-reliability radio frequency LC filter assembly method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117241494A true CN117241494A (en) | 2023-12-15 |
Family
ID=89092507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311199986.5A Pending CN117241494A (en) | 2023-09-15 | 2023-09-15 | High-reliability radio frequency LC filter assembly method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117241494A (en) |
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2023
- 2023-09-15 CN CN202311199986.5A patent/CN117241494A/en active Pending
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