CN114101156B - Wafer fork cleaning method and device - Google Patents
Wafer fork cleaning method and device Download PDFInfo
- Publication number
- CN114101156B CN114101156B CN202010861124.4A CN202010861124A CN114101156B CN 114101156 B CN114101156 B CN 114101156B CN 202010861124 A CN202010861124 A CN 202010861124A CN 114101156 B CN114101156 B CN 114101156B
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- brush
- wafer fork
- cleaning
- spraying
- spraying device
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- 238000004140 cleaning Methods 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005507 spraying Methods 0.000 claims abstract description 82
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 230000001680 brushing effect Effects 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 27
- 238000005406 washing Methods 0.000 claims description 20
- 238000010926 purge Methods 0.000 claims description 6
- 238000010408 sweeping Methods 0.000 claims 1
- 238000007664 blowing Methods 0.000 abstract description 5
- 238000012864 cross contamination Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 74
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B08B1/12—
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- B08B1/30—
-
- B08B1/32—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of equipment maintenance, in particular to a wafer fork cleaning method and a wafer fork cleaning device, wherein the wafer fork cleaning device comprises: the cleaning device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife arranged at an inlet and an outlet of the cleaning chamber; the spraying device is used for spraying cleaning liquid; the brush is used for brushing the wafer fork extending into the cleaning chamber, the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork, so that the wafer fork is effectively and automatically cleaned, the cross contamination of the wafer is avoided, and the productivity is improved.
Description
Technical Field
The invention relates to the technical field of equipment maintenance, in particular to a wafer fork cleaning method and device.
Background
As shown in fig. 1a, 1b, and 1c, the wafer fork is easy to store dirt and dirty at the position where the wafer fork contacts with the wafer.
The wafer fork requires periodic maintenance, including cleaning, etc., to prevent cross-contamination of the wafers. At present, the cleaning is usually carried out directly by hand without the apparatus operating.
However, this cleaning method is not efficient, and thus, affects productivity.
Disclosure of Invention
In view of the above, the present invention has been made to provide a wafer fork cleaning method and apparatus that overcomes or at least partially solves the above-mentioned problems.
In a first aspect, an embodiment of the present invention provides a wafer fork cleaning apparatus, including:
the cleaning device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife arranged at an inlet and an outlet of the cleaning chamber;
the spraying device is used for spraying cleaning liquid;
the brush is used for brushing the wafer fork to be cleaned so as to spray cleaning liquid and brush simultaneously;
the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork.
Further, when the spraying device is integrated on the brush, the device further comprises:
the first rail is arranged at the top end of the cleaning chamber and used for bearing the brush;
the first driving device is connected with the brush and used for driving the brush to move along the first track so as to spray cleaning liquid and wash the brush at the same time.
Further, the brush includes: a brush head and a first support rod;
one end of the first supporting rod is provided with the brush head, and the other end of the first supporting rod is arranged on the first track;
the brush head is provided with brush hair, and a spraying hole for spraying cleaning liquid is arranged in the gap between the brush hair.
Further, when the spraying device is arranged side by side with the brush, still include:
a second support bar;
the second track is arranged at the top end of the cleaning chamber and used for bearing the second supporting rod;
one end of the second support rod is arranged on the second track, the other end of the second support rod is connected with a transverse plate, one end of the transverse plate is provided with the brush, and the other end of the transverse plate is provided with the spraying device;
and the second driving device is connected with the second supporting rod and is used for driving the second supporting rod to move along the second track, so that the spraying device and the brush both move along the second track, and cleaning liquid can be sprayed while brushing.
Furthermore, the upper part, the lower part and the side edge of the cleaning chamber are all fixedly provided with the spraying devices;
further comprising:
the third track is arranged at the top end of the cleaning chamber and used for bearing the brush;
and the third driving device is connected with the brush and is used for driving the brush to move along the third track so as to wash the area where the spraying device sprays the cleaning liquid.
Further, still include:
the fourth driving device is connected with the brush and used for driving the brush to rotate so as to realize rotary washing.
Further, the method also comprises the following steps:
and the fifth driving device is connected with the second supporting rod and is used for driving the second supporting rod to rotate so as to enable the brush and the spraying device on the transverse plate to spray cleaning liquid and wash the cleaning liquid in the rotating process.
In a second aspect, the present invention further provides a wafer fork cleaning method, including:
controlling to insert the wafer fork into the cleaning chamber and controlling the air knife to purge the wafer fork to be cleaned;
controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to spray the cleaning liquid and wash the wafer fork at the same time;
and controlling the wafer fork to move out of the cleaning chamber, and controlling an air knife to dry the cleaned wafer fork.
Further, after controlling the gas knife to purge the wafer fork, the method further comprises:
controlling to close the air knife;
the wafer fork is dried by controlling the air knife, and the method further comprises the following steps:
controlling to close the air knife.
Further, the controlling of starting the spraying device to spray the cleaning solution and controlling the brush to wash the wafer fork to be cleaned includes:
controlling to start the spraying device;
controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning solution sprayed by the spraying device completely covers the wafer fork to be cleaned;
and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the invention provides a wafer fork cleaning device which comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife which is arranged at an inlet and an outlet of the cleaning chamber, wherein the spraying device is used for spraying cleaning liquid, the brush is used for washing and brushing a wafer fork extending into the cleaning chamber so as to spray the cleaning liquid while washing, and the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork so as to effectively and automatically clean the wafer fork, further avoid the cross contamination of the wafer and improve the productivity.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIGS. 1a, 1b, and 1c are schematic structural views of a wafer fork;
FIG. 2 is a schematic structural diagram of a wafer fork cleaning apparatus according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram illustrating an integrated arrangement of a brush and a spraying device according to a first embodiment of the present invention;
FIG. 4 is a schematic view of a brush and a spraying device arranged side by side according to a first embodiment of the present invention;
FIG. 5 is a schematic view showing a structure in which a brush and a spraying device are separately provided according to a first embodiment of the present invention;
fig. 6 is a flowchart illustrating a wafer fork cleaning method according to a second embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Example one
The embodiment of the invention provides a wafer fork cleaning device which is applied to periodic equipment maintenance and used for cleaning a wafer fork.
As shown in fig. 2, the wafer fork cleaning apparatus includes: a cleaning chamber 101, a spraying device 102 and a brush 103 which are arranged in the cleaning chamber 101, and an air knife 106 which is arranged at the entrance and exit of the cleaning chamber 101, wherein the spraying device 102 is used for spraying cleaning liquid; the brush 103 is used for brushing the wafer fork extending into the cleaning chamber 101 so as to spray cleaning liquid and brush simultaneously; and the air knife 106 is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork.
The spraying device 102 not only can spray the cleaning liquid, but also can wash away impurities on the wafer fork by using impulsive force without using the brush 103 while spraying the cleaning liquid.
When the brush 103 is used for washing, a place where the washing liquid cannot wash can be washed.
Wherein the spraying device 102 and the brush 103 can be integrated or can be separately arranged.
The following is a detailed description of the structure in which the spraying device 102 and the brush 103 are integrated together and the structure in which they are separately provided.
As shown in fig. 3, when the spraying device 102 is integrated with the brush 103, the wafer fork cleaning apparatus further includes:
a first rail 1041 disposed at a top end of the cleaning chamber 101 for carrying the brush 103; the first driving device 1051 is connected to the brush 103 and is used for driving the brush to move along the first track 1041 so as to spray the cleaning solution and wash the cleaning solution.
In a specific embodiment, the brush 103 includes a brush head 1031 and a first support rod 1032, one end of the first support rod 1032 is provided with the brush head 1031, the other end of the first support rod 1032 is provided on the first rail 1041, the brush head 1031 is not only provided with bristles 10311, but also provided with a spraying hole 1021 for spraying cleaning liquid in the gap between the bristles 10311, so that when the first driving device 1051 drives the brush 103 to move along the first rail 1041, the cleaning liquid can be sprayed while being washed.
In an alternative embodiment, the wafer fork cleaning apparatus further comprises: and the fourth driving device 1054 is connected with the brush 103, and is used for driving the brush 103 to rotate so as to realize rotary washing, and the washing is cleaner and more efficient by adopting a rotary washing mode.
As shown in fig. 4, the spraying device 102 is disposed side by side with the brush 103, and the wafer fork cleaning device further includes: a second support bar; a second rail 1042 arranged on the top of the cleaning chamber 101 for carrying a second support rod; one end of the second support rod is disposed on the second rail 1042, the other end is connected to a transverse plate, one end of the transverse plate is disposed with the brush 103, and the other end is disposed with the spraying device 102.
Further comprising: and a second driving device 1052 connected to the second support rod for driving the second support rod to move along the second rail 1041, so that both the spraying device 102 and the brush 103 move along the second rail 1041, thereby spraying the cleaning solution while washing.
The wafer fork cleaning device further comprises a fifth driving device 1055, wherein the fifth driving device 1055 is connected with the second support rod and is used for driving the second support rod to rotate, namely, the second support rod rotates around the axis of the second support rod, so that the transverse plate also rotates along with the second support rod, the brush 103 and the spraying device 102 on the transverse plate also rotate along with the second support rod, the purpose of washing while spraying cleaning liquid is achieved in the rotating process, and the washing is cleaner in the rotating process.
As shown in fig. 5, the spraying device 102 is fixedly installed at the upper part, the lower part and the side of the cleaning chamber 101, and the wafer fork cleaning device further includes: a third rail 1043 disposed at the top end of the cleaning chamber for carrying the brush 103; a third driving device 1053 connected to the brush 103 for driving the brush to move along the third track 1043 for brushing an area where the cleaning solution is sprayed by the spraying device 102.
Specifically, the sprinklers 102 are fixedly arranged, but the sprinklers 102 arranged at the upper part, the lower part and the side can realize the sprinkling task in different areas.
The sprinkler 102 may also enable rotation of the spray head to accomplish different areas of the spray task.
The brush 103 is disposed on the third rail 1043, and can move along the third rail 1043, and in an area where the spraying device 102 sprays the cleaning solution, the brush 103 moves to the area to perform the washing, so as to achieve the purpose of spraying the cleaning solution and washing at the same time.
In an alternative embodiment, the brush 103 is connected to the fourth driving means 1054, and the fourth driving means 1054 is used to drive the brush 103 to rotate, so as to achieve the rotary washing, and the rotary washing is adopted, so that the washing is cleaner and more efficient.
In an alternative embodiment, when the air knife 106 performs purging when the wafer fork enters the cleaning chamber 101, the large impurities on the surface of the wafer fork to be cleaned can be purged; when the wafer fork leaves the cleaning chamber 101, the air knife 106 dries the wafer fork, and dries the water stain on the surface of the cleaned wafer fork.
The cleaning solution may be deionized water, ammonia water, or the like.
The first rail 1041, the second rail 1042 and the third rail 1043 each comprise a laterally moving rail and a longitudinally moving rail to facilitate the brush 103 to reach various portions of the wafer fork through the rails.
The first driving device 1051, the second driving device 1052, the third driving device 1053, the fourth driving device 1054 and the fifth driving device 1055 are all driven by a motor, wherein the first driving device 1051, the second driving device 1052 and the third driving device 1053 can realize the lifting and moving of the brush 103 and the spraying device 102, the fourth driving device 1054 and the fifth driving device 1055 are used for driving the rotation of the brush, and so on.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the invention provides a wafer fork cleaning device which comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife which is arranged at an inlet and an outlet of the cleaning chamber, wherein the spraying device is used for spraying cleaning liquid, the brush is used for washing and brushing a wafer fork extending into the cleaning chamber so as to spray the cleaning liquid while washing, and the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork so as to effectively and automatically clean the wafer fork, further avoid the cross contamination of the wafer and improve the productivity.
Example two
Based on the same inventive concept, the invention also provides a wafer fork cleaning method, as shown in fig. 6, comprising:
s601, inserting the wafer fork into a cleaning chamber, and controlling an air knife to purge the wafer fork to be cleaned;
s602, controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to realize simultaneous spraying and washing;
s603, the wafer fork is controlled to be moved out of the cleaning chamber, and an air knife is controlled to dry the cleaned wafer fork.
Specifically, the wafer fork cleaning method mainly performs brushing in a way of spraying cleaning liquid and brushing at the same time, so that the cleaning efficiency is higher.
In an optional embodiment, after controlling the gas knife to purge the wafer fork, the method further includes:
controlling to close the air knife;
after the wafer fork is scrubbed by controlling the air knife, the method further comprises the following steps:
controlling to close the air knife.
Specifically, the air knife is opened only when the wafer fork enters or exits the cleaning chamber, and the air knife is controlled to be in a closed state during the process that the wafer fork is cleaned.
The air knife is controlled to open and blow when the wafer fork enters the cleaning chamber, impurities can be blown firstly, then the air knife is controlled to open and dry when the wafer fork leaves the cleaning chamber, the cleaned wafer fork is dried, and water stains left after cleaning are blown.
In an optional embodiment, the controlling to start a spraying device to spray cleaning liquid and control a brush to brush the wafer fork to be cleaned includes:
controlling to start the spraying device;
controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned;
and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.
The action of the spraying device and the brush is controlled, so that the spraying device is effectively matched with the brush, and the cleaning efficiency is improved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A wafer fork cleaning apparatus, comprising:
the device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and air knives which are arranged at the upper end and the lower end of an inlet and an outlet of the cleaning chamber;
the inlet and the outlet of the cleaning chamber are the same;
the spraying device is used for spraying cleaning liquid;
the brush is used for brushing the wafer fork to be cleaned so as to spray cleaning liquid and brush simultaneously;
the air knife is used for sweeping the wafer fork to be cleaned and drying the cleaned wafer fork;
inserting the wafer fork into a cleaning chamber under control, and purging the wafer fork to be cleaned by controlling air knives at the upper end and the lower end of an inlet and an outlet;
controlling to close the air knife;
controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to spray the cleaning liquid and wash simultaneously;
the wafer fork is controlled to move out of the cleaning chamber, and an air knife is controlled to dry the cleaned wafer fork;
controlling to close the air knife.
2. The wafer fork cleaning apparatus of claim 1, wherein the spray apparatus, when integrated with the brush, further comprises:
the first rail is arranged at the top end of the cleaning chamber and used for bearing the brush;
the first driving device is connected with the brush and used for driving the brush to move along the first track so as to spray cleaning liquid and wash the brush at the same time.
3. The wafer fork cleaning apparatus of claim 2, wherein the brush comprises: a brush head and a first support rod;
one end of the first supporting rod is arranged on the brush head, and the other end of the first supporting rod is arranged on the first track;
the brush head is provided with brush hair, and a spraying hole for spraying cleaning liquid is arranged in the gap between the brush hair.
4. The wafer fork cleaning apparatus of claim 1, further comprising, when the spray device is positioned alongside the brush:
a second support bar;
the second track is arranged at the top end of the cleaning chamber and used for bearing the second supporting rod;
one end of the second supporting rod is arranged on the second track, the other end of the second supporting rod is connected with a transverse plate, one end of the transverse plate is provided with the brush, and the other end of the transverse plate is provided with the spraying device;
and the second driving device is connected with the second supporting rod and is used for driving the second supporting rod to move along the second track, so that the spraying device and the brush both move along the second track, and cleaning liquid can be sprayed while brushing.
5. The wafer fork cleaning apparatus as recited in claim 1, wherein the spraying device is fixedly disposed at an upper portion, a lower portion and a side of the cleaning chamber;
further comprising:
the third track is arranged at the top end of the cleaning chamber and used for bearing the brush;
and the third driving device is connected with the brush and is used for driving the brush to move along the third track so as to wash the area where the spraying device sprays the cleaning liquid.
6. The wafer fork cleaning apparatus of claim 1, further comprising:
the fourth driving device is connected with the brush and used for driving the brush to rotate so as to realize rotary washing.
7. The wafer fork cleaning apparatus of claim 4, further comprising:
and the fifth driving device is connected with the second supporting rod and is used for driving the second supporting rod to rotate so as to enable the brush on the transverse plate and the spraying device to spray the cleaning liquid and wash the brush at the same time in the rotating process.
8. The wafer fork cleaning apparatus of claim 1, wherein controlling the spray device to spray the cleaning solution and controlling the brush to brush the wafer fork to be cleaned comprises:
controlling to start the spraying device;
controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned;
and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010861124.4A CN114101156B (en) | 2020-08-25 | 2020-08-25 | Wafer fork cleaning method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010861124.4A CN114101156B (en) | 2020-08-25 | 2020-08-25 | Wafer fork cleaning method and device |
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| Publication Number | Publication Date |
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| CN114101156A CN114101156A (en) | 2022-03-01 |
| CN114101156B true CN114101156B (en) | 2023-04-11 |
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| CN202010861124.4A Active CN114101156B (en) | 2020-08-25 | 2020-08-25 | Wafer fork cleaning method and device |
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| CN206838611U (en) * | 2017-05-22 | 2018-01-05 | 江苏建康职业学院 | A kind of surgery instrument cleaning case |
| CN208583679U (en) * | 2018-04-03 | 2019-03-08 | 惠安华晨贸易有限公司 | A kind of paediatrics medical instrument spray scrubs drying unit |
| CN108786956A (en) * | 2018-05-03 | 2018-11-13 | 芜湖市诺康生物科技有限公司 | A kind of biologic test platform convenient for cleaning |
| CN210010247U (en) * | 2019-05-16 | 2020-02-04 | 德淮半导体有限公司 | Cleaning device for wafer chuck |
| CN110369371A (en) * | 2019-07-23 | 2019-10-25 | 天津中环领先材料技术有限公司 | A kind of large scale silicon wafer cleaning device and its cleaning process |
| CN210876456U (en) * | 2019-09-06 | 2020-06-30 | 张展 | Efficient cleaning equipment for medical instruments |
| CN110756483A (en) * | 2019-09-19 | 2020-02-07 | 上海提牛机电设备有限公司 | Wafer grabbing mechanism cleaning device |
| CN211070955U (en) * | 2019-11-27 | 2020-07-24 | 李金霞 | Gastroscope belt cleaning device |
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