CN114101156B - Wafer fork cleaning method and device - Google Patents

Abstract

The invention relates to the technical field of equipment maintenance, in particular to a wafer fork cleaning method and a wafer fork cleaning device, wherein the wafer fork cleaning device comprises: the cleaning device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife arranged at an inlet and an outlet of the cleaning chamber; the spraying device is used for spraying cleaning liquid; the brush is used for brushing the wafer fork extending into the cleaning chamber, the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork, so that the wafer fork is effectively and automatically cleaned, the cross contamination of the wafer is avoided, and the productivity is improved.

Description

Wafer fork cleaning method and device

technical field

The invention relates to the technical field of equipment maintenance, in particular to a wafer fork cleaning method and device.

Background technique

The wafer fork is used to carry the wafer, realize the transportation and flipping of the wafer, etc., as shown in Figure 1a, Figure 1b, and Figure 1c, the position on the wafer fork that is in contact with the wafer is easy to hide dirt.

Wafer forks need periodic maintenance, including cleaning, etc., to prevent cross-contamination of wafers. At present, it is usually cleaned manually directly when the equipment is not in operation.

However, the efficiency of this cleaning method is not high, therefore, the production capacity is affected.

Contents of the invention

In view of the above problems, the present invention is proposed to provide a wafer fork cleaning method and device that overcome the above problems or at least partially solve the above problems.

In the first aspect, an embodiment of the present invention provides a wafer fork cleaning device, including:

a cleaning room, a spraying device and a brush arranged in the cleaning room, and an air knife arranged at the entrance and exit of the cleaning room;

The spraying device is used for spraying cleaning liquid;

The brush is used to scrub the wafer fork to be cleaned, so as to realize scrubbing while spraying the cleaning liquid;

The air knife is used for purging the wafer fork to be cleaned and drying the cleaned wafer fork.

Further, when the spraying device is integrated on the brush, it also includes:

The first track is arranged on the top of the cleaning chamber and is used to carry the brushes;

The first driving device is connected to the brush and is used to drive the brush to move along the first track, so as to realize washing while spraying cleaning liquid.

Further, the brush includes: a brush head and a first support rod;

One end of the first support rod is provided with the brush head, and the other end is provided on the first track;

The brush head is provided with bristles, and the gaps between the bristles are provided with spray holes for spraying cleaning liquid.

Further, when the spraying device and the brush are arranged side by side, it also includes:

second support rod;

a second track, arranged at the top of the cleaning chamber, for carrying the second support rod;

One end of the second support rod is arranged on the second track, and the other end is connected to the horizontal plate, the brush is arranged at one end of the horizontal plate, and the spraying device is arranged at the other end;

A second driving device, connected to the second support rod, is used to drive the second support rod to move along the second track, so that both the spraying device and the brush move along the second track , to achieve scrubbing while spraying cleaning fluid.

Further, the spraying device is fixedly installed on the upper part, the lower part and the side of the cleaning chamber;

Also includes:

The third track is arranged on the top of the cleaning chamber and is used to carry the brushes;

The third driving device is connected to the brush and is used to drive the brush to move along the third track, so as to perform scrubbing in the area where the cleaning liquid is sprayed by the spraying device.

Further, it also includes:

A fourth driving device, the fourth driving device is connected to the brush, and is used to drive the brush to rotate, so as to realize rotary scrubbing.

Further, it also includes:

A fifth driving device, the fifth driving device is connected to the second support rod, and is used to drive the rotation of the second support rod, so that the brushes and the spraying device on the horizontal plate can realize side-spray cleaning during the rotation process Scrub the liquid side.

In a second aspect, the present invention also provides a wafer fork cleaning method, comprising:

Control the insertion of the wafer fork into the cleaning chamber, and control the air knife to purge the wafer fork to be cleaned;

Controlling the opening of the spraying device to spray the cleaning solution, and controlling the brush to scrub the wafer fork to be cleaned, so as to realize cleaning while spraying the cleaning solution;

Controlling the wafer fork to move out of the cleaning chamber, and controlling the air knife to dry the cleaned wafer fork.

Further, after controlling the air knife to purge the wafer fork, it also includes:

controlling the closing of said air knife;

After controlling the air knife to dry the wafer fork, it also includes:

Control shuts off the air knife.

Further, the control turns on the spraying device to spray the cleaning liquid, and controls the brush to scrub the wafer fork to be cleaned, including:

Controlling the opening of spraying devices;

Controlling the movement of the spraying device or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device covers all the wafer forks to be cleaned;

The brushes are controlled to rotate and scrub the wafer fork to be cleaned in the area where the cleaning solution is sprayed.

One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

The invention provides a wafer fork cleaning device, comprising a cleaning room, a spraying device and a brush arranged in the cleaning room, an air knife arranged at the entrance and exit of the cleaning room, the spraying device is used for spraying cleaning liquid, and the brush is used for Scrub the wafer fork extending into the cleaning chamber to achieve cleaning while spraying the cleaning liquid, and the air knife is used to purge the wafer fork to be cleaned and dry the cleaned wafer fork to realize Effective and automatic cleaning of the wafer forks avoids cross-contamination of wafers and increases throughput.

Description of drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiment. The drawings are only for the purpose of illustrating a preferred embodiment and are not to be considered as limiting the invention. Also throughout the drawings, the same components are represented by the same reference figures. In the attached picture:

Fig. 1a, Fig. 1b, Fig. 1c show the structural diagram of wafer fork;

2 shows a schematic structural view of a wafer fork cleaning device in Embodiment 1 of the present invention;

Figure 3 shows a schematic structural view of the integrated arrangement of brushes and spraying devices in Embodiment 1 of the present invention;

Figure 4 shows a schematic structural view of brushes and spraying devices arranged side by side in Embodiment 1 of the present invention;

Fig. 5 shows a schematic structural view of brushes and spraying devices separately provided in Embodiment 1 of the present invention;

FIG. 6 shows a schematic flowchart of the steps of the wafer fork cleaning method in Embodiment 2 of the present invention.

Detailed ways

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

Embodiment one

Embodiment 1 of the present invention provides a wafer fork cleaning device, which is used in periodic equipment maintenance to clean the wafer fork.

The wafer fork cleaning device, as shown in Figure 2, comprises: a cleaning chamber 101, a spraying device 102 and a brush 103 arranged in the cleaning chamber 101, an air knife 106 arranged at the entrance and exit of the cleaning chamber 101, and the spraying device 102 is used for Spray cleaning fluid; the brush 103 is used to scrub the wafer fork extending into the cleaning chamber 101, so as to realize scrubbing while spraying the cleaning fluid; the air knife 106 is used to blow the wafer fork to be cleaned. sweep, and dry the cleaned wafer forks.

The spraying device 102 can not only spray the cleaning liquid, but also can wash away the impurities on the wafer fork by only using the momentum while spraying the cleaning liquid without using the brush 103 .

When washing with the brush 103, it is possible to wash the places where the washing liquid cannot be washed.

Wherein, the spraying device 102 and the brush 103 can be integrated together, or can be set separately.

The structure of the spraying device 102 and the brush 103 integrated together and the structure separately provided will be described in detail below.

As shown in Figure 3, when the spraying device 102 is integrated on the brush 103, the wafer fork cleaning device also includes:

The first rail 1041 is arranged on the top of the cleaning chamber 101 for carrying the brush 103; the first driving device 1051 is connected to the brush 103 and is used to drive the brush to move along the first rail 1041 to realize washing while spraying cleaning liquid.

In a specific embodiment, the brush 103 includes a brush head 1031 and a first support rod 1032, one end of the first support rod 1032 is provided with a brush head 1031, and the other end is arranged on the first track 1041, and the brush head 1031 is not only provided with bristles 10311, and the spray holes 1021 for spraying cleaning liquid are set in the gaps of the bristles 10311, and then when the first driving device 1051 drives the brush 103 to move along the first track 1041, it can realize spraying cleaning liquid while washing.

In an optional embodiment, the wafer fork cleaning device further includes: a fourth driving device 1054, which is connected to the brush 103 and used to drive the brush 103 to rotate to realize rotary cleaning. The rotary scrubbing method makes the scrubbing cleaner and more efficient.

As shown in Figure 4, the spraying device 102 is arranged side by side with the brush 103, and the wafer fork cleaning device also includes: a second support rod; a second rail 1042, arranged on the top of the cleaning chamber 101, for carrying the second support rod One end of the second support rod is set on the second rail 1042, and the other end is connected to the horizontal plate, the brush 103 is set on one end of the horizontal plate, and the spraying device 102 is set on the other end.

Also includes: a second driving device 1052, connected to the second support rod, used to drive the second support rod to move along the second rail 1041, so that the spraying device 102 and the brush 103 both move along the second rail 1041, so as to realize the edge Spray cleaning solution while scrubbing.

The wafer fork cleaning device also includes a fifth driving device 1055, the fifth driving device 1055 is connected to the second support rod, and is used to drive the second support rod to rotate, that is, to rotate around the axis of the second support rod, so that , the horizontal plate will also rotate with it, and the brushes 103 and spraying device 102 on the horizontal plate will also rotate thereupon, and in the process of rotation, the goal of scrubbing while spraying the cleaning liquid is realized, and in the process of rotation, the scrubbing cleaner.

As shown in Figure 5, the spraying device 102 is fixedly installed on the upper part, the lower part and the side of the cleaning chamber 101, and the wafer fork cleaning device also includes: a third rail 1043, which is arranged on the top of the cleaning chamber for carrying brushes 103 ; the third driving device 1053 , connected to the brush 103 , is used to drive the brush to move along the third track 1043 to perform scrubbing in the area where the spraying device 102 sprays cleaning liquid.

Specifically, although the spraying device 102 is fixedly installed, the spraying devices 102 installed on the upper part, the lower part and the side can all realize spraying tasks in different areas.

The spraying device 102 can also realize the rotation of the spraying head, so as to realize the spraying tasks in different areas.

The brush 103 is arranged on the third rail 1043, and can move along the third rail 1043. In the area where the spraying device 102 sprays the cleaning liquid, the brush 103 moves to the area for scrubbing, so as to realize cleaning while spraying the cleaning liquid. Scrubbing purposes.

In an optional embodiment, the brush 103 is connected to the fourth driving device 1054, and the fourth driving device 1054 is used to drive the brush 103 to rotate to realize rotary scrubbing, and the rotary scrubbing method is adopted to make the brushing cleaner , and is more efficient.

In an optional embodiment, the air knife 106 is purged when the wafer fork enters the cleaning chamber 101, and the larger impurities on the surface of the wafer fork to be cleaned can be purged away; When the wafer fork leaves the cleaning chamber 101, it is dried, and the water stains on the surface of the cleaned wafer fork are blown dry.

The above-mentioned cleaning solution may specifically be deionized water, ammonia water, or the like.

The first track 1041 , the second track 1042 , and the third track 1043 all include a track for lateral movement and a track for vertical movement, so that the brush 103 can reach various parts of the wafer fork through the track.

The first driving device 1051, the second driving device 1052, the third driving device 1053, the fourth driving device 1054, and the fifth driving device 1055 are all driven by motors, wherein the first driving device 1051, the second driving device 1052, the The third driving device 1053 can realize the lifting and moving of the brush 103 and the spraying device 102, and the fourth driving device 1054 and the fifth driving device 1055 are used to drive the rotation of the brush and so on.

One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

The invention provides a wafer fork cleaning device, comprising a cleaning room, a spraying device and a brush arranged in the cleaning room, an air knife arranged at the entrance and exit of the cleaning room, the spraying device is used for spraying cleaning liquid, and the brush is used for Scrub the wafer fork extending into the cleaning chamber to achieve cleaning while spraying the cleaning liquid, and the air knife is used to purge the wafer fork to be cleaned and dry the cleaned wafer fork to realize Effective and automatic cleaning of the wafer forks avoids cross-contamination of wafers and increases throughput.

Embodiment two

Based on the same inventive concept, the present invention also provides a wafer fork cleaning method, as shown in Figure 6, comprising:

S601, control inserting the wafer fork into the cleaning chamber, and control the air knife to purge the wafer fork to be cleaned;

S602, control to turn on the spraying device to spray the cleaning solution, and control the brush to scrub the wafer forks to be cleaned, so as to realize scrubbing while spraying;

S603, controlling to move the wafer fork out of the cleaning chamber, and controlling the air knife to dry the cleaned wafer fork.

Specifically, the wafer fork cleaning method mainly performs cleaning by spraying the cleaning liquid while cleaning, so as to make the cleaning efficiency higher.

In an optional embodiment, after controlling the air knife to purge the wafer fork, it further includes:

controlling the closing of said air knife;

After controlling the air knife to scrub the wafer fork, it also includes:

Control shuts off the air knife.

Specifically, the air knife is only turned on when the wafer fork enters and exits the cleaning chamber, and the air knife is controlled to be in a closed state during the cleaning process of the wafer fork.

By controlling the air knife to turn on the purge when the wafer fork enters the cleaning chamber, the impurities can be purged first, and then the air knife is controlled to turn on the drying when the wafer fork leaves the cleaning room to dry the cleaned wafer fork , and then blow off the water stains left after cleaning.

In an optional embodiment, the control to turn on the spraying device to spray the cleaning liquid, and control the brush to scrub the wafer fork to be cleaned, includes:

Controlling the opening of spraying devices;

Controlling the movement of the spraying device or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device covers all the wafer forks to be cleaned;

The brushes are controlled to rotate and scrub the wafer fork to be cleaned in the area where the cleaning solution is sprayed.

By controlling the action of the spraying device and the brush, the spraying device and the brush are effectively matched to improve the cleaning efficiency.

While preferred embodiments of the invention have been described, additional changes and modifications to these embodiments can be made by those skilled in the art once the basic inventive concept is appreciated. Therefore, it is intended that the appended claims be construed to cover the preferred embodiment as well as all changes and modifications which fall within the scope of the invention.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (8)

1. A wafer fork cleaning apparatus, comprising:

the device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and air knives which are arranged at the upper end and the lower end of an inlet and an outlet of the cleaning chamber;

the inlet and the outlet of the cleaning chamber are the same;

the spraying device is used for spraying cleaning liquid;

the brush is used for brushing the wafer fork to be cleaned so as to spray cleaning liquid and brush simultaneously;

the air knife is used for sweeping the wafer fork to be cleaned and drying the cleaned wafer fork;

inserting the wafer fork into a cleaning chamber under control, and purging the wafer fork to be cleaned by controlling air knives at the upper end and the lower end of an inlet and an outlet;

controlling to close the air knife;

controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to spray the cleaning liquid and wash simultaneously;

the wafer fork is controlled to move out of the cleaning chamber, and an air knife is controlled to dry the cleaned wafer fork;

controlling to close the air knife.

2. The wafer fork cleaning apparatus of claim 1, wherein the spray apparatus, when integrated with the brush, further comprises:

the first rail is arranged at the top end of the cleaning chamber and used for bearing the brush;

the first driving device is connected with the brush and used for driving the brush to move along the first track so as to spray cleaning liquid and wash the brush at the same time.

3. The wafer fork cleaning apparatus of claim 2, wherein the brush comprises: a brush head and a first support rod;

one end of the first supporting rod is arranged on the brush head, and the other end of the first supporting rod is arranged on the first track;

the brush head is provided with brush hair, and a spraying hole for spraying cleaning liquid is arranged in the gap between the brush hair.

4. The wafer fork cleaning apparatus of claim 1, further comprising, when the spray device is positioned alongside the brush:

a second support bar;

the second track is arranged at the top end of the cleaning chamber and used for bearing the second supporting rod;

one end of the second supporting rod is arranged on the second track, the other end of the second supporting rod is connected with a transverse plate, one end of the transverse plate is provided with the brush, and the other end of the transverse plate is provided with the spraying device;

and the second driving device is connected with the second supporting rod and is used for driving the second supporting rod to move along the second track, so that the spraying device and the brush both move along the second track, and cleaning liquid can be sprayed while brushing.

5. The wafer fork cleaning apparatus as recited in claim 1, wherein the spraying device is fixedly disposed at an upper portion, a lower portion and a side of the cleaning chamber;

further comprising:

the third track is arranged at the top end of the cleaning chamber and used for bearing the brush;

and the third driving device is connected with the brush and is used for driving the brush to move along the third track so as to wash the area where the spraying device sprays the cleaning liquid.

6. The wafer fork cleaning apparatus of claim 1, further comprising:

the fourth driving device is connected with the brush and used for driving the brush to rotate so as to realize rotary washing.

7. The wafer fork cleaning apparatus of claim 4, further comprising:

and the fifth driving device is connected with the second supporting rod and is used for driving the second supporting rod to rotate so as to enable the brush on the transverse plate and the spraying device to spray the cleaning liquid and wash the brush at the same time in the rotating process.

8. The wafer fork cleaning apparatus of claim 1, wherein controlling the spray device to spray the cleaning solution and controlling the brush to brush the wafer fork to be cleaned comprises:

controlling to start the spraying device;

controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned;

and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.

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