CN114083157A - Cutting device for semiconductor - Google Patents
Cutting device for semiconductor Download PDFInfo
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- CN114083157A CN114083157A CN202210025656.3A CN202210025656A CN114083157A CN 114083157 A CN114083157 A CN 114083157A CN 202210025656 A CN202210025656 A CN 202210025656A CN 114083157 A CN114083157 A CN 114083157A
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- plate
- fixedly connected
- bearing plate
- moving mechanism
- top surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
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Abstract
The invention relates to the technical field of semiconductor cutting, in particular to a cutting device for a semiconductor, which comprises a bottom plate, wherein the top surface of the bottom plate is fixedly connected with a circulating mechanism, the circulating mechanism comprises two tool frames, a support frame is fixedly connected between the bottom surfaces of the tool frames and the bottom plate, and a first limiting plate is fixedly connected between four top angles of the two tool frames. According to the invention, the moving direction of the laser emission assemblies is perpendicular to that of the bearing plate through the arrangement of the bearing plate and the two laser emission assemblies, the materials can be cut into complicated shapes through the cooperation of the mutually perpendicular movement of the bearing plate and the laser emission assemblies, the materials can be adsorbed and fixed through the bottom surface and the top surface of the bearing plate, the two materials can be processed at one time, the efficiency is increased, and the first moving mechanism and the second moving mechanism circularly move on the circulating mechanism through the arrangement of the first moving mechanism and the second moving mechanism, so that the waiting time of the laser emission assemblies is reduced, and the efficiency is further increased.
Description
Technical Field
The invention relates to the technical field of semiconductor cutting, in particular to a cutting device for a semiconductor.
Background
The solar cell panel can directly or indirectly convert solar radiation energy into electric energy through a photoelectric effect or a photochemical effect, and main core components of most solar cell panels are photovoltaic panels or other photovoltaic parts made of semiconductor materials.
In solar cell panel's production process, need cut apart the semiconductor material as required, wherein the mode that the laser was divided has quietly, it is little to pollute, and a plurality of advantages such as with material direct contact, the article is not penetrated to laser when dividing, only scribe the shallow slot on the article surface, conveniently follow the shallow slot with the material separately afterwards, current a cutting device for semiconductor, pass through from the laser below through driving the material and realize dividing, although speed is very fast, can't accomplish the cutting comparatively complicated to the material, can only be simple divide the material into two, and can accomplish complicated cutting, its process velocity is slow, efficiency is lower.
Disclosure of Invention
In order to overcome the above technical problems, it is an object of the present invention to provide a cutting apparatus for a semiconductor, through the arrangement of the bearing plate and the two laser emission assemblies, the moving direction of the laser emission assemblies is vertical to the moving direction of the bearing plate, the bearing plate and the laser emission component are matched with each other to move vertically, so that the laser emission component can cut materials with complex shapes, the bottom surface and the top surface of the bearing plate can adsorb and fix materials and are arranged opposite to the two laser emission assemblies, so that two materials can be processed at one time, the efficiency is improved, through the arrangement of the first moving mechanism and the second moving mechanism, the first moving mechanism and the second moving mechanism move circularly on the circulating mechanism, therefore, the waiting time of the laser emission assembly is reduced, the efficiency is further increased, the blanking is faster, a mechanical arm does not need to be additionally arranged, and the cost is reduced.
The purpose of the invention can be realized by the following technical scheme:
a cutting device for semiconductors comprises a bottom plate, wherein a circulating mechanism is fixedly connected to the top surface of the bottom plate, the circulating mechanism comprises two tool frames, a support frame is fixedly connected between the bottom surface of each tool frame and the bottom plate, a first limiting plate is fixedly connected between four top corners of the two tool frames, a first sliding seam is formed between the two first limiting plates positioned on the same side, one end of each first sliding seam is provided with a first deflection module, the other end of each first sliding seam is provided with a second deflection module, a first toothed plate is fixedly connected between the two middle side positions of the two tool frames, a first moving mechanism and a second moving mechanism are matched with the two first toothed plates, the first moving mechanism and the second moving mechanism are slidably connected with the first sliding seam, the first moving mechanism and the second moving mechanism can move along the length direction of the first toothed plate, the first moving mechanism comprises a bearing plate, the top surface and the bottom surface of which can absorb materials, one side of the circulating mechanism is provided with a dividing mechanism which comprises two laser emission components which are oppositely arranged and can move transversely, materials are adsorbed and fixed on the top surface and the bottom surface of the bearing plate, the bearing plate moves along the first direction of the toothed plate in a matching way, the laser emission components move transversely, the moving direction of the laser emission components is perpendicular to that of the bearing plate, the two laser emission components respectively cut the materials on the top surface and the bottom surface of the bearing plate, the materials are cut into complicated shapes by the laser emission components through the matching of the bearing plate and the laser emission components which move vertically, the two materials are machined at one time, the efficiency is increased, meanwhile, the materials on the bearing plate can be machined by the laser emission components in a complicated way, the first moving mechanism and the second moving mechanism can move circularly on the circulating mechanism through the arrangement of the first moving mechanism and the second moving mechanism, thereby reducing latency and increasing efficiency.
Further, the method comprises the following steps: the one end of loading board has linked firmly the fixed plate, the fixed plate top surface has linked firmly the motor, the output of motor has linked firmly the gear, gear and pinion rack meshing, the motor drives the gear and rotates, and the gear drives the loading board through the meshing with pinion rack one and removes along sliding seam one.
Further, the method comprises the following steps: a plurality of absorption holes are all set up to the top surface and the bottom surface of loading board, the one end of loading board has linked firmly gas mouth one and gas mouth two, and the absorption hole that is located the loading board top surface all communicates with gas mouth one, and the absorption hole that is located the loading board bottom surface all communicates with gas mouth two, conveniently controls the absorption hole of loading board top surface and bottom surface respectively, is convenient for adsorb the material and fix on the loading board.
Further, the method comprises the following steps: the one end bottom surface and the top surface of loading board have all linked firmly spacing one, and the one side rotation that spacing one deviates from the loading board is connected with a plurality of gyro wheels, and the outside of a two lateral walls of sliding seam is to middle convergence to avoid the outside skew of loading board through the extrusion spacing one, make gear and pinion rack keep closely meshing, the setting of gyro wheel reduces the friction between spacing one and the limiting plate one simultaneously.
Further, the method comprises the following steps: one of the deflection module includes rotates the seat, the one end of rotating the seat rotates and is connected with the curb plate, the other end of rotating the seat installs drive curb plate pivoted drive assembly, the both ends position of curb plate lateral wall both sides has all linked firmly limiting plate two, and is located and forms the sliding seam two between two limiting plate two of homonymy, a lateral wall of curb plate corresponds two pinion rack primary importance and has all linked firmly pinion rack two, and has linked firmly the crossbeam between the one end that is located two limiting plate two of same end on a lateral wall of curb plate, deflection module two is the same with deflection module one structure, aligns between sliding seam two and the sliding seam one, aligns between pinion rack two and the pinion rack one, makes things convenient for moving mechanism one to get into deflection module one and in the deflection module two.
Further, the method comprises the following steps: dividing the mechanism and still including installing the transverse driving slide rail on the bottom plate, and the moving direction of transverse driving slide rail output is perpendicular with pinion rack one, the output of transverse driving slide rail has linked firmly the chassis, the top of chassis has linked firmly Contraband framves, the both ends of Contraband frame link firmly with a laser emission subassembly respectively, through the setting with a pinion rack vertically transverse driving slide rail, the transverse driving slide rail drives two laser emission subassemblies and removes, makes the moving direction of laser emission subassembly perpendicular with loading board moving direction.
Further, the method comprises the following steps: the utility model discloses a bearing plate, including bearing plate, supporting plate, spacing strip two, the top of supporting plate is connected firmly two relative limiting plates three, the other end top surface and the bottom surface of bearing plate have all been connected firmly spacing two, spacing strip two is the same with spacing one structure, through the setting of firm module for when the bearing plate slided into another sliding joint, the other end of bearing plate slided into between two limiting plates three, and it is spacing to carry out the centre gripping to the other end of bearing plate, thereby makes the bearing plate more stable, makes things convenient for the laser emission subassembly to process the material on the bearing plate.
Further, the method comprises the following steps: the top surface of the bottom plate is positioned at one end of the two sliding seams I, which is deviated from the deflection module I, a conveyer belt is installed, the conveyer belt is used for moving empty material boxes to the oblique lower part of one end of the sliding seams I and sending out the filled material boxes, two sides of one end of the circulation mechanism are respectively provided with a feeding mechanism, the bottom surface and the top surface of the bearing plate are respectively fed through the arrangement of the two feeding mechanisms, the bearing plate is driven by a motor to move to the other end of the other sliding seam I, the adsorption holes on the bottom surface of the bearing plate at the moment release the adsorption of the materials, the materials directly fall into the material box which is opposite to the position on the conveyer belt, the deflection module II drives the moving mechanism to deflect upwards by one hundred eighty degrees, the bearing plate moves into one sliding seam I, and when the bearing plate passes over the conveyer belt, the adsorption holes on the top surface of the bearing plate release the adsorption of the materials, so that the materials fall into the corresponding material box on the conveyer belt, realize the unloading of material on the loading board, distinguish and adsorb the transport unloading with general adoption manipulator, it is more swift, and need not additionally to set up the manipulator, reduce cost.
Further, the method comprises the following steps: two the slide rail has been linked firmly between the top intermediate position of worker's frame, the inner wall sliding connection who goes up the slide rail has the fastener, two the slide rail has been linked firmly down between the bottom intermediate position of worker's frame, the inner wall sliding connection of slide rail has the fastener down, and wherein trachea and various wire on the moving mechanism one pass from the fastener on the line and be connected with the external world, and trachea and various wire on the moving mechanism two pass from the fastener down and are connected with the external world, and deflection module one and deflection module two are one hundred eighty degrees that upwards deflect when driving moving mechanism one and deflect, and deflection module one and deflection module two are one hundred eighty degrees that deflect downwards when driving moving mechanism two and deflect to avoid the pipeline between moving mechanism one and the moving mechanism two to interfere the winding.
Further, the method comprises the following steps: the length of the third limiting plate is the same as that of the first limiting plate, so that when the bearing plate slides into the other sliding seam, the other end of the bearing plate slides into the space between the third limiting plates, the other end of the bearing plate is clamped and limited, and deflection of the bearing plate is not interfered.
The invention has the beneficial effects that:
1. through the arrangement of the bearing plate and the two laser emission assemblies, the bearing plate moves along the toothed plate in one direction, the laser emission assemblies transversely move to enable the moving direction of the laser emission assemblies to be perpendicular to that of the bearing plate, the two laser emission assemblies respectively cut materials on the top surface and the bottom surface of the bearing plate, the materials can be cut into complicated shapes by the aid of the cooperation of the bearing plate and the laser emission assemblies in mutually perpendicular movement, the materials can be adsorbed and fixed by the aid of the bottom surface and the top surface of the bearing plate, and the two laser emission assemblies are arranged oppositely, so that the two materials can be processed at one time, and efficiency is improved;
2. the first moving mechanism and the second moving mechanism move on the circulating mechanism in a circulating manner, double-side loading, processing and unloading processes are realized in the circulating movement process, and the first moving mechanism and the second moving mechanism move in a circulating manner, so that the waiting time of the laser emission assembly is reduced, and the efficiency is increased;
3. through the setting of conveyer belt, material processing to on the loading board is accomplished the back, the motor drives the loading board and removes to the other end of another smooth seam one, the absorption hole of loading board bottom surface at this moment is relieved and is adsorbed to the material, the material directly falls into in the material box to the position on the conveyer belt, two drive moving mechanism one that deflects one hundred eighty degrees back upwards to the deflection module, the loading board removes to in a smooth seam one, and when the loading board passes through the conveyer belt top, the absorption hole of loading board top surface is relieved and is adsorbed the material, thereby make the material fall in the corresponding material box on the conveyer belt, realize the unloading of material on the loading board, distinguish and general adoption manipulator adsorbs the transport unloading, and is more swift, and need not additionally to set up the manipulator, the cost is reduced.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the circulating mechanism of the present invention;
FIG. 3 is a schematic view of the partitioning mechanism of the present invention;
FIG. 4 is a schematic view of a moving mechanism according to the present invention;
FIG. 5 is a schematic view of the bottom structure of the carrier plate of the present invention;
FIG. 6 is a schematic cross-sectional view of the carrier plate of the present invention;
FIG. 7 is a schematic view of a deflection module according to the present invention;
FIG. 8 is a schematic view showing a part of the structure of the circulating mechanism in the present invention;
fig. 9 is a schematic view of the position structure of the upper slide rail and the lower slide rail in the present invention.
In the figure: 100. a circulating mechanism; 110. a tool frame; 111. a support frame; 120. a first limiting plate; 121. sliding seam I; 130. a toothed plate I; 140. an upper slide rail; 141. a wire clip is arranged; 150. a lower slide rail; 151. a wire clamp; 160. a deflection module I; 161. a side plate; 162. a second limiting plate; 163. sliding seams II; 164. a toothed plate II; 165. a cross beam; 166. a drive assembly; 167. a rotating seat; 170. a second deflection module; 180. a stabilizing module; 181. a support plate; 182. a third limiting plate; 200. a first moving mechanism; 210. a carrier plate; 211. an adsorption hole; 212. a first limiting strip; 213. a second limiting strip; 214. a first air pipe opening; 215. a second air pipe opening; 220. a fixing plate; 230. a motor; 231. a gear; 300. a second moving mechanism; 400. a base plate; 500. a feeding mechanism; 600. a dividing mechanism; 610. driving the slide rail transversely; 620. a chassis; 630. contraband shelf; 631. a laser emitting assembly; 700. and (5) conveying the belt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 9, a cutting device for semiconductors includes a bottom plate 400, a circulation mechanism 100 is fixedly connected to a top surface of the bottom plate 400, the circulation mechanism 100 includes two tool frames 110, a support frame 111 is fixedly connected between a bottom surface of the tool frame 110 and the bottom plate 400, a first limit plate 120 is fixedly connected between four top corners of the two tool frames 110, a first sliding slot 121 is formed between the two first limit plates 120 located on the same side, a first deflection module 160 is arranged at one end of the first sliding slot 121, a second deflection module 170 is arranged at the other end of the first sliding slot 121, a first tooth plate 130 is fixedly connected between two middle side positions of the two tool frames 110, a first moving mechanism 200 and a second moving mechanism 300 are arranged in cooperation with the first tooth plate 130, the first moving mechanism 200 and the second moving mechanism 300 are both slidably connected with the first sliding slot 121, and both the first moving mechanism 200 and the second moving mechanism 300 can move along the length direction of the first tooth plate 130, the first moving mechanism 200 comprises a bearing plate 210 with a top surface and a bottom surface capable of adsorbing materials, a dividing mechanism 600 is arranged on one side of the circulating mechanism 100, the dividing mechanism 600 comprises two laser emission components 631 which are oppositely arranged and can move transversely, the materials are adsorbed and fixed on the top surface and the bottom surface of the bearing plate 210 by matching with the arrangement of the two laser emission components 631, the bearing plate 210 moves along the first tooth plate 130, the laser emission components 631 move transversely, the moving direction of the laser emission components 631 is perpendicular to the moving direction of the bearing plate 210, the two laser emission components 631 respectively cut the materials on the top surface and the bottom surface of the bearing plate 210, and the materials are cut into complicated shapes by the laser emission components through the matching of the mutually perpendicular movement of the bearing plate 210 and the laser emission components 631, so that the two materials can be processed at one time, the efficiency is increased, and meanwhile, the complicated processing of the materials on the bearing plate 210 by the laser emission components 631 is facilitated, through the arrangement of the first moving mechanism 200 and the second moving mechanism 300, the first moving mechanism 200 and the second moving mechanism 300 circularly move on the circulating mechanism 100, so that the waiting time is reduced, and the efficiency is increased.
One end of the bearing plate 210 is fixedly connected with the fixing plate 220, the top surface of the fixing plate 220 is fixedly connected with the motor 230, the output end of the motor 230 is fixedly connected with the gear 231, the gear 231 is meshed with the first toothed plate 130, the motor 230 drives the gear 231 to rotate, and the gear 231 drives the bearing plate 210 to move along the first sliding seam 121 through the meshing with the first toothed plate 130.
The top surface and the bottom surface of the bearing plate 210 are both provided with a plurality of adsorption holes 211, one end of the bearing plate 210 is fixedly connected with a first air pipe opening 214 and a second air pipe opening 215, the adsorption holes 211 on the top surface of the bearing plate 210 are both communicated with the first air pipe opening 214, the adsorption holes 211 on the bottom surface of the bearing plate 210 are both communicated with the second air pipe opening 215, the adsorption holes 211 on the top surface and the bottom surface of the bearing plate 210 are respectively controlled conveniently, materials are adsorbed and fixed on the bearing plate 210 conveniently, the bottom surface and the top surface of one end of the bearing plate 210 are fixedly connected with a first limit strip 212, one side of the first limit strip 212, which is far away from the bearing plate 210, is rotatably connected with a plurality of rollers, the outer sides of the two side walls of the sliding seam I121 converge towards the middle, the bearing plate 210 is prevented from deflecting outwards by extruding the first limit strip 212, so that the gear 231 is tightly meshed with the first tooth plate 130, and the arrangement of the rollers reduces the friction between the first limit strip 212 and the first limit plate 120, the first deflection module 160 comprises a rotating seat 167, one end of the rotating seat 167 is rotatably connected with a side plate 161, the other end of the rotating seat 167 is provided with a driving assembly 166 for driving the side plate 161 to rotate, two end positions of two sides of a side wall of the side plate 161 are fixedly connected with two limit plates 162, a sliding seam two 163 is formed between the two limit plates 162 on the same side, a side wall of the side plate 161 corresponds to two tooth plate one 130 positions and is fixedly connected with a tooth plate two 164, a cross beam 165 is fixedly connected between one ends of the two limit plates two 162 on the same end of the side wall of the side plate 161, the second deflection module 170 and the first deflection module 160 are identical in structure, the sliding seam two 163 is aligned with the first sliding seam 121, the tooth plate two 164 is aligned with the first tooth plate 130, and the first moving mechanism 200 can conveniently enter the first deflection module 160 and the second deflection module 170.
The dividing mechanism 600 further comprises a transverse driving slide rail 610 installed on the bottom plate 400, the moving direction of the output end of the transverse driving slide rail 610 is perpendicular to the first tooth plate 130, the output end of the transverse driving slide rail 610 is fixedly connected with a bottom frame 620, the top end of the bottom frame 620 is fixedly connected with Contraband frames 630, two ends of the Contraband frames 630 are fixedly connected with a laser emission component 631 respectively, through the arrangement of the transverse driving slide rail 610 perpendicular to the first tooth plate 130, the transverse driving slide rail 610 drives the two laser emission components 631 to move, so that the moving direction of the laser emission components 631 is perpendicular to the moving direction of the bearing plate 210, one side of the top surface of the bottom plate 400 close to the dividing mechanism 600 is fixedly connected with a stabilizing module 180, the stabilizing module 180 comprises two supporting plates 181 fixedly connected with the bottom plate 400, the top end of the supporting plate 181 is fixedly connected with two opposite third limiting plates 182, and the top surface and the bottom surface of the other end of the bearing plate 210 are fixedly connected with a second limiting strip 213, two spacing strips 213 are the same as one spacing strip 212 in structure, and through the setting of the stabilizing module 180, when the bearing plate 210 slides into another sliding slot 121, the other end of the bearing plate 210 slides into between two three limiting plates 182, and the other end of the bearing plate 210 is clamped and limited, so that the bearing plate 210 is more stable, and the laser emitting assembly 631 can process materials on the bearing plate 210 conveniently.
The top surface of the bottom plate 400 is positioned at one end of the two sliding seams I121 deviating from the deflection module I160, a conveying belt 700 is installed at one end of the conveying belt 700, the conveying belt 700 is used for moving empty material boxes to the oblique lower side of one end of the sliding seams I121 and sending out the filled material boxes, two sides of one end of the circulation mechanism 100 are respectively provided with a feeding mechanism 500, the bottom surface and the top surface of the bearing plate 210 are respectively fed through the arrangement of the two feeding mechanisms 500, the bearing plate 210 is driven by a motor 230 to move to the other end of the other sliding seam I121, at the moment, the adsorption holes 211 in the bottom surface of the bearing plate 210 release the adsorption of the materials, the materials directly fall into the material boxes at opposite positions on the conveying belt 700, after the deflection module II 170 drives the moving mechanism I200 to deflect upwards by one hundred eighty degrees, the bearing plate 210 moves into one sliding seam I121, and when the bearing plate 210 passes through the upper part of the conveying belt 700, the adsorption holes 211 in the top surface of the bearing plate 210 release the adsorption of the materials, thereby make the material fall corresponding material box on conveyer belt 700 in, realize the unloading of material on the loading board 210, distinguish with the unloading of general adoption manipulator absorption transport, it is more swift, and need not additionally to set up the manipulator, reduce the cost.
An upper slide rail 140 is fixedly connected between the middle positions of the top ends of the two tool frames 110, an upper wire clamp 141 is slidably connected to the inner wall of the upper slide rail 140, a lower slide rail 150 is fixedly connected between the middle positions of the bottom ends of the two tool frames 110, a lower wire clamp 151 is slidably connected to the inner wall of the lower slide rail 150, an air pipe and various wires on the first moving mechanism 200 penetrate through the upper wire clamp 141 to be connected with the outside, an air pipe and various wires on the second moving mechanism 300 penetrate through the lower wire clamp 151 to be connected with the outside, the first deflection module 160 and the second deflection module 170 deflect upwards by one hundred eighty degrees when driving the first moving mechanism 200 to deflect, the first deflection module 160 and the second deflection module 170 deflect downwards by one hundred eighty degrees when driving the second moving mechanism 300 to deflect, so that interference winding of pipelines between the first moving mechanism 200 and the second moving mechanism 300 is avoided, and the first moving mechanism 200 is convenient to drive the pipelines to move when moving, the length of the third limiting plate 182 is the same as that of the first limiting plate 120, so that when the bearing plate 210 slides into the first sliding slot 121, the other end of the bearing plate 210 slides into the space between the two third limiting plates 182, the other end of the bearing plate 210 is clamped and limited, and deflection of the bearing plate 210 is not interfered.
The working principle is as follows: in the initial state, the first moving mechanism 200 is slidably connected with the first sliding slit 121 of the deviating dividing mechanism 600, the first air pipe opening 214 and the second air pipe opening 215 are communicated with an external air pump, the motor 230 drives the gear 231 to rotate, the gear 231 rotates to drive the bearing plate 210 to move along the first sliding slit 121, since the first sliding slot 121 is aligned with the second sliding slot 163, and the second tooth plate 164 is aligned with the first tooth plate 130, the carrier plate 210 moves into one sliding slot two 163, a corresponding pair of the feeding mechanisms 500 sucks the material and places it on the bottom surface of the loading plate 210, negative pressure is formed in the suction holes 211 on the bottom surface of the carrier plate 210 through the second air pipe opening 215, thereby fix the material absorption in the bottom surface of loading board 210, drive assembly 166 drives curb plate 161 and rotates, and curb plate 161 drives moving mechanism 200 and upwards deflects one hundred eighty degrees, and another feed mechanism 500 carries out the material loading to the top surface of loading board 210, realizes the material loading to the bottom surface and the top surface of loading board 210.
The motor 230 drives the bearing plate 210 to slide into the other sliding slot 121, the motor 230 drives the bearing plate 210 to move along the first toothed plate 130, through the arrangement of the transverse driving slide rail 610 perpendicular to the first tooth plate 130, the transverse driving slide rail 610 drives the two laser emission assemblies 631 to move, so that the moving direction of the laser emission assemblies 631 is perpendicular to the moving direction of the bearing plate 210, the two laser emission assemblies 631 respectively cut materials on the top surface and the bottom surface of the bearing plate 210, through the cooperation of the motor 230 and the transverse driving slide rail 610, the laser emission component 631 cuts materials with complex shapes, through the arrangement of the stabilizing module 180, when the bearing plate 210 slides into the other sliding slot one 121, the other end of the bearing plate 210 slides into between the two third limiting plates 182, it is spacing to carry out the centre gripping to the other end of loading board 210 to make loading board 210 more stable, make things convenient for laser emission subassembly 631 to process the material on loading board 210.
After the materials are processed, the motor 230 drives the bearing plate 210 to move to the other end of the first sliding slot 121, at this time, the adsorption hole 211 on the bottom surface of the bearing plate 210 releases adsorption of the materials, the materials directly fall into the material box at the opposite position on the conveyor belt 700, the motor 230 drives the bearing plate 210 to slide into the second deflection module 170, the second deflection module 170 drives the first moving mechanism 200 to deflect one hundred eighty degrees upwards, then the motor 230 drives the bearing plate 210 to move out of the second deflection module 170, the bearing plate 210 moves into the first sliding slot 121, and when the bearing plate 210 passes over the conveyor belt 700, the top surface of the bearing plate 210 is actually positioned at the bottom end due to the overturning of the second deflection module 170, the adsorption hole 211 on the top surface of the bearing plate 210 releases adsorption of the materials, so that the materials fall into the corresponding material box on the conveyor belt 700, and the motor 230 drives the bearing plate 210 to return to the initial position, through the arrangement of the second moving mechanism 300 which is the same as the first moving mechanism 200, the first moving mechanism 200 and the second moving mechanism 300 circularly move on the circulating mechanism 100, so that the processing speed of the material is increased, and the waiting time is reduced.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is illustrative and explanatory only and is not intended to be exhaustive or to limit the invention to the precise embodiments described, and various modifications, additions, and substitutions may be made by those skilled in the art without departing from the scope of the invention or exceeding the scope of the claims.
Claims (10)
1. The cutting device for the semiconductor is characterized by comprising a base plate (400), wherein a circulating mechanism (100) is fixedly connected to the top surface of the base plate (400), the circulating mechanism (100) comprises two tool frames (110), a supporting frame (111) is fixedly connected between the bottom surface of the tool frame (110) and the base plate (400), two limiting plates I (120) are fixedly connected between four top corners of the tool frame (110), a sliding seam I (121) is formed between the two limiting plates I (120) positioned on the same side, one end of each sliding seam I (121) is provided with a deflection module I (160), the other end of each sliding seam I (121) is provided with a deflection module II (170), a tooth plate I (130) is fixedly connected between the two middle side positions of the tool frame (110), and a moving mechanism I (200) and a moving mechanism II (300) are arranged on the two tooth plate I (130) in a matching manner, moving mechanism one (200) and moving mechanism two (300) all with sliding seam one (121) sliding connection, and moving mechanism one (200) and moving mechanism two (300) homoenergetic move along pinion rack one (130) length direction, moving mechanism one (200) include top surface and bottom surface homoenergetic adsorption material's loading board (210), one side of circulation mechanism (100) is provided with divides mechanism (600), divide mechanism (600) including two relative settings and can lateral shifting's laser emission subassembly (631).
2. The cutting device for semiconductors according to claim 1, wherein a fixing plate (220) is fixedly connected to one end of the carrying plate (210), a motor (230) is fixedly connected to a top surface of the fixing plate (220), a gear (231) is fixedly connected to an output end of the motor (230), and the gear (231) is engaged with the first toothed plate (130).
3. The semiconductor cutting device according to claim 1, wherein the top surface and the bottom surface of the bearing plate (210) are both provided with a plurality of suction holes (211), one end of the bearing plate (210) is fixedly connected with a first air pipe opening (214) and a second air pipe opening (215), the suction holes (211) on the top surface of the bearing plate (210) are both communicated with the first air pipe opening (214), and the suction holes (211) on the bottom surface of the bearing plate (210) are both communicated with the second air pipe opening (215).
4. The cutting device for the semiconductor as claimed in claim 1, wherein a first limit strip (212) is fixedly connected to a bottom surface and a top surface of one end of the bearing plate (210), and a plurality of rollers are rotatably connected to one surface of the first limit strip (212) facing away from the bearing plate (210).
5. The dicing apparatus for semiconductor according to claim 1, the deflection module I (160) comprises a rotating seat (167), one end of the rotating seat (167) is rotatably connected with a side plate (161), the other end of the rotating seat (167) is provided with a driving component (166) which drives the side plate (161) to rotate, two end positions of two sides of one side wall of the side plate (161) are fixedly connected with a second limiting plate (162), a second sliding seam (163) is formed between the two second limiting plates (162) positioned at the same side, a second toothed plate (164) is fixedly connected to one side wall of the side plate (161) corresponding to the first toothed plates (130), and a cross beam (165) is fixedly connected between one ends of two second limit plates (162) which are positioned at the same end on one side wall of the side plate (161), the second deflection module (170) and the first deflection module (160) have the same structure.
6. The semiconductor cutting device according to claim 1, wherein the dividing mechanism (600) further comprises a transverse driving slide rail (610) mounted on the base plate (400), and the output end of the transverse driving slide rail (610) moves in a direction perpendicular to the first tooth plate (130), the output end of the transverse driving slide rail (610) is fixedly connected with a bottom frame (620), the top end of the bottom frame (620) is fixedly connected with an Contraband frame (630), and two ends of the Contraband frame (630) are fixedly connected with a laser emitting assembly (631) respectively.
7. The cutting device for semiconductors according to claim 4, wherein a stabilizing module (180) is fixedly connected to one side of the top surface of the bottom plate (400) close to the dividing mechanism (600), the stabilizing module (180) comprises two supporting plates (181) fixedly connected to the bottom plate (400), two opposite limiting plates three (182) are fixedly connected to the top end of the supporting plate (181), a limiting strip two (213) is fixedly connected to the top surface and the bottom surface of the other end of the bearing plate (210), and the limiting strip two (213) and the limiting strip one (212) have the same structure.
8. The cutting device for the semiconductors according to claim 1, wherein a conveyor belt (700) is mounted on the top surface of the bottom plate (400) at one end of the two sliding seams (121) away from the deflection module (160), the conveyor belt (700) is used for moving the empty material box to the position obliquely below one end of the sliding seams (121) and sending out the full material box, and the feeding mechanism (500) is arranged on two sides of one end of the circulating mechanism (100).
9. The cutting device for the semiconductor, according to claim 1, characterized in that an upper slide rail (140) is fixedly connected between the top middle positions of the two tool frames (110), an upper wire clamp (141) is slidably connected to the inner wall of the upper slide rail (140), a lower slide rail (150) is fixedly connected between the bottom middle positions of the two tool frames (110), and a lower wire clamp (151) is slidably connected to the inner wall of the lower slide rail (150).
10. The semiconductor cutting device according to claim 7, wherein the length of the third limiting plate (182) is the same as the length of the first limiting plate (120).
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