CN108213741A - A kind of double-workbench laser cutting machine - Google Patents
A kind of double-workbench laser cutting machine Download PDFInfo
- Publication number
- CN108213741A CN108213741A CN201810232457.3A CN201810232457A CN108213741A CN 108213741 A CN108213741 A CN 108213741A CN 201810232457 A CN201810232457 A CN 201810232457A CN 108213741 A CN108213741 A CN 108213741A
- Authority
- CN
- China
- Prior art keywords
- workbench
- laser cutting
- rack
- double
- upper table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
Abstract
The invention discloses a kind of double-workbench laser cutting machines, include rack 1, it is arranged on the cabinet 2 at 1 rear of rack, the rack 1 is equipped with workbench 5, the workbench 5 is equipped with can be with X-axis, Y-axis and the laser cutting head 3 of Z-direction movement, the workbench 5 includes the upper table 51 of high low setting and lower table 52, the upper table 51 and lower table 52 are driven by upper driving device 53 and lower driving device 54 along X-direction alternating movement respectively, the upper table 51 and lower table 52 are equipped with multiple sucker holes 55, vacuum cup is equipped in the sucker hole 55, vacuum cup connects vacuum generating device and adsorbs hemisection material on upper table 51 and lower table 52.Cutting is carried out at the same time with placing hemisection material, is greatly improved the efficiency, and substantially increase cutting accuracy and quality.
Description
Technical field
The present invention relates to a kind of machine tool, more particularly to a kind of double-workbench laser cutting machine.
Background technology
With the rapid development of laser cutting technique, be cut by laser with the characteristics of its high efficiency, high processing quality in machinery
The application in processing and manufacturing field is more and more extensive.The course of work of laser cutting machine, including three feeding, cutting, blanking steps.
Only there are one workbench for existing laser cutting machine, cause processing efficiency low, when processing hemisection material, due to
Hemisection material area is big, and thickness is thin, so when fixed, can not meet the requirements, cause cutting accuracy not high.
Hemisection refers to：In processing, only one layer of cutting, and another layer material is without cutting, general such material area
Greatly, thinner thickness.
Invention content
In order to solve the above technical problem, the present invention provides a kind of double-workbench laser cutting machines.
To realize foregoing purpose, the present invention provides following technical solution：
A kind of double-workbench laser cutting machine comprising rack, is arranged on the cabinet at the rack rear, and the rack is equipped with work
Make platform, the workbench is equipped with the laser cutting head that can be moved with X-axis, Y-axis and Z-direction, and the workbench bag is containing height
The upper table and lower table of setting, the upper table and lower table are respectively by upper driving device and lower driving device band
It is dynamic to be equipped with multiple sucker holes along X-direction alternating movement, the upper table and lower table, it is equipped in the sucker hole true
Suction disk.
Operation console is additionally provided on front side of the rack, the operation console is equipped with multiple operation buttons.
Housing is additionally provided in the rack, the case cover forms a working space above the laser cutting head,
The laser cutting head works in the working space.
Safety door is additionally provided on front side of the housing, the safety door is opposite opened, described when the laser cutting head works
Safety door is closed.
Beneficial effect of the present invention：Using the upper table and lower table of alternating movement, when upper table is cut
When, lower table carries out feeding and blanking, and vice versa.
Multiple sucker holes are equipped on upper table and lower table, vacuum cup is equipped in the sucker hole.It is using
When, hemisection material is adsorbed by vacuum cup to be fixed, not only easy to operate, and fixation.
Description of the drawings
Fig. 1：A kind of double-workbench laser cutting machine stereogram.
Fig. 2：A kind of workbench stereogram of double-workbench laser cutting machine.
Fig. 3：A kind of double-workbench laser cutting machine stereogram, containing housing.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes.
Fig. 3 is please referred to Fig.1, a kind of double-workbench laser cutting machine comprising rack 1, is arranged on 1 rear of rack
Cabinet 2, the rack 1 are equipped with workbench 5, and the workbench 5 is equipped with the laser that can be moved with X-axis, Y-axis and Z-direction
Cutting head 3, the workbench 5 include the upper table 51 of high low setting and lower table 52, the upper table 51 and lower work
Make platform 52 to be driven along X-direction alternating movement, 51 He of upper table by upper driving device 53 and lower driving device 54 respectively
Lower table 52 is equipped with multiple sucker holes 55, is equipped with vacuum cup in the sucker hole 55, vacuum cup connects vacuum
Device adsorbs hemisection material on upper table 51 and lower table 52.
1 front side of rack is additionally provided with operation console 4, and the operation console 4 is equipped with multiple operation buttons, operation button and electricity
Control system electrical connection in case, while control system control laser cutting head 3, workbench 5 and the normal work of vacuum generating device
Make.
Housing 6 is additionally provided in the rack 1, the housing 6 covers on 3 top of laser cutting head and forms a work sky
Between, the laser cutting head 3 works in the working space.
6 front side of housing is additionally provided with safety door 61, and the safety door 61 is opposite opened, and the laser cutting head 3 works
When, the safety door 61 is in off state.
When in use, when upper table 51 is in working space, lower table 52 is located at the operation outside working space
The side of platform 4 is conveniently operated personnel and takes out from lower table 52 or hemisection material is placed into lower table hemisection material
On 52, vice versa.
Workflow：Upper table 51 is outside working space, and lower table 52 is in working space；
1st, hemisection material is placed on upper table 51, presses start button；
2nd, vacuum generating device generates vacuum, and by the absorption of hemisection material on upper table 51, upper driving device 53 drives upper work
Make platform 51 to be moved in working space, lower table 52 is driven to be moved to work sky out of working space with driving device 54 at present
Between it is outer, upper table 51 is high low setting with lower table 52, thus upper table 51 and lower table 52 replace move when
Interference will not be generated；
3rd, laser cutting head 3 carries out cutting operation in working space to hemisection material on upper table 51, meanwhile, operating personnel
Another block of hemisection material is placed on lower table 52, vacuum generating device adsorbs hemisection material on lower table 52；
4th, after the completion of 3 cutting operation of laser cutting head, upper driving device 53 drives upper table 51 to move again to outside working space,
Lower table 52 is driven to be moved in working space outside working space with driving device 54 at present；
5th, laser cutting head 3 carries out cutting operation in working space to hemisection material on lower table 52, meanwhile, operating personnel
First the hemisection material for cutting completion is taken out, then the uncut hemisection material of third block is placed on upper work from upper table 51
Make on platform 51, vacuum generating device adsorbs hemisection material on upper table 51, and a cycle is completed；
Illustrate, can be needed to carry out continuous multiple cycle operations, and cut and be carried out at the same time with placing hemisection material according to production,
It greatly improving the efficiency, vacuum generating device adsorbs hemisection material on the table, not only picks and places conveniently, fixation, and
And substantially increase cutting accuracy and quality.
It is obvious to a person skilled in the art that the present invention is not limited to the details of foregoing example embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requirement rather than preceding description limit, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference numeral in claim should not be considered as to the involved claim of limitation.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (4)
1. a kind of double-workbench laser cutting machine comprising rack, is arranged on the cabinet at the rack rear, the rack is equipped with
Workbench, the workbench are equipped with the laser cutting head that can be moved with X-axis, Y-axis and Z-direction, and the workbench bag is containing height
The upper table and lower table of low setting, the upper table and lower table are respectively by upper driving device and lower driving device
It drives along X-direction alternating movement, the upper table and lower table are equipped with multiple sucker holes, are equipped in the sucker hole
Vacuum cup.
2. a kind of double-workbench laser cutting machine according to claim 1, which is characterized in that be additionally provided on front side of the rack
Operation console, the operation console are equipped with multiple operation buttons.
3. a kind of double-workbench laser cutting machine according to claim 1, it is characterised in that：Shell is additionally provided in the rack
Body, the case cover form a working space above the laser cutting head, and the laser cutting head is in work sky
Interior work.
4. a kind of double-workbench laser cutting machine according to claim 3, it is characterised in that：It is additionally provided on front side of the housing
Safety door, the safety door is opposite opened, and when the laser cutting head works, the safety door is closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810232457.3A CN108213741A (en) | 2018-03-21 | 2018-03-21 | A kind of double-workbench laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810232457.3A CN108213741A (en) | 2018-03-21 | 2018-03-21 | A kind of double-workbench laser cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108213741A true CN108213741A (en) | 2018-06-29 |
Family
ID=62659814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810232457.3A Pending CN108213741A (en) | 2018-03-21 | 2018-03-21 | A kind of double-workbench laser cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108213741A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109514624A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film-cutting device |
| CN109516180A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film automatical feeding system and the automatic deflesher of rubber plug |
| CN114083157A (en) * | 2022-01-11 | 2022-02-25 | 江苏卓远半导体有限公司 | Cutting device for semiconductor |
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| CN203751534U (en) * | 2014-02-26 | 2014-08-06 | 深圳市大族激光科技股份有限公司 | Double-workbench robot laser cutting machine |
| JP2015016485A (en) * | 2013-07-10 | 2015-01-29 | 三菱電機株式会社 | Laser cutting device and laser cutting method |
| CN205166187U (en) * | 2015-11-09 | 2016-04-20 | 佛山市宏石激光技术有限公司 | Laser cutting machine change table |
| CN206662553U (en) * | 2017-04-24 | 2017-11-24 | 安徽艾克森机械设备有限公司 | A kind of air-draft-type lathe bed of laser cutting machine |
| CN208214588U (en) * | 2018-03-21 | 2018-12-11 | 东莞市合力激光设备有限公司 | A kind of double-workbench laser cutting machine |
-
2018
- 2018-03-21 CN CN201810232457.3A patent/CN108213741A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015016485A (en) * | 2013-07-10 | 2015-01-29 | 三菱電機株式会社 | Laser cutting device and laser cutting method |
| CN203751534U (en) * | 2014-02-26 | 2014-08-06 | 深圳市大族激光科技股份有限公司 | Double-workbench robot laser cutting machine |
| CN205166187U (en) * | 2015-11-09 | 2016-04-20 | 佛山市宏石激光技术有限公司 | Laser cutting machine change table |
| CN206662553U (en) * | 2017-04-24 | 2017-11-24 | 安徽艾克森机械设备有限公司 | A kind of air-draft-type lathe bed of laser cutting machine |
| CN208214588U (en) * | 2018-03-21 | 2018-12-11 | 东莞市合力激光设备有限公司 | A kind of double-workbench laser cutting machine |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109514624A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film-cutting device |
| CN109516180A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film automatical feeding system and the automatic deflesher of rubber plug |
| CN109514624B (en) * | 2018-11-09 | 2020-11-17 | 青岛时间河智能科技有限公司 | Film cutting device |
| CN109516180B (en) * | 2018-11-09 | 2021-08-20 | 青岛时间河智能科技有限公司 | Automatic film feeding system and automatic rubber plug edge removing machine |
| CN114083157A (en) * | 2022-01-11 | 2022-02-25 | 江苏卓远半导体有限公司 | Cutting device for semiconductor |
| CN114083157B (en) * | 2022-01-11 | 2022-04-12 | 江苏卓远半导体有限公司 | Cutting device for semiconductor |
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