CN114073171A - 线路嵌入式基板、芯片封装结构及基板制备方法 - Google Patents

线路嵌入式基板、芯片封装结构及基板制备方法 Download PDF

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Publication number
CN114073171A
CN114073171A CN201980097889.0A CN201980097889A CN114073171A CN 114073171 A CN114073171 A CN 114073171A CN 201980097889 A CN201980097889 A CN 201980097889A CN 114073171 A CN114073171 A CN 114073171A
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CN
China
Prior art keywords
layer
chip
substrate
embedded substrate
circuit
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Pending
Application number
CN201980097889.0A
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English (en)
Inventor
郭茂
黄京
张晓东
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN114073171A publication Critical patent/CN114073171A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种线路嵌入式基板、芯片封装结构及基板制备方法。线路嵌入式基板用于固定安装芯片裸片，封装后则可形成芯片封装结构。具体的，上述线路嵌入式基板包括介电层和焊垫，该焊垫用于与芯片裸片焊接连接。上述焊垫的一部分嵌入上述介电层，另一部分凸出于介电层，即该焊垫与芯片裸片连接的表面高于介电层靠近芯片裸片的表面。利用该实施例中的线路嵌入式基板封装芯片裸片时，可以充分的清除线路嵌入式基板的焊垫与芯片裸片的导电端部之间的非导电物质，从而可以使芯片裸片的导电端部与线路嵌入式基板的焊垫之间利用焊料实现有效可靠的电连接，从而提高芯片封装结构的可靠性和稳定性，提高芯片封装结构的良率。

Description

PCT国内申请，说明书已公开。

Claims (12)

  1. PCT国内申请，权利要求书已公开。
CN201980097889.0A 2019-08-20 2019-08-20 线路嵌入式基板、芯片封装结构及基板制备方法 Pending CN114073171A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/101646 WO2021031125A1 (zh) 2019-08-20 2019-08-20 线路嵌入式基板、芯片封装结构及基板制备方法

Publications (1)

Publication Number Publication Date
CN114073171A true CN114073171A (zh) 2022-02-18

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CN201980097889.0A Pending CN114073171A (zh) 2019-08-20 2019-08-20 线路嵌入式基板、芯片封装结构及基板制备方法

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CN (1) CN114073171A (zh)
WO (1) WO2021031125A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114531135B (zh) * 2022-04-25 2022-08-05 深圳新声半导体有限公司 一种用于SAW filter CSP形式的封装结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110147924A1 (en) * 2009-12-21 2011-06-23 Shinko Electric Industries Co., Ltd. Wiring substrate and method of manufacturing the same
US20130075145A1 (en) * 2011-09-27 2013-03-28 Shinko Electric Industries Co., Ltd. Wiring substrate and method of manufacturing the same
US20140174805A1 (en) * 2012-12-24 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US20150208517A1 (en) * 2014-01-22 2015-07-23 Amkor Technology, Inc. Embedded trace substrate and method of forming the same
US20160021759A1 (en) * 2014-07-15 2016-01-21 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP2016100352A (ja) * 2014-11-18 2016-05-30 イビデン株式会社 プリント配線板およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100992181B1 (ko) * 2007-12-26 2010-11-04 삼성전기주식회사 패키지용 기판 및 그 제조방법
US8686300B2 (en) * 2008-12-24 2014-04-01 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP5147779B2 (ja) * 2009-04-16 2013-02-20 新光電気工業株式会社 配線基板の製造方法及び半導体パッケージの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110147924A1 (en) * 2009-12-21 2011-06-23 Shinko Electric Industries Co., Ltd. Wiring substrate and method of manufacturing the same
US20130075145A1 (en) * 2011-09-27 2013-03-28 Shinko Electric Industries Co., Ltd. Wiring substrate and method of manufacturing the same
US20140174805A1 (en) * 2012-12-24 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US20150208517A1 (en) * 2014-01-22 2015-07-23 Amkor Technology, Inc. Embedded trace substrate and method of forming the same
US20160021759A1 (en) * 2014-07-15 2016-01-21 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP2016100352A (ja) * 2014-11-18 2016-05-30 イビデン株式会社 プリント配線板およびその製造方法

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