CN114041196B - 薄膜电容器以及薄膜电容器用的外装壳体 - Google Patents

薄膜电容器以及薄膜电容器用的外装壳体 Download PDF

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Publication number
CN114041196B
CN114041196B CN202080048484.0A CN202080048484A CN114041196B CN 114041196 B CN114041196 B CN 114041196B CN 202080048484 A CN202080048484 A CN 202080048484A CN 114041196 B CN114041196 B CN 114041196B
Authority
CN
China
Prior art keywords
resin
film
exterior case
capacitor
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080048484.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114041196A (zh
Inventor
城岸贤
菊池公明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Original Assignee
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd, Shizuki Electric Co Inc filed Critical Murata Manufacturing Co Ltd
Publication of CN114041196A publication Critical patent/CN114041196A/zh
Application granted granted Critical
Publication of CN114041196B publication Critical patent/CN114041196B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/24—Distinguishing marks, e.g. colour coding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202080048484.0A 2019-08-08 2020-04-24 薄膜电容器以及薄膜电容器用的外装壳体 Active CN114041196B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-146346 2019-08-08
JP2019146346 2019-08-08
PCT/JP2020/017752 WO2021024558A1 (ja) 2019-08-08 2020-04-24 フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース

Publications (2)

Publication Number Publication Date
CN114041196A CN114041196A (zh) 2022-02-11
CN114041196B true CN114041196B (zh) 2023-08-15

Family

ID=74502580

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080048484.0A Active CN114041196B (zh) 2019-08-08 2020-04-24 薄膜电容器以及薄膜电容器用的外装壳体

Country Status (4)

Country Link
US (1) US11978593B2 (https=)
JP (1) JP7222494B2 (https=)
CN (1) CN114041196B (https=)
WO (1) WO2021024558A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021004865T5 (de) * 2020-10-16 2023-07-20 Murata Manufacturing Co., Ltd. Folienkondensator

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173226A (ja) * 1982-04-01 1983-10-12 Kawasaki Steel Corp 仮設地中切梁を用いた地下構造物の構築法
JP2002064030A (ja) * 2000-08-18 2002-02-28 Sumitomo Chem Co Ltd フィルムコンデンサー
CN1768393A (zh) * 2003-04-04 2006-05-03 东丽株式会社 糊状组合物及使用了该糊状组合物的电介质组合物
JP2007311625A (ja) * 2006-05-19 2007-11-29 Hitachi Aic Inc 金属化フィルムコンデンサ
CN102122569A (zh) * 2005-09-06 2011-07-13 东丽株式会社 电介质组合物及使用其的电容器
CN107708998A (zh) * 2015-06-03 2018-02-16 株式会社钟化 金属树脂复合体
WO2019146751A1 (ja) * 2018-01-25 2019-08-01 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173226U (ja) * 1982-05-12 1983-11-19 マルコン電子株式会社 コンデンサ
DE19710963C1 (de) * 1997-03-17 1998-09-17 Wolfgang Westermann SMD-Folienkondensator
JP4106738B2 (ja) * 1998-04-27 2008-06-25 住友化学株式会社 モールドコンデンサ
JP4416443B2 (ja) * 2003-06-26 2010-02-17 パナソニック株式会社 電池パックとその製造方法
JP2005222910A (ja) 2004-02-09 2005-08-18 Matsushita Electric Works Ltd 放電灯点灯装置及び照明器具
JP2006108228A (ja) * 2004-10-01 2006-04-20 Alps Electric Co Ltd 回転型可変抵抗器
JP4830479B2 (ja) 2005-12-20 2011-12-07 パナソニック株式会社 金属化フィルムコンデンサ
JP4894427B2 (ja) * 2006-09-19 2012-03-14 パナソニック株式会社 ケースモールド型コンデンサ
WO2008108089A1 (ja) * 2007-03-08 2008-09-12 Panasonic Corporation ケースモールド型コンデンサおよびその使用方法
WO2010004704A1 (ja) * 2008-07-10 2010-01-14 パナソニック株式会社 モールド型コンデンサとその製造方法
WO2011040353A1 (ja) * 2009-09-30 2011-04-07 三洋電機株式会社 電解コンデンサ
KR20120005262U (ko) * 2010-03-15 2012-07-18 파나소닉 주식회사 전지 팩
KR20160140258A (ko) * 2015-05-29 2016-12-07 삼성전기주식회사 패키지용 수지 조성물, 이를 이용한 절연 필름 및 인쇄회로기판

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173226A (ja) * 1982-04-01 1983-10-12 Kawasaki Steel Corp 仮設地中切梁を用いた地下構造物の構築法
JP2002064030A (ja) * 2000-08-18 2002-02-28 Sumitomo Chem Co Ltd フィルムコンデンサー
CN1768393A (zh) * 2003-04-04 2006-05-03 东丽株式会社 糊状组合物及使用了该糊状组合物的电介质组合物
CN102122569A (zh) * 2005-09-06 2011-07-13 东丽株式会社 电介质组合物及使用其的电容器
JP2007311625A (ja) * 2006-05-19 2007-11-29 Hitachi Aic Inc 金属化フィルムコンデンサ
CN107708998A (zh) * 2015-06-03 2018-02-16 株式会社钟化 金属树脂复合体
WO2019146751A1 (ja) * 2018-01-25 2019-08-01 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース

Also Published As

Publication number Publication date
JP7222494B2 (ja) 2023-02-15
US20220108837A1 (en) 2022-04-07
WO2021024558A1 (ja) 2021-02-11
CN114041196A (zh) 2022-02-11
US11978593B2 (en) 2024-05-07
JPWO2021024558A1 (https=) 2021-02-11

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