CN114038935B - 一种太阳能电池新型硼扩散方法 - Google Patents
一种太阳能电池新型硼扩散方法 Download PDFInfo
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- CN114038935B CN114038935B CN202111171260.1A CN202111171260A CN114038935B CN 114038935 B CN114038935 B CN 114038935B CN 202111171260 A CN202111171260 A CN 202111171260A CN 114038935 B CN114038935 B CN 114038935B
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- China
- Prior art keywords
- boron
- amorphous silicon
- diffusion
- silicon wafer
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910052796 boron Inorganic materials 0.000 title claims abstract description 47
- 238000009792 diffusion process Methods 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 31
- 239000010703 silicon Substances 0.000 claims abstract description 31
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000000137 annealing Methods 0.000 claims abstract description 11
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 238000005137 deposition process Methods 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- 238000002425 crystallisation Methods 0.000 claims description 5
- 230000008025 crystallization Effects 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 230000000087 stabilizing effect Effects 0.000 claims description 2
- 239000010453 quartz Substances 0.000 abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 11
- 239000007795 chemical reaction product Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000009835 boiling Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 12
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000004298 light response Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
- H01L21/2233—Diffusion into or out of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111171260.1A CN114038935B (zh) | 2021-10-08 | 2021-10-08 | 一种太阳能电池新型硼扩散方法 |
Applications Claiming Priority (1)
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CN202111171260.1A CN114038935B (zh) | 2021-10-08 | 2021-10-08 | 一种太阳能电池新型硼扩散方法 |
Publications (2)
Publication Number | Publication Date |
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CN114038935A CN114038935A (zh) | 2022-02-11 |
CN114038935B true CN114038935B (zh) | 2024-01-19 |
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Family Applications (1)
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CN202111171260.1A Active CN114038935B (zh) | 2021-10-08 | 2021-10-08 | 一种太阳能电池新型硼扩散方法 |
Country Status (1)
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CN (1) | CN114038935B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101129422B1 (ko) * | 2010-11-09 | 2012-03-26 | 고려대학교 산학협력단 | 태양전지 제조방법 및 그로 인해 제조된 태양전지 |
CN111341649A (zh) * | 2020-02-03 | 2020-06-26 | 深圳市拉普拉斯能源技术有限公司 | 一种n型太阳能电池硼扩散方法 |
-
2021
- 2021-10-08 CN CN202111171260.1A patent/CN114038935B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101129422B1 (ko) * | 2010-11-09 | 2012-03-26 | 고려대학교 산학협력단 | 태양전지 제조방법 및 그로 인해 제조된 태양전지 |
CN111341649A (zh) * | 2020-02-03 | 2020-06-26 | 深圳市拉普拉斯能源技术有限公司 | 一种n型太阳能电池硼扩散方法 |
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Effective date of registration: 20230117 Address after: 518000 Room 103, Building 3, Shekou Lanyuan, Nanshan District, Shenzhen, Guangdong Province Applicant after: Ou Wenkai Address before: 221399 room 1222, office building, No.11 Zhujiang East Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Applicant before: Pule new energy technology (Xuzhou) Co.,Ltd. |
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Effective date of registration: 20230414 Address after: No. 168, West Side of Kechuang Road, High-tech Industrial Development Zone, Taixing City, Taizhou City, Jiangsu Province, 225400 Applicant after: Pule New Energy Technology (Taixing) Co.,Ltd. Address before: 518000 Room 103, Building 3, Shekou Lanyuan, Nanshan District, Shenzhen, Guangdong Province Applicant before: Ou Wenkai |
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