CN114034895A - High-frequency probe card for wafer test - Google Patents
High-frequency probe card for wafer test Download PDFInfo
- Publication number
- CN114034895A CN114034895A CN202111390168.4A CN202111390168A CN114034895A CN 114034895 A CN114034895 A CN 114034895A CN 202111390168 A CN202111390168 A CN 202111390168A CN 114034895 A CN114034895 A CN 114034895A
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- probe
- panel
- hole
- probe card
- wafer testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
The invention belongs to the technical field of integrated circuit testing, and particularly relates to a high-frequency probe card for wafer testing, which comprises a connecting seat, wherein a panel is slidably arranged on the connecting seat, a probe group for connecting a testing machine and an integrated chip signal contact is fixedly arranged on the connecting seat, the probe group penetrates through the panel and is slidably connected with the panel, a correction assembly is detachably arranged on the panel, and the correction assembly is positioned on the outer side of the probe group. According to the invention, when a certain detection part of the probe group is bent or seriously worn and cannot be normally contacted with a certain signal contact of the integrated chip, the indicating assembly sends an indication, so that a user is reminded of maintaining the probe group, and the whole probe group can be ensured to normally conduct the testing machine and the integrated chip; the correcting component can correct the detection part with serious abrasion or bending, ensures that the correcting component can play a role in conducting the test machine and the integrated chip, does not need to be integrally replaced, and has lower maintenance cost.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to a high-frequency probe card for wafer testing.
Background
Since the advent of smart phones, the mobile data traffic has increased explosively, with the further intelligentization in the future, the emergence of user-centered terminal devices and inter-device communication terminals, which will further accelerate this trend and pursue faster speeds, the demand for saw filter chips from communication technology changes greatly, and the frequency bands to be covered increase with the development of the communications era as compared with the mobile phone shipment, so saw filter chips must be mounted and the required mounting amount increases proportionally, saw filters are essential parts in operations such as radio frequency, Wi-Fi, bluetooth, and inter-country mobile communication authentication carried on smart phones, and high-frequency test probe cards are devices for detecting whether such chips have defects.
However, the probe on the test probe card is easily worn or even bent seriously during a long-time test operation, so that the probe cannot normally achieve the purpose of electrical connection between the test machine and the integrated chip, the probe has a small volume, the bent and worn probe is difficult to visually check, the test result of the subsequent integrated chip is easily affected, and meanwhile, when the existing test probe is damaged, the whole probe needs to be replaced, and the cost is high.
Therefore, we propose a high frequency probe card for wafer test to solve the above problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a high-frequency probe card for wafer testing.
In order to achieve the purpose, the invention adopts the following technical scheme: the high-frequency probe card for wafer testing comprises a connecting seat, wherein a panel is slidably mounted on the connecting seat, a probe set for connecting a testing machine and an integrated chip signal contact is fixedly mounted on the connecting seat, the probe set penetrates through the panel and is slidably connected with the panel, a correction assembly is detachably mounted on the panel and is positioned on the outer side of the probe set, the correction assembly is mounted at the upper end of the panel and used for detecting the working state of the probe set, and the correction assembly is used for straightening and correcting the probe set when being detached.
Preferably, the correcting component comprises a rectangular frame, an indicating component for detecting the damaged probe group is fixedly mounted in the rectangular frame, the indicating component comprises a rectangular plate, a plurality of clamping components capable of straightening the bent probe group are fixedly mounted on the rectangular plate, a groove is formed in the connecting seat, the panel is connected with the inner wall of the groove in a sliding mode, a plurality of guide pillars and a plurality of springs are fixedly mounted on the inner wall of the bottom of the groove, the tops of the springs are detachably connected with the panel, and guide holes matched with the guide pillars are formed in the panel.
Preferably, the indicating assembly is completely positioned in the rectangular frame, a positioning part is formed between the top of the indicating assembly and the top of the rectangular frame, an annular groove is formed in the center of the top of the panel, and the rectangular frame and the annular groove are detachably connected together.
Preferably, the probe group includes the PCB board that is in the same place with recess bottom inner wall fixed connection, a plurality of rectangular channels that are linear distribution have been seted up on the PCB board, the detachable probe module of installing in the rectangular channel, the probe module includes the bar shaped plate, fixed mounting has a plurality of connection probes that are linear distribution on the bar shaped plate.
Preferably, the strip shaped plate includes the installation department with the strip shaped plate is detachable to be linked together, fixed mounting has the elasticity portion on the installation department, the one end fixed mounting that the installation department was kept away from to the elasticity portion has the detection part, the inside sliding connection in detection part and probe hole is in the same place.
Preferably, a plurality of probe holes matched with the detection part are formed in the rectangular plate, lamp beads with the number equal to that of the plurality of probe holes are fixedly mounted on the rectangular plate, two binding posts are arranged on the lamp beads and extend into the corresponding probe holes, the connection probe is in contact with the two binding posts under a normal state, the connection probe is electrically connected with the two binding posts when being inserted into the probe holes, and the connection probe, the two binding posts and the lamp beads form a closed path.
Preferably, the probe holes are provided with arc-shaped openings below the inner walls of the two sides close to the panel.
Preferably, the centre gripping subassembly includes that symmetry fixed mounting has all seted up oblique groove in the correction piece on the inner wall of probe hole both sides, and the one side that two correction pieces are close to the terminal, and the interval between two correction pieces equals with the thickness of test section, and the equal even distribution in one side that two correction pieces are close to each other has anti-skidding granule.
Preferably, seted up on the panel annular groove and passed the mouth, it is inboard that the mouth is located annular groove to pass, it includes that the matrix is seted up a plurality of clearing holes on the panel to pass the mouth, fixed mounting has flexible packing ring on the inner wall of clearing hole, the test section run through flexible packing ring and clearing hole and with the inner wall sliding connection of flexible packing ring together.
Preferably, the panel, the rectangular frame and the rectangular plate are all made of insulating materials.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, when a certain detection part of the probe group is bent or seriously worn and cannot be normally contacted with a corresponding signal contact of the integrated chip, the indication assembly displays the fault part of the probe group, so that a user is reminded to maintain the probe group, the user can conveniently and visually replace the connection probe of the damaged probe group independently, and the whole probe group can be ensured to normally conduct a testing machine and the integrated chip.
2. The correcting component can be taken down from the probe group and correct the seriously worn or bent detection part, and can also be corrected when the correcting component is reversely inserted into the probe module, so that the correcting component can play a role in conducting a testing machine and an integrated chip, the whole testing machine and the integrated chip are not required to be replaced, and the maintenance cost is low.
Drawings
Fig. 1 is a schematic overall structure diagram of a high frequency probe card for wafer testing according to the present invention;
fig. 2 is an exploded view of a high frequency probe card for wafer testing according to the present invention;
FIG. 3 is a schematic diagram illustrating an overall structure of a calibration assembly of a high frequency probe card for wafer testing according to the present invention;
FIG. 4 is a schematic diagram of a split structure of a calibration component of a high frequency probe card for wafer testing according to the present invention;
FIG. 5 is a schematic cross-sectional side view of an indicating assembly of a high frequency probe card for wafer testing according to the present invention;
FIG. 6 is an enlarged schematic view of portion A of FIG. 5;
fig. 7 is a schematic overall structure diagram of a high frequency probe card probe set for wafer testing according to the present invention;
fig. 8 is a schematic overall structure diagram of a PCB trigger probe module in a high frequency probe card for wafer testing according to the present invention;
fig. 9 is a schematic view illustrating an overall structure of a probe module in a high frequency probe card for wafer testing according to the present invention;
fig. 10 is a schematic view illustrating an overall structure of a connection probe in a high frequency probe card for wafer testing according to the present invention.
In the figure: 1. a connecting seat; 11. a groove; 2. a panel; 21. a guide hole; 22. a pass-through port; 23. an annular groove; 3. a guide post; 4. a spring; 5. a probe set; 53. a rectangular groove; 51. a PCB board; 52. a probe module; 521. a strip plate; 522. connecting a probe; 5221. an installation part; 5222. a detection unit; 5223. an elastic portion; 6. a corrective component; 61. a rectangular frame; 62. an indicating component; 621. a rectangular plate; 622. a lamp bead; 623. a probe hole; 624. a binding post; 625. a clamping assembly; 6251. a rectification block; 626. an arc-shaped opening; 63. a positioning part.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1-10, the embodiment provides a high-frequency probe card for wafer testing, which includes a connecting seat 1, a panel 2 is slidably mounted on the connecting seat 1, a probe set 5 for connecting a testing machine and an integrated chip signal contact is fixedly mounted on the connecting seat 1, the probe set 5 penetrates through the panel 2 and is slidably connected with the panel 2, a correcting assembly 6 is detachably mounted on the panel 2, the correcting assembly 6 is located outside the probe set 5, the working state of the probe set 5 is detected when the correcting assembly 6 is mounted on the upper end of the panel 2, and the probe set 5 is straightened and corrected when the correcting assembly 6 is detached.
Specifically, when testing integrated chip, connecting seat 1 and test machine fixed connection are in the same place, and later the test machine drives connecting seat 1 and panel 2 and moves down, at first corrects the signal contact that subassembly 6 is hugging closely integrated chip, later along with the continuous drive connecting seat 1 that drives of test machine moves down, in panel 2 will slide gradually connecting seat 1, later integrated chip's signal contact and probe group 5 contact to can play the purpose of testing integrated chip.
The correcting component 6 comprises a rectangular frame 61, an indicating component 62 for detecting the damaged probe group 5 is fixedly mounted in the rectangular frame 61, the indicating component 62 comprises a rectangular plate 621, a plurality of clamping components 625 capable of straightening the bent probe group 5 are fixedly mounted on the rectangular plate 621, when a certain part of the probe group 5 is bent or seriously worn and cannot normally contact with a certain signal contact of an integrated chip, the indicating component 62 gives an indication, so that a user is reminded of maintaining the probe group 5, the whole device can be ensured to be normally conducted with a testing machine and the integrated chip, and meanwhile the clamping components 625 on the indicating component 62 can correct the worn or seriously bent probe group 5.
Seted up recess 11 on connecting seat 1, panel 2 and recess 11's inner wall sliding connection are in the same place, and fixed mounting has a plurality of guide pillars 3 and a plurality of spring 4 on recess 11's the bottom inner wall, and a plurality of spring 4's top all links together with panel 2 is detachable, set up on panel 2 with the guide hole 21 of a plurality of guide pillars 3 looks adaptations.
Specifically, the cooperation of guide pillar 3 and guide hole 21 makes panel 2 play the effect of a direction when sliding in recess 11, ensures that probe group 5 can be smooth pass panel 2, guarantees that probe group 5 can not take place deformation, and a plurality of springs 4 can be when correcting subassembly 6 and integrated chip separation, and the position relation between connecting seat 1 and the panel 2 can reset rapidly, ensures next time.
The indicating assembly 62 is completely positioned in the rectangular frame 61, a positioning part 63 is formed between the top of the indicating assembly 62 and the top of the rectangular frame 61, the annular groove 23 is formed in the center of the top of the panel 2, and the rectangular frame 61 and the annular groove 23 are detachably connected together.
Specifically, by providing the positioning portion 63, the signal contacts of the integrated chip can be completely located in the rectangular frame 61 and at the designated connection position on the indication assembly 62, and the connection relationship between the rectangular frame 61 and the annular groove 23 can be a connection manner which is convenient to assemble and disassemble, such as adhesion together, clamping together, or magnetic attraction connection together, so that when the probe set 5 is bent or worn seriously, the rectangular frame 61 can be taken down from the panel 2, and then the probe set 5 is corrected by the plurality of clamping assemblies 625 on the indication assembly 62.
Specifically, the probe modules 52 modularly installed on the PCB 51 are independent, so that when one of the probe modules 52 cannot be used, only the probe module needs to be replaced independently without being replaced integrally, the maintenance cost is low, and the operation is also convenient.
The strip-shaped plate 521 comprises a mounting portion 5221 detachably connected with the strip-shaped plate 521, an elastic portion 5223 is fixedly mounted on the mounting portion 5221, a detection portion 5222 is fixedly mounted at one end, far away from the mounting portion 5221, of the elastic portion 5223, and the detection portion 5222 is connected with the inside of the probe hole 623 in a sliding mode.
Specifically, the elastic portion 5223 has a certain amount of elastic bending deformation, so that when the detecting portion 5222 is worn, the length of the detecting portion 5222 penetrating into the probe hole 623 is kept unchanged during operation, and normal conduction operation between the tester and the integrated chip is ensured.
Offer a plurality ofly on the rectangular plate 621 with the probe hole 623 of detection part 5222 looks adaptation, fixed mounting has the lamp pearl 622 that equals with a plurality of probe hole 623 quantity on the rectangular plate 621, be equipped with two terminals 624 on the lamp pearl 622, two terminals 624 extend to in the probe hole 623 that corresponds, connect probe 522 all contacts with two terminals 624 under normal condition, connect probe 522 peg graft in probe hole 623 in the time with two terminals 624 electric connection, and connect probe 522, two terminals 624, lamp pearl 622 forms closed circuit.
Specifically, a plurality of lamp beads 622 on the rectangular plate 621 are connected in series, and the detecting portion 5222 can play a role of conducting electricity at two terminals 624 on the lamp beads 622, the detecting portion 5222 is in the probe hole 623 in an initial state, the detecting portion 5222 capable of normally conducting the testing machine and the integrated chip can conduct two terminals 624 on the lamp beads 622, so that the lamp beads 622 can normally emit light, thereby indicating that the detecting portion 5222 in the probe hole 623 can normally work, when the detecting portion 5222 in the probe hole 623 cannot normally conduct the testing machine and the integrated chip, the detecting portion 5222 cannot conduct two terminals 624, and when the lamp beads 622 are not bright, the detecting portion 5222 in the probe hole 623 is damaged, and needs to be corrected or replaced, when detecting the signal contact of the integrated chip, the signal contact of the integrated chip will be inserted into the probe hole 623 and contacted with the detecting portion 5222, the tester and the integrated chip will form a path through the communication of the detection portions 5222.
Arc-shaped openings 626 are formed in the positions, close to the lower portions of the inner walls of the two sides of the panel 2, of the probe holes 623.
Specifically, the two arc-shaped openings 626 are formed, so that the opening below the probe hole 623 can be larger than the width of the probe hole 623, and therefore when the rectangular frame 61 and the panel 2 are mounted together, the detection part 5222 can smoothly enter the probe hole 623, and the whole device can be mounted more smoothly.
The clamping assembly 625 comprises correcting blocks 6251 which are symmetrically and fixedly mounted on the inner walls of the two sides of the probe hole 623, oblique grooves are formed in one side, close to the binding post 624, of each of the two correcting blocks 6251, the distance between the two correcting blocks 6251 is equal to the thickness of the detection part 5222, and anti-skid particles are uniformly distributed on one side, close to each other, of each of the two correcting blocks 6251.
Specifically, when the detecting portion 5222 is bent or seriously worn, which may easily cause poor or even no contact between itself and the signal contacts of the integrated chip during the test operation, the correcting assembly 6 and the panel 2 may be separated, during the separation process, the two correcting blocks 6251 may contact and slide with the detecting portion 5222 having serious bending, the top of the detecting portion 5222 may be straightened and corrected by the pressing force of the two correcting blocks 6251, then the detecting portion 5222 may be reversely inserted into the probe hole 623 from one end of the two correcting blocks 6251, and the two correcting blocks 6251 having two inclined notches may allow the detecting portion 5222 to be smoothly inserted into the probe hole 623 and between the two correcting blocks 6251, and then the detecting portion 5222 may be pulled to one side of the parallel rectangular plate 621 to be clamped by the two correcting blocks 6251, so that the detecting portion 5222 may be stretched and lengthened, thereby making up the portion having serious bending and shrinkage at the top, after that, the correcting component 6 is connected with the panel 2, the detecting part 5222 is inserted into the probe hole 623 through one side of the two arc-shaped openings 626, so that the two terminals 624 can be normally conducted, the signal contact of the integrated chip can be ensured to be tightly contacted with the detecting part 5222 when being inserted into the probe hole 623, and the anti-skid particles are arranged on one side of the correcting block 6251 close to the detecting part 5222, so that the friction force between the correcting block 6251 and the detecting part 5222 can be increased.
The panel 2 is provided with a through hole 22, the through hole 22 is located on the inner side of the annular groove 23, the through hole 22 comprises a plurality of through holes which are arranged on the panel 2 in a matrix mode, a flexible gasket is fixedly arranged on the inner wall of each through hole, and the detection part 5222 penetrates through the flexible gasket and the through holes and is connected with the inner wall of the flexible gasket in a sliding mode.
Specifically, through setting up the through hole that the matrix distributes, can be convenient for a plurality of detection portions 5222 smooth panel 2 that passes, the flexible packing ring can prevent that detection portion 5222 from appearing rocking the unstable condition when on panel 2 simultaneously, ensures that the integrated chip and the test machine that switch on that detection portion 5222 can be smooth.
The panel 2, the rectangular frame 61 and the rectangular plate 621 are made of insulating materials.
Specifically, the insulating material may be ceramic or another composite material, which does not affect the connection between the integrated chip and the tester by the detecting portion 5222.
It should be noted that, in the initial state, the detecting part 5222 is in the probe hole 623, the detecting part 5222 capable of normally conducting the tester and the ic will conduct the two terminals 624 on the lamp bead 622, so that the lamp bead 622 can normally emit light, thereby indicating that the detecting part 5222 in the probe hole 623 can normally operate, when the detecting part 5222 in the probe hole 623 cannot normally conduct the tester and the ic, the detecting part 5222 cannot conduct the two terminals 624, and the lamp bead 622 is not bright, indicating that the detecting part 5222 in the probe hole 623 needs to be corrected or replaced, when detecting the signal contact of the ic, the signal contact of the ic will be inserted into the probe hole 623 and contact with the detecting part 5222, the tester and the ic will form a passage through the communication of the detecting part 5222, when the detecting part 5222 is bent or seriously worn, it is very easy to perform a testing operation, the correcting component 6 and the panel 2 can be separated from each other when poor contact or even no contact occurs between the signal contacts of the integrated chip and the signal contacts of the integrated chip, the detecting part 5222 is reversely inserted into the probe hole 623 from one end of the two correcting blocks 6251, the two inclined holes are provided with the correction blocks 6251, so that the detection part 5222 can be smoothly inserted into the probe hole 623 and between the two correction blocks 6251, and then the detection part 5222 is pulled to one side of the parallel rectangular plate 621, through the clamping of the two correcting blocks 6251, the detecting part 5222 can be stretched and extended, the top of the detecting part 5222 is made up for the serious part of abrasion and overall bending shrinkage, then the correcting component 6 is connected with the panel 2, the detecting part 5222 is inserted into the probe hole 623 through one side of the two arc-shaped openings 626, the two binding posts 624 can be conducted normally, and the signal contact of the integrated chip can be ensured to be in close contact with the detecting part 5222 when being inserted into the probe hole 623.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (10)
1. The high-frequency probe card for wafer testing comprises a connecting seat and is characterized in that a panel is slidably mounted on the connecting seat, a probe set for connecting a testing machine and an integrated chip signal contact is fixedly mounted on the connecting seat, the probe set penetrates through the panel and is slidably connected with the panel, a correction assembly is detachably mounted on the panel and is located on the outer side of the probe set, the correction assembly detects the working state of the probe set when mounted at the upper end of the panel, and the correction assembly straightens and corrects the probe set when detached.
2. The high-frequency probe card for wafer testing as claimed in claim 1, wherein the correcting component comprises a rectangular frame, an indicating component for detecting the damaged probe set is fixedly installed in the rectangular frame, the indicating component comprises a rectangular plate, a plurality of clamping components capable of straightening the bent probe set are fixedly installed on the rectangular plate, a groove is formed in the connecting seat, the panel is slidably connected with the inner wall of the groove, a plurality of guide pillars and a plurality of springs are fixedly installed on the inner wall of the bottom of the groove, the top ends of the plurality of springs are detachably connected with the panel, and guide holes matched with the plurality of guide pillars are formed in the panel.
3. The high-frequency probe card for wafer testing as claimed in claim 2, wherein the indicating assembly is completely located in the rectangular frame, a positioning portion is formed between the top of the indicating assembly and the top of the rectangular frame, an annular groove is formed at the center of the top of the panel, and the rectangular frame and the annular groove are detachably connected together.
4. The high-frequency probe card for wafer testing as claimed in claim 2, wherein the probe set comprises a PCB board fixedly connected with the inner wall of the bottom of the groove, the PCB board is provided with a plurality of rectangular grooves distributed linearly, the rectangular grooves are detachably provided with probe modules, the probe modules comprise strip-shaped boards, and the strip-shaped boards are fixedly provided with a plurality of connecting probes distributed linearly.
5. The high-frequency probe card for wafer testing as claimed in claim 4, wherein the strip-shaped plate comprises a mounting portion detachably connected with the strip-shaped plate, an elastic portion is fixedly mounted on the mounting portion, a detection portion is fixedly mounted at an end of the elastic portion far away from the mounting portion, and the detection portion is slidably connected with the inside of the probe hole.
6. The high-frequency probe card for wafer testing according to claim 5, wherein a plurality of probe holes matched with the detecting portion are formed in the rectangular plate, a number of lamp beads equal to the number of the plurality of probe holes are fixedly mounted on the rectangular plate, two binding posts are arranged on the lamp beads, the two binding posts extend into the corresponding probe holes, the connection probe is in contact with both the two binding posts under a normal state, the connection probe is electrically connected with the two binding posts when being inserted into the probe holes, and the connection probe, the two binding posts and the lamp beads form a closed path.
7. The high-frequency probe card for wafer testing as claimed in claim 6, wherein the probe holes are provided with arc-shaped openings under inner walls of two sides close to the panel.
8. The high-frequency probe card for wafer testing according to claim 6, wherein the clamping assembly comprises two correcting blocks symmetrically and fixedly installed on inner walls of two sides of the probe hole, one sides of the two correcting blocks close to the binding post are both provided with an inclined groove, a distance between the two correcting blocks is equal to a thickness of the detection portion, and anti-skid particles are uniformly distributed on one sides of the two correcting blocks close to each other.
9. The high-frequency probe card for wafer test as claimed in claim 8, wherein the annular groove of the panel is opened with a through hole, the through hole is located inside the annular groove, the through hole comprises a plurality of through holes opened in a matrix form on the panel, a flexible gasket is fixedly mounted on an inner wall of the through hole, and the detecting portion penetrates through the flexible gasket and the through hole and is slidably connected with the inner wall of the flexible gasket.
10. The high-frequency probe card for wafer testing according to claim 2, wherein the face plate, the rectangular frame and the rectangular plate are made of insulating materials.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111390168.4A CN114034895B (en) | 2021-11-22 | 2021-11-22 | High-frequency probe card for wafer test |
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| CN202111390168.4A CN114034895B (en) | 2021-11-22 | 2021-11-22 | High-frequency probe card for wafer test |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117517735A (en) * | 2024-01-04 | 2024-02-06 | 苏州迪克微电子有限公司 | Probe card convenient for replacing test probes |
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