CN114032068B - Diamond composite abrasive for grinding and polishing and preparation method thereof - Google Patents
Diamond composite abrasive for grinding and polishing and preparation method thereof Download PDFInfo
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- CN114032068B CN114032068B CN202111353630.3A CN202111353630A CN114032068B CN 114032068 B CN114032068 B CN 114032068B CN 202111353630 A CN202111353630 A CN 202111353630A CN 114032068 B CN114032068 B CN 114032068B
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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Abstract
The invention discloses a diamond composite abrasive for grinding and polishing and a preparation method thereof, belonging to the technical field of composite abrasives. The diamond composite abrasive comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water; the invention adopts the polyether-ether-ketone as the bonding agent, and the polyether-ether-ketone has lower melting point, so that the diamond has lower loss when the blank body is sintered and reinforced. The invention provides a preparation method of a diamond composite abrasive for grinding and polishing, which comprises the following steps: uniformly mixing diamond micro powder, polyether-ether-ketone and water, performing spray granulation to obtain a composite abrasive blank, mixing the composite abrasive blank with sodium chloride, placing the mixture in a muffle furnace for drying, then placing the mixture in water, rinsing, drying and screening to obtain the diamond composite abrasive; the diamond composite abrasive prepared by the preparation method has higher strength and higher cutting force.
Description
Technical Field
The invention belongs to the technical field of composite abrasives, and particularly relates to a diamond composite abrasive for grinding and polishing and a preparation method thereof.
Background
The combined abrasive has many cutting edges as novel abrasive material contrast traditional abrasive material, and the combined abrasive material can drop layer upon layer in the grinding field, thereby can maintain more cutting edges, maintain higher cutting force for a long time, the ceramic bond that mostly uses when traditional technology prepares combined abrasive material is as the binder, the melting point of ceramic bond is all relatively higher, use the diamond combined abrasive material idiosome that the ceramic bond prepared as the binder, when high temperature sintering increases intensity, the diamond loss can be up to 9-50%, the more thin loss of granularity is big more, greatly reduced diamond proportion in the combined abrasive material, thereby lead to the effect rate greatly reduced of diamond in the combined abrasive material.
Therefore, a bonding agent which has a low melting point and causes the diamond to have a small graphitization degree in a sintering process needs to be found, and the polyetheretherketone has a low melting point and a high strength, and is widely applied to the aerospace field and the artificial bone repair defect field.
Disclosure of Invention
Based on the problem that a bonding agent which is low in melting point and small in graphitization degree of diamond in the sintering process needs to be found urgently, the invention provides a diamond composite abrasive for grinding and polishing and a preparation method thereof, wherein polyether-ether-ketone is used as the bonding agent, and the polyether-ether-ketone has a lower melting point, so that the diamond has lower loss when a blank body is sintered and enhanced; meanwhile, the polyetheretherketone has the characteristics of impact resistance, wear resistance and fatigue resistance, so that the prepared diamond composite abrasive has higher strength and higher cutting force.
In order to achieve the above purpose, the invention provides the following technical scheme:
a diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water.
Preferably, the diamond micro powder comprises one of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystalline diamond-like micro powder or a combination thereof.
Preferably, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um.
Preferably, the particle size of the polyether-ether-ketone is 0.4-10um.
The invention provides a preparation method of a diamond composite abrasive for grinding and polishing, which comprises the following specific steps:
(1) dispersing diamond micro powder and polyether-ether-ketone in water, and uniformly mixing by ultrasonic stirring to prepare mixed slurry;
(2) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer to prepare a composite abrasive blank;
(3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride, and then placing the mixture in a muffle furnace for drying to prepare a mixture of the composite abrasive and the sodium chloride;
(4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing and drying the composite abrasive material to prepare the composite abrasive material with mixed granularity;
(5) and (5) screening the composite abrasive material with the mixed particle size prepared in the step (4) by using a screen to prepare the diamond composite abrasive material.
Preferably, in the step (1), the ultrasonic stirring time is 15-20min.
Preferably, in the step (2), the rotation speed of the spray dryer is 25000-30000rpm; the atomization drying temperature during spray granulation is 250-300 ℃.
Preferably, in the step (3), the mass ratio of the composite abrasive blank to the sodium chloride is 3; the drying temperature of the mixture of the composite abrasive blank and sodium chloride in a muffle furnace is 350-370 ℃, and the drying time is 1-3h.
Preferably, in the step (4), the drying temperature is 100-120 ℃; the drying time is 3-5h.
The invention has the following beneficial effects:
(1) According to the invention, sodium chloride is added when the diamond composite abrasive blank is sintered to increase the strength, the sodium chloride has a high-temperature resistant effect and does not react with the diamond composite abrasive blank chemically, and the sodium chloride plays a role in separation when the composite abrasive blank is sintered to increase the strength, so that the bonding between particles in the sintering process of the composite abrasive blank is avoided.
(2) The polyether-ether-ketone binding agent selected by the invention has a lower melting point, so that the graphitization degree of the diamond is small when the composite abrasive blank is sintered, and the diamond weight loss is less than 0.1% when the strength of the blank is enhanced by sintering; tests show that the performance of releasing diamond can be better by using the composite abrasive prepared by the invention than the composite abrasive prepared by the traditional process, and the grinding capacity can be improved by more than 20% under the same condition; therefore, the composite abrasive prepared by the invention has the advantages of low energy consumption, high cutting force and the like, so that the cost can be reduced in a phase-changing manner, and the product competitiveness is further increased.
Detailed Description
For a further understanding of the present invention, reference should now be made to the following preferred embodiments of the invention, taken in conjunction with the examples, but it is understood that the description is intended to further illustrate the features and advantages of the invention and is not intended to limit the scope of the invention.
Unless defined otherwise, technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
The diamond abrasive composite for grinding and polishing and the preparation method thereof provided by the present invention will be described with reference to the following specific examples, and the scope of the present invention is not limited by the following examples.
Example 1
A diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water.
Example 2
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water. Wherein the diamond micro powder comprises but is not limited to one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystalline diamond-like micro powder.
Example 3
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water.
Wherein the diamond micro powder comprises but is not limited to one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystal-like diamond micro powder, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um; the particle size of the polyether-ether-ketone is 0.4-10um.
Example 4
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10% of diamond micro powder, 20% of polyether-ether-ketone and 70% of water.
Wherein the diamond micro powder comprises one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystal-like diamond micro powder, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um; the particle size of the polyether-ether-ketone is 0.4-10um.
Example 5
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 20% of diamond micro powder, 12% of polyether-ether-ketone and 68% of water.
Wherein the diamond micro powder comprises one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystal-like diamond micro powder, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um; the particle size of the polyether-ether-ketone is 0.4-10um.
Example 6
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 20% of diamond micro powder, 20% of polyether-ether-ketone and 60% of water.
Wherein the diamond micro powder comprises but is not limited to one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystal-like diamond micro powder, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um; the particle size of the polyether-ether-ketone is 0.4-10um.
Example 7
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 15% of diamond micro powder, 35% of polyether-ether-ketone and 50% of water.
Wherein the diamond micro powder comprises one or the combination of nano diamond micro powder, single crystal diamond micro powder, polycrystalline diamond micro powder and polycrystal-like diamond micro powder, the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um; the particle size of the polyether-ether-ketone is 0.4-10um.
Example 8
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) dispersing the diamond micro powder and the polyether-ether-ketone in water, and uniformly mixing by ultrasonic stirring to prepare mixed slurry.
(2) And (3) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer to prepare the composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride, and then placing the mixture in a muffle furnace for drying to prepare a mixture of the composite abrasive and the sodium chloride.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing and drying the composite abrasive material, and preparing the composite abrasive material with mixed granularity.
(5) And (5) screening the composite abrasive material with the mixed particle size prepared in the step (4) by using a screen to prepare the diamond composite abrasive material.
Example 9
The diamond composite abrasive for grinding and polishing comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water.
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) dispersing the diamond micro powder and the polyether-ether-ketone in water, and uniformly mixing by ultrasonic stirring to prepare mixed slurry.
(2) And (3) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer to prepare the composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride, and then placing the mixture in a muffle furnace for drying to prepare a mixture of the composite abrasive and the sodium chloride.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing and drying the composite abrasive material, and preparing the composite abrasive material with mixed granularity.
(5) And (5) screening the composite abrasive material with the mixed particle size prepared in the step (4) by using a screen to prepare the diamond composite abrasive material.
Example 10
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) dispersing 10-30% of diamond micro powder and 12-35% of polyether-ether-ketone in 50-70% of water according to weight percentage, ultrasonically stirring for 15-20min, and uniformly mixing to obtain mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) by using a spray dryer at the rotating speed of 25000-30000rpm and the temperature of 250-300 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to the mass ratio of 3.
(4) And (3) putting the mixture of the composite abrasive and sodium chloride prepared in the step (3) into water, dissolving the sodium chloride into the water, rinsing the composite abrasive, and drying at 100-120 ℃ for 3-5h to prepare the composite abrasive with mixed granularity.
(5) And (4) screening the composite abrasive with mixed particle size prepared in the step (4) by using screens with different specifications according to different requirements to prepare the diamond composite abrasive.
Example 11
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of single crystal diamond with the grain size of 0.2um and 270g of polyether ether ketone with the grain size of 0.4um are dispersed in 430g of water, and are stirred for 15min by ultrasonic wave and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer at the rotating speed of 30000rpm and the temperature of 250 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to the mass ratio of 3.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 110 ℃ for 4 hours to prepare the composite abrasive material with mixed granularity.
(5) And (4) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 43um screen, and taking undersize products to prepare the diamond composite abrasive material with the particle size of 43 um.
The diamond abrasive composite obtained in example 11 was prepared into a polishing liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 10um/h. Under the same condition, the average removal rate of the wafer is about 8um/h by adopting the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion.
Example 12
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of single crystal diamond with the grain diameter of 0.7um and 270g of polyether ether ketone with the grain diameter of 1.4um are dispersed in 430g of water, and are stirred for 20min by ultrasonic wave and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer at the rotating speed of 30000rpm and the temperature of 280 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to the mass ratio of 3.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 100 ℃ for 3 hours to prepare the composite abrasive material with mixed granularity.
(5) And (5) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 43um screen, and taking undersize to prepare the diamond composite abrasive material with the particle size of 43 um.
The diamond abrasive composite obtained in example 12 was prepared into a polishing liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 0.611um/min. Under the same condition, the average removal rate of the wafer is about 0.502um/min by adopting the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion.
Example 13
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of polycrystalline diamond with the grain size of 1.5um and 270g of polyether-ether-ketone with the grain size of 3um are dispersed in 430g of water, and are stirred for 20min by ultrasound and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer at the rotating speed of 25000rpm and the temperature of 300 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to the mass ratio of 3.
(4) And (3) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 120 ℃ for 3 hours to prepare the composite abrasive material with mixed granularity.
(5) And (5) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 43um screen, and taking undersize to prepare the diamond composite abrasive material with the particle size of 43 um.
The diamond abrasive composite obtained in example 13 was prepared into a polishing liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 1.256um/min. Under the same condition, the average removal rate of the wafer of the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion is about 1.011um/min.
Example 14
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of polycrystalline diamond with the grain size of 3.0um and 270g of polyether-ether-ketone with the grain size of 3um are dispersed in 430g of water, and are stirred for 20min by ultrasound and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) by using a spray dryer at the rotating speed of 25000rpm and the temperature of 300 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to the mass ratio of 3.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 100 ℃ for 5 hours to prepare the composite abrasive material with mixed particle size.
(5) And (4) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 43um screen, and taking undersize products to prepare the diamond composite abrasive material with the particle size of 43 um.
The diamond abrasive composite obtained in example 14 was prepared into an abrasive liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 1.760um/min. Under the same condition, the average removal rate of the wafer is about 1.415um/min by adopting the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion.
Example 15
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of polycrystalline diamond with the grain size of 0.2um and 270g of polyether-ether-ketone with the grain size of 0.4um are dispersed in 430g of water, and are stirred for 20min by ultrasound and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) by using a spray dryer at the rotating speed of 25000rpm and the temperature of 300 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to a mass ratio of 3.
(4) And (4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 100 ℃ for 5 hours to prepare the composite abrasive material with mixed granularity.
(5) And (4) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 20um screen, and taking undersize products to prepare the diamond composite abrasive material with the particle size of 20um.
The diamond abrasive composite obtained in example 15 was prepared into a polishing liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 7.1um/h. Under the same condition, the average removal rate of the wafer is about 5.7um/h by adopting the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion.
Example 16
A preparation method of a diamond composite abrasive for grinding and polishing comprises the following specific steps:
(1) 160g of polycrystalline diamond with the grain size of 1.5um and 270g of polyether-ether-ketone with the grain size of 3um are dispersed in 430g of water, and are stirred for 20min by ultrasound and mixed evenly to prepare mixed slurry.
(2) And (2) performing spray granulation on the mixed slurry prepared in the step (1) through a spray dryer at the rotating speed of 25000rpm and the temperature of 300 ℃ to prepare the spherical composite abrasive blank.
(3) And (3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride according to a mass ratio of 3.
(4) And (3) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing the composite abrasive material, and drying at 120 ℃ for 3 hours to prepare the composite abrasive material with mixed granularity.
(5) And (4) screening the composite abrasive material with the mixed particle size prepared in the step (4) through a 63um screen to prepare the diamond composite abrasive material with the particle size of 63 um.
The diamond abrasive composite obtained in example 16 was prepared into a polishing liquid, and a 2-inch sapphire wafer was processed using a polypropylene polishing pad with a pressure per unit area of 210g/cm 2 The average removal rate of the wafer can reach 1.51um/min. Under the same condition, the average removal rate of the wafer is about 1.212um/min by adopting the spherical abrasive prepared by the same diamond powder and the glass powder type bonding agent in the same proportion.
The diamond abrasive composite for grinding and polishing and the preparation method thereof provided by the invention are described in detail above. The principles and embodiments of the present invention have been described herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. A diamond composite abrasive for grinding and polishing is characterized in that: the composite material comprises the following raw materials in percentage by weight: 10-30% of diamond micro powder, 12-35% of polyether-ether-ketone and 50-70% of water;
the preparation method comprises the following steps:
(1) dispersing diamond micro powder and polyether-ether-ketone in water, and uniformly mixing by ultrasonic stirring to prepare mixed slurry;
(2) carrying out spray granulation on the mixed slurry prepared in the step (1) through a spray dryer to prepare a composite abrasive blank;
(3) uniformly mixing the composite abrasive blank prepared in the step (2) with sodium chloride, and then placing the mixture in a muffle furnace for drying to prepare a mixture of the composite abrasive and the sodium chloride;
(4) putting the mixture of the composite abrasive material prepared in the step (3) and sodium chloride into water, dissolving the sodium chloride into the water, rinsing and drying the composite abrasive material to prepare the composite abrasive material with mixed granularity;
(5) and (4) screening the composite abrasive material with the mixed particle size prepared in the step (4) by using a screen to prepare the diamond composite abrasive material.
2. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: the diamond micro powder comprises one or the combination of nano diamond micro powder, monocrystal diamond micro powder, polycrystalline diamond micro powder and polycrystalline diamond-like micro powder.
3. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: the purity of the diamond micro powder is more than or equal to 99.9 percent, and the granularity of the diamond micro powder is 0.2-20um.
4. The diamond composite abrasive for grinding and polishing according to claim 1 or 3, wherein: the particle size of the polyether-ether-ketone is 0.4-10um.
5. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: in the step (1), the ultrasonic stirring time is 15-20min.
6. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: in the step (2), the rotating speed of the spray dryer is 25000-30000rpm; the atomization drying temperature during spray granulation is 250-300 ℃.
7. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: in the step (3), the mass ratio of the composite abrasive blank to the sodium chloride is 3; and drying the mixture of the abrasive compound embryo and sodium chloride in a muffle furnace at the temperature of 350-370 ℃ for 1-3h.
8. The diamond composite abrasive for grinding and polishing according to claim 1, wherein: in the step (4), the drying temperature is 100-120 ℃; the drying time is 3-5h.
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| CN102303268A (en) * | 2011-09-21 | 2012-01-04 | 大连理工大学 | Ultra smooth non-destructive nano grinding method for soft and fragile film |
| CN106633162A (en) * | 2015-11-03 | 2017-05-10 | 株洲时代新材料科技股份有限公司 | Surface method for improving adhesive property of polyether-ether-ketone and rubber |
| CN107955327A (en) * | 2017-11-28 | 2018-04-24 | 绩溪县黄山石英有限公司 | It is a kind of to be modified phenolic resin abrasive material of the silicon powder as base-material |
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