CN114030094B - Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation - Google Patents
Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation Download PDFInfo
- Publication number
- CN114030094B CN114030094B CN202111365979.9A CN202111365979A CN114030094B CN 114030094 B CN114030094 B CN 114030094B CN 202111365979 A CN202111365979 A CN 202111365979A CN 114030094 B CN114030094 B CN 114030094B
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- shell
- wall
- wafer
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of wafer preparation, in particular to a silicon wafer scribing system for semiconductor wafer preparation, which can prevent edge breakage, and comprises a base, wherein the top of the base is provided with a water tank, the top of the base is fixedly connected with a shell, one side of the shell is provided with a mounting groove, two rotating door plates are rotationally connected in the mounting groove, and the inner wall of the shell is fixedly connected with a moving mechanism; the driving motor can move to drive the driving shaft and the centrifugal rotating rod to rotate, the centrifugal rotating rod drives the sliding rod and the rack to reciprocate through the special-shaped rotating rod, the rack drives the rotating gear, the rotating shaft and the air spraying head to reciprocate, the air pump sprays air to the placing table through the air guide pipe and the air spraying head, the surface of the wafer is blown, sewage containing impurities on the wafer can be blown away, the cleanliness of the surface of the wafer is ensured, the phenomenon that the residual impurities of the wafer affect the grinding wheel to cut the wafer is avoided, and edge breakage during wafer cutting is effectively prevented.
Description
Technical Field
The invention relates to the technical field of wafer preparation, in particular to a silicon wafer scribing system for semiconductor wafer preparation, which can prevent edge breakage.
Background
The wafer refers to a chip used for manufacturing a semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular; in recent years, silicon-based materials are also gradually applied to high-speed optical communication, and after being manufactured on a wafer, the wafer needs to be cut into strips and then into pieces.
In the prior art, the following problems exist:
(1) Most of the existing silicon wafer scribing devices prepared by semiconductor wafers are washed only by a water spraying mechanism matched with a grinding wheel in the cutting process, the washing mode is not comprehensive, impurities on the wafers cannot be washed clean, and then the grinding wheel is influenced to cut the wafers, so that the wafers are easy to break edges in the cutting process;
(2) Most of wafers are fixed through the suckers, the fixing effect of the suckers is not ideal, the wafers are prone to shaking in the cutting process, and the suckers are also important factors of edge breakage of the wafers.
Disclosure of Invention
The present invention is directed to a silicon wafer dicing system for semiconductor wafer preparation, which can prevent edge chipping, so as to solve the problems mentioned in the background art.
The technical scheme of the invention is as follows: the utility model provides a can prevent to produce silicon chip scribing system of semiconductor wafer preparation that collapses limit, the on-line screen storage device comprises a base, the basin has been seted up at the top of base, the top fixedly connected with shell of base, the mounting groove has been seted up to one side of shell, the mounting groove internal rotation is connected with two and rotates the door plant, the inner wall fixedly connected with moving mechanism of shell, moving mechanism's bottom fixedly connected with cutting motor, the one end fixedly connected with emery wheel of cutting motor output shaft, one side fixedly connected with sprinkler bead of cutting motor, the position of sprinkler bead is corresponding with the position of emery wheel, one side inner wall fixedly connected with fixed plate of shell, install swing jet-propelled mechanism on the fixed plate, the fixedly connected with of base places the platform, place the bench and install clamping mechanism.
Preferably, the jet-propelled mechanism is connected with the axis of rotation including seting up in the rotation hole of fixed plate top inner wall and bottom inner wall, and the fixed cover in the axis of rotation has connect the jet-propelled head, and the board is placed to one side fixedly connected with of shell, places the top fixedly connected with air pump of board, and the venthole of air pump and the downthehole fixedly connected with air duct of the inlet air of jet-propelled head install reciprocal unit in the axis of rotation.
Preferably, reciprocal unit includes the key-type connection in the rolling gear of axis of rotation bottom, and the fixed orifices has been seted up to one side inner wall of shell, fixedly connected with fixed sleeving in the fixed orifices, and fixed sleeving's inner wall sliding connection has the slide bar, the one end fixedly connected with rack of slide bar, the rack meshes with rolling gear mutually, the one end fixedly connected with dead lever of rack, installs drive unit on the slide bar, the sliding unit is installed to the adaptation on the dead lever.
Preferably, the fixing rod and the rotating shaft are sleeved with a waterproof shell, and one side of the waterproof shell is fixedly connected to the inner wall of one side of the shell.
Preferably, the drive unit includes fixed connection in the cylinder piece of the slide bar other end, rotates on the cylinder piece and installs the dysmorphism bull stick, places the bottom fixedly connected with driving motor of board, and driving motor's output has the drive shaft through the coupling joint, and the bottom fixedly connected with centrifugation bull stick of drive shaft, the one end rotation of centrifugation bull stick are connected in the one end of dysmorphism bull stick.
Preferably, the slip unit includes fixed connection in the protecting crust of placing a cylinder lateral wall, and sliding connection has the slider on the bottom inner wall fixedly connected with trapped orbit of protecting crust, the trapped orbit, and the one end fixedly connected with L shape push rod of slider, the slide opening has been seted up to one side inner wall of protecting crust, and the one end of L shape push rod runs through the slide opening and laminates mutually with the dead lever, the top fixedly connected with fixed toothed plate of slider, and the lock joint component is installed to one side of slider.
Preferably, the inner wall of one side of the protecting shell is fixedly connected with a guide rod, the guide rod is sleeved with an installation block, one end of the installation block is fixedly connected to one side of the sliding block, the guide rod is sleeved with a reset spring, and two ends of the reset spring are respectively fixedly connected with the installation block and the protecting shell.
Preferably, the fastening element includes a fixing column fixedly connected to one side of the slider, a strip-shaped hole is formed in an inner wall of one side of the protective shell, one end of the fixing column penetrates through the strip-shaped hole and is provided with a sliding groove, a sliding column is slidably connected in the sliding groove, one end of the sliding column is fixedly connected with a special-shaped fixture block, one side of one of the rotating door plates is fixedly connected with a U-shaped joint, the special-shaped fixture block is matched with the U-shaped joint, an extrusion spring is slidably connected in the sliding groove, and two ends of the extrusion spring are fixedly connected with the fixing column and the sliding column respectively.
Preferably, clamping mechanism has all seted up the activity chamber including placing the inside activity chamber of having seted up of platform, the both sides inner wall in activity chamber has all been seted up and has been removed the hole, it has the threaded rod to remove downthehole sliding connection, the one end fixedly connected with dysmorphism connecting rod of threaded rod, the one end fixedly connected with arc of dysmorphism connecting rod, the one end fixedly connected with screwed pipe that two threaded rods are close to each other, it has two fixed blocks to rotate to have cup jointed on the screwed pipe, the bottom fixed connection of two fixed blocks is in placing a platform inner wall, the one side inner wall of placing the chamber has seted up rotatory hole, rotatory downthehole rotation is connected with the dwang, the dwang is connected with bevel gear with equal key-type on the screwed pipe, two bevel gear mesh mutually, the one end key-type connection of dwang has rotatory gear, rotatory gear meshes with fixed toothed plate mutually.
The invention provides a silicon wafer scribing system for preparing a semiconductor wafer capable of preventing edge breakage by improving, compared with the prior art, the silicon wafer scribing system has the following improvements and advantages:
one is as follows: the driving motor moves to drive the driving shaft and the centrifugal rotating rod to rotate, the centrifugal rotating rod drives the sliding rod and the rack to reciprocate through the special-shaped rotating rod, the rack drives the rotating gear, the rotating shaft and the air spraying head to reciprocate, meanwhile, the air pump sprays air to the placing table through the air guide pipe and the air spraying head, so that the surface of the wafer is blown, sewage containing impurities on the wafer can be blown away, the cleanliness of the surface of the wafer is ensured, the phenomenon that the residual impurities of the wafer affect the grinding wheel to cut the wafer is avoided, and edge breakage during wafer cutting is effectively prevented;
the second step is as follows: according to the invention, the fixed rod moves to drive the L-shaped push rod, the slide block and the fixed toothed plate to move, the fixed toothed plate moves to drive the rotary gear and the rotary rod to rotate, the rotary rod rotates to drive the threaded pipe to rotate through the bevel gear, the threaded pipe rotates to enable the two threaded rods to approach each other, the two threaded rods approach each other to drive the two special-shaped connecting rods and the arc-shaped plate to approach each other, and the special-shaped clamping block is buckled with the U-shaped joint, so that the wafer can be automatically clamped and fixed, the fixing effect on the wafer is improved, the wafer is not easy to shake in the cutting process, and the edge breakage in the wafer cutting process is further prevented;
and thirdly: according to the invention, the rotating door plate is pulled outwards to drive the U-shaped joint to be separated from the special-shaped fixture block, the mounting block and the sliding block can be driven to reset under the elastic force action of the reset spring, the sliding block resets to drive the fixed toothed plate to reset, the fixed toothed plate drives the rotating gear and the rotating rod to reversely rotate, so that the rotating rod drives the threaded pipe to reversely rotate through the bevel gear, the threaded pipe reversely rotates to drive the threaded rod, the special-shaped connecting rod and the arc plates to reset, the two arc plates loosen the wafer, the wafer can be loosened while the rotating door plate is opened, and the wafer can be conveniently taken out.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional perspective view of the present invention;
FIG. 3 is a perspective view of the reciprocating unit of the present invention;
FIG. 4 is a schematic perspective view of the clamping mechanism of the present invention;
FIG. 5 is a schematic perspective view of the invention at A in FIG. 4;
FIG. 6 is a perspective view of a fastening device of the present invention;
FIG. 7 is a cross-sectional plan view of a fastening element of the present invention;
fig. 8 is a perspective view of the grinding wheel and sprinkler head of the present invention.
Description of the reference numerals:
1. a base; 101. a housing; 102. a moving mechanism; 103. cutting the motor; 104. a grinding wheel; 105. a sprinkler head; 106. a placing table; 107. a protective shell; 108. rotating the door panel; 2. a fixing plate; 201. a rotating shaft; 202. a gas showerhead; 203. an air duct; 204. an air pump; 205. a rotating gear; 206. a waterproof shell; 3. fixing the sleeve; 301. a slide bar; 302. a rack; 303. fixing the rod; 304. a special-shaped rotating rod; 305. centrifuging the rotating rod; 306. a drive motor; 4. a threaded pipe; 401. a threaded rod; 402. a special-shaped connecting rod; 403. an arc-shaped plate; 404. a bevel gear; 405. rotating the rod; 406. a rotating gear; 407. a fixed toothed plate; 408. a slider; 409. fixing a track; 410. an L-shaped push rod; 411. mounting a block; 412. a guide bar; 413. a return spring; 5. fixing a column; 501. a sliding post; 502. a special-shaped fixture block; 503. extruding the spring; 504. a U-shaped joint.
Detailed Description
The present invention is described in detail below, and the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a silicon wafer scribing system for preparing a semiconductor wafer capable of preventing edge breakage through improvement, and the technical scheme of the invention is as follows:
as shown in fig. 1-8, a silicon wafer scribing system for semiconductor wafer preparation capable of preventing edge breakage includes a base 1, a water tank is disposed on the top of the base 1, a housing 101 is fixedly connected to the top of the base 1, a mounting groove is disposed on one side of the housing 101, two rotating door plates 108 are rotatably connected to the mounting groove, a moving mechanism 102 is fixedly connected to the inner wall of the housing 101, a cutting motor 103 is fixedly connected to the bottom end of the moving mechanism 102, a grinding wheel 104 is fixedly connected to one end of an output shaft of the cutting motor 103, a water spray head 105 is fixedly connected to one side of the cutting motor 103, the position of the water spray head 105 corresponds to the position of the grinding wheel 104, a fixing plate 2 is fixedly connected to the inner wall of one side of the housing 101, a swing air injection mechanism is mounted on the fixing plate 2, a placing table 106 is fixedly connected to the base 1, and a clamping mechanism is mounted on the placing table 106; borrow by above-mentioned structure, through the setting of sprinkler bead 105, sprinkler bead 105 can spray water to the emery wheel 104 of cutting wafer, can produce the powder when emery wheel 104 cutting wafer, has realized that sprinkler bead 105 can wash the powder on the emery wheel 104 clean, can cool down emery wheel 104 simultaneously.
Further, the air injection mechanism comprises rotating holes formed in the top inner wall and the bottom inner wall of the fixing plate 2, a rotating shaft 201 is rotatably connected in each rotating hole, an air injection head 202 is fixedly sleeved on each rotating shaft 201, a placing plate is fixedly connected to one side of the shell 101, an air pump 204 is fixedly connected to the top of each placing plate, an air guide pipe 203 is fixedly connected in an air outlet of each air pump 204 and an air inlet of each air injection head 202, and a reciprocating unit is mounted on each rotating shaft 201; by means of the structure, the air pump 204 is started through the arrangement of the air injection mechanism, so that air in the air pump 204 can enter the air injection head 202 through the air guide pipe 203 and is injected out through the air injection holes of the air injection head 202, the sewage containing powder on the surface of the wafer is blown away, and the cleanliness of the surface of the wafer is further ensured.
Further, the reciprocating unit comprises a rotating gear 205 which is in key connection with the bottom end of the rotating shaft 201, a fixing hole is formed in the inner wall of one side of the shell 101, a fixing sleeve 3 is fixedly connected in the fixing hole, the inner wall of the fixing sleeve 3 is slidably connected with a sliding rod 301, one end of the sliding rod 301 is fixedly connected with a rack 302, the rack 302 is meshed with the rotating gear 205, one end of the rack 302 is fixedly connected with a fixing rod 303, a driving unit is installed on the sliding rod 301, and a sliding unit is installed on the fixing rod 303 in a matched mode; by means of the structure, the reciprocating unit is arranged, the sliding rod 301 of the driving unit reciprocates, the sliding rod 301 moves to drive the rack 302 to reciprocate, and the rack 302 drives the rotating gear 205, the rotating shaft 201 and the gas nozzle 202 to reciprocate, so that the surface of the wafer can be uniformly blown.
Further, the fixing rod 303 and the rotating shaft 201 are sleeved with a waterproof shell 206, and one side of the waterproof shell 206 is fixedly connected to the inner wall of one side of the casing 101; borrow by above-mentioned structure, through the setting of buckler 206, effectually prevented that water from splashing to the part, lead to the part damage of rustting, realized that the part protects.
Further, the driving unit comprises a cylindrical block fixedly connected to the other end of the sliding rod 301, a special-shaped rotating rod 304 is rotatably mounted on the cylindrical block, a driving motor 306 is fixedly connected to the bottom of the placing plate, the output end of the driving motor 306 is connected with a driving shaft through a coupler, a centrifugal rotating rod 305 is fixedly connected to the bottom end of the driving shaft, and one end of the centrifugal rotating rod 305 is rotatably connected to one end of the special-shaped rotating rod 304; by means of the structure, through the arrangement of the driving unit, the driving motor 306 moves to drive the driving shaft and the centrifugal rotating rod 305 to rotate, the centrifugal rotating rod 305 drives the sliding rod 301 to reciprocate through the special-shaped rotating rod 304, and power transmission is achieved.
Further, the sliding unit comprises a protective shell 107 fixedly connected to the outer cylindrical side wall of the placing table 106, a fixed rail 409 is fixedly connected to the inner wall of the bottom of the protective shell 107, a sliding block 408 is slidably connected to the fixed rail 409, one end of the sliding block 408 is fixedly connected with an L-shaped push rod 410, a sliding hole is formed in the inner wall of one side of the protective shell 107, one end of the L-shaped push rod 410 penetrates through the sliding hole and is attached to the fixed rod 303, a fixed toothed plate 407 is fixedly connected to the top of the sliding block 408, and a fastening element is installed on one side of the sliding block 408; by means of the structure, the sliding rod 301 moves to drive the fixing rod 303 to move through the arrangement of the L-shaped push rod 410, the fixing rod 303 moves to drive the L-shaped push rod 410 and the sliding block 408 to move, the sliding block 408 moves to drive the fixing toothed plate 407 to move, the power of the driving unit can be borrowed through mechanical design, and then energy is saved.
Further, a guide rod 412 is fixedly connected to the inner wall of one side of the protective shell 107, an installation block 411 is sleeved on the guide rod 412, one end of the installation block 411 is fixedly connected to one side of the sliding block 408, a return spring 413 is sleeved on the guide rod 412, and two ends of the return spring 413 are respectively and fixedly connected with the installation block 411 and the protective shell 107; by means of the structure, due to the arrangement of the return spring 413, under the elastic force action of the return spring 413 and without the action of external force, the return spring 413 can drive the sliding block 408 to reset, and automatic resetting is achieved.
Further, the fastening element comprises a fixed column 5 fixedly connected to one side of the sliding block 408, a strip-shaped hole is formed in the inner wall of one side of the protective shell 107, one end of the fixed column 5 penetrates through the strip-shaped hole and is provided with a sliding groove, a sliding column 501 is slidably connected in the sliding groove, one end of the sliding column 501 is fixedly connected with a special-shaped fixture block 502, one side of one rotating door panel 108 is fixedly connected with a U-shaped connector 504, the special-shaped fixture block 502 is matched with the U-shaped connector 504, an extrusion spring 503 is slidably connected in the sliding groove, and two ends of the extrusion spring 503 are respectively fixedly connected with the fixed column 5 and the sliding column 501; by the above structure, through the arrangement of the fastening element, the sliding block 408 moves to drive the fixing column 5, the sliding column 501 and the special-shaped fixture block 502 to move, so that the special-shaped fixture block 502 and the U-shaped connector 504 are fastened under the elastic force of the extrusion spring 503, thereby realizing automatic fastening and convenient operation.
Further, the clamping mechanism comprises a placing table 106, wherein a movable cavity is formed in the placing table 106, moving holes are formed in inner walls of two sides of the movable cavity, a threaded rod 401 is connected in the moving hole in a sliding mode, a special-shaped connecting rod 402 is fixedly connected to one end of the threaded rod 401, an arc-shaped plate 403 is fixedly connected to one end of the special-shaped connecting rod 402, a threaded pipe 4 is fixedly connected to one end, close to the two threaded rods 401, of the threaded pipe 4, two fixing blocks are sleeved on the threaded pipe 4 in a rotating mode, bottom ends of the two fixing blocks are fixedly connected to the inner wall of the placing table 106, a rotating hole is formed in the inner wall of one side of the placing cavity, a rotating rod 405 is rotatably connected in the rotating hole, the rotating rod 405 and the threaded pipe 4 are connected with a bevel gear 404 in a key mode, the two bevel gears 404 are meshed, a rotating gear 406 is connected to one end of the rotating rod 405 in a key mode, and the rotating gear 406 is meshed with a fixed toothed plate 407; borrow by above-mentioned structure, through clamping mechanism's setting, fixed tooth plate 407 removes and drives rotary gear 406 and dwang 405 rotation, and dwang 405 rotates and drives screwed pipe 4 through bevel gear 404 and rotates, and screwed pipe 4 rotates two threaded rods 401 and is close to each other, and two threaded rods 401 are close to each other and drive two special-shaped connecting rods 402 and arc 403 and are close to each other, have realized can be automatic to press from both sides tight fixedly with the wafer.
The working principle is as follows: the wafer to be diced is placed on the placing table 106, the cutting motor 103 is started to cut the wafer, the water spraying head 105 sprays water to the grinding wheel 104 in the cutting process, the driving motor 306 moves to drive the driving shaft and the centrifugal rotating rod 305 to rotate, the centrifugal rotating rod 305 drives the sliding rod 301 to reciprocate through the special-shaped rotating rod 304, the sliding rod 301 moves to drive the rack 302 to reciprocate, the rack 302 drives the rotating gear 205, the rotating shaft 201 and the air spraying head 202 to rotate in a reciprocating mode, meanwhile, the air pump 204 sprays air to the placing table 106 through the air guide tube 203 and the air spraying head 202, the wafer surface is blown, and then impurity-containing sewage on the wafer can be blown away, the cleanliness of the wafer surface is guaranteed, the wafer is prevented from being cut by the grinding wheel 104 due to the influence of residual impurities on the wafer, and edge breakage is effectively prevented when the wafer is cut.
The slide rod 301 moves to drive the fixing rod 303 to move, the fixing rod 303 moves to drive the L-shaped push rod 410 and the slide block 408 to move, the slide block 408 moves to drive the fixing toothed plate 407 to move, the fixing toothed plate 407 moves to drive the rotary gear 406 and the rotary rod 405 to rotate, the rotary rod 405 rotates to drive the threaded pipe 4 to rotate through the bevel gear 404, the threaded pipe 4 rotates two threaded rods 401 to approach each other, the two threaded rods 401 approach each other to drive the two special-shaped connecting rods 402 and the arc-shaped plate 403 to approach each other, so that the wafer can be clamped, the slide block 408 moves to drive the mounting block 411 to move, the mounting block 411 moves to drive the reset spring 413 to move and generate elastic deformation, meanwhile, the slide block 408 moves to drive the fixing column 5, the slide column 501 and the special-shaped fixture block 502 to move, under the elastic force of the extrusion spring 503, the special-shaped fixture block 502 and the U-shaped joint 504 are buckled, the wafer can be automatically clamped and fixed, the fixing effect on the wafer is improved, so that the wafer is not easy to shake in the cutting process of the wafer, and edge breakage in the cutting process of the wafer is further prevented.
Outwards stimulate and rotate door plant 108 and drive U-shaped joint 504 and break away from special-shaped fixture block 502, under the spring action of reset spring 413, can drive installation piece 411 and slider 408 and reset, slider 408 resets and drives fixed toothed plate 407 and reset, fixed toothed plate 407 drives rotary gear 406 and dwang 405 and carries out the antiport, make dwang 405 drive screwed pipe 4 through bevel gear 404 and carry out the antiport, screwed pipe 4 antiport drives threaded rod 401, special-shaped connecting rod 402 and arc 403 reset, make two arc 403 loosen the wafer, can loosen the wafer when having realized opening and rotating door plant 108, be convenient for take out the wafer.
The previous description is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (1)
1. A silicon chip scribing system for semiconductor wafer preparation capable of preventing edge breakage comprises a base (1), and is characterized in that: the water tank is arranged at the top of the base (1), the shell (101) is fixedly connected to the top of the base (1), a mounting groove is formed in one side of the shell (101), two rotary door plates (108) are connected in the mounting groove in a rotating mode, a moving mechanism (102) is fixedly connected to the inner wall of the shell (101), a cutting motor (103) is fixedly connected to the bottom end of the moving mechanism (102), a grinding wheel (104) is fixedly connected to one end of an output shaft of the cutting motor (103), a water spraying head (105) is fixedly connected to one side of the cutting motor (103), the position of the water spraying head (105) corresponds to the position of the grinding wheel (104), a fixing plate (2) is fixedly connected to the inner wall of one side of the shell (101), a swinging air injection mechanism is installed on the fixing plate (2), a placing table (106) is fixedly connected with the base (1), a clamping mechanism is installed on the placing table (106), the air injection mechanism comprises rotary holes formed in the inner wall of the top and the inner wall of the bottom of the fixing plate (2), a rotary hole is rotatably connected with a rotary shaft (201), an air inlet hole (203) and an air inlet hole (201) and an outlet hole (204) of an air pump (201) are fixedly connected with the air inlet hole (201) of the air pipe (201) and a reciprocating unit (201) of an air inlet hole (201), reciprocating unit includes the key-type and connects in rotating gear (205) of axis of rotation (201) bottom, the fixed orifices has been seted up to one side inner wall of shell (101), fixed orifices internal fixation connected with fixed sleeve (3), the inner wall sliding connection of fixed sleeve (3) has slide bar (301), the one end fixedly connected with rack (302) of slide bar (301), rack (302) meshes with rotating gear (205) mutually, the one end fixedly connected with dead lever (303) of rack (302), install drive unit on slide bar (301), the sliding unit is installed to the adaptation on dead lever (303), waterproof shell (206) has been cup jointed on dead lever (303) and axis of rotation (201), one side fixed connection of waterproof shell (206) is in one side inner wall of shell (101), drive unit includes the cylinder piece of fixed connection in the slide bar (301) other end, rotate on the cylinder piece and install special-shaped rotating rod (304), place the bottom fixedly connected with driving motor (306) of board, the output of driving motor (306) has the drive shaft through the coupling joint, the bottom fixedly connected with centrifugal rotating rod (305) of drive shaft, the one end of centrifugal rotating rod (305) is connected in the special-shaped rotating rod (304) and is connected in the one end fixed track of fixed track protection shell (107), the outer wall of protection shell (107) is placed, the protection shell (409) is connected with the protection shell (107), the outer wall (409) bottom of protection shell (107), the protection shell (409) is placed, the protection shell (106) of protection shell (107), the protection shell (409) is connected with the one end fixedly connected with, A sliding block (408) is connected on the fixed track (409) in a sliding manner, one end of the sliding block (408) is fixedly connected with an L-shaped push rod (410), a sliding hole is formed in the inner wall of one side of the protective shell (107), one end of the L-shaped push rod (410) penetrates through the sliding hole and is attached to the fixed rod (303), a fixed toothed plate (407) is fixedly connected to the top of the sliding block (408), a buckling element is installed on one side of the sliding block (408), a guide rod (412) is fixedly connected to the inner wall of one side of the protective shell (107), an installation block (411) is sleeved on the guide rod (412), one end of the installation block (411) is fixedly connected to one side of the sliding block (408), a reset spring (413) is sleeved on the guide rod (412), two ends of the reset spring (413) are fixedly connected with the installation block (411) and the protective shell (107) respectively, the buckling element comprises a fixed column (5) fixedly connected to one side of the sliding block (408), a strip-shaped hole is formed in the inner wall of one side of the protective shell (107), one end of the fixed column (501) penetrates through the strip-shaped hole and is connected with a special-shaped sliding chute (504), one side of the door panel (501), one U-shaped connector (502) is connected with a special-shaped sliding connector (504), sliding connection has extrusion spring (503) in the spout, the both ends of extrusion spring (503) respectively with fixed column (5) and slip post (501) fixed connection, clamping mechanism has seted up movable chamber including placing platform (106) inside, the both sides inner wall in activity chamber has all seted up the removal hole, sliding connection has threaded rod (401) in the removal hole, the one end fixedly connected with special-shaped connecting rod (402) of threaded rod (401), one end fixedly connected with arc (403) of special-shaped connecting rod (402), one end fixedly connected with screwed pipe (4) that two threaded rod (401) are close to each other, it has two fixed blocks to rotate to have cup jointed on screwed pipe (4), the bottom fixed connection of two fixed blocks is in placing platform (106) inner wall, place one side inner wall in chamber and seted up the rotatory hole, the rotatory downthehole internal rotation is connected with dwang (405), dwang (405) and screwed pipe (4) all key-connected with bevel gear (404), two bevel gear (404) mesh, the one end key-connection of dwang (405) has rotatory pinion (406), rotatory gear (406) meshes with fixed tooth plate (407).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111365979.9A CN114030094B (en) | 2021-11-18 | 2021-11-18 | Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111365979.9A CN114030094B (en) | 2021-11-18 | 2021-11-18 | Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114030094A CN114030094A (en) | 2022-02-11 |
| CN114030094B true CN114030094B (en) | 2022-12-09 |
Family
ID=80144779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111365979.9A Active CN114030094B (en) | 2021-11-18 | 2021-11-18 | Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114030094B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0150074A2 (en) * | 1984-01-23 | 1985-07-31 | Disco Abrasive Systems, Ltd. | Method and apparatus for grinding the surface of a semiconductor wafer |
| EP0610657A2 (en) * | 1993-01-07 | 1994-08-17 | Texas Instruments Incorporated | Integrated partial sawing process |
| CN102097546A (en) * | 2010-11-25 | 2011-06-15 | 山东华光光电子有限公司 | Method for cutting LED chip |
| CN105957835A (en) * | 2016-07-18 | 2016-09-21 | 浙江钱江摩托股份有限公司 | Cutting method for chip |
| CN112297262A (en) * | 2019-07-29 | 2021-02-02 | 江苏晶品新能源科技有限公司 | Solar monocrystalline silicon slice slicing device |
| CN112976381A (en) * | 2021-02-08 | 2021-06-18 | 南京守思商贸有限公司 | Semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness during slicing |
| CN113103138A (en) * | 2021-04-26 | 2021-07-13 | 高彬 | Semiconductor wafer processing pretreatment equipment |
| CN113510870A (en) * | 2021-04-26 | 2021-10-19 | 高彬 | Semiconductor wafer cutting device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268752A (en) * | 2004-02-19 | 2005-09-29 | Canon Inc | Method of laser cutting, workpiece and semiconductor-element chip |
| JP4790229B2 (en) * | 2004-04-27 | 2011-10-12 | 株式会社ディスコ | Cutting equipment |
| JP2007229843A (en) * | 2006-02-28 | 2007-09-13 | Disco Abrasive Syst Ltd | Cutting device |
| JP4642002B2 (en) * | 2006-11-14 | 2011-03-02 | 日東電工株式会社 | Semiconductor wafer protective tape cutting method and protective tape cutting device |
| CN101734613B (en) * | 2009-12-03 | 2011-08-24 | 西北工业大学 | SOI wafer-based MEMS structure manufacturing and dicing method |
| EP2711979A1 (en) * | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Wafer cutting system |
| JP6101140B2 (en) * | 2013-04-18 | 2017-03-22 | 株式会社ディスコ | Cutting equipment |
| JP6144107B2 (en) * | 2013-05-09 | 2017-06-07 | 株式会社ディスコ | Wafer cutting method |
| CN108397988A (en) * | 2018-04-17 | 2018-08-14 | 南安市瑞欣生物科技有限公司 | A kind of portable type tea drier that the drying efficiency based on Internet of Things is high |
| CN211163353U (en) * | 2019-10-21 | 2020-08-04 | 苏州英尔捷微电子股份有限公司 | Wafer grinding device with cleaning function |
| CN112864059A (en) * | 2021-03-04 | 2021-05-28 | 泸州龙芯微科技有限公司 | Semiconductor wafer cleaning device and working method thereof |
-
2021
- 2021-11-18 CN CN202111365979.9A patent/CN114030094B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0150074A2 (en) * | 1984-01-23 | 1985-07-31 | Disco Abrasive Systems, Ltd. | Method and apparatus for grinding the surface of a semiconductor wafer |
| EP0610657A2 (en) * | 1993-01-07 | 1994-08-17 | Texas Instruments Incorporated | Integrated partial sawing process |
| CN102097546A (en) * | 2010-11-25 | 2011-06-15 | 山东华光光电子有限公司 | Method for cutting LED chip |
| CN105957835A (en) * | 2016-07-18 | 2016-09-21 | 浙江钱江摩托股份有限公司 | Cutting method for chip |
| CN112297262A (en) * | 2019-07-29 | 2021-02-02 | 江苏晶品新能源科技有限公司 | Solar monocrystalline silicon slice slicing device |
| CN112976381A (en) * | 2021-02-08 | 2021-06-18 | 南京守思商贸有限公司 | Semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness during slicing |
| CN113103138A (en) * | 2021-04-26 | 2021-07-13 | 高彬 | Semiconductor wafer processing pretreatment equipment |
| CN113510870A (en) * | 2021-04-26 | 2021-10-19 | 高彬 | Semiconductor wafer cutting device |
Non-Patent Citations (3)
| Title |
|---|
| 半导体硅晶片超精密加工研究;李媛;《电子工业专用设备》;20180220(第01期);全文 * |
| 晶圆切割中背面崩裂问题的分析;龚平;《电子与封装》;20080720(第07期);全文 * |
| 石英玻璃晶圆的加工工艺;花宁等;《红外与激光工程》;20161225;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114030094A (en) | 2022-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110314881B (en) | Desolate and boundless photovoltaic power plant photovoltaic module maintenance system | |
| CN110441925B (en) | Special purger of polymer resin lens | |
| CN111872794A (en) | Green battery shell grinding device | |
| CN114030094B (en) | Silicon chip scribing system capable of preventing edge breakage during semiconductor wafer preparation | |
| CN210756892U (en) | Loudspeaker shell production grinding device | |
| CN211819940U (en) | Automatic pump priming device of centrifugal pump | |
| CN217619480U (en) | Polishing device for machining miniature motor metal shell capable of preventing damage | |
| CN110899208A (en) | Orange flower washing unit of orange flower cake preparation usefulness | |
| CN216861728U (en) | Chain stopper | |
| CN213965339U (en) | Circulating water purification tank with automatic descaling function | |
| CN213829760U (en) | Assembled is dust-protection cutting device for fitment | |
| CN112820627B (en) | Efficient wafer cleaning method | |
| CN219882085U (en) | Silicon-based material glassware corner grinding device | |
| CN113206028A (en) | Apparatus for etching semiconductor wafers | |
| CN219628024U (en) | Surface cleaning and drying device for integrated circuit board | |
| CN219985681U (en) | All-round cleaning machine of precision parts | |
| CN220142842U (en) | Fan generator gear box radiator cleaning device | |
| CN216098031U (en) | Glass tangent plane grinding device is used in production of solar photovoltaic glass | |
| CN217317612U (en) | Protector is used in emery wheel production | |
| CN214638768U (en) | Miniature laser cleaning head | |
| CN218743519U (en) | Spherical mechanical workpiece cleaning device | |
| CN218424451U (en) | Subassembly belt cleaning device is used in photovoltaic board production | |
| CN214012912U (en) | High-efficient wafer's belt cleaning device | |
| CN220575550U (en) | Polishing device for silicon wafer processing | |
| CN220261525U (en) | Ceramic tile cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |