CN214012912U

CN214012912U - High-efficient wafer's belt cleaning device

Info

Publication number: CN214012912U
Application number: CN202023292126.0U
Authority: CN
Inventors: 钱诚; 李刚; 周兴江
Original assignee: Jiangsu Asia Electronics Technology Co Ltd
Current assignee: Jiangsu Asia Electronics Technology Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-08-20
Anticipated expiration: 2030-12-30

Abstract

The utility model discloses a belt cleaning device of high-efficient wafer, including wasing the bucket, it mainly comprises outer staving, interior staving, shower nozzle to wash the bucket, the inboard top of outer staving is fixed with interior staving, the inboard top of interior staving is provided with the downward sloping the shower nozzle still includes actuating mechanism, actuating mechanism includes frame, motor, bolted connection is passed through in the frame outer staving top. The utility model discloses a mode through the linkage washs the wafer, has realized the function of once wasing a plurality of wafers, has improved cleaning efficiency, can also utilize the washing liquid inside the inner barrel body to wash the wafer in the process that the wafer rises, makes the time that the washing liquid inside the outer barrel body used longer, and then has realized the function of practicing thrift the washing liquid; still realized installing the wafer of equidimension not, improved the practicality of this device, can also be through dismantling the bayonet joint from the connector bottom for convenience more when installing the wafer.

Description

High-efficient wafer's belt cleaning device

Technical Field

The utility model relates to a wafer processing technology field especially relates to a belt cleaning device of high-efficient wafer.

Background

As is well known, a wafer cleaning apparatus is an apparatus for cleaning a wafer during a wafer processing process, and is widely used in the field of wafer processing equipment; the existing wafer cleaning device comprises an operation table, a washing liquid box, a wafer and a clamp, wherein the washing liquid box is provided with a cleaning cavity, and the bottom end of the washing liquid box is connected with the top end of the operation table; when the existing wafer cleaning device is used, firstly, a proper amount of cleaning solution is added into a cleaning solution box, then a wafer is clamped by a clamp, and a worker holds the clamping handle end of the clamp to immerse the wafer into the wafer cleaning solution for rinsing; the existing wafer cleaning device is used for discovering that firstly, in the rinsing process of the wafer, the cleaning liquid can not realize high washing frequency to the wafer, so that stains attached to the outer surface of the wafer can not be removed by the strong impact force of the cleaning liquid, the practicability is poor, only one wafer can be scrubbed at a time, and the cleaning efficiency is low.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solve the above problems and to provide a cleaning apparatus for a high-efficiency wafer.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

the cleaning device for the high-efficiency wafer comprises a cleaning barrel, wherein the cleaning barrel mainly comprises an outer barrel body, an inner barrel body and a sprayer, the inner barrel body is fixed at the top of the inner side of the outer barrel body, the sprayer which inclines downwards is arranged at the top of the inner side of the inner barrel body, the cleaning device also comprises a driving mechanism, the driving mechanism comprises a rack and a motor, the rack is connected with the top of the outer barrel body through a bolt, the motor is arranged at the top of the rack, the output end of the motor penetrates through the rack and is connected with a linkage mechanism, the linkage mechanism comprises a rotating shaft, a lifting assembly and a rotating assembly, the upper end of the rotating shaft is fixedly connected with the output end of the motor, the lower end of the rotating shaft is connected with the lifting assembly, the rotating assembly is connected with the rotating assembly on the peripheral side of the rotating shaft, the lifting assembly comprises a transmission lead screw, a threaded pipe and a planet carrier, the upper end of the transmission screw is fixedly connected with the rotating shaft, the lower end of the transmission screw extends into the inner side of the threaded pipe and is in threaded connection with the threaded pipe, the bottom of the threaded pipe is connected with the planet carrier through bolts, the rotating assembly comprises a fixing frame, an outer toothed ring, a driving rod, a driven rotating rod, a connecting head and balls, the fixing frame is connected with the periphery of the rotating shaft in a key mode, the outer side of the fixing frame is connected with the outer toothed ring through screws, a plurality of gears are meshed with the periphery of the outer toothed ring, one driving rod is connected with one driving rod in a key mode in the inner side of each gear, the driven rotating rod is arranged on the inner side of the driving rod, a positioning cavity is formed in the periphery of the driven rotating rod, the balls are connected with the inner side of the positioning cavity in a rolling mode, a placing cavity is formed in the inner side of the driving rod, and the lower end of the driven rotating rod extends out of the driving rod, and welded with the connector, the lower end of the connector passes through the planet carrier and is connected with the planet carrier through a bearing, the center of the bottom of the connector is provided with a clamping groove, the connector is also provided with a connecting hole, 6 discharging frames are clamped and connected at the inner side of the clamping groove, the rotating shaft can be driven by a motor to rotate, the rotating shaft drives a transmission screw and a fixing frame to rotate, the transmission screw drives a screwed pipe to descend, the screwed pipe drives the planet carrier to descend, the planet carrier drives the connector to descend, the connector drives the discharging frames to enable the wafer to enter the cleaning solution in the outer barrel body, the fixing frame drives an outer toothed ring to rotate in the process, the outer toothed ring drives a driving rod to rotate, the driving rod drives a driven rotating rod to rotate under the action of the balls, the driven rotating rod drives the connector to rotate, the connector drives the discharging frames to rotate, and further the wafer to rotate, the cleaning device has the advantages that the function of cleaning wafers is realized, the wafers are cleaned in a linkage mode, the function of cleaning a plurality of wafers at one time is realized, the cleaning efficiency is improved, the cleaning device can also be reversely rotated by the motor, the material placing frame ascends at the moment, the wafers firstly come out of the cleaning liquid in the outer barrel body, then the cleaning liquid in the inner barrel body is sprayed out by the spray head, the cleaning liquid washes the wafers, impurities on the wafers are washed away, the use time of the cleaning liquid in the outer barrel body is longer, and the cleaning liquid is saved, the material placing frame comprises a plug-in connector, a holding rod, a top plate, an installation screw rod, a material supporting plate and a sliding rod, the plug-in connector is integrally formed at the top of the holding rod, a positioning hole is formed in the plug-in connector, the plug-in connector is plugged in the inner side of the clamping groove and is fixed by a positioning pin, and the bottom of the holding rod is connected with the top plate through a bolt, roof week side spiro union has a plurality of the installation screw rod, the installation screw rod outside is connected with through the bearing the material backup pad, material backup pad lower extreme downwardly extending, and sliding connection have the slide bar, every the blowing groove has all been seted up to the material backup pad inboard, just the blowing groove one-to-one sets up like this and can pass through rotating the installation screw rod, and the installation screw rod drives the material backup pad and removes for the distance between the material backup pad changes, has realized installing the wafer of equidimension not, has improved the practicality of this device, can also be through dismantling the connector from the connector bottom, make more convenient when installing the wafer.

Preferably, the cleaning barrel further comprises supporting legs, the bottom end inside the outer barrel body is provided with the supporting legs, the tops of the supporting legs are supported by the inner barrel body, and the detachable fixing function of the inner barrel body is achieved through the arrangement.

Preferably, the cleaning barrel further comprises a support ring, the support ring is welded to the top of the outer side of the inner barrel body, and the support ring is overlapped to the top of the outer barrel body, so that the detachable fixing function of the inner barrel body is achieved.

Preferably, the driving mechanism further comprises a rotating disc, a clamping rod, a cylinder and a stabilizing frame, the rotating disc is rotatably connected to the inner side of the frame, the center of the top of the rotating disc is connected with the motor through a bolt, the output end of the motor penetrates through the rotating disc, and is connected with the rotating disc through a bearing, a plurality of gaps are arranged on the periphery of the rotating disc, the inner sides of the gaps are clamped with the clamping rods, one end of the clamping rod, which is far away from the rotating disc, is connected with the output end of the air cylinder through a bolt, the air cylinder is connected with the top of the frame through a bolt, the outer side of the clamping rod is connected with the stabilizing frame in a sliding way, and the stabilizing frame is connected to the top of the rack through a bolt, so that the linkage mechanism is rotated while not descending, and the material placing frame is convenient to install at the bottom of the connector.

Preferably, the outer ring gear outside is provided with the safety cover, this safety cover bottom with the actuating lever with the axis of rotation passes through the bearing and connects, this safety cover top with the axis of rotation passes through the bearing and connects, and still with the frame passes through the screw connection, sets up like this and has realized carrying out the function protected to the mount.

Preferably, the mounting screws are three or four and arranged at equal angles, so that the wafer can be mounted more conveniently.

Preferably, one end of the mounting screw, which is far away from the top plate, is provided with a handle, so that the mounting screw can be conveniently rotated.

Preferably, the arc-shaped groove is formed in the outer side of the holding rod, and anti-slip lines are arranged on the inner side of the arc-shaped groove, so that the material taking and placing frame is convenient to take.

Preferably, the plug connector is a hexagonal prism, positioning holes with the same size are formed in each prism face, the height of each positioning hole is the same, and the plug connector can be conveniently fixed through the arrangement.

Has the advantages that:

1. the rotating shaft can be driven to rotate by the motor, the rotating shaft drives the transmission screw rod and the fixing frame to rotate, the transmission screw rod drives the threaded pipe to descend, the threaded pipe drives the planet carrier to descend, the planet carrier drives the connecting head to descend, the connecting head drives the discharging frame to descend, so that the wafer enters cleaning liquid in the outer barrel body, the fixing frame drives the outer toothed ring to rotate in the process, the outer toothed ring drives the driving rod to rotate, the driving rod drives the driven rotating rod to rotate under the action of the balls, the driven rotating rod drives the connecting head to rotate, the connecting head drives the discharging frame to rotate, further the wafer is rotated, the function of cleaning the wafer is realized, the wafer is cleaned in a linkage mode, the function of cleaning a plurality of wafers at one time is realized, and the cleaning efficiency is improved;

2. the motor can rotate reversely, the material placing frame ascends at the moment, then the wafer comes out of the cleaning liquid in the outer barrel body, the cleaning liquid in the inner barrel body is sprayed out by the spray head, the cleaning liquid washes the wafer, impurities on the wafer are washed away, the use time of the cleaning liquid in the outer barrel body is longer, and the function of saving the cleaning liquid is further realized;

3. can drive the material backup pad through rotating the installation screw rod, the installation screw rod removes for the distance between the material backup pad changes, has realized installing the wafer of equidimension not, has improved the practicality of this device, can also be through dismantling the bayonet joint from the connector bottom, make more convenience when installing the wafer.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of an efficient wafer cleaning apparatus according to the present invention;

FIG. 2 is a schematic structural diagram of a cleaning barrel of the high-efficiency wafer cleaning apparatus according to the present invention;

fig. 3 is a sectional view of a first embodiment of a cleaning tub of a high-efficiency wafer cleaning apparatus according to the present invention;

FIG. 4 is a sectional view of a second embodiment of a cleaning tank of an apparatus for cleaning a high-efficiency wafer according to the present invention;

fig. 5 is an assembly view of the driving mechanism, the linkage mechanism and the material placing frame of the high-efficiency wafer cleaning device according to the present invention;

fig. 6 is a schematic structural diagram of a linkage mechanism of a high-efficiency wafer cleaning apparatus according to the present invention;

FIG. 7 is a schematic cross-sectional view of a linkage mechanism of an efficient wafer cleaning apparatus according to the present invention;

fig. 8 is a schematic structural diagram of a material placing frame of the apparatus for cleaning a high-efficiency wafer according to the present invention.

The reference numerals are explained below:

1. a washing barrel; 2. a drive mechanism; 3. a linkage mechanism; 4. a material placing frame; 101. an outer barrel body; 102. an inner barrel body; 103. a spray head; 104. supporting legs; 11. a support ring; 201. a frame; 202. rotating the disc; 203. A motor; 204. a clamping rod; 205. a cylinder; 206. a stabilizer frame; 2021. a notch; 31. a rotating shaft; 32. A lifting assembly; 33. a rotating assembly; 321. a drive screw; 322. a threaded pipe; 323. a planet carrier; 331. A fixed mount; 332. an outer ring gear; 333. a drive rod; 334. a passive rotating rod; 335. a connector; 336. a ball bearing; 3331. a placement chamber; 3341. a positioning cavity; 401. a plug-in connector; 402. a holding rod; 403. a top plate; 404. Installing a screw rod; 405. a material supporting plate; 406. a slide bar; 4051. a discharge chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example 1

As shown in fig. 1-3 and 5-8, a cleaning device for a high-efficiency wafer comprises a cleaning barrel 1, wherein the cleaning barrel 1 mainly comprises an outer barrel body 101, an inner barrel body 102 and a nozzle 103, the inner top of the outer barrel body 101 is fixed with the inner barrel body 102, the inner top of the inner barrel body 102 is provided with the nozzle 103 inclined downwards, and the cleaning device further comprises a driving mechanism 2, the driving mechanism 2 comprises a frame 201 and a motor 203, the frame 201 is connected to the top of the outer barrel body 101 through a bolt, the top of the frame 201 is provided with the motor 203, the output end of the motor 203 penetrates through the frame 201 and is connected with a linkage mechanism 3, the linkage mechanism 3 comprises a rotating shaft 31, a lifting assembly 32 and a rotating assembly 33, the upper end of the rotating shaft 31 is fixedly connected with the output end of the motor 203, the lower end of the rotating shaft 31 is connected with the lifting assembly 32, the rotating assembly 33 is circumferentially connected with the rotating assembly 31, and the lifting assembly 32 comprises a transmission lead screw 321, A threaded pipe 322, a planet carrier 323, the upper end of a transmission screw 321 is fixedly connected with the rotating shaft 31, the lower end of the transmission screw 321 extends into the inner side of the threaded pipe 322 and is in threaded connection with the threaded pipe 322, the bottom of the threaded pipe 322 is connected with the planet carrier 323 through a bolt, the rotating component 33 comprises a fixed frame 331, an outer toothed ring 332, a driving rod 333, a driven rotating rod 334, a connector 335 and balls 336, the fixed frame 331 is in key connection with the peripheral side of the rotating shaft 31, the outer toothed ring 332 is connected with the outer toothed ring through a bolt, a plurality of gears are meshed with the peripheral side of the outer toothed ring 332, a driving rod 333 is connected with the inner side of each gear in key connection, the driven rotating rod 334 is arranged inside the driving rod 333, a positioning cavity 3341 is arranged on the peripheral side of the driven rotating rod 334, the balls 336 are in rolling connection with the inner side of the positioning cavity 3341, a placing cavity 3331 is arranged inside the driving rod 333, the rolling connection balls 336 is arranged inside the placing cavity 3331, the lower end of the driven rotating rod 334 extends out of the driving rod 333, and a connector 335 is welded, the lower end of the connector 335 passes through the planet carrier 323 and is connected with the planet carrier 323 through a bearing, a clamping groove is formed in the center of the bottom of the connector 335, a connecting hole is further formed on the connector 335, 6 material placing frames 4 are clamped inside the clamping groove, in this way, the motor 203 can drive the rotating shaft 31 to rotate, the rotating shaft 31 drives the transmission screw 321 and the fixing frame 331 to rotate, the transmission screw 321 drives the threaded pipe 322 to descend, the threaded pipe 322 drives the planet carrier 323 to descend, the planet carrier 323 drives the connector 335 to descend, the connector 335 drives the material placing frames 4 to descend, so that the wafer enters the cleaning solution inside the outer barrel body 101, in the process, the fixing frame 331 drives the outer toothed ring 332 to rotate, the outer toothed ring 332 drives the driving rod 333 to rotate, the driving rod 333 drives the driven rotating rod 334 to rotate under the action of the ball 336, and the driven rotating rod 334 drives the connector 335 to rotate, the connector 335 drives the material placing frame 4 to rotate, so that the wafer rotates, the function of cleaning the wafer is realized, the wafer is cleaned in a linkage mode, the function of cleaning a plurality of wafers at one time is realized, the cleaning efficiency is improved, the motor 203 can also rotate reversely, at the moment, the material placing frame 4 rises, so that the wafers firstly come out of the cleaning solution in the outer barrel body 101, then the spray head 103 sprays the cleaning solution in the inner barrel body 102, the cleaning solution washes the wafer, impurities on the wafer are washed away, the use time of the cleaning solution in the outer barrel body 101 is longer, the function of saving the cleaning solution is realized, the material placing frame 4 comprises a plug 401, a holding rod 402, a top plate 403, a mounting screw 404, a material supporting plate 405 and a sliding rod 406, the plug 401 is integrally formed at the top of the holding rod 402, a positioning hole is formed in the plug 401, and the plug 401 is plugged in the clamping groove, the cleaning device is fixed by a positioning pin, the bottom of the holding rod 402 is connected with a top plate 403 by a bolt, a plurality of mounting screws 404 are screwed on the periphery of the top plate 403, the outer sides of the mounting screws 404 are connected with material supporting plates 405 by bearings, the lower ends of the material supporting plates 405 extend downwards and are connected with slide rods 406 in a sliding manner, the inner sides of the material supporting plates 405 are respectively provided with a material discharging groove 4051, and the material discharging grooves 4051 correspond to each other one by one, so that the mounting screws 404 can be rotated to drive the material supporting plates 405 to move, the distance between the material supporting plates 405 is changed, wafers with different sizes can be mounted, the practicability of the device is improved, the plugging head 401 can be detached from the bottom of the connecting head 335, the wafer mounting is more convenient, the cleaning barrel 1 further comprises supporting legs 104, the bottom inside the outer, the top of the supporting leg 104 supports the inner barrel 102, so as to realize the detachable fixing function of the inner barrel 102, the driving mechanism 2 further comprises a rotating disc 202, a clamping rod 204, an air cylinder 205 and a stabilizing frame 206, the rotating disc 202 is rotatably connected to the inner side of the frame 201, the center of the top of the rotating disc 202 is connected with a motor 203 through a bolt, the output end of the motor 203 penetrates through the rotating disc 202 and is connected with the rotating disc 202 through a bearing, a plurality of notches 2021 are arranged on the peripheral side of the rotating disc 202, the clamping rod 204 is clamped to the inner side of the notches 2021, one end of the clamping rod 204 far away from the rotating disc 202 is connected to the output end of the air cylinder 205 through a bolt, the air cylinder 205 is connected to the top of the frame 201 through a bolt, the stabilizing frame 206 is slidably connected to the outer side of the clamping rod 204, and the stabilizing frame 206 is connected to the top of the frame 201 through a bolt, so as to realize that the linkage mechanism 3 rotates the linkage mechanism 3 without descending, thereby facilitating the installation of the material placing frame 4 at the bottom of the connecting head 335, arranging a protective cover outside the outer gear ring 332, the bottom of the protective cover is connected with the driving rod 333 and the rotating shaft 31 through a bearing, the top of the protective cover is connected with the rotating shaft 31 through a bearing, and is connected with the frame 201 through screws, so that the function of protecting the fixing frame 331 is realized, four mounting screw rods 404 are arranged, and the equal angle arrangement makes the wafer installation more convenient, the end of the installation screw 404 far away from the top plate 403 is provided with a handle, the arrangement facilitates the rotation of the mounting screw 404, the outer side of the holding rod 402 is provided with an arc-shaped groove, the inner side of the arc-shaped groove is provided with anti-skid lines, so that the material taking and placing rack 4 is convenient to arrange, the plug connector 401 is a hexagonal prism, and all set up the locating hole of the same size on every faceted pebble, and the locating hole height is the same, has set up like this and has made things convenient for and has fixed spigot 401.

A use method of a high-efficiency wafer cleaning device comprises the following steps:

example 2

As shown in fig. 4, embodiment 2 differs from embodiment 1 in that: cleaning barrel 1 still includes support ring 11, and the welding of inner barrel body 102 outside top has support ring 11, and support ring 11 overlap joint has realized inner barrel body 102's detachable fixed function like this at outer barrel body 101 top.

the method comprises the following steps: firstly, rotating the mounting screw 404, driving the material supporting plates 405 to move by the mounting screw 404, enabling the material supporting plates 405 to move to proper positions, enabling two or three material supporting plates 405 to move to proper positions according to the mode, then rotating the rest mounting screw 404 to separate the rest mounting screw 404 from the top plate 403, then sequentially placing the wafers on the inner side of the material placing groove 4051, and then mounting the taken-down mounting screws 404 on the top plate 403 to enable the material supporting plates 405 to clamp the wafers;

step two: then the holding rod 402 is taken up, so that the plug-in connector 401 is clamped at the inner side of a clamping groove formed in the bottom of the connector 335 and is fixed by a fixing pin;

step three: then, repeating the first step, rotating the driving rod 333 to rotate the rotating shaft 31, so that the position of the driving rod 333 is changed, repeating the second step, so that the material placing frames 4 are fixed below all the connectors 335, then starting the air cylinder 205, and driving the stabilizing frame 206 to move by the air cylinder 205, so that the stabilizing frame 206 is inserted into the notch 2021, and the rotating disc 202 is fixed;

step four: cleaning fluid is injected into the inner barrel 102 and the outer barrel 101;

step five: the motor 203 is started, the motor 203 drives the rotating shaft 31 to rotate, the rotating shaft 31 drives the transmission lead screw 321 and the fixing frame 331 to rotate, the transmission lead screw 321 drives the threaded pipe 322 to descend, the threaded pipe 322 drives the planet carrier 323 to descend, the planet carrier 323 drives the connecting head 335 to descend, the connecting head 335 drives the discharging frame 4 to descend, so that the wafer enters the cleaning solution in the outer barrel body 101, in the process, the fixing frame 331 drives the outer toothed ring 332 to rotate, the outer toothed ring 332 drives the driving rod 333 to rotate, the driving rod 333 drives the driven rotating rod 334 to rotate under the action of the balls 336, the driven rotating rod 334 drives the connecting head 335 to rotate, the connecting head 335 drives the discharging frame 4 to rotate, and further the wafer is rotated, and the function of cleaning the wafer is achieved;

step six: the motor 203 rotates reversely, the material placing frame 4 ascends at the moment, and then the wafer comes out of the cleaning liquid inside the outer barrel body 101, and then the cleaning liquid inside the inner barrel body 102 is sprayed out by the spray head 103 and washes the wafer, so that the impurities on the wafer are washed away.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a belt cleaning device of high-efficient wafer, includes washing bucket (1), its characterized in that: the cleaning barrel (1) mainly comprises an outer barrel body (101), an inner barrel body (102) and a spray head (103), wherein the inner barrel body (102) is fixed at the top of the inner side of the outer barrel body (101), the spray head (103) which inclines downwards is arranged at the top of the inner side of the inner barrel body (102), the cleaning barrel further comprises a driving mechanism (2), the driving mechanism (2) comprises a rack (201) and a motor (203), the rack (201) is connected at the top of the outer barrel body (101) through bolts, the motor (203) is arranged at the top of the rack (201), the output end of the motor (203) penetrates through the rack (201) and is connected with a linkage mechanism (3), the linkage mechanism (3) comprises a rotating shaft (31), a lifting assembly (32) and a rotating assembly (33), the upper end of the rotating shaft (31) is fixedly connected with the output end of the motor (203), the utility model discloses a solar energy water heater, including pivot axis (31), pivot axis (31) lower extreme is connected with lifting unit (32), pivot axis (31) week side is connected with rotating assembly (33), lifting unit (32) include drive screw (321), screwed pipe (322), planet carrier (323), drive screw (321) upper end with pivot axis (31) fixed connection, drive screw (321) lower extreme stretches into screwed pipe (322) are inboard, and with screwed pipe (322) spiro union, screwed pipe (322) bottom has through bolted connection planet carrier (323), rotating assembly (33) include mount (331), outer ring gear (332), actuating lever (333), passive bull stick (334), connector (335), ball (336), mount (331) key-type connection is in pivot axis (31) week side, mount (331) outside has through the screw connection outer ring gear (332), the meshing of outer ring gear (332) week side has a plurality of gear, and every gear inboard equal key-type connection has one actuating lever (333), actuating lever (333) inboard is provided with passive bull stick (334), location chamber (3341) has been seted up to passive bull stick (334) week side, location chamber (3341) inboard roll connection has ball (336), chamber (3331) has been seted up to actuating lever (333) inboard and has been placed, place chamber (3331) inboard roll connection has ball (336), passive bull stick (334) lower extreme stretches out actuating lever (333), and the welding has connector (335), connector (335) lower extreme passes planet carrier (323), and with planet carrier (323) passes through the bearing and connects, connector (335) bottom central authorities have seted up the draw-in groove, still seted up the connecting hole on connector (335), the inner side of the clamping groove is clamped with 6 material placing frames (4), each group of material placing frames (4) comprises a plug-in connector (401), a holding rod (402), a top plate (403), mounting screw rods (404), material supporting plates (405) and sliding rods (406), the plug-in connector (401) is integrally formed at the top of the holding rod (402), a positioning hole is formed in the plug-in connector (401), the plug-in connector (401) is plugged in the inner side of the clamping groove and is fixed through the positioning pin, the bottom of the holding rod (402) is connected with the top plate (403) through bolts, a plurality of mounting screw rods (404) are screwed on the periphery of the top plate (403), the outer side of each mounting screw rod (404) is connected with the material supporting plate (405) through a bearing, the lower end of each material supporting plate (405) extends downwards and is connected with the sliding rod (406), a material placing groove (4051) is formed in the inner side of each material supporting plate (405), and the discharging grooves (4051) are in one-to-one correspondence.

2. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the cleaning barrel (1) further comprises supporting legs (104), the supporting legs (104) are arranged at the bottom end inside the outer barrel body (101), and the inner barrel body (102) is supported at the tops of the supporting legs (104).

3. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the cleaning barrel (1) further comprises a support ring (11), the support ring (11) is welded to the top of the outer side of the inner barrel body (102), and the support ring (11) is lapped on the top of the outer barrel body (101).

4. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the driving mechanism (2) also comprises a rotating disc (202), a clamping rod (204), an air cylinder (205) and a stabilizing frame (206), the rotating disc (202) is rotatably connected to the inner side of the rack (201), the motor (203) is connected to the center of the top of the rotating disc (202) through a bolt, the output end of the motor (203) penetrates through the rotating disc (202), and is connected with the rotating disc (202) through a bearing, a plurality of notches (2021) are arranged on the periphery of the rotating disc (202), the clamping rod (204) is clamped on the inner side of the notch (2021), one end of the clamping rod (204) far away from the rotating disc (202) is connected to the output end of the air cylinder (205) through a bolt, the cylinder (205) is connected to the top of the frame (201) through a bolt, the outer side of the clamping rod (204) is connected with the stabilizing frame (206) in a sliding manner, and the stabilizing frame (206) is connected to the top of the frame (201) through bolts.

5. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the outer side of the outer gear ring (332) is provided with a protective cover, the bottom of the protective cover is connected with the driving rod (333) and the rotating shaft (31) through a bearing, and the top of the protective cover is connected with the rotating shaft (31) through a bearing and is also connected with the rack (201) through a screw.

6. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the number of the mounting screws (404) is three or four, and the mounting screws are arranged at equal angles.

7. The efficient wafer cleaning apparatus as set forth in claim 6, wherein: and a handle is arranged at one end of the mounting screw rod (404) far away from the top plate (403).

8. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: an arc-shaped groove is formed in the outer side of the holding rod (402), and anti-skidding lines are arranged on the inner side of the arc-shaped groove.

9. A high efficiency wafer cleaning apparatus as defined in claim 1, wherein: the plug connector (401) is a hexagonal prism, positioning holes with the same size are formed in each prism face, and the heights of the positioning holes are the same.