CN114000117A - Control device and control method for dynamically controlling utilization rate of sputtering target - Google Patents

Abstract

The invention discloses a control device and a control method for dynamically controlling the utilization rate of a sputtering target, relates to the field of magnetron sputtering coating, and aims to solve the problems that the control device for the utilization rate of the sputtering target in the prior art is complex in measurement mode, influences the working efficiency, cannot realize online real-time measurement, wastes time and cannot dynamically control the utilization of the target. The fixing base is installed to the up end of target sputtering workstation, the lift guard plate is all installed to the both ends top of fixing base, just movable guard plate is all installed to the preceding terminal surface and the rear end face of fixing base, the sealed cover body is installed to the top of target sputtering workstation, the electric box is installed to the top of the sealed cover body, magnetic field generator is installed to the lower extreme of electric box, the plate electrode is all installed to magnetic field generator's both sides, the target base is installed to the top of internal fixation case, the target main part of sputtering is all installed to the both sides of target base.

Description

Control device and control method for dynamically controlling utilization rate of sputtering target

Technical Field

The invention relates to the technical field of magnetron sputtering coating, in particular to a control device and a control method for dynamically controlling the utilization rate of a sputtering target material.

Background

Magnetron sputtering coating is a novel physical vapor coating mode, namely, an electrode plate system is used for emitting and focusing electrons on a coated material, so that atoms sputtered out of the material fly away from the material to a substrate by high kinetic energy according to a momentum conversion principle to deposit and form a film. The material to be plated is called sputtering target material, sputtering is one of the main techniques for preparing film material, and it uses the ions produced by ion source, and makes them undergo the process of accelerating and collecting in vacuum to form high-speed ion beam flow, and bombards the surface of solid, and the ions and the atoms on the surface of solid produce kinetic energy exchange to make the atoms on the surface of solid leave the solid and deposit on the surface of substrate, and the bombarded solid is the raw material for depositing film by sputtering method, and is called sputtering target material. Various types of sputtered thin film materials have found wide application in semiconductor integrated circuits, recording media, flat panel displays, and workpiece surface coatings. The high temperature and high vacuum environment inside the process reaction chamber can make these metal atoms form crystal grains, and then through the lithography patterning and etching, finally layer by layer of metal wires, and the data transmission of the chip is completely dependent on these metal wires.

The existing control device for the utilization rate of the sputtering target has complex measurement mode, influences the working efficiency and cannot realize online real-time measurement, thereby wasting time and dynamically controlling the utilization of the target; therefore, the market is urgently in need of developing a control device and a control method for dynamically controlling the utilization rate of the sputtering target material to help people to solve the existing problems.

Disclosure of Invention

The invention aims to provide a control device and a control method for dynamically controlling the utilization rate of a sputtering target, and aims to solve the problems that the existing control device for the utilization rate of the sputtering target in the background art has a complex measurement mode, influences the working efficiency, cannot realize online real-time measurement, wastes time and cannot dynamically control the utilization of the target.

In order to achieve the purpose, the invention provides the following technical scheme: the control device for dynamically controlling the utilization rate of the sputtering target comprises a target sputtering workbench, wherein a fixed seat is installed on the upper end face of the target sputtering workbench, lifting protection plates are installed above two ends of the fixed seat respectively, movable protection plates are installed on the front end face and the rear end face of the fixed seat respectively, a sealing cover body is installed above the target sputtering workbench, an electric cabinet is installed above the sealing cover body, a magnetic field generator is installed at the lower end of the electric cabinet, electrode plates are installed on two sides of the magnetic field generator respectively, inner fixing boxes are installed on two sides above the target sputtering workbench respectively, a speed reduction motor is installed inside the inner fixing boxes, a target base is installed above the inner fixing boxes, sputtering target main bodies are installed on two sides of the target base respectively, and a target detection plate is arranged between the target base and the sputtering target main bodies, two the one end of sputtering target main part all extends to target base inside and target pick-up plate sliding connection, just install the locating plate in the middle of the inside of target base, the internally mounted of locating plate has the movable block, electric motor is all installed to the both sides of movable block, and electric motor's one end installs the threaded rod, the threaded rod passes the locating plate and extends to inside and sputtering target main part threaded connection of sputtering target main part, the inside of lift guard plate and activity guard plate all installs interior detection panel, the internally mounted of interior detection panel has the enlarged camera.

Preferably, the link is all installed to the both sides of the sealed cover body, electronic jar is installed to the lower extreme of link, electronic jar lower extreme and target sputter workstation fixed connection, just electronic jar upper end and link fixed connection, the lower extreme embedding target sputter workstation upper end and target sputter workstation sealing connection of the sealed cover body, the protection casing is installed to the lower terminal surface of fixing base, the internally mounted of protection casing has the vacuum pump, the connecting pipe is installed to the upper end of vacuum pump, the atomic absorption board is installed to the upper end of connecting pipe, the up end sealing connection of atomic absorption board and fixing base, the bleed-off pipeline is installed to the lower extreme of protection casing, bleed-off pipeline and atomic absorption board intercommunication.

Preferably, the electric box and the sealing cover body fixed connection, just the surface mounting of electric box has the display screen, the internally mounted of electric box has transformer and wireless transmission module, transformer and wireless transmission module all with magnetic field generator electric connection, magnetic field generator's internally mounted has regulating switch, regulating switch and plate electrode electric connection.

Preferably, install the pivot between activity guard plate and the fixing base, just the internally mounted of fixing base has driving motor, and driving motor passes through the shaft coupling transmission with the pivot and is connected, the lower extreme installation electric telescopic handle of lift guard plate, and electric telescopic handle and lift guard plate fixed connection, just the lift guard plate extends to inside and fixing base sliding connection of fixing base.

Preferably, an overhaul cover plate is installed at the upper end of the target base and is in sealing connection with the target base, the positioning plate is fixedly connected with the overhaul cover plate, sliding grooves are formed in the front end and the two sides of the outer portion of the positioning plate, and the moving block and the threaded rod are in sliding connection with the positioning plate through the sliding grooves.

Preferably, the upper end face of the target detection plate is provided with a pressure sensor, a temperature sensor and a magnetic sensor, a spring is arranged between the target detection plate and the positioning plate, the target detection plate is movably connected with the target base, an electromagnetic shielding cover is arranged below the sputtering target main body, and the upper end of the speed reduction motor is provided with a torque sensor.

Preferably, the inside of activity guard plate and lift guard plate all installs interior sealed transparent plate, interior test panel and interior sealed transparent plate fixed connection, it is provided with a plurality of to enlarge the camera.

The control method of the control device for dynamically controlling the utilization rate of the sputtering target comprises the following steps:

the method comprises the following steps: remotely transmitting an operation command by the magnetic field generator through the wireless transmission module, contracting the electric cylinder, and driving the sealing cover body and the target sputtering workbench to be sealed and fixed;

step two: turning on an adjusting switch, starting an electrode plate by a magnetic field generator to add an orthogonal magnetic field and an electric field between a cathode and an anode of a sputtering target material main body, filling inert gas, accelerating the inert gas to fly to a target surface under the action of Lorentz force, bombarding the target surface at a high speed, and enabling atoms sputtered from the sputtering target material main body to fly to a substrate with high kinetic energy to deposit and form a film by following a momentum conversion principle;

step three: the power supply of the target detection plate is turned on, the sputtering target main body is detected through a pressure sensor, a temperature sensor and a magnetic sensor which are arranged outside the target detection plate, and detected data are sent to the cloud end through a wireless transmission module;

step four: monitoring the sputtering target main body according to inner detection panels and amplification cameras in the movable protection plate and the lifting protection plate, adjusting the position angles of the movable protection plate and the lifting protection plate to adapt to sputtering target main bodies with different shapes, and counting the coating efficiency according to the sputtering target main bodies with different shapes and different angles;

step five: according to the monitoring information of high in the clouds, the position and the angle of long-range adjustment gear motor according to the demand adjustment sputtering target main part, open the electric motor power again, drive the threaded rod and rotate, adjust the position between two sets of sputtering target main parts and the target base, make the position of sputtering target main part correspond the position of plate electrode to the utilization efficiency of control sputtering target main part.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the sputtering target material main body monitoring device, the movable protection plate and the lifting protection plate are arranged, the sputtering target material main body can be monitored through the inner detection panels and the amplifying cameras in the movable protection plate and the lifting protection plate in the working process, the position angles of the movable protection plate and the lifting protection plate can be adjusted to adapt to sputtering target material main bodies in different shapes, the film coating efficiency is counted according to the sputtering target material main bodies in different shapes and different angles, the angle positions of the amplifying cameras are convenient to adjust, so that the detection work in different positions can be carried out, the detection range is wide, the data counting efficiency can be improved, and the control effect can be improved.

2. According to the invention, through the arrangement of the target detection plate, the sputtering target main body is added with an orthogonal magnetic field and an orthogonal electric field between a sputtered target pole and an anode through the magnetic field generator and the electrode plate in operation, inert gas is filled, the inert gas is accelerated to fly to the target surface under the action of Lorentz force and bombards the target surface at a high speed, the sputtering target main body can be detected through the pressure sensor, the temperature sensor and the magnetic sensor outside the target detection plate, detected data is sent to the cloud end through the wireless transmission module, the weight, the temperature and the magnetism of the sputtering target main body are counted, the use condition of the sputtering target main body can be timely clarified, the position and the angle of the sputtering target main body can be adjusted according to big data, and the utilization efficiency of the sputtering target main body is improved.

3. According to the sputtering target material base, the gear motor is remotely adjusted according to the monitoring information of the cloud end, the position and the angle of the sputtering target material main body are adjusted according to requirements, then the power supply of the electric motor is turned on to drive the threaded rod to rotate, the positions between the two groups of sputtering target material main bodies and the target material base are adjusted, the positions of the sputtering target material main bodies correspond to the positions of the electrode plates, the utilization efficiency of the sputtering target material main bodies is controlled, the use effect of the sputtering target material main bodies can be improved, and the working quality of sputtering coating is improved.

Drawings

FIG. 1 is an overall schematic view of the present invention;

FIG. 2 is an internal structural view of the present invention;

FIG. 3 is an internal structural view of a target base according to the present invention;

FIG. 4 is an internal structural view of the magnetic field generator of the present invention;

fig. 5 is an internal structure view of the moving guard of the present invention.

In the figure: 1. a target sputtering workbench; 2. sealing the cover body; 3. an electric cylinder; 4. a connecting frame; 5. an electric box; 6. a display screen; 7. a fixed seat; 8. a movable protection plate; 9. lifting protection plates; 10. a target material base; 11. sputtering the target material main body; 12. overhauling the cover plate; 13. an air extraction pipeline; 14. a magnetic field generator; 15. an electrode plate; 16. a protective cover; 17. a vacuum pump; 18. an atom absorption plate; 19. a connecting pipe; 20. an inner fixed box; 21. positioning a plate; 22. a moving block; 23. a chute; 24. a threaded rod; 25. detecting a target material plate; 26. an electromagnetic shield; 27. a reduction motor; 28. a torque sensor; 29. a transformer; 30. a wireless transmission module; 31. an adjustment switch; 32. an inner detection panel; 33. amplifying the camera; 34. the transparent plate is sealed inside.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-5, an embodiment of the present invention is shown: a control device for dynamically controlling the utilization rate of a sputtering target comprises a target sputtering workbench 1, wherein a fixed seat 7 is installed on the upper end face of the target sputtering workbench 1, lifting protection plates 9 are installed above two ends of the fixed seat 7 respectively, movable protection plates 8 are installed on the front end face and the rear end face of the fixed seat 7 respectively, a sealing cover body 2 is installed above the target sputtering workbench 1, an electric box 5 is installed above the sealing cover body 2, a magnetic field generator 14 is installed at the lower end of the electric box 5, electrode plates 15 are installed on two sides of the magnetic field generator 14, inner fixing boxes 20 are installed on two sides above the target sputtering workbench 1 respectively, a speed reduction motor 27 is installed inside each inner fixing box 20, a target base 10 is installed above each inner fixing box 20, sputtering target main bodies 11 are installed on two sides of the target base 10, and a target detection plate 25 is arranged between each target base 10 and each sputtering target main body 11, one end of each of the two sputtering target main bodies 11 extends into the target base 10 and is connected with the target detection plate 25 in a sliding manner, the middle inside the target base 10 is provided with a positioning plate 21, the inside of the positioning plate 21 is provided with a moving block 22, the two sides of the moving block 22 are provided with electric motors, one end of each electric motor is provided with a threaded rod 24, the threaded rod 24 penetrates through the positioning plate 21 and extends into the sputtering target main bodies 11 to be connected with the sputtering target main bodies 11 in a threaded manner, the inside of each of the lifting protection plate 9 and the movable protection plate 8 is provided with an inner detection panel 32, the inside of each inner detection panel 32 is provided with an amplifying camera 33, the sputtering target main bodies 11 are provided with an orthogonal magnetic field and an electric field between a sputtered target pole and an anode through the magnetic field generator 14 and the electrode plate 15 during working, inert gas is filled, and the inert gas is accelerated to fly to the target surface under the action of Lorentz force, bombard the target surface with very high speed, accessible target detection board 25 outside pressure sensor, temperature sensor and magnetic sensor detect sputtering target main part 11, send the data that detect for the high in the clouds through wireless transmission module 30, make statistics of the weight, the temperature and the magnetism of sputtering target main part 11, can in time understand the in service behavior of sputtering target main part 11, can be according to big data adjustment sputtering target main part 11's position and angle, improve sputtering target main part 11's utilization efficiency.

Furthermore, both sides of the sealed cover body 2 are provided with connecting frames 4, the lower end of the connecting frame 4 is provided with an electric cylinder 3, the lower end of the electric cylinder 3 is fixedly connected with the target sputtering worktable 1, the upper end of the electric cylinder 3 is fixedly connected with the connecting frame 4, the lower end of the sealing cover body 2 is embedded into the upper end of the target sputtering workbench 1 and is hermetically connected with the target sputtering workbench 1, the lower end face of the fixed seat 7 is provided with a protective cover 16, the protective cover 16 is internally provided with a vacuum pump 17, the upper end of the vacuum pump 17 is provided with a connecting pipe 19, the upper end of the connecting pipe 19 is provided with an atomic absorption plate 18, the atomic absorption plate 18 is hermetically connected with the upper end face of the fixed seat 7, the lower end of the protective cover 16 is provided with an air exhaust pipeline 13, the air exhaust pipeline 13 is communicated with the atomic absorption plate 18, the space between the sealed cover body 2 and the target sputtering table 1 is evacuated by a vacuum pump 17, and sputtered coating atoms are evacuated.

Further, the electrical box 5 is fixedly connected with the sealing cover body 2, the display screen 6 is installed on the outer surface of the electrical box 5, the transformer 29 and the wireless transmission module 30 are installed inside the electrical box 5, both the transformer 29 and the wireless transmission module 30 are electrically connected with the magnetic field generator 14, the adjusting switch 31 is installed inside the magnetic field generator 14, the adjusting switch 31 is electrically connected with the electrode plate 15, the sputtering target main body 11 can be detected by a pressure sensor, a temperature sensor and a magnetic sensor outside the target detection plate 25, the detected data is sent to the cloud end through the wireless transmission module 30, the weight, the temperature and the magnetism of the sputtering target main body 11 are counted, the using condition of the sputtering target main body 11 can be known in time, the position and the angle of the sputtering target main body 11 can be adjusted according to big data, and the utilization efficiency of the sputtering target main body 11 is improved.

Further, install the pivot between activity guard plate 8 and the fixing base 7, and the internally mounted of fixing base 7 has driving motor, and driving motor passes through the shaft coupling transmission with the pivot and is connected, the lower extreme installation electric telescopic handle of lift guard plate 9, and electric telescopic handle and lift guard plate 9 fixed connection, and lift guard plate 9 extends to fixing base 7 inside and fixing base 7 sliding connection, through the position angle of the adjustable activity guard plate 8 of driving motor and electric telescopic handle and lift guard plate 9, in order to adapt to the sputtering target main part 11 of different shapes, according to the sputtering target main part 11 of different shapes and different angles, statistics coating efficiency, and the convenient adjustment of angular position of enlarging camera 33, in order to carry out the detection achievement of different positions, the detection range is wide, thereby can improve data statistics efficiency, improve the control effect.

Further, an overhaul cover plate 12 is installed at the upper end of the target base 10, the overhaul cover plate 12 is connected with the target base 10 in a sealing mode, the positioning plate 21 is fixedly connected with the overhaul cover plate 12, sliding grooves 23 are formed in the front end and the two sides of the outer portion of the positioning plate 21, and the moving block 22 and the threaded rod 24 are connected with the positioning plate 21 in a sliding mode through the sliding grooves 23.

Further, a pressure sensor, a temperature sensor and a magnetic sensor are mounted on the upper end face of the target detection plate 25, a spring is mounted between the target detection plate 25 and the positioning plate 21, the target detection plate 25 is movably connected with the target base 10, an electromagnetic shielding cover 26 is arranged below the sputtering target main body 11, a torque sensor 28 is mounted on the upper end of the speed reduction motor 27, the position and the angle of the sputtering target main body 11 are adjusted according to requirements, the power supply of the electric motor is turned on again to drive the threaded rod 24 to rotate, the position between the two groups of sputtering target main bodies 11 and the target base 10 is adjusted, the position of the sputtering target main body 11 corresponds to the position of the electrode plate 15, and therefore the utilization efficiency of the sputtering target main body 11 is controlled.

Further, interior sealed transparent plate 34 is all installed in the inside of activity guard plate 8 and lift guard plate 9, and interior test panel 32 and interior sealed transparent plate 34 fixed connection amplify camera 33 and be provided with a plurality of, and accessible activity guard plate 8 and the inside interior test panel 32 of lift guard plate 9 and the camera 33 of amplifying monitor sputtering target main part 11, the position angle of adjustable activity guard plate 8 and lift guard plate 9 to adapt to the sputtering target main part 11 of different shapes.

The control method of the control device for dynamically controlling the utilization rate of the sputtering target comprises the following steps:

the method comprises the following steps: remotely transmitting an operation command to the magnetic field generator 14 through the wireless transmission module 30, contracting the electric cylinder 3, and driving the sealing cover body 2 and the target sputtering workbench 1 to be sealed and fixed;

step two: turning on the adjusting switch 31, the magnetic field generator 14 starts the electrode plate 15 to apply an orthogonal magnetic field and an electric field between the cathode and the anode of the sputtering target material main body 11, inert gas is filled, the inert gas is accelerated to fly to the target surface under the action of Lorentz force and bombards the target surface at a high speed, atoms sputtered from the sputtering target material main body 11 fly to the substrate to deposit and form a film by separating materials with high kinetic energy according to the momentum conversion principle;

step three: turning on a power supply of the target detection plate 25, detecting the sputtering target main body 11 through a pressure sensor, a temperature sensor and a magnetic sensor outside the target detection plate 25, and sending detected data to a cloud end through the wireless transmission module 30;

step four: monitoring the sputtering target main body 11 according to the inner detection panel 32 and the amplifying camera 33 inside the movable protection plate 8 and the lifting protection plate 9, adjusting the position angles of the movable protection plate 8 and the lifting protection plate 9 to adapt to the sputtering target main bodies 11 with different shapes, counting the film coating efficiency according to the sputtering target main bodies 11 with different shapes and different angles, conveniently adjusting the angle position of the amplifying camera 33 to carry out detection work at different positions, and having wide detection range, thereby improving the data counting efficiency and improving the control effect;

step five: according to the monitoring information at the high in the clouds, remote adjustment gear motor 27, adjust the position and the angle of sputtering target main part 11 according to the demand, open the electric motor power again, drive threaded rod 24 and rotate, adjust the position between two sets of sputtering target main parts 11 and the target base 10, make the position of sputtering target main part 11 correspond the position of plate electrode 15, in order to control the utilization efficiency of sputtering target main part 11, the weight of sputtering target main part 11, temperature and magnetism have been counted out, can in time understand the in service behavior of sputtering target main part 11, can adjust the position and the angle of sputtering target main part 11 according to big data, improve the utilization efficiency of sputtering target main part 11.

The working principle is as follows: when the device is used, the magnetic field generator 14 remotely transmits an operation command through the wireless transmission module 30, the electric cylinder 3 is contracted to drive the sealing cover body 2 and the target sputtering workbench 1 to be sealed and fixed, the adjusting switch 31 is turned on, the magnetic field generator 14 starts the electrode plate 15 to apply an orthogonal magnetic field and an electric field between the cathode and the anode of the sputtering target main body 11, the vacuum pump 17 is turned on, air in the sealing cover body 2 is pumped out and filled with inert gas, the inert gas is accelerated to fly to the target surface under the action of Lorentz force and bombards the target surface at a high speed, atoms sputtered from the sputtering target main body 11 fly to a substrate to deposit a film by a high kinetic energy separating material according to a momentum conversion principle, the power supply of the target detection plate 25 is turned on, and the sputtering target main body 11 is detected through a pressure sensor, a temperature sensor and a magnetic sensor outside the target detection plate 25, the detected data is sent to the cloud end through the wireless transmission module 30, the sputtering target main body 11 is monitored according to the inner detection panel 32 and the amplifying camera 33 inside the movable protection plate 8 and the lifting protection plate 9, the position angles of the movable protection plate 8 and the lifting protection plate 9 can be adjusted to adapt to the sputtering target main bodies 11 with different shapes, the film coating efficiency is counted according to the sputtering target main bodies 11 with different shapes and different angles, the angle position of the amplifying camera 33 is convenient to adjust so as to carry out detection work with different positions, the detection range is wide, the data statistical efficiency can be improved, the control effect is improved, the speed reduction motor 27 is adjusted remotely according to the monitoring information of the cloud end, the position and the angle of the sputtering target main body 11 are adjusted according to requirements, then the power supply of the electric motor is turned on, the threaded rod 24 is driven to rotate, and the positions between the two groups of sputtering target main bodies 11 and the target base 10 are adjusted, the position of the sputtering target main body 11 corresponds to the position of the electrode plate 15, so that the utilization efficiency of the sputtering target main body 11 is controlled, the weight, the temperature and the magnetism of the sputtering target main body 11 are counted, the use condition of the sputtering target main body 11 can be known in time, the position and the angle of the sputtering target main body 11 can be adjusted according to big data, and the utilization efficiency of the sputtering target main body 11 is improved.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. Control device of dynamic control sputter target utilization ratio, including target sputter work platform (1), its characterized in that: a fixing seat (7) is installed on the upper end face of the target sputtering workbench (1), a lifting protection plate (9) is installed above the two ends of the fixing seat (7), a movable protection plate (8) is installed on the front end face and the rear end face of the fixing seat (7), a sealing cover body (2) is installed above the target sputtering workbench (1), an electric box (5) is installed above the sealing cover body (2), a magnetic field generator (14) is installed at the lower end of the electric box (5), electrode plates (15) are installed on the two sides of the magnetic field generator (14), an internal fixing box (20) is installed on the two sides above the target sputtering workbench (1), a speed reduction motor (27) is installed inside the internal fixing box (20), a target base (10) is installed above the internal fixing box (20), and a sputtering target main body (11) is installed on the two sides of the target base (10), a target detection plate (25) is arranged between the target base (10) and the sputtering target main bodies (11), one end of each of the two sputtering target main bodies (11) extends into the target base (10) and is connected with the target detection plate (25) in a sliding manner, a positioning plate (21) is arranged in the middle of the interior of the target base (10), a moving block (22) is arranged in the positioning plate (21), electric motors are arranged on two sides of the moving block (22), and one end of the electric motor is provided with a threaded rod (24), the threaded rod (24) passes through the positioning plate (21) and extends to the inside of the sputtering target main body (11) to be in threaded connection with the sputtering target main body (11), inner detection panels (32) are respectively arranged inside the lifting protection plate (9) and the movable protection plate (8), an amplifying camera (33) is arranged in the inner detection panel (32).

2. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: the device comprises a sealing cover body (2), connecting frames (4) are arranged on two sides of the sealing cover body (2), an electric cylinder (3) is arranged at the lower end of each connecting frame (4), the lower end of each electric cylinder (3) is fixedly connected with a target sputtering workbench (1), the upper end of each electric cylinder (3) is fixedly connected with the corresponding connecting frame (4), the lower end of the sealing cover body (2) is embedded into the upper end of the target sputtering workbench (1) and is hermetically connected with the target sputtering workbench (1), a protective cover (16) is arranged on the lower end face of a fixed seat (7), a vacuum pump (17) is arranged inside the protective cover (16), a connecting pipe (19) is arranged at the upper end of the vacuum pump (17), an atomic absorption plate (18) is arranged at the upper end of the connecting pipe (19), the atomic absorption plate (18) is hermetically connected with the upper end face of the fixed seat (7), and an air exhaust pipeline (13) is arranged at the lower end of the protective cover (16), the air extraction pipeline (13) is communicated with the atom absorption plate (18).

3. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: electric box (5) and the sealed cover body (2) fixed connection, just the surface mounting of electric box (5) has display screen (6), the internally mounted of electric box (5) has transformer (29) and wireless transmission module (30), transformer (29) and wireless transmission module (30) all with magnetic field generator (14) electric connection, the internally mounted of magnetic field generator (14) has regulating switch (31), regulating switch (31) and plate electrode (15) electric connection.

4. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: install the pivot between activity guard plate (8) and fixing base (7), just the internally mounted of fixing base (7) has driving motor, and driving motor passes through the shaft coupling transmission with the pivot and is connected, the lower extreme installation electric telescopic handle of lift guard plate (9), and electric telescopic handle and lift guard plate (9) fixed connection, just lift guard plate (9) extend to fixing base (7) inside and fixing base (7) sliding connection.

5. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: the fixture is characterized in that an overhauling cover plate (12) is installed at the upper end of the target base (10), the overhauling cover plate (12) is in sealing connection with the target base (10), the positioning plate (21) is fixedly connected with the overhauling cover plate (12), sliding grooves (23) are formed in the front end and the two sides of the outer portion of the positioning plate (21), and the moving block (22) and the threaded rod (24) are in sliding connection with the positioning plate (21) through the sliding grooves (23).

6. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: the sputtering target comprises a sputtering target main body (11), wherein a pressure sensor, a temperature sensor and a magnetic sensor are installed on the upper end face of the target detection plate (25), a spring is installed between the target detection plate (25) and a positioning plate (21), the target detection plate (25) is movably connected with a target base (10), an electromagnetic shielding cover (26) is arranged below the sputtering target main body (11), and a torque sensor (28) is installed at the upper end of a speed reducing motor (27).

7. The control device for dynamically controlling the utilization of a sputtering target according to claim 1, wherein: interior sealed transparent plate (34) are all installed to the inside of activity guard plate (8) and lift guard plate (9), interior test panel (32) and interior sealed transparent plate (34) fixed connection, it is provided with a plurality of to enlarge camera (33).

8. The control method of the control device for dynamically controlling the utilization rate of the sputtering target is realized based on the control device for dynamically controlling the utilization rate of the sputtering target in claims 1 to 7, and is characterized by comprising the following steps:

the method comprises the following steps: remotely transmitting an operation command to the magnetic field generator (14) through the wireless transmission module (30), contracting the electric cylinder (3), and driving the sealing cover body (2) and the target sputtering workbench (1) to be sealed and fixed;

step two: turning on an adjusting switch (31), starting an electrode plate (15) by a magnetic field generator (14) to add an orthogonal magnetic field and an electric field between a cathode and an anode of a sputtering target main body (11), filling inert gas, accelerating the inert gas to fly to a target surface under the action of Lorentz force, bombarding the target surface at a high speed, and separating the sputtered atoms of the sputtering target main body (11) from a material with high kinetic energy to fly to a substrate to deposit and form a film by following a momentum conversion principle;

step three: the power supply of the target detection plate (25) is turned on, the sputtering target main body (11) is detected through a pressure sensor, a temperature sensor and a magnetic sensor outside the target detection plate (25), and detected data are sent to the cloud end through a wireless transmission module (30);

step four: monitoring the sputtering target main body (11) according to an inner detection panel (32) and an amplification camera (33) inside the movable protection plate (8) and the lifting protection plate (9), adjusting the position angles of the movable protection plate (8) and the lifting protection plate (9) to adapt to the sputtering target main bodies (11) with different shapes, and counting the film coating efficiency according to the sputtering target main bodies (11) with different shapes and different angles;

step five: according to the monitoring information of high in the clouds, remote adjustment gear motor (27), according to the position and the angle of demand adjustment sputtering target main part (11), open the electric motor power again, drive threaded rod (24) and rotate, adjust the position between two sets of sputtering target main parts (11) and target base (10), make the position of sputtering target main part (11) correspond the position of plate electrode (15) to the utilization efficiency of control sputtering target main part (11).

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