CN113990795A - 一种能够对晶圆平放角度进行调整的夹紧装置 - Google Patents

一种能够对晶圆平放角度进行调整的夹紧装置 Download PDF

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CN113990795A
CN113990795A CN202111039441.9A CN202111039441A CN113990795A CN 113990795 A CN113990795 A CN 113990795A CN 202111039441 A CN202111039441 A CN 202111039441A CN 113990795 A CN113990795 A CN 113990795A
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wafer
adjusting
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钱诚
李刚
霍召军
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Jiangsu Asia Electronics Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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Abstract

本发明公开了一种能够对晶圆平放角度进行调整的夹紧装置,包括用于对圆晶进行冲洗的密封机构和用于驱动圆晶旋转的旋转机构以及用于固定圆晶的夹紧机构,所述密封机构内部设置有所述旋转机构,所述旋转机构上安装有所述夹紧机构,所述旋转机构和所述夹紧机构之间设置有调节机构。本发明利用密封机构、旋转机构、夹紧机构配合,使得圆晶能够独立进行清洗,避免交叉影响,且提高了圆晶的清洗效率,利用旋转机构对圆晶在不同的清洗阶段进行不同的姿态调整,从而提高清洗效率。

Description

一种能够对晶圆平放角度进行调整的夹紧装置
技术领域
本发明涉及晶圆清洗领域,特别是涉及一种能够对晶圆平放角度进行调整的夹紧装置。
背景技术
圆晶是指硅半导体集成电路制作所用的硅芯片,由于其形状为圆形,故称为圆晶。圆晶是生产集成电路所用的载体,一般意义晶圆多指单晶硅圆片。单晶硅圆片由普通硅砂拉制提炼,经过溶解、提纯、蒸馏一系列措施制成单晶硅棒,单晶硅棒经过抛光、切片之后,就成为了圆晶,而圆晶加工中,需要进行化学机械抛光,化学机械抛光是一种全局平整化的超精密表面加工工艺。由于化学机械抛光中大量使用的化学试剂和研磨剂会在抛光完成后在晶圆表面残留大量的研磨颗粒和研磨副产物等污染物,这些污染物会对后续工艺产生不良影响,并可能导致晶圆良率损失。由于晶圆表面的清洁度是影响半导体器件可靠性的重要因素之一,为了达到晶圆表面无污染物的目的,需要移除晶圆表面的污染物以避免制程前污染物重新残留于晶圆表面。因此,在晶圆制造过程中需要经过多次的表面清洗,以去除晶圆表面附着的金属离子、原子、有机物及微粒等污染物。
目前对于晶圆的清洗均是将晶圆平放在一个旋转盘上进行的,无法对晶圆的角度做一定的调整,当喷洗头的角度固定时,清洗液只能以固定的角度喷射到晶圆上,导致晶圆的清洗效果不能得到提高。
发明内容
本发明的目的就在于为了解决上述问题而提供一种能够对晶圆平放角度进行调整的夹紧装置。
本发明通过以下技术方案来实现上述目的:
一种能够对晶圆平放角度进行调整的夹紧装置,包括:
用于驱动晶圆旋转旋转机构,用于夹紧晶圆的夹紧组件和调整晶圆倾斜角度的调节机构;
所述旋转机构包括旋转电机、旋转盘、支撑盘、万向节,所述旋转电机安装在一底座下端面,所述旋转电机输出端连接有所述万向节,所述万向节上端连接有所述旋转盘,位于所述万向节外侧且所述旋转盘下端设置有所述支撑盘,所述支撑盘下端面连接有折叠胶筒,所述折叠胶筒下端连接有固定筒;
所述夹紧组件包括夹紧座、无杆气缸、供压管、供压电磁阀,四个所述夹紧座设置在所述旋转盘上端,所述夹紧座动力端连接有所述无杆气缸,所述无杆气缸功能端连接有集中筒,所述集中筒外侧连接有四个所述供压管,所述供压管外部连接有所述供压电磁阀;
所述调节机构包括伸缩气缸、活塞杆,所述支撑盘底部设置有若干所述伸缩气缸,所述伸缩气缸上设置有所述活塞杆,所述活塞杆连接所述支撑盘。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述伸缩气缸为成矩形设置的四个。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述调节机构包括伸缩电机、螺杆、螺纹筒,所述支撑盘固定于所述底部固定盘上,且所述支撑盘和底部固定盘之间设置有所述伸缩电机,所述伸缩电机下端连接底部固定盘,所述伸缩电机上设置有所述螺杆,所述螺杆上端连接所述螺纹筒,所述螺纹筒安装在所述支撑盘下端面。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述旋转盘表面具有硅胶层,所述旋转盘上位于夹紧座移动位置处为褶皱。
5.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,所述夹紧座滑动连接所述旋转盘,所述夹紧座内侧面为硅胶材质且内置有压力传感器。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述支撑盘顶部设置若干滚珠或者直线轴承。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述供压管通过螺纹连接所述供压电磁阀、所述集中筒。
优选地,本发明的能够对晶圆平放角度进行调整的夹紧装置,所述伸缩气缸通过螺栓连接所述底部固定盘,所述活塞杆通过螺栓连接所述支撑盘。
与现有技术相比,本发明的有益效果如下:
1、利用密封机构、旋转机构、夹紧机构配合,使得圆晶能够独立进行清洗,避免交叉影响,且提高了圆晶的清洗效率;
2、利用旋转机构对圆晶在不同的清洗阶段进行不同的姿态调整,从而提高清洗效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1是本发明所述一种晶圆清洗的姿态调整装置的结构示意图;
图2是本发明所述一种晶圆清洗的姿态调整装置的冲洗喷头结构示意图;
图3是本发明所述一种晶圆清洗的姿态调整装置的内部结构示意图;
图4是本发明所述一种晶圆清洗的姿态调整装置的旋转盘结构示意图;
图5是本发明所述一种晶圆清洗的姿态调整装置的夹紧机构结构示意图;
图6是本发明所述一种晶圆清洗的姿态调整装置的旋转机构结构示意图;
图7是本发明所述一种晶圆清洗的姿态调整装置的伸缩气缸结构示意图;
图8是本发明所述一种晶圆清洗的姿态调整装置的螺杆结构示意图。
附图标记说明如下:
1、密封机构;2、旋转机构;3、夹紧机构;4、调节机构;11、底座;12、密封筒;13、侧向进料管;14、密封盖;15、顶部进料管;16、冲洗喷头;17、底部固定盘;18、角度调节座;21、旋转电机;22、旋转盘;23、支撑盘;24、万向节;25、固定筒;26、折叠胶筒;31、夹紧座;32、无杆气缸;33、供压管;34、供压电磁阀;35、集中筒;41、伸缩气缸;42、活塞杆;411、伸缩电机;412、螺杆;413、螺纹筒。
具体实施方式
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以通过具体情况理解上述术语在本发明中的具体含义。
下面结合附图对本发明作进一步说明:
实施例1
如图1-图7所示,一种晶圆清洗的姿态调整装置,包括用于对圆晶进行冲洗的密封机构1和用于驱动圆晶旋转的旋转机构2以及用于固定圆晶的夹紧机构3,密封机构1内部设置有旋转机构2,旋转机构2上安装有夹紧机构3,旋转机构2和夹紧机构3之间设置有调节机构4;
密封机构1包括底座11、密封筒12、侧向进料管13、密封盖14,底座11上端安装有底部固定盘17,底部固定盘17上端连接有密封筒12,密封筒12上端面设置有密封盖14,密封盖14上设置有顶部进料管15,密封筒12侧面安装有侧向进料管13,侧向进料管13出水端和顶部进料管15出水端均安装有角度调节座18,角度调节座18上安装有冲洗喷头16;
旋转机构2包括旋转电机21、旋转盘22、支撑盘23、万向节24,旋转电机21安装在底座11下端面,旋转电机21输出端连接有万向节24,万向节24上端连接有旋转盘22,位于万向节24外侧且旋转盘22下端设置有支撑盘23,支撑盘23下端面连接有折叠胶筒26,折叠胶筒26下端连接有固定筒25;
夹紧机构3包括夹紧座31、无杆气缸32、供压管33、供压电磁阀34,四个夹紧座31设置在旋转盘22上端,夹紧座31动力端连接有无杆气缸32,无杆气缸32功能端连接有集中筒35,集中筒35外侧连接有四个供压管33,供压管33外部连接有供压电磁阀34。
优选的:调节机构4包括伸缩气缸41、活塞杆42,支撑盘23和底部固定盘17之间设置有四个伸缩气缸41,伸缩气缸41下端连接底部固定盘17,伸缩气缸41上设置有活塞杆42,活塞杆42连接支撑盘23,当需要调节旋转盘22和圆晶的角度时,控制四个伸缩气缸41进行伸缩调节,从而对支撑盘23和旋转盘22的状态进行调节;密封筒12通过螺栓连接底座11,密封盖14通过合页连接密封筒12,密封筒12用于密封,底座11用于支撑;侧向进料管13通过密封胶连接密封筒12,顶部进料管15通过密封胶连接密封盖14,角度调节座18通过螺栓连接侧向进料管13、顶部进料管15,利用密封胶保证密封性,角度调节座18用于调节清洁液喷射的角度;底部固定盘17通过螺栓连接底座11,旋转电机21通过螺栓连接底部固定盘17,万向节24通过螺栓连接支撑盘23、旋转电机21,万向节24用于动能传输;固定筒25通过法兰连接底部固定盘17,折叠胶筒26通过胶水连接固定筒25、支撑盘23,固定筒25和折叠胶筒26用于密封万向节24,避免旋转电机21进水;夹紧座31滑动连接旋转盘22,夹紧座31内侧面为硅胶材质且内置有压力传感器,夹紧座31用于固定圆晶,配合压力传感器保证圆晶的安全性;供压管33通过螺纹连接供压电磁阀34、集中筒35,通过螺纹连接保证密封性;伸缩气缸41通过螺栓连接底部固定盘17,活塞杆42通过螺栓连接支撑盘23,利用四个伸缩气缸41更精确控制旋转盘22和圆晶的角度。
所述旋转盘22表面具有硅胶层,如图4所示,所述旋转盘22上位于夹紧座31移动位置处为褶皱,以实现夹紧座31能够移动,同时保持密封效果。
需要指出的是,支撑盘23不转动、旋转盘22转动,支撑盘23的顶面与旋转盘22的底面滑动接触,当伸缩气缸41调节支撑盘23角度时,能够使旋转盘22一起调整,为了降低运动摩擦力,可以将支撑盘23顶部设置若干滚珠或者直线轴承。
实施例2
如图8,本实施例与实施例1的区别在于:
调节机构4包括伸缩电机411、螺杆412、螺纹筒413,支撑盘23和底部固定盘17之间设置有四个伸缩电机411,伸缩电机411下端连接底部固定盘17,伸缩电机411上设置有螺杆412,螺杆412上端连接螺纹筒413,螺纹筒413安装在支撑盘23下端面,当需要调节旋转盘22和圆晶的角度时,控制四个伸缩电机411启动,使得螺杆412配合螺纹筒413,从而对支撑盘23和旋转盘22的状态进行调节。
工作原理:将密封盖14打开,将圆晶通过吸盘放置在夹紧座31之间,利用真空泵接通任意一个供压电磁阀34,对供压管33内部进行抽气,从而使得夹紧座31向内移动夹紧圆晶,同时配合压力传感器避免夹得过紧,关闭密封盖14,利用两个冲洗喷头16进行冲洗,对侧向进料管13按顺序接入清洗液和惰性气体,按顺序进行冲洗和烘干,在冲洗时,旋转电机21通过固定筒25带动旋转盘22旋转,从而保证圆晶的清洗效果,且在不同阶段时,控制伸缩气缸41或伸缩电机411,使得支撑盘23发生角度偏差,圆晶的冲洗角度和姿态发生变化,提高清洗液的冲击范围和力度,从而提高清洗效果。
以上显示和描述了本发明的基本原理、主要特征和优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。

Claims (8)

1.一种能够对晶圆平放角度进行调整的夹紧装置,其特征在于,包括:
用于驱动晶圆旋转旋转机构(2),用于夹紧晶圆的夹紧组件(3)和调整晶圆倾斜角度的调节机构(4);
所述旋转机构(2)包括旋转电机(21)、旋转盘(22)、支撑盘(23)、万向节(24),所述旋转电机(21)安装在一底座(11)下端面,所述旋转电机(21)输出端连接有所述万向节(24),所述万向节(24)上端连接有所述旋转盘(22),位于所述万向节(24)外侧且所述旋转盘(22)下端设置有所述支撑盘(23),所述支撑盘(23)下端面连接有折叠胶筒(26),所述折叠胶筒(26)下端连接有固定筒(25);
所述夹紧组件(3)包括夹紧座(31)、无杆气缸(32)、供压管(33)、供压电磁阀(34),四个所述夹紧座(31)设置在所述旋转盘(22)上端,所述夹紧座(31)动力端连接有所述无杆气缸(32),所述无杆气缸(32)功能端连接有集中筒(35),所述集中筒(35)外侧连接有四个所述供压管(33),所述供压管(33)外部连接有所述供压电磁阀(34);
所述调节机构(4)包括伸缩气缸(41)、活塞杆(42),所述支撑盘(23)底部设置有若干所述伸缩气缸(41),所述伸缩气缸(41)上设置有所述活塞杆(42),所述活塞杆(42)连接所述支撑盘(23)。
2.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述伸缩气缸(41)为成矩形设置的四个。
3.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述调节机构(4)包括伸缩电机(411)、螺杆(412)、螺纹筒(413),所述支撑盘(23)固定于所述底部固定盘(17)上,且所述支撑盘(23)和底部固定盘(17)之间设置有所述伸缩电机(411),所述伸缩电机(411)下端连接底部固定盘(17),所述伸缩电机(411)上设置有所述螺杆(412),所述螺杆(412)上端连接所述螺纹筒(413),所述螺纹筒(413)安装在所述支撑盘(23)下端面。
4.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述旋转盘(22)表面具有硅胶层,所述旋转盘(22)上位于夹紧座(31)移动位置处为褶皱。
5.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述夹紧座(31)滑动连接所述旋转盘(22),所述夹紧座(31)内侧面为硅胶材质且内置有压力传感器。
6.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述支撑盘(23)顶部设置若干滚珠或者直线轴承。
7.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述供压管(33)通过螺纹连接所述供压电磁阀(34)、所述集中筒(35)。
8.根据权利要求1所述的能够对晶圆平放角度进行调整的夹紧装置,其特征在于,所述伸缩气缸(41)通过螺栓连接所述底部固定盘(17),所述活塞杆(42)通过螺栓连接所述支撑盘(23)。
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* Cited by examiner, † Cited by third party
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CN115410983A (zh) * 2022-11-02 2022-11-29 泓浒(苏州)半导体科技有限公司 一种半导体晶圆转运装置
CN115582333A (zh) * 2022-10-24 2023-01-10 智程半导体设备科技(昆山)有限公司 半导体晶圆翻转式清洗装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115582333A (zh) * 2022-10-24 2023-01-10 智程半导体设备科技(昆山)有限公司 半导体晶圆翻转式清洗装置
CN115582333B (zh) * 2022-10-24 2023-09-01 苏州智程半导体科技股份有限公司 半导体晶圆翻转式清洗装置
CN115410983A (zh) * 2022-11-02 2022-11-29 泓浒(苏州)半导体科技有限公司 一种半导体晶圆转运装置

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