CN1139677C - Apparatus and method for strip solder plating - Google Patents
Apparatus and method for strip solder plating Download PDFInfo
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- CN1139677C CN1139677C CNB998165999A CN99816599A CN1139677C CN 1139677 C CN1139677 C CN 1139677C CN B998165999 A CNB998165999 A CN B998165999A CN 99816599 A CN99816599 A CN 99816599A CN 1139677 C CN1139677 C CN 1139677C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
- B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
- B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
- B65G49/0436—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath
- B65G49/044—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath along a continuous circuit
- B65G49/0445—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length arrangements for conveyance from bath to bath along a continuous circuit the circuit being movable vertically as a whole
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to an apparatus for solder plating. At least one work piece comprises a frame, a carrier (10) mounted on the frame for rotation about a vertical axis (14) and having a plurality of work piece holders (20), and a plurality of process stations (11) arranged in a circular array, at least some of said process stations including electrolytic solutions. The work piece holders have top and bottom fingers for holding respective work pieces (6), indexing means for moving the carrier, a plurality of first contacts and a plurality of second contacts wherein the indexing means is operable to cause selected first and second contacts to engage one another when the carrier is in said lowered position to thereby enable electrical connections to be established with the process stations which include said electrolytic solutions. The present invention further relates to a method for strip solder plating.
Description
Technical field
The present invention relates to a kind of band be carried out the method and apparatus of solder plating, particularly a kind ofly utilize a carrier band device that can annular rotates molded strip to be carried out the method and apparatus of solder plating.
Background technology
Solder plating equipment is known in semi-conductor industry, and it is as a part of production line, and its length usually can be above 20 meters.This is because this system uses is that a kind of e Foerderanlage delivers molded strip in a linear production line, makes it become very heavy thereby consumed a large amount of floor spaces and added existing communication front-end equipment.
Summary of the invention
Therefore, people wish to reduce the size of solder plating equipment so that it takies less area, compact construction and is easy to installs.These advantages can reach by being provided with in the annular mode among each each embodiment that handles station in the present invention.
The invention provides a kind of equipment that is used at least one workpiece plated solder, this equipment comprises:
A frame;
A carrier that is installed on the described frame, described carrier can and have a plurality of workholders around a vertical axis rotation;
A plurality of processing stations that are provided with in a kind of mode of annular array, at least some in described a plurality of processing stations comprise electrolytic solution;
Each described workholder all has upper clip and the lower clip that is used for each workpiece of clamping;
Dividing apparatus, described dividing apparatus is used for moving described carrier so that the workpiece that is clamped on the described carrier is moved to tactic processing station, and described dividing apparatus can make described carrier move between hoisting position and lowering position when described carrier moves to workpiece tactic processing station;
A plurality of with respect to localized first contact of described processing station; And
A plurality of with respect to localized second contact of described carrier; And
It is characterized in that when described carrier was in described lowering position, described dividing apparatus can make selected first contact and second contact be bonded with each other, thereby be electrically connected with the processing station foundation that comprises described electrolytic solution.
The present invention also provides a kind of method that is used at least one workpiece plated solder, and described method comprises the following steps:
Described at least one workpiece is loaded on the corresponding workholder in a plurality of workholders, described a plurality of workholder is positioned on the carrier and has a plurality of corresponding upper clip and lower clips that are used for described at least one workpiece of clamping, and described carrier has hoisting position and lowering position and can rotate around a vertical axis;
Described carrier is rotated so that each workholder is suspended on the described carrier and make described each workholder through being arranged on a plurality of processing stations that are positioned in the described endless path below the described workholder in a circular path, at least some described processing stations comprise a plurality of electrolytic solutions;
Make described carrier move to described lowering position so that with respect to localized first contact of described processing station with selected second engage contacts that moves with described carrier, be electrically connected thereby set up with the processing station that comprises described electrolytic solution.
Description of drawings
Each embodiment of the present invention has been shown in the accompanying drawing and has been used to illustrate the principle of the invention.But, it should be understood that these accompanying drawings only are used to illustrate, be not limitation of the invention.
Fig. 1 is an orthographic plan of the related a kind of solder plating equipment of one embodiment of the invention.
Fig. 2 is a front view of equipment shown in Fig. 1.
Fig. 3 A is a fragmentary, perspective view of described equipment, wherein shows molded strip anchor clamps that link to each other with carrier.
Fig. 3 B is a fragmentary, perspective view of described equipment, and molded strip anchor clamps shown in it are in one and are reduced to a position of handling in the station.
Fig. 4 is a skeleton view, wherein shows one by the molded strip of carrying jig clamping.
Fig. 5 A is a side-view of loading arm and carrying jig.
Fig. 5 B, Fig. 5 C, Fig. 5 D, Fig. 5 E, Fig. 5 F and Fig. 5 G show loading arm each working order when being loaded into a molded strip in the carrying jig.
Fig. 6 A is a side-view of unload arm and carrying jig.
Fig. 6 B, Fig. 6 C, Fig. 6 D, Fig. 6 E, Fig. 6 F and Fig. 6 G show unload arm each working order when a molded strip is taken off from carrying jig.
Fig. 7 is an end view of a scale removal container used in an embodiment of equipment shown in Fig. 1.
Fig. 8 A is an orthographic plan of scale removal station.
Fig. 8 B is a side-view of scale removal station.
Fig. 9 is an end view of a wash station used in an embodiment of equipment shown in Fig. 1.
Figure 10 A is an orthographic plan of wash station.
Figure 10 B is a side-view of wash station.
Figure 11 is used in an embodiment of equipment shown in a Fig. 1 end view that activates station.
Figure 12 A is an orthographic plan of activation station.
Figure 12 B is a side-view of activation station.
Figure 13 be suitable for used in an embodiment of equipment shown in a Fig. 1 preimpregnation station, in and station and peel off an end view of station.
Figure 14 A is an orthographic plan of preimpregnation station.
Figure 14 B is a side-view of preimpregnation station.
Figure 15 A be in and an orthographic plan of station.
Figure 15 B be in and a side-view of station.
Figure 16 A is an orthographic plan peeling off station.
Figure 16 B is a side-view peeling off station.
Figure 17 A is an end view of four plating stations being used in combination in an embodiment of equipment shown in Fig. 1.
Figure 17 B is an end view of a plating station used in an embodiment of equipment shown in Fig. 1.
Figure 18 A is an orthographic plan of four plating stations.
Figure 18 B is the resulting sectional view of X-X line in Figure 18 A.
Figure 19 A is an end view of used in an embodiment of equipment shown in a Fig. 1 blowing station.
Figure 19 B is an orthographic plan of blowing station.
Figure 20 A is an end view of a Drying station used in an embodiment of equipment shown in Fig. 1.
Figure 20 B is an orthographic plan of Drying station.
Figure 21 is a synoptic diagram of a formed circuit when the related carrier of one embodiment of the present of invention is in a lowering position and a carrying jig and is immersed in a kind of electrolytic solution.
Embodiment
Now in conjunction with example embodiments of the invention are described in detail with reference to the accompanying drawings, identical in the accompanying drawings parts are represented with identical Reference numeral.
Fig. 1 shows a kind of solder plating equipment 1 involved in the present invention, and this solder plating equipment 1 comprises that is handled a station 11, and these are handled station and are arranged in the circular path.Solder plating equipment 1 comprises a carrier 10, and carrier 10 delivery molded strips 6 (such as a kind of electron device and allied equipment of encapsulation) also make it to handle station by each.These are handled station and comprise a load station 101, then are respectively chemical treatment station, Drying station and unloading station, and these handle station round the spacing setting of circular path to equate, end at wash station 120 at last.Described chemical treatment station comprises scale removal station 102 and 103, wash station 104,106,112,114,115 and 120, activation station 105, preimpregnation station 107, plating station 108 to 111, in and station 113 and peel off station 119.Described equipment also comprises blowing station 116, Drying station 117 and unloading station 118.
In the arrangement form shown in Fig. 2, carrier 10 is installed on the coupling shaft 14, and coupling shaft 14 is driven by a rotation protractor 15.Utilize cylinder 13 to make carrier 10 rise and descend.As shown in Figure 2, be in a hoisting position during in the drawings upper right side of carrier 10, be in a lowering position during in the drawings upper left side of carrier 10.In each step in treating processes, rotation protractor 15 rotates around an axis 30 with a fixed amount.Among the described here embodiment, rotation protractor 15 turns over 18 degree in each step.Cylinder 13 is used to make carrier 10 to rise and descend, and therefore can make 20 risings of molded strip anchor clamps and the decline that links to each other with carrier 10 and can make the molded strip 6 by anchor clamps 20 clampings sequentially enter into chemical treatment station and dry air station and leave the chemical treatment station and the dry air station.
Described solder plating equipment 1 has a frame 3, and frame 3 has top 2 and bottom 4.Bottom 4 holds under meter 16 that cylinder 13, rotation protractor 15, one be used for measuring the discharge that supplies to wash station, one and is used for making chemical substance round-robin pump 12, waste-disposal container and a plurality of valve 17 that is used to be adjusted in the current of this solder plating equipment 1.In this solder plating equipment 1, be provided with seven chemical substance pumps altogether.Top 2 holds carrier 10 and chemical treatment station and dry air station and provides takes off passage with 6 with being encased in 20 neutralizations of molded strip anchor clamps with 6 from molded strip anchor clamps 20.The top 2 of solder plating equipment 1 can be partially transparent observe treating processes to help an operator, also complete closed to keep clean and the environment of safety.
As shown in Fig. 3 A, Fig. 3 B and Fig. 4, carrier 10 has a plurality of carrying jigs 20, utilizes an arm 24 that these carrying jigs 20 are connected on the carrier 10.A contact bar 23 links to each other with arm 24, and described contact bar 23 is electrically connected with finger springs contact, top 32, but utilize an insulation strip 33 make a stainless steel stent 34 and contact bar 23 at least in part with arm 24 electrical isolations.Each molded strip anchor clamps 20 clamping molded strip 6 so that the longer size of molded strip 6 be level and are radial arrays with respect to axis 30, its thinnest size is an arranged vertical.Each carrying jig 20 comprises the upper clip 28 that can contact with the upper limb of molded strip 6, and the lower clip 27 of each anchor clamps 20 can be at the lower edge contact and the clamping molded strip 6 of molded strip 6.Utilize spring contact 32 that upper clip 28 and lower clip 27 are elastically biased toward each other, thereby can clamp molded strip 6 securely.In order to carry out electrolysis cleaning and plating (back will be described) to molded strip, molded strip 6 electrically contacts with upper clip 28, and can electrically contact with lower clip 27.Preferably having 20 molded strip anchor clamps 20 and link to each other with annular carrier 10, is spaced apart from each other with the angle of one 18 degree between each molded strip anchor clamps 20 and the adjacent molded strip anchor clamps 20.Each at least one molded strip 6 of molded strip anchor clamps 20 clampings is so that can the clamping a plurality of experience electrolysis cleanings of described carrier 10, electroplate and the molded strip 6 of different steps such as other treatment step.Each molded strip anchor clamps 20 is preferably made by stainless steel, so that it can resist the erosion of used chemical substance in chemical treatment and electrochemical treatment process.Described molded strip 6 can be that a kind of printed circuit board (PCB) or other are suitable for standing the workpiece or the thin framework of soldering.
In the preferred embodiment, carrying jig 20 can guarantee that molded strip 6 can not come off in welding process.Compare with the only edge place clamping on top molded strip known in the prior art, on top edge and lower edge clamp molded strip 6 can provide a kind of assurance to clamp the method for molded strip 6 more firmly.
Fig. 5 A to Fig. 5 G and Fig. 6 A to Fig. 6 G show and are loaded on the carrying jig 20 molded strip 6 and the working process of taking off molded strip 6 from carrying jig 20.Utilize a loader mechanism 49 to carry out above-mentioned loading, as shown in Fig. 5 A to 5G, described loader mechanism 49 comprises that is loaded 50 and stowage unit pick-up arms 52 of fork.At first, the spring contact 32 that lifting gear 40 that is used to promote upper clip is in a lowering position and molded strip anchor clamps 20 is in a relaxed state, and the work of described lifting gear 40 is controlled by a cylinder.In next procedure, as shown in Fig. 5 C, lifting gear 40 promotes upper clip 28 and extrusion spring contact 32, can make molded strip 6 be inserted into enough spaces between upper clip 28 and the lower clip 27 thereby provide, and stowage unit pick-up arm 52 extend so that molded strip 6 can be loaded in the slit that loads fork 50.In the 3rd step, stowage unit is around an axis rotation and be with molded strip 6 to shift to molded strip anchor clamps 20 together.In next procedure, as shown in Fig. 5 D, load fork 50 molded strip is held in place suitable position between upper clip 28 and the lower clip 27.In next procedure, as shown in Fig. 5 E, when loading fork 50 retractions (utilizing the retraction of stowage unit pick-up arm 52), lifting gear 40 returns lowering position and upper clip 28 is freely dropped on the upper limb of molded strip 6, thereby molded strip is clamped between upper clip 28 and the lower clip 27.If solder plating equipment 1 is as an independent means, molded strip 6 can be loaded from a buffer pocket (not shown) so, if perhaps solder plating equipment 1 is used in the automatic on-line system, molded strip 6 can be loaded from an e Foerderanlage so.Unloading mechanism shown in Fig. 6 A to Fig. 6 G and unloading step and stowage unit and stowage are similar, and difference is, unloading step be with loading process in opposite in sequence.Carrier 10 carries out loading and unloading when being in lowering position.
Fig. 7 shows the scale removal station 102 of handling station group 11.The scale removal station is used for removing organic compound (such as fingerprint and air pollutant) from molded strip 6.Handle station group 11 and comprise second a scale removal station 103 identical with scale removal station 102.Each scale removal station is divided into an inner room 26 and a mistress 25.As shown in Fig. 8 A, a kind of detergent solution (such as basic solution) by suction line 77 and vent line 76 according to 26 direction circulates from mistress 25 to inner room.After loading molded strip 6, carrier 10 moves up and turns over 18 degree along clockwise direction, and molded strip 6 is immersed in the first scale removal station 102.When carrier 10 was in lowering position, contact bar 23 contacted with contact bush 22, and will offer molded strip 6 from the electric current from a rectifier 98 (as shown in Figure 21) by contact bush 22, contact bar 23, spring contact 32 and upper clip 28.Detergent solution and a negative plate 75 by station 1 02 make circuit complete, and described negative plate 75 is electrically connected with rectifier 98.Like this, electrolytic action can be removed organic compound from molded strip 6.When carrier 10 was in lowering position, carrying jig 20 partly was immersed in the detergent solution in the described inner room 26 and clamping is immersed in molded strip 6 in the detergent solution fully.The solution that is used for scale removal station 102 and 103 can be known any conductive soln of removing organic compound that is applicable to.A level sensor 74 is used to protect chemical substance pump 12 and well heater 73.If liquid level of solution is low excessively, this phenomenon will be sensed and utilize a programmable logic controller (not shown) automatically to disconnect chemical substance pump and well heater by level sensor 74.An Abgasabsaugung pipe 80 is set taking away, so that handle or reclaim by the flue gas that chemical solution was produced.After molded strip 6 stands to handle fully in detergent solution, carrier 10 will move up and molded strip 6 will be removed the scale removal station.When carrier moves up, start one and have the air knife 70 that is positioned at the arm on carrying jig 20 both sides so that residual solution is blown down from molded strip 6.This helps to remain on the solution amount in this station and can prevent that next station from being polluted by unwanted chemical substance.Then, carrier 10 turn over 18 the degree reach the second scale removal station 103 so that molded strip is further processed.Use two scale removal stations can guarantee to remove effectively organic compound.
The structure and the station 102 of station 103 to 115 are similar, therefore in these figure, utilize identical Reference numeral to represent identical or corresponding parts.
Fig. 9, Figure 10 A and Figure 10 B show wash station 104, wash station 106,112,114,115 and 120 is same or similar.The effect of wash station is before molded strip being carried out chemical treatment and plating and afterwards molded strip 6 is cleaned.Wash station 104 also comprises an inner room 26 and a mistress 25.Supply water from the bottom of inner room 26, these water overflow in water shoot 82 of mistress's 25 neutralizations, flow to a waste disposal container (not shown) at last.The reason that supplies water from the bottom is, can clean and wash away residuals effectively to water water flows to the process of water shoot 82 from inner room 26.When carrier 10 is in lowering position, carrying jig 20 partly be immersed in the water in the described inner room 26 and preferably clamping be immersed in molded strip 6 in the water fully.When molded strip 6 in water through after the sufficient rinsing, carrier 10 will move up and molded strip 6 will be removed from wash station.Each wash station all comprises an air knife 70 and when carrier moves up, starts air knife 70 so that residual water is blown down from molded strip 6 and carrying jig 20.This helps to prevent that the unnecessary water that the chemical substance in next station is left on molded strip 6, upper clip 27 and the lower clip 28 from diluting.
After removing organic compound, utilize a kind of activated solution to remove oxide compound from the metallic surface.Figure 11, Figure 12 A and Figure 12 B at length show activation station 105.This station also comprises an inner room 26 and a mistress 25.As shown in Figure 12 A, utilize a pump 12 activated solution to be pumped into inner room 26 from mistress 25 by suction line 77 and vent line 76.Excessive solution is got back to mistress 25 from inner room 26 overflows.When carrier 10 was in lowering position, contact bar 23 contacted with contact bush 22, and will offer molded strip 6 from the electric current from a rectifier 98 (as shown in Figure 21) by contact bush 22, contact bar 23, spring contact 32 and upper clip 28.85 constitute a complete circuit from electrolytic solution to the platinum titanium anode plate, and described platinum titanium anode plate 85 is electrically connected with rectifier.Like this, electrolytic action can be removed oxide compound from molded strip 6.When carrier 10 is in lowering position, carrying jig 20 partly be immersed in the activated solution in the described inner room 26 and preferably clamping be immersed in molded strip 6 in the activated solution fully.The solution that is used for activating station 105 can be known any solution of removing oxide compound (such as the oxide compound of iron/nickel/copper) that is applicable to.A level sensor 74 is used to protect chemical substance pump 12.If liquid level of solution is low excessively, this phenomenon will be sensed and utilize a programmable logic controller (not shown) automatically to disconnect the chemical substance pump by level sensor 74.An Abgasabsaugung pipe 80 is set taking away by the flue gas that chemical solution was produced.After molded strip 6 stands to handle fully in activated solution, carrier 10 will move up and molded strip 6 will be removed the activation station.When carrier moves up, start one and be positioned at air knife 70 on carrying jig 20 both sides so that residual solution is blown down from molded strip 6, upper clip 27 and lower clip 28 as previously described.This helps to remain on the solution amount in this station and can prevent that next station from being polluted by unwanted chemical substance.
Figure 13, Figure 14 A and Figure 14 B show preimpregnation station 107.The effect of preimpregnation station 107 is before molded strip is carried out solder plating molded strip 6 to be carried out " adjusting ".Preferably a kind of with used in the coating solution identical diluted acid of type of solutions employed in this station.This station also comprises an inner room 26 and a mistress 25.As shown in Figure 14 A, utilize a pump 12 activated solution to be pumped into inner room 26 from mistress 25 by suction line 77 and vent line 76.Excessive solution is got back to mistress 25 from inner room 26 overflows.When carrier 10 is in lowering position, carrying jig 20 partly be immersed in the detergent solution in the described inner room 26 and preferably clamping be immersed in molded strip 6 in the detergent solution fully.A level sensor 74 is used to protect chemical substance pump 12.If liquid level of solution is low excessively, this phenomenon will be sensed and utilize a programmable logic controller (not shown) automatically to disconnect the chemical substance pump by level sensor 74.An Abgasabsaugung pipe 80 is set taking away by the flue gas that preimpregnation solution is produced.After molded strip 6 stands to handle fully in preimpregnation solution, carrier 10 will move up and molded strip 6 will be removed the preimpregnation station.When carrier moves up, start air knife 70 so that residual solution is blown down from molded strip 6 and carrying jig 20.
Electroplate station 108 to 111 back be in and station 113 and peel off station 119, their design form and preimpregnation station are similar and respectively as shown in Figure 15 A and Figure 15 B and Figure 16 A and Figure 16 B.But according to required function, solutions employed is different in these stations.For example, can use a kind of basic solution.In and station 113 is used for and the acidity of used acid in the plating station.Peeling off station 119 is positioned at the terminal location of whole operation and can enters loading at carrying jig 20 and before the stage upper clip 27 that is plated on carrying jig 20 or the scolder on the lower clip 28 are peeled off.In and the effect of station 113 be in and the acidity of used acid in the plating station.
Scolder is deposited on the lead-in wire of molded strip in electroplating process, preferably a kind of tin/lead alloy of described scolder.Figure 17 A, 17B, 18A and 18B show and electroplate station 108 to 111.Use four plating stations altogether, this is to be longer than the used time in other step of plating process because molded strip 6 is carried out effectively the plating required time.Each is electroplated station and all has the shared mistress 25 of 26, four stations of an inner room.As shown in Figure 17 A, utilize a pump 12 activated solution to be pumped into inner room 26 from mistress 25 by suction line 77 and vent line 76.Excessive solution is got back to mistress 25 from inner room 26 overflows.When carrier 10 was in lowering position, contact bar 23 contacted with contact bush 22, and will offer molded strip 6 from the electric current from a rectifier 98 (as shown in Figure 21) by contact bush 22, contact bar 23, spring contact 32 and upper clip 28.From electroplating solution to scolder anode strap 85 or the anode basket 88 that has a solder ball constitute a complete circuit, described scolder anode strap 85 or the anode basket 88 that has a solder ball are electrically connected with rectifier.Like this, scolder is plated on the molded strip 6.A level sensor 74 is used to protect chemical substance pump 12.If liquid level of solution is low excessively, this phenomenon will be sensed and utilize a programmable logic controller (not shown) automatically to disconnect the chemical substance pump by level sensor 74.An Abgasabsaugung pipe 80 is set taking away by electroplating the flue gas that station was produced.When carrier 10 moves up, start one and be positioned at the air knife 70 at last plating station 111 places, otherwise these residual solution will be brought to each station so that residual solution is blown down from molded strip 6 and carrying jig 20.
Through after the last plating station 111, carrier 10 moves to wash station 112 with molded strip 6, behind the wash station 112 and then be described in and station 113.As shown in Figure 19 A and Figure 19 B, behind other two wash stations 114 and 115 of process, 116 places utilize 70 pairs of molded strips of an air knife 6 to carry out dry air at the blowing station.This is used to remove the unnecessary water that is present on molded strip 6 and the carrying jig 20.Air knife 70 at blowing station 116 places preferably can move up and down in the both sides of molded strip 6 and molded strip anchor clamps 20 after described carrier 10 is in the lowering position place.Utilize moving up and down of a cylinder control air knife.
As shown in Figure 20 A and 20B, next treatment step is a dry air station 117.When carrier 10 was in the lowering position place, moisture eliminator 95 warm air of self-heating air feeder 94 in the future supplied on the molded strip 6.Dry air station 117 preferably includes that a temperature sensor that adopts thermocouple type, one be used to produce the hot air gun of heat and be used to produce can be through the blowing device of the air of hot air gun.Then, take off molded strip 6 at unloading station 118 places.
Preferably operate described solder plating equipment 1 by series of processing steps.In normal operation and when carrier 10 is in the lowering position place, can observe, each station of handling in the station 102 to 117 all is to be used for a molded strip 6 is handled, load fork 50 molded strip 6 is encased in the molded strip anchor clamps 20, unloading fork 60 takes off a molded strip 6 from carrying jig 20.During this period of time, not by the molded strip 6 of carrying jig 20 clampings, these stations are used for carrying jig 20 is cleaned in handling station 119 and 120.When carrier 10 after the lowering position place stops one section preset time, drive carrier 10 so that it arrives hoisting position, then rotate so that each carrying jig 20 is positioned at next station top with a fixed amount.Then, drive carrier 10, thereby finished go forward one by one the cycle (the increment cycle) of a carrier so that it arrives lowering position once more.For at least one molded strip 6, repeat each step each in its process processing station 101 to 118, these are handled stations and comprise the loading and unloading station.Under works better, each station of handling in the station 102 to 117 in each cycle is used for a molded strip 6 is handled, and at least one molded strip 6 will be loaded onto in the carrying jig 20 at station 101 places, and another will be removed at station 118 places.This will in the cycle of going forward one by one of each carrier, form one treated and by the molded strip 6 of plated solder.
Foregoing moves in a clockwise direction based on carrier 10, counterclockwise or in conjunction with both direction to move equally also in protection scope of the present invention.Therefore, those of ordinary skills obviously can carry out various modifications and variations to the present invention on the basis that does not break away from protection domain of the present invention.
Claims (33)
1. equipment that is used at least one workpiece plated solder, this equipment comprises:
A frame;
A carrier that is installed on the described frame, described carrier can and have a plurality of workholders around a hard straight axis rotation;
A plurality of processing stations that are provided with in a kind of mode of annular array, at least some in set a plurality of processing stations comprise electrolytic solution;
Each described workholder all has upper clip and the lower clip that is used for each workpiece of clamping;
Dividing apparatus, described dividing apparatus is used for moving described carrier so that the workpiece that is clamped on the described carrier is moved to tactic processing station, and described dividing apparatus can make described carrier move between hoisting position and lowering position when described carrier moves to workpiece tactic processing station;
A plurality of with respect to localized first contact of described processing station; And
A plurality of with respect to localized second contact of described carrier; And
It is characterized in that, when described carrier is in described lowering position, described dividing apparatus can make selected first contact and second contact be bonded with each other, thus by described first contact and second contact at described workpiece be included in to set up between the electrolytic solution in the described processing station and be electrically connected.
2. an equipment as claimed in claim 1 is characterized in that, described upper clip electrically contacts for described workpiece provides.
3. an equipment as claimed in claim 2 is characterized in that, described lower clip also electrically contacts for described workpiece provides.
4. an equipment as claimed in claim 1 is characterized in that, each set workholder is arranged to around one of them described workpiece of described vertical axis clamping diametrically.
5. equipment as claimed in claim 1, it is characterized in that, when described carrier is in described lowering position place and selected described first contact and second contact and is bonded with each other, described at least one workpiece at least fully is immersed in wherein a kind of described electrolytic solution, thereby has constituted a complete circuit.
6. an equipment as claimed in claim 5 is characterized in that, utilizing a power supply is described circuit supply.
7. an equipment as claimed in claim 6 is characterized in that, each described processing station of a kind of electrolytic solution that comprises also comprises at least one male or female.
8. equipment as claimed in claim 7, it is characterized in that, in described circuit, between described first contact of described power supply and one of them, be electrically connected, between described one of them first contact and described at least one workpiece, be electrically connected, between described at least one male or female and described workpiece, be electrically connected, between described at least one male or female and described power supply, be electrically connected by described electrolytic solution.
9. an equipment as claimed in claim 1 is characterized in that, one of them described processing station is a wash station.
10. one kind as claim 1 or 9 described equipment, it is characterized in that, one of them described processing station has one and is used for air knife that excess liquid is removed from described at least one workpiece.
11. an equipment as claimed in claim 1 is characterized in that, at least one described processing station comprises that one is used for described at least one workpiece is carried out the exsiccant instrument air dryer.
12. an equipment as claimed in claim 1 is characterized in that, at least one described processing station comprises and is used for device that the scolder that is plated on described upper clip or the lower clip is peeled off.
13. an equipment as claimed in claim 1 is characterized in that, a plurality of described processing stations comprise an inner room.
14. an equipment as claimed in claim 1 is characterized in that, a plurality of described processing stations comprise a mistress.
15. an equipment as claimed in claim 1 is characterized in that, described processing station comprises that one is used for described at least one workpiece is loaded into a load station on the corresponding described workholder.
16. one kind as claim 1 or 15 described equipment, it is characterized in that, described processing station comprises that is used for the unloading station that described at least one workpiece is taken off from a corresponding described workholder.
17. a method that is used at least one workpiece plated solder, described method comprises the following steps:
Described at least one workpiece is loaded on the corresponding workholder in a plurality of workholders, described a plurality of workholder is positioned on the carrier and has a plurality of upper clip and lower clips that are used for the corresponding section of described at least one workpiece of clamping, and described carrier has hoisting position and lowering position and can rotate around a vertical axis;
Described carrier is rotated so that each workholder is suspended on the described carrier and make described each workholder through being arranged on a plurality of processing stations that are positioned in the described endless path below the described workholder in a circular path, at least some described processing stations comprise multiple electrolytic solution;
Make described carrier move to described lowering position so that with respect to localized first contact of described processing station with selected second engage contacts that moves with described carrier, thereby can be by described first contact and second contact at described workpiece be included in to set up between the electrolytic solution in the described processing station and be electrically connected.
18. a method as claimed in claim 17 is characterized in that, described method also is included in through making described carrier move to the step of described hoisting position behind one section preset time.
19. one kind as claim 17 or 18 described methods, it is characterized in that described upper clip electrically contacts for described workpiece provides.
20. a method as claimed in claim 19 is characterized in that, described lower clip also electrically contacts for described workpiece provides.
21. a method as claimed in claim 19 is characterized in that, each described workholder is around one of them described workpiece of described center vertical axis clamping diametrically.
22. method as claimed in claim 17, it is characterized in that, when described carrier is in described lowering position place and selected described first contact and second contact and is bonded with each other, described at least one workpiece at least fully is immersed in wherein a kind of described electrolytic solution, thereby has constituted a complete circuit.
23. a method as claimed in claim 22 is characterized in that, utilizing a power supply is described circuit supply.
24. a method as claimed in claim 23 is characterized in that, each described processing station of a kind of electrolytic solution that comprises also comprises at least one male or female.
25. method as claimed in claim 24, it is characterized in that, in described circuit, between described first contact of described power supply and one of them, be electrically connected, between described one of them first contact and described at least one workpiece, be electrically connected, between described at least one male or female and described workpiece, be electrically connected, between described at least one male or female and described power supply, be electrically connected by described electrolytic solution.
26. one kind as claim 17 or 18 described methods, it is characterized in that, one of them described processing station is a wash station.
27. a method as claimed in claim 26 is characterized in that, one of them described processing station has one and is used for air knife that excess liquid is removed from described at least one workpiece.
28. one kind as claim 17 or 18 described methods, it is characterized in that at least one described processing station comprises that one is used for described at least one workpiece is carried out the exsiccant instrument air dryer.
29. one kind as claim 17 or 18 described methods, it is characterized in that, at least one described processing station comprises and is used for device that the scolder that is plated on described upper clip or the lower clip is peeled off.
30. one kind as claim 17 or 18 described methods, it is characterized in that a plurality of described processing stations comprise an inner room.
31. one kind as claim 17 or 18 described methods, it is characterized in that a plurality of described processing stations comprise a mistress.
32. a method as claimed in claim 18 is characterized in that, described processing station comprises that one is used for described at least one workpiece is loaded into a load station on the corresponding described workholder.
33. a method as claimed in claim 32 is characterized in that, described processing station comprises that is used for the unloading station that described at least one workpiece is taken off from a corresponding described workholder.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG99010688 | 1999-03-06 | ||
| SG1999001068A SG75925A1 (en) | 1999-03-06 | 1999-03-06 | Apparatus and method for strip solder plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1348512A CN1348512A (en) | 2002-05-08 |
| CN1139677C true CN1139677C (en) | 2004-02-25 |
Family
ID=20430298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB998165999A Expired - Fee Related CN1139677C (en) | 1999-03-06 | 1999-04-09 | Apparatus and method for strip solder plating |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN1139677C (en) |
| AU (1) | AU3352399A (en) |
| SG (1) | SG75925A1 (en) |
| TW (1) | TW434079B (en) |
| WO (1) | WO2000053829A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9362440B2 (en) * | 2012-10-04 | 2016-06-07 | International Business Machines Corporation | 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE934383C (en) * | 1952-04-29 | 1955-10-20 | Deinert & Co | Fully automatic electroplating device with different dwell times in the electroplating or auxiliary baths |
| GB1331861A (en) * | 1972-01-03 | 1973-09-26 | Elliott Brothers London Ltd | Apparatus for fluid treatment of articles in stages |
| DE2944401A1 (en) * | 1979-11-02 | 1981-05-14 | GAMA Maschinen und Einrichtungen für die Galvanotechnik Gm bH, 7129 Ilsfeld | Electroplating plant using two or more treatment stations - where each station has modular structure contg. tanks, pump, filter and heater for treatment liq. |
| GB2292952A (en) * | 1994-09-12 | 1996-03-13 | Yee Kiong Khong | Holder for electroplating and chemically treating contact elements of plastics moulded or ceramic encapsulated electronic components |
-
1999
- 1999-03-06 SG SG1999001068A patent/SG75925A1/en unknown
- 1999-03-09 TW TW088103578A patent/TW434079B/en not_active IP Right Cessation
- 1999-04-09 AU AU33523/99A patent/AU3352399A/en not_active Abandoned
- 1999-04-09 WO PCT/SG1999/000026 patent/WO2000053829A1/en active Application Filing
- 1999-04-09 CN CNB998165999A patent/CN1139677C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW434079B (en) | 2001-05-16 |
| AU3352399A (en) | 2000-09-28 |
| WO2000053829A1 (en) | 2000-09-14 |
| SG75925A1 (en) | 2000-10-24 |
| CN1348512A (en) | 2002-05-08 |
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Granted publication date: 20040225 |