KR100817762B1 - Automatic plating system for wafer - Google Patents

Abstract

An automatic wafer plating system is provided to easily remove a plating liquid and fine foreign substances adhered to the surface of a wafer returned to its original position after a plating process while using nitrogen gas by installing a buffer pusher in an elevation cap part the presses downward the wafer supported by an elastic support member of a plate bath and by installing a nitrogen gas injecting nozzle in the elevation cap part. In an automatic plating system, a stacked wafer(1a) with a surface to be plated is taken out from a loading apparatus(20) to a transfer apparatus(30) and the wafer is transferred to a plate bath of a plate part containing a refluxing plating liquid so as to be plated. The plated wafer is cleaned by using clean water and the cleaned wafer is dried. After the wafer with the surface to be plated is soaked into the plating liquid in the plate part to be plated, the plate liquid stuck to the surface of the plate wafer after the wafer is separated from the plate liquid is immediately removed by spray gas of high pressure by using a plating and plating liquid removing apparatus(500). After a cleaning and drying apparatus(600) adsorbs and rotates the processed wafer(1c) from which the plating and plating liquid are removed to be cleaned by water, the water on the surface of the cleaned wafer is dehydrated and dried at high rotation speed.

Description

Wafer Automatic Plating System {AUTOMATIC PLATING SYSTEM FOR WAFER}

1 is a perspective view showing a state in which the automatic wafer plating system is installed according to an embodiment of the present invention

2 is a perspective view schematically showing a wafer automatic plating system according to an embodiment of the present invention;

Figure 3 is a perspective view schematically showing a plating and plating liquid removal apparatus of the automatic wafer plating system according to an embodiment of the present invention

4 is a schematic exploded perspective view of FIG.

Figure 5 is a side cross-sectional view showing a state in which the wafer is seated in the plating bath of the plating portion of the plating and plating solution removal apparatus of the present invention.

Figure 6 is a side cross-sectional view showing a state in which the wafer seated on the plating portion of the plating and plating liquid removing apparatus of the present invention is pressed down by the lifting cap of the lifting cap portion to be pressed.

7 is a lifting cap portion lifting cap while the plated wafer is returned to its original position in the state in which the elevating cap of the elevating cap portion is raised to its original position as the elevating bar of the elevating and rotating members of the plating and plating liquid removing device of the present invention is raised. Side view showing a state in which the plating liquid on the plated wafer is removed while nitrogen gas is injected through the nitrogen gas injection nozzle

8 is a perspective view schematically showing a cleaning and drying apparatus of the automatic wafer plating system according to an embodiment of the present invention

9 is a schematic exploded perspective view of FIG. 8

Figure 10 is a side cross-sectional view showing a state in which the plating and plating liquid removal wafer is adsorbed on the adsorption rotating member of the cleaning and drying apparatus of the present invention.

11 is a state in which the plating and plating liquid removal wafer adsorbed to the adsorption rotating member of the cleaning and drying apparatus of the present invention is cleaned by water ejected from the water supply member while the adsorption rotating member is rotated while the cleaning tank elevating member is raised. Side cross-sectional view

Explanation of symbols on the main parts of the drawings

1a. Plated Wafer 1b. Plated wafer

1c. Plating and Plating Liquid Removal Wafers 1d. Clean and Dry Wafers

2. Plating solution 3. Water

10. Housing 12. Intake and exhaust air conditioner

13. Power supply unit 14. Control unit

15. Mounting Table 20. Loading Device

30. Carrier 40. Aligner

500. Plating and plating liquid removal device 510. Plating part

520. Plating bath 522. Top cover plate

523. Plating bath (-) electrode contacts 529. Plating bath (+) electrodes

524. Elastic support member 530. Recovery plating bath

540. Plating solution storage tank 560. Lifting cap

570. Lifting cap 574. Shock absorber

575. Lifting cap (-) electrode contact 576. Nitrogen gas injection nozzle

580. Up and down lifting and rotating members 590. Lifting bar

591. First Cylinder 596. Rotating Bar

597. Second Cylinder

600. Cleaning and drying device 610. Adsorption rotary member

620. Suction Bar 624. Suction Hole

630. Air suction pipe 640. Drive motor

660. Cleaning tank lifting member 668. Cleaning tank cylinder

665. Rinsing tank 666. Rinsing water discharge pipe

670. Water supply member 673. Water supply pipe

70. Unloading device

The present invention relates to a wafer automatic plating system, and more specifically, to provide an elastic support member in a plating bath in which the plating solution is refluxed when the surface of the semiconductor wafer is deposited in the plating solution and automatically plated. By providing a structure that is settled inside, the wafer flows up and down at the time of plating without additional cost in a small space, so that a more complete plating is performed, and the recovery is processed at once in the plating apparatus without installing a plating liquid recovery device. The present invention relates to a wafer automatic plating system that can be used.

In addition, by providing a structure in which a nitrogen gas injection nozzle is fastened together with a cushioning pusher that prevents the shock transmitted to the wafer, the lifting cap portion presses downwardly the wafer supported by the elastic support member of the plating bath, while descending downward from the plating bath. As the plating liquid is ejected, the plating liquid is discharged down and the plating solution is returned to its original position after returning to the original position, and the plating liquid and fine foreign substances on the surface of the wafer exposed out of the plating liquid can be easily removed by spraying nitrogen gas, thereby improving the plating quality. It is about.

In addition, when the surface of the semiconductor wafer is cleaned using purified water, the wafer is adsorbed by rotating the adsorption rod and the cleaning tank is driven up and down. The present invention relates to a wafer automatic plating system which is rotated to have high cleaning efficiency and can be dried at a time in a cleaning apparatus without installing a drying apparatus.

BACKGROUND ART In general, semiconductor wafers are electroplated by depositing in an air spraying method and a metal plating solution such as copper and nickel.

In the plating method of the plating method, the prior art wafer automatic plating system (not shown) is carried out by a transfer device (carrying robot) withdrawing a plated wafer from a loading device on which a wafer having a plated surface is loaded, and plating. Electroplating is carried out by dipping in the plating bath of the apparatus.

Thereafter, the plated wafer is cleaned in a cleaning apparatus and then separately washed with purified water in the cleaning apparatus. And it is a structure which performs a drying process in a separate external drying apparatus.

However, in the prior art, an additional device is additionally installed, that is, an additional device such as a vibrating device that vibrates up and down so that the wafer deposited and plated in the plating liquid is plated more completely, or the plated wafer is cleaned with a cleaning device. Since it is a structure that must be additionally equipped with a drying apparatus to dry afterwards, there was a problem that a lot of manufacturing cost and space is required.

The present invention is to overcome the above-mentioned conventional problems, an object of the present invention is to settle down the surface of the semiconductor wafer in the plating liquid and the automatic electroplating in the plating bath in the plating bath in the down flow settled down the wafer supported by the elastic support member The plating solution is returned to its original position by the elastic force of the elastic support member, and the plating liquid and fine foreign substances on the surface of the wafer exposed out of the plating liquid can be easily removed by spraying with nitrogen gas to improve the plating quality. To provide a plating system.

Still another object of the present invention is to provide a structure in which the wafer is adsorbed when the surface of the semiconductor wafer is cleaned using purified water, and the cleaning tank is driven up and down to provide a structure in which no space is required. The wafer is rotated at the time of cleaning, the cleaning efficiency is high, and to provide a wafer automatic plating system that can be dried at a time in the cleaning apparatus without installing a separate drying apparatus.

As an example of the automatic wafer plating system according to the present invention for achieving the above object of the present invention, will be described in detail in the following configuration and effects.

In the automatic wafer plating system according to the present invention for achieving the above object, the wafer 1a having the plated surface loaded in the loading device 20 is taken out to the transfer device 30 so that the plating solution 2 is refluxed. In the automatic plating system of the wafer which transfers to the plating tank 520 of the plating section 510 to be deposited, immerses the plated wafer 1b with purified water 3, and dries the cleaned wafer. After plating the plated wafer 1a to the plating solution 2 of the plating part 510, plating and plating solution removal is performed to remove the plating solution on the surface of the plating wafer 1b separated from the plating solution with a high-pressure injection gas. Device 500; The plating and plating liquid removal apparatus 500 sucks and rotates the wafer 1c, which has been subjected to the plating and plating liquid removal treatment, and then washes with water (3), and immediately dehydrates and dries the water on the cleaned wafer surface at high speed. It comprises a washing and drying apparatus 600 to.

Hereinafter, with reference to the accompanying drawings, an automatic wafer plating system according to a preferred embodiment of the present invention will be described in detail.

1 is a perspective view showing a state in which the automatic wafer plating system is installed according to an embodiment of the present invention, Figure 2 is a perspective view schematically showing a wafer automatic plating system according to an embodiment of the present invention.

Referring to FIGS. 1 and 2, a wafer automatic plating system according to an embodiment of the present invention will be described. The wafer 1a having the plated surface loaded from the loading apparatus 20 is taken out to the conveying apparatus 30. The plating solution 2 is transferred to the plating bath 520 of the plating section 510 where the reflux solution 2 is refluxed, and the plated wafer 1b is rinsed with purified water 3, preferably using washing water. And a structure for drying the cleaned wafer, a rectangular housing 10, a loading device 20 mounted inside the housing 10 and having a surface to be plated 1a loaded thereon, and the loading A conveying apparatus 30 which draws out the to-be-plated wafer 1a loaded in the apparatus 20 and sequentially conveys them to apparatuses for plating and unloading, and a to-be-plated wafer conveyed by the conveying apparatus 30 ( 1a) sorting device 40 sorting by sorting by inch (4 inch, 6 inch wafer, etc.), and the aligned plating way In order to plate the fur 1a, the plating liquid is transferred to the plating tank 520 of the plating portion 510 where the plating liquid is refluxed, and the plating solution is deposited and the plating liquid deposited on the plated wafer 1b is elevated. Adsorption of the plating and plating liquid removing device 500 for removing the nitrogen gas by high pressure injection with a nitrogen gas injection nozzle 576 of the c), and the wafer 1c which has been plated and the plating liquid removing processed by the plating and plating liquid removing device 500. And a washing and drying apparatus 600 which spins and cleans the purified wafer with water, and then dehydrates and dries the water on the cleaned wafer at a high speed rotation, and a wafer that has been cleaned and dried by the washing and drying apparatus 600 ( And an unloading device 70 conveyed and loaded by the conveying device 30 so that 1d) is carried out to the outside.

That is, in the automatic wafer plating system according to an embodiment of the present invention, the plating liquid on the surface of the wafer to be plated 1a is removed immediately after the plated wafer 1a is plated, and the plating and plating solution removing process 1c is performed. ) Is dried immediately after cleaning.

The housing 10 is connected to the intake and exhaust air conditioner 12 for supplying clean air to the upper surface, the inner side of the power supply 13 for supplying power for electroplating and a series of necessary for electroplating The control unit 14 for controlling the process is embedded, and on the other side, the upper and lower parts are partitioned by the mounting table 15 embedded in the inner center, and the apparatus for wafer plating is embedded.

Figure 3 is a perspective view schematically showing a plating and plating liquid removal apparatus of the automatic wafer plating system according to an embodiment of the present invention, Figure 4 is a schematic exploded perspective view of Figure 3, Figure 5 is a plating and plating solution removal of the present invention It is a side sectional view which shows the state in which the wafer was seated in the plating tank of the plating part of the apparatus.

Referring to FIGS. 3 to 5, the plating and plating liquid removing apparatus 500 of the automatic wafer plating system according to an embodiment of the present invention uses the plating liquid 2 of the plating portion 510 to transfer the plated wafer 1a. The plating liquid deposited on the surface of the plating wafer 1b separated from the plating liquid is immediately removed by a high-pressure injection gas, and the removed plating liquid is recovered.

The plating part 510 is a plating tank 520 in which the plating liquid is supplied from an external plating liquid storage tank 540 and fully refluxed, and an upper cover plate 522 on which the elastic support member 524 is fastened and fastened is fastened and fixed on the upper part. And the elevating cap 560 is driven to descend and the plated wafer 1a seated and supported by the elastic support member 524 of the plating vessel is pressed down and plated so that the plating liquid overflowed outside the plating vessel 520 is recovered. The bath includes a recovery plating bath 530 placed therein.

The elevating cap part 560 of the plating and plating liquid removing device 500 includes an elevating cap 570, and an elevating and rotating member 580.

The lifting cap 570 has two connection plates 570a coupled thereto, and cushions the spring 574a at the bottom to alleviate the shock transmitted to the plated wafer when the plated wafer 1a is pushed downward. An excitation buffer pusher 574 is provided to protrude, and a nitrogen gas injection nozzle 576 to which nitrogen gas for removing the plating liquid deposited on the plating wafer 1b is injected is installed at the upper portion.

The vertical elevating and rotating member 580 is fastened and fixed to one side of the elevating cap portion 560 so that the elevating cap is elevated up and down in the plating bath 520 by the driving of the first cylinder 591. The bar 590 and one side is fastened and fixed to the elevating bar is configured to include a rotating bar (596) to allow the elevating cap to be elevated by the drive of the second cylinder (597).

Figure 6 is a side cross-sectional view showing a state in which the wafer seated on the plating portion of the plating and plating liquid removing apparatus of the present invention is pressed down by the lifting cap portion of the lifting cap portion and pressed, and Figure 7 is a plating and plating liquid removing apparatus of the present invention. As the lifting cap of the elevating cap portion is raised to the original position as the elevating bar of the elevating member and the elevating member of the rotating member are raised, the plated wafer is returned to the original position and nitrogen gas is injected through the nitrogen gas injection nozzle of the elevating cap portion of the elevating cap. It is a side sectional view which shows the state in which the plating liquid adhered to a plating wafer is removed.

By the above-described configuration, the automatic wafer plating system according to the preferred embodiment of the present invention operates as follows.

Hereinafter, the operation of the plating and plating liquid removing apparatus 500 and the cleaning and drying apparatus 600 which are characteristic components of the present invention will be described.

First, referring to FIGS. 6 and 7, the operation of the plating and plating liquid removing apparatus 500, which is a characteristic component of the present invention, will be described below. First, the plated wafer aligned in the alignment apparatus 40 is transferred. (30, the transfer robot) is drawn out to the transfer arm 31 to move the transfer arm 31 to the upper portion of the upper cover plate 522 of the plating and plating solution removal device 500 plating tank 520 and then lowered. At this time, in order to place the wafer to be plated on the elastic support member 524 fastened and fixed to the central hole of the upper cover plate 522 of the plating tank 520, one side of the upper surface of the upper cover plate 522 has a transfer arm ( One side of the transfer arm 31 is inserted into the transfer arm insertion groove 521 which is cut in the longitudinal direction so as to prevent the 31 from being caught by the upper surface of the upper cover plate 522 and the bottom surface of the plated wafer 1a at the end. After the interview with the elastic support member 524, the transfer arm 31 is pulled out (when the reversed plated wafer 1b is taken out, the transfer arm 31 is inserted along the transfer arm insertion groove 521). To raise the plated wafer 1b).

At this time, the plating liquid supply pump 542 controlled by the flow sensor 541 is driven so that the plating liquid supply tank of the plating liquid storage tank 540 is provided inside the filter 543 and the recovery plating tank 530 through the supply pipe ( The plating bath 520 is buffered via 544.

Thereafter, when the up and down lifting and lowering of the lifting cap 560 and the elevating node of the second cylinder 597 of the rotating member 580 are driven up and down, the lifting cap fastened to the end of the rotating bar 596 around the hinge shaft 598. 570 is lowered to press and lower the plated wafer 1a held by the elastic support member 524 to be pressed down. On the other hand, the elevating cap 570 of the elevating cap portion 560 is fixed to the elevating bar while the elevating bar 590 is lowered by further driving the elevating node of the first cylinder (591) of the up and down lifting and rotating member 580 It can be controlled to be pressed down by pressing down the plated wafer (1a) supported by the elastic support member 524 is lowered.

Therefore, the plated wafer 1a is pressed by the elastic support member 524 connected to the four (-) electrode contacts 523 of the plating bath 520 in which the plating liquid is buffered, so that the plated wafer 1a The four (-) electrode contacts 523 of the plating bath 520 are perfectly connected.

At this time, the plating bath 520 on the four (-) electrode contacts 575 of the lifting cap 560 and the lifting cap 570 fixed at a position corresponding to the (-) electrode contact 523 of the plating bath 520. An elastic support member made of a metal material on which the four (-) electrode contacts 523 of the contact and the plated wafer 1a connected to the four (-) electrode contacts 523 of the plating bath 520 are simultaneously seated and supported. Electricity is supplied to 524. At the same time, the plated wafer 1a is energized with the (+) electrode 529 exposed to the plating solution 2 in the plating bath, and electroplating is performed to complete the plating.

Meanwhile, the wire 529a connected to the positive electrode 529 exposed to the plating solution 2 in the plating bath and the four (-) electrode contacts 575 of the lifting cap 570 are electrically connected to each other. Of course.

Thereafter, when the first cylinder 591 of the upper and lower elevating and rotating members 580 is pulled up and lowered to a predetermined length, the elevating cap 560 of the elevating cap portion 560 is fastened to the elevating bar 590 while being elevated. 570 is raised to release the pressure on the plated wafer 1b so that the plated wafer 1b held by the elastic support member 524 is raised to its original position by the elastic restoring force of the elastic support member 524. In the state in which the wafer 1b is deposited in the plating liquid, the wafer 1b is brought out of the plating liquid.

On the other hand, the principle that the plated wafer (1b) is exposed to the outside of the plating solution, the plating solution is reduced as the plating solution to be plated on the wafer (1a), and the plated wafer (1a) held by the elastic support member 524 as described above ) Is pressed down and pressed down, the plating liquid 2 in the plating tank 520 flows out to the outside, that is, the recovery plating tank 530 through the plating solution 520, the plating solution outlet groove 526, and the recovery hole 531 at the bottom thereof. This is because it is returned to the plating liquid storage tank 540 through.

At this time, the plating liquid and fine foreign matter on the plating wafer 1b in the state exposed out of the plating liquid are removed while nitrogen gas is injected under high pressure through the nitrogen gas injection nozzle 576 of the lifting cap 570, thereby improving plating quality.

Subsequently, when the elevating cap of the elevating cap 560 is moved up and down and the elevating node of the second cylinder 597 of the rotating member 580 is driven, the elevating cap fastened to the end of the pivoting bar 596 about the hinge shaft 598. 570 rises and the plating and plating liquid removal wafer 1c can be taken out by the transfer arm 31 of the transfer apparatus 30.

At the same time, the plating liquid supply pump 542 controlled by the flow sensor 541 is driven so that the plating liquid supply tank of the plating liquid storage tank 540 is installed inside the filter 543 and the recovery plating tank 530 through the supply pipe ( It is repeated that the plating bath 520 is buffered via 544.

8 is a perspective view schematically showing a cleaning and drying apparatus of an automatic wafer plating system according to an embodiment of the present invention, Figure 9 is a schematic exploded perspective view of FIG.

8 and 9, the cleaning and drying apparatus 600 of the present invention adsorbs and rotates the wafer 1c that has been subjected to the plating and plating liquid removal treatment in the plating and plating liquid removing apparatus 500 to rotate the water 3. After washing with water, the water on the surface of the cleaned wafer is immediately dehydrated and dried at high speed.

The adsorption rotating member 610 of the cleaning and drying apparatus has a hollow adsorption rod 620 having adsorption holes 624 formed on an upper surface thereof, and a plating and plating liquid removal wafer 1c adsorbed and fixed to the adsorption rod 620. It comprises an air suction pipe 630 connected to the hollow of the adsorption rod to rotate, and a drive motor 640 connected to one side of the adsorption rod to rotate.

In addition, the cleaning tank elevating member 660 of the cleaning and drying apparatus 600 has a plating and plating liquid removing wafer 1c disposed therein when the plating and plating liquid removing wafer 1c on the upper surface of the adsorption rod 620 is cleaned and rotated. A washing tank 650 which is raised to be settled and connected to a washing water discharge pipe 666 at a lower portion thereof is fastened and fixed to a lower surface of the washing tank 665 so that the washing tank is lifted up and down by driving of the washing tank cylinder 668. It is composed.

Figure 10 is a side cross-sectional view showing a state in which the plating and the plating liquid removal wafer is adsorbed on the adsorption rotating member of the cleaning and drying apparatus of the present invention, Figure 11 is a plating and adsorbed on the adsorption rotating member of the cleaning and drying apparatus of the present invention A side cross-sectional view showing a state where the plating liquid removal wafer is cleaned by water ejected from the water supply member while the adsorption rotating member is rotated while the cleaning tank elevating member is raised.

10 and 11, the operation of the cleaning and drying apparatus 600, which is a characteristic component of the present invention, will be described.

First, the transfer arm 31 of the transfer device 30 is inserted along the transfer arm insertion groove 521 to withdraw the plating and plating liquid removing wafer 1c, and then raised to raise the plating and plating liquid removing wafer 1c. After drawing out and conveying to the cleaning and drying apparatus 600 which is the next process, the plating and plating liquid removing wafer 1c is adsorbed on the upper surface of the adsorption rotating member 610 and the adsorption rod 620 of the cleaning and drying apparatus 600. It is conveyed and adsorbed to 624.

Thereafter, as the lifting rod of the cleaning tank cylinder 668 of the cleaning tank lifting member 660 is raised, the cleaning tank 665 is plated and lifted so as to be located inside the wafer 1c in a state where the plating liquid is removed. Driven.

Thereafter, while the adsorption rod 620 is rotated, the water washed through the water supply member 670 is ejected to perform the cleaning. At this time, since the plating and plating liquid removal wafer 1c is rotated, the cleaning efficiency is improved.

When the cleaning is completed, the water supply through the water supply pipe 673 is stopped, and at this time, since the rotation of the adsorption rod 620 is continued for drying, the wafer is rotated and cleaned at a small space without additional cost. The efficiency is high, and drying can be done in one time in the washing apparatus without installing the drying apparatus separately.

On the other hand, the lifting cap 560 pushes down the plated wafer 1a seated and supported by the elastic support member 524 of the plating portion 510 to be pressed to the plating tank 520 of the plating portion 510. After immersing in the buffered plating solution 2 to be plated, the pressure restoring force on the plated wafer 1b is released so that the wafer 1b immersed in the plating solution is elastically restoring of the elastic support member 524 of the plating part. After returning to the original position out of the plating liquid, it may have a function of removing the plating liquid by spraying the nitrogen gas to the plating wafer with the plating liquid through the nitrogen gas injection nozzle 576 provided immediately above.

Although the technical spirit of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, the wafer automatic plating system according to the present invention includes an elastic support member in the plating bath in which the plating solution is refluxed when the surface of the semiconductor wafer is deposited in the plating solution and automatically plated, and the plating bath is placed inside the recovery plating bath. By providing a structure that allows the wafer to flow up and down at the time of plating without additional cost in a small space, more complete plating is achieved, and it is possible to process recovery at once in the plating apparatus without separately installing a plating liquid recovery apparatus. There is.

In addition, by providing a structure in which a nitrogen gas injection nozzle is fastened together with a cushioning pusher that prevents the shock transmitted to the wafer, the lifting cap portion presses downwardly the wafer supported by the elastic support member of the plating bath, while descending downward from the plating bath. Since the plating liquid is ejected in excess, the plating liquid and fine foreign matters buried on the surface of the wafer returned to its original position after plating while falling down are easily removed by spraying nitrogen gas.

In addition, when the surface of the semiconductor wafer is cleaned using purified water, the wafer is adsorbed by rotating the adsorption rod and the cleaning tank is driven up and down. Rotating efficiency is high, there is an effect that can be dried at a time in the washing apparatus without installing a separate drying apparatus.

Claims (8)

The wafer 1a having the plated surface loaded in the loading device 20 is taken out to the transfer device 30, transferred to the plating bath 520 of the plating part 510 where the plating solution 2 is refluxed, and deposited by plating. In the wafer automatic plating system for cleaning the plated wafer 1b with purified water 3 and drying the cleaned wafers, After the wafer 1a having the surface to be plated is deposited by plating on the plating solution 2 of the plating portion 510, the plating solution deposited on the surface of the plating wafer 1b separated from the plating solution is directly removed by a high pressure injection gas. Plating and plating liquid removing apparatus 500; The plating and plating liquid removal apparatus 500 sucks and rotates the wafer 1c, which has been subjected to the plating and plating liquid removal treatment, and then washes with water (3), and immediately dehydrates and dries the water on the cleaned wafer surface at high speed. Wafer automatic plating system, characterized in that configured to include a cleaning and drying device (600). The plating and plating solution removing apparatus 500 of claim 1, wherein the plated wafer 1a is seated and supported on an upper portion of the plating and plating solution removing device 500, and an elastic support member 524 fastened up and down by external force acting on the plated wafer is fastened. Unit 510; A negative electrode contact 523 exposed to the upper portion of the plating bath 520 in which the plating liquid is buffered by pushing the plated wafer 1a seated and supported by the elastic support member 524 of the plating part 510 downwardly; It is pressed by the elastic support member 524 connected to the (-) electrode contact 575 of the plating bath 520 fixed to a position corresponding to the (-) electrode contact 523 of the plating bath 520 The plated wafer 1b is energized and plated with the (+) electrode 529 exposed to the plating liquid 2 inside the plating bath 520 while the (-) electrode contact 523 contacts, and then the plated wafer 1b. The plated wafer 1b is returned to its original position by the elastic restoring force of the elastic support member 524 of the plated portion, and is exposed out of the plating solution. It comprises a lifting cap portion 560 to remove the plating liquid by injecting nitrogen gas on the plating wafer with the plating liquid Automatic wafer plating system, characterized in that. The upper part of claim 2, wherein the plating part 510 of the plating and plating liquid removing device 500 is fully refluxed from the plating liquid supplied from an external plating liquid storage tank 540, and the elastic support member 524 is fastened and fixed. The plating plate 520 is fastened and fixed to the upper cover plate 522, and the lifting cap 560 is driven downward to be pressed down to be plated wafer (1a) seated and supported by the elastic support member 524 of the plating bath. According to the plating bath 520, a plating bath 530, the plating bath is settled therein so as to recover the plating liquid flowing out to the outside, characterized in that the automatic wafer plating system made. According to claim 2, The lifting cap portion 560 of the plating and plating liquid removing device 500 is a buffer spring in the lower portion to alleviate the shock transmitted to the plated wafer when pressing the plated wafer (1a) by pressing downward A lifting cap 570 having a buffer pusher 574 having a 574a installed thereon, and a nitrogen gas injection nozzle 576 having a nitrogen gas sprayed thereon for removing a plating solution from the plating wafer 1b; An elevating bar 590 which is fastened and fixed to one side of the elevating cap 570 so that the elevating cap is elevated up and down in the plating bath 520 of the plating part by driving of the first cylinder 591, and one side of the elevating bar. Wafer automatic plating system comprising the up and down lifting and rotating member (580) having a rotation bar (596) is fastened and fixed so that the lifting cap is rotated by the drive of the second cylinder (597). The cleaning and drying apparatus 600 of claim 1, wherein the cleaning and drying apparatus 600 includes an adsorption rotating member 610 which is rotated by adsorption and fixing the plating and plating liquid removing wafer 1c on the upper surface, and the plating and plating liquid removing wafer 1c is cleaned. Cleaning tank elevating member 660 which is raised during rotation, and a water supply member 670 having a water supply pipe 673 connected to one side thereof so that water is supplied to the plating and plating liquid removal wafer which is adsorbed on the upper surface of the adsorption rotating member and rotated. Wafer automatic plating system comprising a. The method of claim 5, wherein the adsorption rotating member 610 of the cleaning and drying apparatus is a hollow adsorption rod 620, the adsorption hole 624 is formed on the upper surface, and the plating and plating liquid removal wafer ( 1c) is an automatic suction plating system characterized in that it comprises an air suction pipe 630 connected to the hollow of the adsorption rod so that the adsorption fixed is rotated, and a drive motor (640) connected to one side of the adsorption rod to rotate. The cleaning tank elevating member 660 of the cleaning and drying apparatus 600 is a plating and plating liquid removing wafer 1c when the plating and plating liquid removing wafer 1c on the upper surface of the suction rod 620 is rotated. ) Is raised so as to be settled inside, and the washing tank 665 connected to the washing water discharge pipe 666 at the lower portion thereof is fastened and fixed to the lower surface of the washing tank 665 so that the washing tank is driven by the washing tank cylinder 668. Wafer automatic plating system, characterized in that the jaw is made up and down. The upper surface is connected to the intake and exhaust air conditioner tube 12 for supplying clean air therein, the inner side of the power supply unit 13 for supplying the power required for electroplating and a control unit for controlling a series of processes required for electroplating ( A rectangular housing (10) having a built-in unit 14, and on the other side thereof divided into upper and lower parts by an installation table 15 embedded in an inner center thereof, in which devices for wafer plating are embedded; A loading device 20 mounted inside the housing 10 and having a wafer 1a loaded thereon with a plated surface thereon; A conveying apparatus 30 which takes out the to-be-plated wafer 1a loaded in the loading apparatus 20 and sequentially conveys them to apparatuses for plating and unloading; An alignment device (40) for aligning the plated wafer (1a) conveyed by the transfer device (30); The plated wafer 1a is withdrawn to a transfer device for plating and transferred to the plating bath 520 of the plating section 510 where the plating solution is refluxed to deposit and plate the plating solution on the plated wafer 1b. A plating and plating liquid removing apparatus 500 for removing nitrogen gas by high-pressure injection into the nitrogen gas injection nozzle 576 of the elevating cap 560; The plating and plating liquid removing apparatus 500 sucks and rotates the plated and plating liquid removed wafer 1c and cleans it with purified water, and then cleans and dries to dehydrate water dried on the cleaned wafer at high speed. Device 600; And an unloading device 70 conveyed and loaded by the conveying device 30 so that the wafer 1d cleaned and dried in the cleaning and drying device 600 is carried out to the outside. Wafer characterized in that the plating liquid on the surface of the wafer to be plated (1a) is removed immediately after the plated wafer (1a) is plated, and dried immediately after cleaning the plated and the plating solution removal treatment (1c) Automatic plating system.

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