CN111593391A - Wafer electroplating equipment with wafer capable of being washed - Google Patents
Wafer electroplating equipment with wafer capable of being washed Download PDFInfo
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- CN111593391A CN111593391A CN202010462975.1A CN202010462975A CN111593391A CN 111593391 A CN111593391 A CN 111593391A CN 202010462975 A CN202010462975 A CN 202010462975A CN 111593391 A CN111593391 A CN 111593391A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 64
- 239000007921 spray Substances 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 238000011010 flushing procedure Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 44
- 230000005540 biological transmission Effects 0.000 claims description 41
- 230000000903 blocking effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 abstract description 72
- 229910021645 metal ion Inorganic materials 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 131
- 239000011810 insulating material Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a wafer electroplating device capable of flushing a wafer. The wafer electroplating equipment comprises: the inner wall of the electroplating liquid tank is provided with a collecting tank; a cover which covers the electroplating solution tank; a wafer rotatably mounted on the lid; the first driving mechanism is used for driving the wafer to rotate; the spray head is arranged on the electroplating bath solution and is used for spraying water to the surface of the wafer; when the spray head sprays water to the surface of the wafer, the first driving mechanism drives the wafer to rotate, so that the water sprayed from the surface of the wafer is thrown out and collected in the collecting tank. According to the stirring device and the wafer electroplating equipment provided by the invention, the surface of the wafer can be cleaned by arranging the spray head and the collecting tank, so that unnecessary impurities on the surface of the wafer are avoided, the surface of the wafer is only plated with required metal ions, and the electroplating effect of the wafer is better.
Description
Technical Field
The invention relates to a wafer electroplating device capable of flushing a wafer.
Background
Some integrated circuit parts need to be electroplated in the production process, and the requirement on the electroplating precision is very high. However, in the electroplating process of the wafer in the prior art, not only metal ions are plated, but also other ions in the electroplating solution are carried, so that unnecessary impurities are carried on the wafer, the electroplating effect is poor, and the performance of the wafer is affected.
Disclosure of Invention
The first purpose of the invention is to overcome the defects in the prior art and provide a wafer-washing wafer electroplating device.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
according to a first aspect of the present invention, a wafer-rinsable wafer electroplating apparatus is provided. The wafer electroplating equipment comprises:
the inner wall of the electroplating liquid tank is provided with a collecting tank;
a cover which covers the electroplating solution tank;
a wafer rotatably mounted on the lid;
the first driving mechanism is used for driving the wafer to rotate;
the spray head is arranged on the electroplating bath solution and is used for spraying water to the surface of the wafer;
when the spray head sprays water to the surface of the wafer, the first driving mechanism drives the wafer to rotate, so that the water sprayed from the surface of the wafer is thrown out and collected in the collecting tank.
Optionally, the collecting tank is provided with an opening, and the opening is opposite to the wafer in radial direction;
the collecting groove extends towards the interior of the electroplating liquid groove from the opening along the axial direction.
Optionally, the spray head is mounted on the inner wall of the electroplating bath solution; the water spraying direction of the spray head is obliquely arranged relative to the surface of the wafer.
Optionally, the lid comprises a wafer clamp; the wafer is fixedly arranged on the wafer clamping piece;
the first driving mechanism comprises a first transmission shaft, and the wafer clamping piece is circumferentially fixed on the first transmission shaft;
the first driving mechanism is configured to drive the first transmission shaft to rotate, so as to drive the wafer clamping mechanism to rotate circumferentially.
Optionally, the first driving mechanism includes a first rotating electrical machine, a first driving wheel, and a second driven wheel;
the first driving wheel is circumferentially fixed on a first output shaft of the first rotating motor;
the first transmission shaft is circumferentially fixed on the driven wheel;
the first driving wheel drives the first driven wheel to rotate through a transmission belt.
Optionally, the method further comprises:
a second drive mechanism configured to drive the wafer chuck and the wafer to move axially and to enable the wafer to move axially from an electroplating position to a rinse position;
at the electroplating position, the wafer is immersed in the electroplating solution tank;
in the flushing position, the wafer is axially moved to be separated from the electroplating solution in the electroplating solution tank so as to be washed by the water sprayed by the spray head.
Optionally, the second driving mechanism is in transmission connection with the first transmission shaft, and is configured to drive the first transmission shaft to move axially, so as to drive the wafer holder to move axially.
Optionally, the second driving mechanism includes a second rotating electrical machine, a second driving wheel, a second driven wheel and a bearing seat;
the second driven wheel is axially fixed on the mounting seat; the bearing seat is circumferentially fixed on the mounting seat; the bearing block is sleeved on the first transmission shaft through a bearing;
a second output shaft of the second rotating motor is circumferentially fixed on the second driving wheel and is used for driving the second driving wheel to rotate;
the second driving wheel is meshed with the second driven wheel and is used for driving the second driven wheel to rotate;
the driven wheel is provided with an internal thread, and the bearing seat is provided with an external thread; the second driven wheel is sleeved with the internal thread of the bearing seat and used for driving the bearing seat and the first transmission shaft to move axially.
Optionally, the second rotating electrical machine is mounted on the mount;
a top fixing plate is fixedly connected to the bearing seat, and a first guide piece is arranged on the top fixing plate;
and a second guide piece is arranged on the mounting seat and is matched with the first guide piece to limit the bearing seat to move along the axial direction.
Optionally, the number of the first guide members is at least two;
the number of the second guide pieces is equal to that of the first guide pieces and corresponds to that of the first guide pieces respectively;
the second guide part is matched with the corresponding first guide part, so that the bearing seat is circumferentially fixed.
Optionally, the first guide part is a guide post, and the second guide part is a guide hole; the guide post is inserted into the guide hole.
Optionally, the mounting seat may be provided with an axial fixing member, and the axial fixing member is provided with two blocking members axially spaced from each other; the second driven wheel is axially fixed between the two blocking pieces.
Optionally, the cover further comprises a mounting seat which covers the electroplating liquid tank; the first driving mechanism and the second driving mechanism are respectively installed on the installation seat.
Optionally, a wafer accommodating groove is formed in the wafer clamping piece and used for fixedly mounting the wafer.
Compared with the prior art, in the stirring device and the wafer electroplating equipment provided by the invention, the surface of the wafer can be cleaned by arranging the spray head and the collecting tank, so that unnecessary impurities on the surface of the wafer are avoided, the surface of the wafer is only plated with required metal ions, and the electroplating effect of the wafer is better.
Drawings
Fig. 1 is a schematic structural diagram of a wafer electroplating apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of the structure of the cap of fig. 1.
Fig. 3 is a bottom view of fig. 2.
Fig. 4 is a sectional view taken along a-a direction in fig. 3.
Fig. 5 is a schematic view of the cover of fig. 2 with a portion of the mounting base removed.
Fig. 6 is a partial structural schematic view of the stirring device in fig. 1.
Fig. 7 is a schematic view of fig. 6 with the housing removed.
Fig. 8 is a schematic view of fig. 7 from another perspective.
Fig. 9 is a top view of fig. 8.
Fig. 10 is a schematic structural diagram of the carrying device in fig. 8.
FIG. 11 is a schematic view showing the structure of the plating bath tank in FIG. 1.
Fig. 12 is a top view of fig. 11.
Fig. 13 is a sectional view taken along the direction B-B in fig. 12.
Detailed Description
The invention is described in detail below with reference to the attached drawing figures:
according to one embodiment of the invention, a wafer plating apparatus is provided. As shown in fig. 1, the wafer plating apparatus includes a plating bath, a lid 7, and a wafer 78. The wall of the electroplating liquid groove is made of insulating materials, and the electroplating liquid groove is used for containing electroplating liquid. The bottom of the electroplating liquid tank is provided with a conductive material which is an anode. For example, the anode may be an anode mesh structure.
The cover 7 can be covered on the plating solution tank. For example, the lid 7 may be rotatably mounted on the plating tank. The cover 7 is made of an insulating material. The wafer 78 is rotatably mounted on the lid 7. The wafer 78 is a conductive material and is a cathode. The lid 7 comprises a first drive mechanism. The first driving mechanism is in driving connection with the wafer 78 for driving the wafer 78 to rotate.
The plating solution tank is provided with a stirring device for stirring the plating solution in the plating solution tank. The stirring device is made of insulating materials.
When the lid 7 is closed on the plating bath, the anode and cathode wafers 78 are spaced apart from each other. When the wafer plating apparatus is powered on, a potential difference is generated between the anode and the cathode of the wafer plating apparatus 78, and the metal ions in the plating solution tank can move to the wafer 78, so that the metal can be plated on the wafer 78.
In the electroplating process of this embodiment, agitating unit can stir the plating solution in the plating bath groove, and the plating solution distributes evenly, and first actuating mechanism can drive wafer 78 rotatory, and metal ion can electroplate more evenly on wafer 78 surface, avoids because electric potential line non-uniform distribution leads to the uneven electroplating of metal ion on wafer 78 surface, convenient to use, and it is effectual to electroplate.
The structure of the wafer 78 mounted on the lid 7 may be selectively set as desired. In this embodiment, as shown in fig. 2-4, the cover 7 may include a wafer holder 72 for holding a wafer 78. The wafer holder 72 is made of an insulating material. The wafer 78 is fixedly mounted on the wafer holder 72. The wafer 78 is circumferentially fixed relative to the wafer holder 72. More preferably, the wafer holder 72 may be provided with a wafer receiving slot in which the wafer 78 is fixedly mounted. The wafer 78 and the wafer holder 72 are synchronously rotatable circumferentially.
The lid 7 may also include a mount 70. The mounting seat 70 is made of an insulating material. The mounting seat 70 is covered on the plating bath. The mounting base 70 is detachably mounted to the plating bath tank, for example, the mounting base 70 is rotatably coupled to the plating bath tank. The first drive mechanism is mounted on the mount 70.
As shown in fig. 2-5, the first drive mechanism may include a first drive shaft 89. The first transmission shaft 89 is made of an insulating material. The wafer holder 72 is circumferentially fixed to the first transmission shaft 89. The first driving mechanism can drive the first transmission shaft 89 to rotate, so as to drive the wafer clamping mechanism to rotate. In this manner, the wafer holder 72 is rotatably mounted on the mount 70 of the cover 7.
The first drive mechanism includes a first rotating electric machine 80, a first drive pulley 82, and a first driven pulley 83. For example, the housing of the rotating electrical machine may be fixedly mounted on the mounting block 70. A first output shaft 81 of the first rotating electrical machine 80 is circumferentially fixed on the first driving wheel 82 for driving the first driving wheel 82 to rotate. For example, the first driver 82 and the first output shaft 81 may be coaxially fixed. The first driving pulley 82 rotates the first driven pulley 83 via a transmission belt 84. For example, the first drive pulley 82 may be engaged with the drive belt 84, and the first driven pulley 83 may be engaged with the drive belt 84. The driven wheel is circumferentially fixed on the first transmission shaft 89 and used for driving the first transmission shaft 89 to rotate. For example, the first transmission shaft 89 may be fixed coaxially with the first driven wheel 83.
When the first driving mechanism works, the first output shaft 81 and the first driving wheel 82 can be driven to rotate, so that the first driving wheel 82 drives the first driven wheel 83 to rotate through the transmission belt 84, and further drives the first transmission shaft 89, the wafer clamping mechanism and the wafer 78 to synchronously rotate.
The lid 7 may also comprise a second drive mechanism. The wafer 78 is fixedly mounted on the wafer holder 72, and the wafer 78 may be axially fixed relative to the wafer holder 72. The second driving mechanism is in driving connection with the wafer holder 72 and is used for driving the wafer holder 72 and the wafer 78 thereon to reciprocate along the axial direction.
The second driving mechanism can drive the cathode wafer 78 to move along the axial direction, so that the position of the cathode wafer 78 can be adjusted, the distance between the anode and the cathode wafer 78 can be adjusted as required, the potential difference between the anode and the cathode wafer 78 can be adjusted, a better electroplating effect can be obtained, and the electroplating precision is high.
The transmission connection structure between the second driving mechanism and the wafer holder 72 can be set as required, so long as the second driving mechanism can drive the wafer holder 72 to move along the axial direction. In this embodiment, as shown in fig. 2 to 5, the wafer holder 72 may be axially fixed on the first transmission shaft 89. The second driving mechanism is in transmission connection with the first transmission shaft 89, and is used for driving the first transmission shaft 89 to move along the axial direction, so as to drive the wafer holder 72 and the wafer 78 to move along the axial direction.
The second drive mechanism may include a second rotary motor 90, a second drive pulley 92, a second driven pulley 94, and a bearing housing 95. A second driven pulley 94 is axially fixed to the mounting block 70. More preferably, the mounting seat 70 may be provided with an axial fixing member 74, and the axial fixing member 74 is provided with two blocking members 740 arranged at an axial interval; the second driven pulley 94 is axially fixed between two stops 740.
The bearing housing 95 is circumferentially fixed to the mounting housing 70. The bearing seat 95 is sleeved on the first transmission shaft 89, a bearing 98 is arranged between the bearing seat 95 and the first transmission shaft 89, and the first transmission shaft 89 can rotate circumferentially relative to the bearing seat 95. The bearing blocks 95 are axially fixed relative to the first drive shaft 89 and are axially movable in unison.
A second output shaft 91 of the second rotating electric machine 90 is circumferentially fixed on the second driving wheel 92, and the second output shaft 91 of the second rotating electric machine 90 can drive the second driving wheel 92 to rotate. For example, the second output shaft 91 and the second driver 92 may be coaxially fixed.
The second driving wheel 92 is engaged with the second driven wheel 94 for driving the second driven wheel 94 to rotate. The secondary drive pulley 92 and the secondary driven pulley 94 may each be provided in a gear arrangement, such as a intermeshing gear arrangement between the two gears,
the driven wheel is provided with internal threads and the bearing block 95 is provided with external threads. The second driven pulley 94 has an internal thread that is received on an external thread on the bearing seat 95. Since the second driven pulley 94 is axially fixed relative to the mounting block 70. Bearing housing 95 is circumferentially fixed relative to mount 70, and bearing housing 95 is only allowed to move axially when acted upon by the mating of the driven wheel internal threads with the bearing housing 95 external threads. When the second driving wheel 92 drives the second driven wheel 94 to rotate, the bearing seat 95 can move along the axial direction through the matching effect of the internal thread of the driven wheel and the external thread of the bearing seat 95.
The second rotating electric machine 90 may be mounted on the mount 70. For example, the housing of the second rotating electric machine 90 may be fixedly mounted on the mount 70.
As shown in fig. 5, a top fixing plate 96 is fixedly coupled to the bearing housing 95. The top fixing plate 96 is provided with a first guide 97. The mount 70 is provided with a second guide 76. The second guide 76 and the first guide 97 may be shaped to match each other. The second guide member 76 cooperates with the first guide member 97 to perform a guiding function, thereby restricting the axial movement of the bearing housing 95.
Further, the number of the first guide 97 may be provided with at least two. The number of the second guides 76 is equal to the number of the first guides 97, and corresponds to each other. The second guide 76 is engaged with the corresponding first guide 97 to circumferentially fix the bearing housing 95. Thus, the axial seat is circumferentially fixed, and when the second driving wheel 92 drives the second driven wheel 94 to rotate and the internal thread of the driven wheel and the external thread of the bearing seat 95 are matched with each other, the bearing seat 95 cannot rotate due to being circumferentially fixed, and the bearing seat 95 can only move in the axial direction.
For example, the first guide 97 may be provided as a guide post, and the second guide 76 is a guide hole; the guide post is inserted into the guide hole. For another example, the first guide 97 may be provided as a guide hole, and the second guide 76 may be provided as a guide post; the guide post is inserted into the guide hole.
It should be noted that the axial seat may also be fixed circumferentially by other means, which is not limited solely by the present application.
When the second driving mechanism works, the second output shaft 91 of the second rotating motor 90 drives the second driving wheel 92 to rotate, the second driving wheel 92 drives the second driven wheel 94 to rotate, and the second driven wheel 94 is sleeved with the bearing seat 95 and the first transmission shaft 89 to move axially through a thread fit, so as to drive the wafer holder 72 to move axially.
As shown in fig. 6 to 9, the stirring device may comprise a housing 3, a third drive mechanism 1 and a rotatable carrier 4. The housing 3 is provided with a recess 31. The housing 3 is made of an insulating material. The third drive mechanism 1 includes a third output shaft 11. A driving gear 20 is mounted on the third output shaft 11 of the third drive mechanism 1. The drive gear 20 is an external gear. The drive gear 20 is disposed within the recess 31. For example, the third output shaft 11 and the driving gear 20 may be coaxially disposed to rotate in synchronization.
The carrier 4 is arranged in the recess 31. The carrier 4 is made of an insulating material. The bearing device 4 is provided with a stirring piece. The stirring piece is made of insulating materials. The carrier 4 is an external gear. The drive gear 20 meshes with an intermediate gear 22, and the intermediate gear 22 meshes with an external gear of the carrier 4. The third driving mechanism 1 can drive the bearing device 4 and the stirring piece thereon to rotate through the third output shaft 11, thereby realizing the revolution of the stirring piece. In addition, in other embodiments, the carrier 4 may also directly engage with the driving gear 20.
The specific structure of the stirring element mounted on the carrying device 4 can be set as required. In this embodiment, the supporting device 4 is fixedly provided with a mounting frame. The stirring piece is rotatably arranged on the mounting frame. The third driving mechanism drives the bearing device 4 to rotate, so as to drive the stirring piece to revolve and drive the stirring piece to rotate.
Specifically, as shown in fig. 9, the middle of the carrying device 4 is a hollow structure. The carrier 4 is provided with a first mounting bracket 41 and a second mounting bracket 42. The first mounting frame 41 and the second mounting frame 42 are made of insulating materials. The first mounting bracket 41 and the second mounting bracket 42 extend in opposite directions in the hollow portion of the carrier 4.
The stirring member may include a first stirring member 66. The stirring device further comprises a fourth drive mechanism for driving the first stirring member 66 to rotate. The fourth driving mechanism is in transmission connection with the first stirring member 66 and is used for driving the first stirring member 66 to rotate.
In the example shown, the fourth drive mechanism may be provided as an internal gear 5. The first mounting bracket 41 is mounted with a rotatable first planetary gear shaft 611. The first planetary gear shaft 611 is provided with a first planetary gear 61 and a first stirring member 66. The first planetary gear shaft 611 and the first planetary gear 61 are made of insulating materials. The first planetary gears 61 and the first stirring member 66 can be rotated in synchronization. For example, the first planetary gear 61 and the first stirring member 66 may be coaxially disposed.
The first mount 41 is provided with second planetary gear shafts 621. The second planetary gear shafts 621 are provided with second planetary gears 62 rotatably. The second planetary gear shafts 621 and the second planetary gears 62 are made of insulating material. The first planetary gears 61 and the second planetary gears 62 are both external gears, and the first planetary gears 61 and the second planetary gears 62 mesh with each other. The second planetary gears 62 mesh with the internal gear 5. The internal gear 5 of the carrier 4 can rotate the first planetary gear shaft 611 and the first stirring element 66 through the second planetary gear 62.
The stirring member may also include a first stirring member 68. A third rotatable planet gear shaft 631 is mounted on the second mounting bracket 42. The second mounting bracket 42 is further provided with a fourth planetary gear shaft 641 and a fifth planetary gear shaft 651. The third planetary gear shaft 631 is sleeved with the third planetary gears 63 and the first stirring member 68. The fourth planetary gear shaft 641 is sleeved with a rotatable fourth planetary gear 64. A rotatable fifth planetary gear 65 is sleeved on the fifth planetary gear shaft 651. The third planetary gear 63, the fourth planetary gear 64, and the fifth planetary gear 65 are all external gears. The third planetary gear 63, the fourth planetary gear 64, and the fifth planetary gear 65 are sequentially engaged. The fifth planetary gears 65 mesh with the ring gear 5. The ring gear 5 of the carrier device 4 can rotate the third planet gears 63 and the first stirring element 68 sequentially via the fifth planet gears 65 and the fourth planet gears 64.
The ring gear 5 is arranged above the carrier device 4 and meshes with the second planet gears 62 and the fifth planet gears 65 at the same time. The internal gear 5 is disposed in the groove 31. For example, the internal gear 5 may be provided on an inner circumferential surface of the hollow structure of the carrier 4.
The third drive mechanism 1 may be provided as a servomotor. In use, the third driving mechanism 1 is started, the third output shaft 11 drives the driving gear 20 to rotate, and transmits the driving force to the bearing device 4, so as to drive the bearing device 4 to rotate. The driving bearing device 4 drives the first stirring member 66 and the first stirring member 68 to rotate, so as to realize revolution.
The carrier 4 is driven to simultaneously move the second planet gears 62 and the fifth planet gears 65 along the circumferential direction of the internal gear 5. During the movement of the second planetary gears 62 and the fifth planetary gears 65 along the circumferential direction of the internal gear 5, the internal gear 5 is fixed, and the second planetary gears 62 and the fifth planetary gears 65 are driven by the internal teeth of the internal gear 5 to rotate around the second planetary gear shafts 621 and the fifth planetary gear shafts 651, respectively. The rotating second planetary gears 62 drive the first planetary gears 61 to rotate, and rotate the first planetary gear shafts 611 and the first stirring members 66. The rotation of the first stirring element 66 is about the first planetary gear shaft 611. The rotating fifth planetary gear 65 drives the fourth planetary gear 64 and the third planetary gear 63 to rotate, and further drives the third planetary gear shaft 631 and the first stirring element 68 to rotate. The first stirring element 68 rotates on its own axis about the third planetary gear shaft 631. The third planetary gear shafts 631, the third planetary gears 63, the fourth planetary gear shafts 641, the fourth planetary gears 64, the fifth planetary gear shafts 651 and the fifth planetary gears 65 are all made of insulating materials. In this way, with an active fourth driving mechanism, the first stirring element 66 and the first stirring element 68 can rotate independently of each other by appropriate design of the transmission.
In the example shown in fig. 8, the direction of rotation of the first stirring member 66 is set opposite to the direction of rotation of the first stirring member 68. For example, when the third driving mechanism 1 drives the carrying device 4 to rotate clockwise, the first stirring member 66 can be driven to rotate in the counterclockwise direction, and the first stirring member 68 can be driven to rotate in the clockwise direction. For another example, when the third driving mechanism 1 drives the carrying device 4 to rotate counterclockwise, the first stirring member 66 can be driven to rotate clockwise, and the first stirring member 68 can be driven to rotate counterclockwise.
The internal gear 5 in this embodiment is in driving connection with the first stirring element 66 via two planetary gears, namely the second planetary gear 621 and the first planetary gear 611. Furthermore, the internal gear 5 can be in driving connection with the first stirring element 66 via a further even number of planet gears.
The ring gear 5 in the present exemplary embodiment is in driving connection with the first stirring element 68 via three planet gears, namely the fifth planet gear 65, the fourth planet gear 64 and the third planet gear 63. Furthermore, the internal gear 5 can be in driving connection with the first stirring element 68 via an odd number of further planet gears.
Since the internal gear 5 can be in driving connection with the first stirring element 66 via an even further number of planet gears and the internal gear 5 can be in driving connection with the first stirring element 68 via an odd further number of planet gears, the direction of rotation of the first stirring element 66 is always opposite to the direction of rotation of the first stirring element 68.
Furthermore, in other embodiments, a hollow timing pulley may be used in place of carrier 4. The third driving mechanism 1 drives the bearing device 4 to rotate through a synchronous belt. In this embodiment, the stirring member may include a plurality of stirring paddles. Wherein each stirring paddle can be a linear rod-shaped structure, a T-shaped structure, a cubic structure and the like. The plurality of stirring paddles may be arranged at intervals in the circumferential direction. In the illustrated example, each of the first stirring member 81 and the second stirring member 82 includes four stirring paddles having a substantially square structure, and the four stirring paddles are arranged in a substantially cross shape as a whole.
In addition, in other examples, the stirring member may also include a stirring paddle. Wherein each stirring paddle can be a linear rod-shaped structure, a T-shaped structure, a cubic structure and the like.
Further, in some other examples, the stirring member may include one or more impellers. The impeller may be provided in an arcuate or linear configuration. When the stirring member comprises a plurality of impellers, the plurality of impellers may be distributed crosswise, for example the plurality of impellers may be arranged in 2 crossed leaves or 3 crossed leaves or t-shaped leaves, etc.
In a preferred embodiment, the rotation direction of the wafer 78 is opposite to the rotation direction of the carrier 4, so that the rotation direction of the wafer 78 is opposite to the revolving direction of the stirring member. The rotation direction of the wafer 78 and the rotation direction of the at least one stirring member may be opposite. The rotation direction of the wafer 78 and the rotation direction of the carrier 4 may be the same.
In addition, in other embodiments, the first driving mechanism can also be in transmission connection with the stirring piece. The first driving mechanism drives the wafer 78 to rotate circumferentially and drives the stirring member to rotate. In this way, the first driving mechanism can simultaneously drive the wafer 78 and the stirring member to rotate.
In this embodiment, as shown in fig. 10 to 12, a spray head 32 may be disposed on the plating bath. The showerhead 32 is configured to spray water onto the surface of the wafer 78. The showerhead 32 is an insulating material. For example, the spray head 32 may be provided as a tube structure. The inner wall of the electroplating liquid tank is provided with a collecting tank 30.
When the nozzle 32 sprays water onto the surface of the wafer 78, the first driving mechanism drives the wafer 78 to rotate, so that the water sprayed on the surface of the wafer 78 is thrown out and collected in the collecting tank 30.
Therefore, by arranging the spray head 32 and the collecting tank 30, the surface of the wafer 78 can be cleaned, unnecessary impurities on the surface of the wafer 78 are avoided, only required metal ions are plated on the surface of the wafer 78, and the electroplating effect of the wafer 78 is better.
As shown in fig. 12, the collection trough 30 may be provided with an opening 300. The opening 300 is diametrically opposed to the wafer 78. When the wafer 78 rotates, the clean water on the wafer can be thrown out to the collecting tank 30, so as to prevent the water sprayed on the surface of the wafer 78 from entering the electroplating solution tank to mix with the electroplating solution, thereby preventing the electroplating solution from being diluted.
In order to collect the water thrown off by the rotation of the wafer 78 in the collecting groove 30, the collecting groove 30 is extended from the opening 300 toward the inside of the plating bath in the axial direction. Thus, the collection tank 30 can independently collect water thrown off when the wafer 78 rotates, and the collected water does not flow out to be mixed with the plating liquid in the plating liquid tank.
In one embodiment, as shown in the figure, when the nozzle 32 sprays water onto the surface of the wafer 78, the first driving mechanism drives the wafer 78 to rotate, and the water sprayed onto the surface of the wafer 78 can be thrown off along the tangential direction of the circumference and collected in the collecting tank 30, so as to avoid falling into the plating solution tank to dilute the plating solution.
In this embodiment, the second drive mechanism drives the wafer chuck 72 and the wafer 78 to move axially and can drive the wafer 78 to move axially from the plating position to the cleaning position.
When the second driving mechanism drives the wafer 78 to move axially to the plating position, the wafer 78 is immersed in the plating solution tank, so that the wafer 78 can be plated.
When the second driving mechanism drives the wafer 78 to move axially to the cleaning position, the wafer 78 moves axially to the plating solution separated from the plating solution tank, and the wafer 78 can be located above the liquid level of the plating solution and can be cleaned by the nozzle 32.
In the electroplating process, the stirring device can stir the electroplating solution in the electroplating solution tank, the electroplating solution is uniformly distributed, the first driving mechanism can drive the wafer to rotate, metal ions can be more uniformly electroplated on the surface of the wafer, the phenomenon that the metal ions are unevenly electroplated on the surface of the wafer due to uneven distribution of potential lines is avoided, the use is convenient, and the electroplating effect is good.
The second driving mechanism can drive the cathode wafer to move along the axial direction, the position of the cathode wafer can be adjusted, the distance between the anode and the cathode wafer can be adjusted according to needs, and therefore the potential difference between the anode and the cathode wafer is adjusted, a better electroplating effect can be obtained, and the electroplating precision is high.
Through setting up shower nozzle and collecting vat, can wash the wafer surface, avoid the wafer surface to have unnecessary impurity, the wafer surface only has plated required metal ion, and the electroplating effect of wafer is better.
The embodiments of the present invention are merely illustrative, and not restrictive, of the scope of the claims, and other substantially equivalent alternatives may occur to those skilled in the art and are within the scope of the present invention.
Claims (14)
1. Wafer electroplating equipment that wafer can be rinsed, its characterized in that includes:
the inner wall of the electroplating liquid tank is provided with a collecting tank;
a cover which covers the electroplating solution tank;
a wafer rotatably mounted on the lid;
the first driving mechanism is used for driving the wafer to rotate;
the spray head is arranged on the electroplating bath solution and is used for spraying water to the surface of the wafer;
when the spray head sprays water to the surface of the wafer, the first driving mechanism drives the wafer to rotate, so that the water sprayed from the surface of the wafer is thrown out and collected in the collecting tank.
2. The wafer plating apparatus of claim 1, wherein:
the collecting tank is provided with an opening, and the opening is opposite to the wafer in the radial direction;
the collecting groove extends towards the interior of the electroplating liquid groove from the opening along the axial direction.
3. The wafer plating apparatus of claim 1, wherein:
the spray head is arranged on the inner wall of the electroplating bath solution; the water spraying direction of the spray head is obliquely arranged relative to the surface of the wafer.
4. The wafer plating apparatus of claim 1, wherein:
the cover comprises a wafer holder; the wafer is fixedly arranged on the wafer clamping piece;
the first driving mechanism comprises a first transmission shaft, and the wafer clamping piece is circumferentially fixed on the first transmission shaft;
the first driving mechanism is configured to drive the first transmission shaft to rotate, so as to drive the wafer clamping mechanism to rotate circumferentially.
5. The wafer plating apparatus of claim 4, wherein:
the first driving mechanism comprises a first rotating motor, a first driving wheel and a second driven wheel;
the first driving wheel is circumferentially fixed on a first output shaft of the first rotating motor;
the first transmission shaft is circumferentially fixed on the driven wheel;
the first driving wheel drives the first driven wheel to rotate through a transmission belt.
6. The wafer plating apparatus of claim 4, further comprising:
a second drive mechanism configured to drive the wafer chuck and the wafer to move axially and to enable the wafer to move axially from an electroplating position to a rinse position;
at the electroplating position, the wafer is immersed in the electroplating solution tank;
in the flushing position, the wafer is axially moved to be separated from the electroplating solution in the electroplating solution tank so as to be washed by the water sprayed by the spray head.
7. The wafer plating apparatus of claim 6, wherein:
the second driving mechanism is in transmission connection with the first transmission shaft and is used for driving the first transmission shaft to move along the axial direction, so that the wafer clamping piece is driven to move along the axial direction.
8. The wafer plating apparatus of claim 7, wherein:
the second driving mechanism comprises a second rotating motor, a second driving wheel, a second driven wheel and a bearing seat;
the second driven wheel is axially fixed on the mounting seat; the bearing seat is circumferentially fixed on the mounting seat; the bearing block is sleeved on the first transmission shaft through a bearing;
a second output shaft of the second rotating motor is circumferentially fixed on the second driving wheel and is used for driving the second driving wheel to rotate;
the second driving wheel is meshed with the second driven wheel and is used for driving the second driven wheel to rotate;
the driven wheel is provided with an internal thread, and the bearing seat is provided with an external thread; the second driven wheel is sleeved with the internal thread of the bearing seat and used for driving the bearing seat and the first transmission shaft to move axially.
9. The wafer plating apparatus of claim 8, wherein:
the second rotating motor is mounted on the mounting seat;
a top fixing plate is fixedly connected to the bearing seat, and a first guide piece is arranged on the top fixing plate;
and a second guide piece is arranged on the mounting seat and is matched with the first guide piece to limit the bearing seat to move along the axial direction.
10. The wafer plating apparatus of claim 9, wherein:
the number of the first guide pieces is at least two;
the number of the second guide pieces is equal to that of the first guide pieces and corresponds to that of the first guide pieces respectively;
the second guide part is matched with the corresponding first guide part, so that the bearing seat is circumferentially fixed.
11. The wafer plating apparatus of claim 9, wherein:
the first guide part is a guide post, and the second guide part is a guide hole; the guide post is inserted into the guide hole.
12. The wafer plating apparatus of claim 8, wherein:
the mounting seat can be provided with an axial fixing piece, and the axial fixing piece is provided with two blocking pieces which are axially arranged at intervals; the second driven wheel is axially fixed between the two blocking pieces.
13. The wafer plating apparatus of claim 6, wherein:
the cover also comprises a mounting seat which is covered on the electroplating liquid tank; the first driving mechanism and the second driving mechanism are respectively installed on the installation seat.
14. The wafer plating apparatus of claim 4, wherein:
the wafer clamping piece is provided with a wafer accommodating groove for fixedly mounting a wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010462975.1A CN111593391A (en) | 2020-05-27 | 2020-05-27 | Wafer electroplating equipment with wafer capable of being washed |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010462975.1A CN111593391A (en) | 2020-05-27 | 2020-05-27 | Wafer electroplating equipment with wafer capable of being washed |
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| CN111593391A true CN111593391A (en) | 2020-08-28 |
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| CN202010462975.1A Pending CN111593391A (en) | 2020-05-27 | 2020-05-27 | Wafer electroplating equipment with wafer capable of being washed |
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| CN112725867A (en) * | 2020-12-23 | 2021-04-30 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Working method of rotary shearing mechanism for stirring plating solution in horizontal film-coating spray cup of wafer |
| WO2023040465A1 (en) * | 2021-09-14 | 2023-03-23 | 盛美半导体设备(上海)股份有限公司 | Electroplating apparatus |
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