CN113966085A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN113966085A CN113966085A CN202111277271.8A CN202111277271A CN113966085A CN 113966085 A CN113966085 A CN 113966085A CN 202111277271 A CN202111277271 A CN 202111277271A CN 113966085 A CN113966085 A CN 113966085A
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- routing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application discloses circuit board and manufacturing method thereof, the circuit board includes: a substrate having opposing first and second surfaces; the wiring is positioned in the substrate, one end of the wiring is exposed out of the first surface, and the other end of the wiring is exposed out of the second surface; the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes; for any one of the conductive through holes and the two routing segments connected with the conductive through holes, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition. According to the technical scheme, back drilling is required to be carried out on the second surface at most, back drilling is not required to be carried out on the first surface, and a single-sided back drilling process is required at most, so that the manufacturing process of the circuit board is simple, and the circuit board has low manufacturing cost.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
With the continuous development of science and technology, more and more electronic devices are widely applied to daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present.
The main component of an electronic device for mounting and connecting electronic components is a circuit board. In the field of special circuit boards such as high-speed back boards, back drilling is increasingly applied. The back drilling is to adopt a larger drill bit to carry out depth control drilling on the metalized conductive through hole, and remove part of the metalized inner wall of the metalized conductive through hole so as to avoid the problems of reflection, scattering, delay and the like of high-speed signal transmission.
In the existing circuit board, a double-sided back drill is needed, so that the manufacturing process of the circuit board is complex and the manufacturing cost is high.
Disclosure of Invention
In view of this, the present application provides a circuit board and a method for manufacturing the same, and the scheme is as follows:
a circuit board, the circuit board comprising:
a substrate having opposing first and second surfaces;
the wiring is positioned in the substrate, one end of the wiring is exposed out of the first surface, and the other end of the wiring is exposed out of the second surface;
the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes;
for any one of the conductive through holes and the two routing segments connected with the conductive through holes, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition.
Preferably, in the circuit board, if a second distance between the route segment and the second surface meets the back drilling condition, a back drilling hole is formed between the route segment and the second surface to eliminate a stub formed by a conductive through hole connected with the route segment and located between the route segment and the second surface;
and if the second distance between the route segment and the second surface does not meet the back drilling condition, retaining a stub formed by a conductive through hole between the route segment and the second surface and connected with the route segment.
Preferably, in the above circuit board, at most the second distance satisfies a back drilling condition, including:
at most said second distance is greater than 1/4 mm.
Preferably, in the above circuit board, the substrate includes a plurality of film layers stacked in sequence; at least one layer of film includes the wire segments.
Preferably, in the circuit board, at least one first line segment is provided, and the distance between the first line segment and the first surface does not satisfy the back drilling condition;
the first routing section is close to one side of the second surface through other routing sections connected with the conductive through holes.
Preferably, in the above circuit board, the circuit board includes a plurality of film layers stacked in sequence; the multilayer film layers are sequentially a 1 st film layer to an Nth film layer in a direction from the first surface to the second surface, N is a positive integer not less than 10, and the first route segment is located on any one of the 1 st film layer to the 3 rd film layer.
The application also provides a manufacturing method of the circuit board, which comprises the following steps:
preparing a substrate having first and second opposing surfaces; the substrate is internally provided with a wire, one end of the wire is exposed out of the first surface, and the other end of the wire is exposed out of the second surface; the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes; for any one conductive through hole and the two routing segments connected with the conductive through hole on different layers, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition;
and forming a back drilling hole opposite to the conductive through hole connected with the line segment on the second surface for the line segment meeting the back drilling condition.
Preferably, in the above manufacturing method, the method of manufacturing the substrate includes:
sequentially laminating a plurality of film layers, wherein at least one film layer comprises the line segment;
forming via holes penetrating through the substrate corresponding to two ends of the line segment in a direction perpendicular to the substrate;
and forming a conductive material in the via hole to form a conductive through hole connected with the routing section.
Preferably, in the above manufacturing method, a method of forming a conductive material in the via hole includes:
depositing a metal layer on the side wall of the via hole;
or filling a conductive material in the via hole.
The application also provides an electronic device comprising the circuit board.
As can be seen from the above description, in the circuit board and the manufacturing method thereof provided in the present application, the circuit board includes: a substrate having opposing first and second surfaces; the wiring is positioned in the substrate, one end of the wiring is exposed out of the first surface, and the other end of the wiring is exposed out of the second surface; the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes; for any one of the conductive through holes and the two routing segments connected with the conductive through holes, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition. According to the technical scheme, the second distance at most meets the back drilling condition, so that back drilling is required to be carried out on the second surface at most, back drilling is not required to be carried out on the first surface, and a single-sided back drilling process is required at most, so that the manufacturing process of the circuit board is simple and has lower manufacturing cost.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in related arts, the drawings used in the description of the embodiments or prior arts will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
The structures, proportions, and dimensions shown in the drawings and described in the specification are for illustrative purposes only and are not intended to limit the scope of the present disclosure, which is defined by the claims, but rather by the claims, it is understood that these drawings and their equivalents are merely illustrative and not intended to limit the scope of the present disclosure.
FIG. 1 is a schematic diagram of a circuit board before back drilling;
FIG. 2 is a schematic structural diagram of the circuit board shown in FIG. 1 after back drilling;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic flow chart of a manufacturing method according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a circuit board before a back drilling process according to an embodiment of the present application;
fig. 6 is a schematic flow chart illustrating a substrate manufacturing method according to an embodiment of the present disclosure.
Detailed Description
Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the application are shown, and in which it is to be understood that the embodiments described are merely illustrative of some, but not all, of the embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a circuit board before back drilling, and fig. 2 is a schematic structural diagram of the circuit board shown in fig. 1 after back drilling, in this way, the circuit board includes a substrate 10, and the substrate 10 has a trace therein. The tracks comprise track segments 11 and conductive vias 12.
Specifically, the substrate 10 is provided with the routing segments 11, the routing segments 11 extend in a direction (horizontal direction in fig. 1 and 2) parallel to the substrate 10, in order to facilitate connection between the routing segments 11 or connection between the routing segments 11 and a circuit on the surface of the circuit board, a conductive through hole 12 penetrating through the substrate 10 needs to be provided, and the conductive through hole 12 extends in a direction (vertical direction in fig. 1 and 2) perpendicular to the substrate 10.
Depending on the actual connection requirements of the circuit, only a wiring path as shown by the dashed line in fig. 1 and 2 is required, which may result in a longer stub 14 in the conductive via 12. The stub 14 causes problems of reflection, scattering, and delay of high-speed signal transmission, and in order to solve these problems and improve the integrity of the high-speed signal, a back-drilled hole 13 is formed at the position of the stub 14 through a back-drilling process to remove the stub 14 through the back-drilled hole 13.
In the manner shown in fig. 2, due to the stubs 14 having a large length in both the first surface and the second surface, the routing layout manner results in the circuit board needing to be subjected to a double-sided back drilling process, i.e., the upper surface and the lower surface of the substrate 10 need to be subjected to a back drilling process to eliminate the stubs 14. However, compared with the single-sided back drilling process, the double-sided back drilling process has the disadvantages of complex manufacturing process, high manufacturing cost and 4% higher manufacturing cost. In addition, under the condition that the material of a Printed Circuit Board (PCB) is more and more expensive, how to manufacture the PCB by a single-sided back drilling process instead of a double-sided back drilling process is a problem to be solved urgently in the technical field of the PCB.
In view of this, an embodiment of the present application provides a circuit board and a manufacturing method thereof, where the circuit board includes:
a substrate having opposing first and second surfaces;
the wiring is positioned in the substrate, one end of the wiring is exposed out of the first surface, and the other end of the wiring is exposed out of the second surface;
the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes;
for any one of the conductive through holes and the two routing segments connected with the conductive through holes, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition.
In the circuit board in the embodiment of the application, at most the second distance meets the back drilling condition, so that back drilling is required to be performed on the second surface at most, back drilling is not required to be performed on the first surface, and at most a single-sided back drilling process is required, so that the circuit board is simple in manufacturing process and has lower manufacturing cost.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
As shown in fig. 3, fig. 3 is a schematic structural diagram of a circuit board provided in an embodiment of the present application, where the circuit board includes:
a substrate 20, the substrate 20 having opposing first and second surfaces S1, S2;
one end D1 of the trace 21 is exposed at the first surface S1, and the other end D2 is exposed at the second surface S2;
the trace 21 includes a plurality of trace segments 211, and an extending direction of the trace segments 211 and the substrate 20 satisfy a parallel condition; the wire sections 211 are connected through conductive through holes 22;
for any one of the conductive vias 22 and the two wire segments 211 connected thereto, the wire segment 211 close to the first surface S1 has a first distance H1 from the first surface S1, the wire segment 211 close to the second surface S2 has a second distance H2 from the second surface S2, and at most the second distance H2 satisfies a backdrilling condition.
The extending direction of the routing segment 211 and the substrate 20 satisfy the parallel condition, that is, the extending direction of the routing segment 211 is parallel or approximately parallel to the substrate 20, that is, the extending direction of the routing segment 211 is parallel or approximately parallel to the first surface S1/the second surface S2. In the manner shown in fig. 3, the extending direction of the line segment 211 is the horizontal direction in fig. 3, and is parallel to the first surface S1/the second surface S2.
The extending direction of the conductive via 22 and the substrate 20 satisfy a vertical condition, that is, the extending direction of the conductive via 22 is perpendicular or approximately perpendicular to the substrate 20, that is, the extending direction of the conductive via 22 is perpendicular or approximately perpendicular to the first surface S1/the second surface S2. In the manner shown in fig. 3, the extending direction of the conductive via 22 is the vertical direction in fig. 3, and is perpendicular to the first surface S1/the second surface S2.
In the circuit board according to the embodiment of the present application, since the second distance H2 at most satisfies the back drilling condition, the back drilling is performed at most on the second surface S2 to form the back drilled hole 23, and the back drilling is not performed on the first surface S1. Therefore, only one single-side back drilling process is needed at most, so that the manufacturing process of the circuit board is simple and the manufacturing cost is low.
As shown in fig. 3, if the second distance H2 between the line segment 211 and the second surface S2 satisfies the back drilling condition, a back drilled hole 23 is formed between the line segment 211 and the second surface S2 to eliminate a stub 24 formed by a conductive through hole 22 between the line segment 211 and the second surface S1 and connected with the line segment 211; if the second distance H2 between the line segment 211 and the second surface S2 does not satisfy the backdrilling condition, stub 24 formed by the conductive via 22 between the line segment 211 and the second surface S2 connected by the line segment 211 is retained.
Wherein the second distance H2 is greater than the first distance H1. Since the second distance H2 is large and at most the second distance H2 satisfies the back drilling condition, when the second distance H2 satisfies the back drilling condition, only the stub 24 with a large length needs to be removed by the back drilling process on the second surface S2, and the stub 24 with the length of the second distance H2 needs to be removed by the back drilling process because the stub has a large length and has a large influence on high-speed signals.
And the first distance H1 does not satisfy the back drilling condition, so that the stub 24 formed by the conductive via 22 connected to the running line segment 211 and located between the running line segment 211 and the first surface S1 and the stub 24 with the length of the first distance H1 can be retained, and because the stub 24 has a small length, the stub has a small influence on high-speed signals and does not need to be eliminated by the back drilling process.
In the circuit board according to the embodiment of the present application, at most the second distance H2 satisfies a back drilling condition, including: at most the second distance H2 is greater than 1/4 mm. Specifically, the second distance H2 is greater than 1/4mm, the first distance H1 is not greater than 1/4mm, or neither the second distance H2 nor the first distance H1 is greater than 1/4 mm.
It is easy to understand that, in the direction perpendicular to the substrate 20, the two line segments 211 passing through the same conductive via 22 are parallel and not collinear. For any one of the conductive vias 22 and the two line segments 211 connected thereto, in a direction perpendicular to the substrate 20, the conductive via 22 is divided into three parts by the two line segments 211 connected thereto, a middle part located between the two line segments 211 is used for connecting the two line segments 211, and the other two parts on both sides of the middle part are stubs 24 having lengths equal to a first distance H1 and a second distance H2, respectively.
In the circuit board according to the embodiment of the present application, the substrate 20 includes a plurality of film layers 201 stacked in sequence; at least one of the film layers 201 includes the routing segments 211. The film layer 201 including the routing segment 211 is made of metal, and the routing segment 211 can be realized by patterning a metal layer. The substrate 20 includes at least one metal film 201, and when there are multiple metal films 201, there is an insulating film 201 between two adjacent metal films 201.
In the circuit board of the embodiment of the application, at least one first route segment is provided, and the distance between the first route segment and the first surface S1 does not satisfy the back drilling condition; the other trace segments connected by the first trace segment through the conductive via 22 are located on one side of the first trace close to the second surface S2. In the manner shown in fig. 3, two line segments 211 are shown, and the right line segment 211 is the first line segment, so that by setting the first line segment, the length of the stub 24 communicating with the first surface S1 is reduced, thereby avoiding the back drilling process on the first surface S1.
In the circuit board according to the embodiment of the present application, the circuit board includes a plurality of film layers 201 stacked in sequence; the multilayer film 201 is sequentially a 1 st film to an nth film in a direction from the first surface S1 to the second surface S2, N is a positive integer not less than 10, and the first line segment is located in any one of the 1 st film to the 3 rd film. Generally, in a circuit board requiring high-speed signal transmission, the number of layers of the film layer 201 is not less than 10, and the first routing section is arranged on any one of the 1 st film layer to the 3 rd film layer, so that the first distance does not satisfy the back drilling condition.
It should be noted that, in the embodiment of the present application, the number of the routing segments 211 and the positions of the film layers in the substrate 20 may be set based on requirements and are not limited to the manner shown in fig. 3. There may be one or more first route segments. When there are a plurality of first running line segments, different first running line segments may be adjacent to or spaced apart from each other by at least one non-first running line segment in a direction parallel to the substrate 20.
Based on the circuit board described in the foregoing embodiment, another embodiment of the present application further provides a manufacturing method of a circuit board, as shown in fig. 4 and fig. 5, fig. 4 is a schematic flow diagram of the manufacturing method provided in the embodiment of the present application, fig. 5 is a schematic structural diagram of the circuit board before back drilling process in the embodiment of the present application, the manufacturing method is used for manufacturing the circuit board described in the foregoing embodiment, and as shown in fig. 3 to fig. 5, the manufacturing method includes:
step S11: preparing a substrate 20, the substrate 20 having a first surface S1 and a second surface S2 opposite; the substrate 20 is provided with a trace 21, one end D1 of the trace 21 is exposed on the first surface S1, and the other end D2 is exposed on the second surface S2; the trace 21 includes a plurality of trace segments 211, and an extending direction of the trace segments 211 and the substrate 20 satisfy a parallel condition; the wire sections 211 are connected through the conductive through holes 22; for any one of the conductive vias 22 and the two routing segments 211 connected to the same layer, the routing segment 211 close to the first surface S1 has a first distance H1 from the first surface S1, the routing segment 211 close to the second surface S2 has a second distance H2 from the second surface S2, and at most the second distance H2 satisfies a back drilling condition.
Step S12: for the routing segments 211 meeting the backdrilling condition, backdrilling holes 23 opposite to the conductive through holes 22 connected with the routing segments 211 are formed on the second surface S2.
In the manufacturing method of the embodiment, the required first distance H1 and second distance H2 are set by setting the film layer position of the routing segment in the substrate 20, so that at most the second distance H2 meets the back drilling condition, and at most only the back drilling process needs to be performed on the second surface S2 to form the back drilling hole 23, so as to eliminate the stub 24 close to the second surface S2, and the back drilling process does not need to be performed on the first surface S1, so that the manufacturing process of the circuit board is simple and the manufacturing cost is low.
As shown in fig. 6, fig. 6 is a schematic flow chart of a substrate manufacturing method according to an embodiment of the present application, where the method for manufacturing the substrate includes:
step S21: sequentially laminating a plurality of film layers, wherein at least one film layer comprises the line segment;
step S22: forming via holes penetrating through the substrate corresponding to two ends of the line segment in a direction perpendicular to the substrate;
step S23: and forming a conductive material in the via hole to form a conductive through hole connected with the routing section.
The positions of the line segments in all film layers of the substrate can be set, so that the back drilling condition can be met at most by the second distance, the circuit board is prepared through a single-sided back drilling process, a double-sided back drilling process is not needed, the manufacturing process is simple, and the manufacturing cost is low.
In the manufacturing method of the embodiment of the application, the method for forming the conductive material in the via hole comprises the following steps:
depositing a metal layer on the side wall of the via hole; the metal layer may be a conductive metal such as copper or silver.
Or, filling a conductive material in the via hole, where the conductive material may be graphite, metal, or the like.
Based on the above embodiment, another embodiment of the present application further provides an electronic device, where the electronic device includes the circuit board described in the above embodiment.
The electronic equipment can be any electronic device with a circuit board, such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, furniture appliances, intelligent wearable equipment and the like.
The electronic equipment adopts the electronic equipment of the embodiment, the circuit board for transmitting the high-speed signal does not need a double-sided back drilling process, the manufacturing process is simple, and the manufacturing cost is low.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. For the electronic device and the manufacturing method disclosed by the embodiment, since the electronic device and the manufacturing method correspond to the circuit board disclosed by the embodiment, the description is relatively simple, and relevant points can be described by referring to the corresponding part of the circuit board.
It should be noted that in the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only used for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A circuit board, the circuit board comprising:
a substrate having opposing first and second surfaces;
the wiring is positioned in the substrate, one end of the wiring is exposed out of the first surface, and the other end of the wiring is exposed out of the second surface;
the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes;
for any one of the conductive through holes and the two routing segments connected with the conductive through holes, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition.
2. The circuit board of claim 1, wherein if a second distance between the route segment and the second surface meets the back drilling condition, a back drilling hole is formed between the route segment and the second surface to eliminate stubs formed by conductive through holes connected with the route segment and located between the route segment and the second surface;
and if the second distance between the route segment and the second surface does not meet the back drilling condition, retaining a stub formed by a conductive through hole between the route segment and the second surface and connected with the route segment.
3. The circuit board of claim 1, at most the second distance satisfying a back-drilling condition, comprising:
at most said second distance is greater than 1/4 mm.
4. The circuit board of claim 1, the substrate comprising a plurality of film layers stacked in sequence; at least one layer of film includes the wire segments.
5. The circuit board of claim 1, having at least one first run segment that is at a distance from the first surface that does not satisfy the backdrilling condition;
the other routing sections of the first routing section connected through the conductive through hole are positioned on one side of the first routing section close to the second surface.
6. The circuit board of claim 5, comprising a plurality of film layers stacked in sequence; the multilayer film layers are sequentially a 1 st film layer to an Nth film layer in a direction from the first surface to the second surface, N is a positive integer not less than 10, and the first route segment is located on any one of the 1 st film layer to the 3 rd film layer.
7. A method of fabricating a circuit board, the method comprising:
preparing a substrate having first and second opposing surfaces; the substrate is internally provided with a wire, one end of the wire is exposed out of the first surface, and the other end of the wire is exposed out of the second surface; the routing comprises a plurality of routing segments, and the extending direction of the routing segments and the substrate meet the parallel condition; the wire sections are connected through conductive through holes; for any one conductive through hole and the two routing segments connected with the conductive through hole on different layers, a routing segment close to the first surface has a first distance from the first surface, a routing segment close to the second surface has a second distance from the second surface, and at most the second distance meets the back drilling condition;
and forming a back drilling hole opposite to the conductive through hole connected with the line segment on the second surface for the line segment meeting the back drilling condition.
8. The method of manufacturing of claim 7, the method of preparing the substrate comprising:
sequentially laminating a plurality of film layers, wherein at least one film layer comprises the line segment;
forming via holes penetrating through the substrate corresponding to two ends of the line segment in a direction perpendicular to the substrate;
and forming a conductive material in the via hole to form a conductive through hole connected with the routing section.
9. The method of fabricating of claim 8, the method of forming a conductive material within the via comprising:
depositing a metal layer on the side wall of the via hole;
or filling a conductive material in the via hole.
10. An electronic device comprising a circuit board as claimed in any one of claims 1-6.
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| CN202111277271.8A CN113966085B (en) | 2021-10-29 | 2021-10-29 | Circuit board and manufacturing method thereof |
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| CN202111277271.8A CN113966085B (en) | 2021-10-29 | 2021-10-29 | Circuit board and manufacturing method thereof |
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| US20050161255A1 (en) * | 2003-12-19 | 2005-07-28 | Hitachi, Ltd. | Multi-layer wiring board |
| US20150180104A1 (en) * | 2013-12-19 | 2015-06-25 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Reduced backdrilling with quarter wavelength transmission line stubs |
| CN205883702U (en) * | 2016-07-04 | 2017-01-11 | 深圳市一博科技有限公司 | Avoid via hole back drilling's PCB wiring structure |
| CN107846780A (en) * | 2017-11-01 | 2018-03-27 | 郑州云海信息技术有限公司 | A kind of method of the cabling in pcb board |
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| CN113966085B (en) | 2023-07-21 |
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