CN113950464A - 整体陶瓷体和组件 - Google Patents

整体陶瓷体和组件 Download PDF

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Publication number
CN113950464A
CN113950464A CN202080039060.8A CN202080039060A CN113950464A CN 113950464 A CN113950464 A CN 113950464A CN 202080039060 A CN202080039060 A CN 202080039060A CN 113950464 A CN113950464 A CN 113950464A
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China
Prior art keywords
ceramic body
monolithic ceramic
pores
complementary
monolithic
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CN202080039060.8A
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Inventor
马克·汉普登-史密斯
弗兰切斯卡·米里
迈克尔·麦加恩
博亚娜·兰特
埃曼努埃尔·西马迪瑞斯
迈克尔·森德
保罗·W·雷里格
帕特里克·阮万努奥伊
S·L·达哈尔
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Saint Gobain Ceramics and Plastics Inc
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Saint Gobain Ceramics and Plastics Inc
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Publication of CN113950464A publication Critical patent/CN113950464A/zh
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    • C04B38/06Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
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Abstract

本发明公开一种整体陶瓷体,所述整体陶瓷体可包括第一部分,所述第一部分包括限定孔互连网络的多个孔;和第二部分,所述第二部分与所述第一部分整体形成并限定所述整体陶瓷体的周边表面的至少一部分,其中所述第二部分可包括至少一个互补接合结构。在另一个实施例中,本发明公开一种多孔陶瓷组件,所述多孔陶瓷组件可包括通过第一互补接合结构和第二互补接合结构彼此联接的整体陶瓷体中的至少两者。

Description

整体陶瓷体和组件
技术领域
本公开涉及一种包括限定互连网络的多个孔的整体陶瓷体和一种包括通过互补接合结构彼此联接的整体陶瓷体中的至少两者的组件。
背景技术
包含互连孔的限定多孔结构的复杂三维陶瓷体的制造可以在广泛的领域中,例如在涉及过滤、绝缘或用于催化剂载体的应用中得到应用。
需要制备具有受控多孔结构的陶瓷体,使得孔结构可以适合任何特定需要和应用。
发明内容
在一个实施例中,一种整体陶瓷体可包括第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括至少一个互补接合结构。
在另一个实施例中,一种整体陶瓷体可包括第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分;其中当在由陶瓷体的长度和宽度限定的平面中观察时,整体陶瓷体包括非多边形二维形状。
在进一步的实施例中,一种整体陶瓷体可包括第一部分,所述第一部分包括限定多个孔的陶瓷基体结构,所述多个孔限定延伸穿过陶瓷体的孔互连网络;第二加强部分,所述第二加强部分与第一部分整体形成并延伸穿过第一部分并且具有比陶瓷基体的长度、宽度或厚度中的至少一个尺寸大的相应尺寸。
在一个实施例中,一种多孔陶瓷组件可包括:至少一个第一整体陶瓷体,所述至少一个第一整体陶瓷体包括:第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;和第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括第一互补接合结构;以及至少一个第二整体陶瓷体,所述至少一个第二整体陶瓷体包括:第二互补接合结构,其中第一整体陶瓷体和第二整体陶瓷体经由第一互补接合结构和第二互补接合结构彼此联接。
在又一实施例中,一种用于制备整体陶瓷体的工艺可包括:通过增材制造工艺形成整体生坯,其中生坯包含陶瓷颗粒和粘合剂;通过热处理去除生坯的粘合剂;以及在至少700℃的温度下烧结生坯以获得陶瓷体,其中陶瓷体包括第一部分,所述第一部分包括限定孔互连网络的多个孔;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括至少一个互补接合结构。
附图说明
通过参考附图,可以更好地理解本公开,并且让本公开的众多特征和优点对于本领域的技术人员显而易见。
图1包括根据一个实施例的整体陶瓷体的透视图的图示。
图2包括根据一个实施例的整体陶瓷体的透视图的图示。
图3包括根据一个实施例的整体陶瓷体的透视图的图示。
图4包括根据一个实施例的整体陶瓷体的透视图的图示。
图5包括根据一个实施例的整体陶瓷体的透视图的图示。
图6包括根据一个实施例的整体陶瓷体的透视图的图示。
图7包括根据一个实施例的整体陶瓷体的透视图的图示。
图8包括根据一个实施例的整体陶瓷体的透视图的图示。
图9A包括根据一个实施例的用于形成多孔陶瓷组件的包括互补接合结构的两个整体陶瓷体的俯视图的图示。
图9B包括根据一个实施例的多孔陶瓷组件的透视图的图示,所述多孔陶瓷组件包括彼此联接的第一整体陶瓷体和第二整体陶瓷体。
图10A包括根据一个实施例的在实例1中获得的整体陶瓷体(左)和相应生坯(右)的透视侧视图像。
图10B包括根据一个实施例的在实例1中获得的整体陶瓷体(左)和相应生坯(右)的俯视图像。
图11A包括根据一个实施例的整体陶瓷体的俯视图像。
图11B包括根据一个实施例的图11A中所示的整体陶瓷体的透视侧视图像。
图12A包括根据一个实施例的整体陶瓷体的俯视图像。
图12B包括根据一个实施例的图12A中所示的整体陶瓷体的透视侧视图像。
具体实施方式
如本文所用,术语“由...构成”、“包括”、“包含”、“具有”、“有”或它们的任何其他变型旨在涵盖非排他性的包含之意。例如,包含特征列表的工艺、方法、物件或装置不一定仅限于相应的特征,而是可包括没有明确列出或这类工艺、方法、物件或装置所固有的其他特征。
如本文所用,除非另有明确说明,否则“或”是指包括性的“或”而非排他性的“或”。例如,以下任何一项均可满足条件A或B:A为真(或存在的)而B为假(或不存在的)、A为假(或不存在的)而B为真(或存在的),以及A和B两者都为真(或存在的)。
而且,使用“一个”或“一种”来描述本文所述的要素和组分。这样做仅是为了方便并且给出本发明范围的一般性意义。除非很明显地另指他意,否则这种描述应被理解为包括一个或至少一个,并且单数也包括复数。
现在将参考附图仅以举例的方式描述本公开的各种实施例。
在一个实施例中,本公开涉及一种整体陶瓷体,所述整体陶瓷体包括多个孔,所述多个孔限定孔互连网络作为第一部分。整体陶瓷体还包括与第一部分整体形成的第二部分,其中第二部分可以包括至少一个互补接合结构。接合结构可以允许将整体陶瓷体中的至少两者彼此联接或将整体陶瓷体固定到更大的结构。本公开的整体陶瓷体可适用于其中需要互连开孔结构或这种结构具有优势的多种应用。非限制性实例可为过滤器、用于催化剂的载体结构、绝缘材料、电极材料、用于电池的支架或生物支架。
图1说明整体陶瓷体的实施例,其中第一部分包含形成互连网络(11)的多个孔,并且第二部分(12)位于第一部分的一侧表面处,其中第二部分包含非多边形凹痕形式的互补接合结构(13)。
如本文所用,术语互补接合结构是指它是突起(凸结构单元)或凹痕(凹结构单元),其中突起和凹痕具有彼此匹配的结构并且可以将例如两个整体陶瓷体彼此联接,或者可以将整体陶瓷体附接到保持构造。一方面,突起可为第一互补接合结构,并且凹痕可为第二互补接合结构。在特定方面,突起和凹痕可具有非多边形结构,类似于拼图游戏的互连单元(通常称为凸片和坯件)。
图2说明与图1类似的结构,其中第二部分(22)位于包括多个互连孔(21)的第一部分的一侧表面上,并且第二部分(22)包括具有非多边形形状的突起的互补接合结构(23)。
图3说明了一个实施例,其中第一部分的多孔结构(31)在相对侧表面上包含第二部分(32),并且一个第二部分包括突起作为互补接合结构(33a),而另一个第二部分包括凹痕作为互补接合结构(33b)。
在图4中,示出了一个实施例,其中第一部分(41)的多孔结构完全被第二部分(42)包围,并且每个侧表面包括一个互补接合结构(43a和43b)。
图5示出了整体陶瓷体的实施例,其中第一部分包含多个互连孔(51),而第二部分是互补接合结构,每个侧表面(53a和53b)上有一个。
在另一个实施例中,本公开的整体陶瓷体可包含整体形成在包含多个孔的第一部分内的加强部分。这种实施例的实例在图7中说明。在该实施例中,多个孔(71)由两个对角交叉的壁结构(73)稳定。
图8示出了整体陶瓷体的实施例,其中多个孔(81)的第一部分整体连接到包围内孔结构的框架(82)形式的第二部分,并且由此可以例如在过滤过程期间防止侧壁泄漏。
图6是具有带有受控孔隙率的复杂多孔结构和互连孔结构的整体陶瓷体的图示。
在另一个实施例中,本公开涉及一种多孔陶瓷组件,其中上述整体陶瓷体中的至少两者经由第一互补接合结构和第二互补接合结构彼此联接。在图9A和图9B中可以看到包含本公开的两个整体陶瓷体的组件的图示。在图9A中,示出了两个整体陶瓷体(具有相同结构的第一整体陶瓷体和第二整体陶瓷体),其中每个侧表面包含一个互补接合结构,具有接合结构的两个相对侧表面是突起(93a),即第一互补接合结构,而具有接合结构的另外两个相对侧表面是凹痕(93b),即第二互补接合结构。图9B说明了图9A的两个整体陶瓷体可如何经由第一互补接合结构和第二互补接合结构彼此联接的实施例。
实施例
实施例1.一种整体陶瓷体,所述整体陶瓷体包括第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括至少一个互补接合结构。
实施例2.一种整体陶瓷体,所述整体陶瓷体包括第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分;并且其中当在由陶瓷体的长度和宽度限定的平面中观察时,整体陶瓷体包括非多边形二维形状。
实施例3.一种整体陶瓷体,所述整体陶瓷体包括:第一部分,所述第一部分包括:
限定多个孔的陶瓷基体结构,所述多个孔限定延伸穿过陶瓷体的孔互连网络;第二加强部分,所述第二加强部分与第一部分整体形成并延伸穿过第一部分并且具有比陶瓷基体的长度、宽度或厚度中的至少一个尺寸大的相应尺寸。
实施例4.一种多孔陶瓷组件,所述多孔陶瓷组件包括:至少一个第一整体陶瓷体,所述至少一个第一整体陶瓷体包括:第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过整体陶瓷体的一部分的孔互连网络;和第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括至少一个第一互补接合结构,以及至少一个第二整体陶瓷体,所述至少一个第二整体陶瓷体包括:第二互补接合结构,其中第一整体陶瓷体和第二整体陶瓷体经由至少一个第一互补接合结构和至少一个第二互补接合结构彼此联接。
实施例5.根据实施例4所述的多孔陶瓷组件,其中第二整体陶瓷体包括第一部分,所述第一部分包括限定互连网络的多个孔,所述互连网络具有与第一整体陶瓷体的第一部分的所述多个孔相同的结构。
实施例6.根据实施例4所述的多孔陶瓷组件,其中第二整体陶瓷体包括第一部分,所述第一部分包括限定互连网络的多个孔,所述互连网络具有与第一整体陶瓷体的第一部分的所述多个孔不同的结构。
实施例7.根据前述实施例中任一项所述的整体陶瓷体,其中第一部分的所述多个孔具有至少20微米的平均孔径,并且第一部分的总孔隙率为至少50体积%。
实施例8.根据前述实施例中任一项所述的整体陶瓷体,其中第一部分的所述多个孔具有不大于10cm的平均孔径,并且第一部分的总孔隙率为至少50体积%。
实施例9.根据实施例7所述的整体陶瓷体,其中第一部分的所述多个孔的平均孔径为至少30微米、至少50微米、至少100微米、至少200微米、至少500微米、至少800微米、至少1000微米、至少2000微米、至少5000微米、至少1cm、至少2cm或至少5cm。
实施例10.根据实施例7所述的整体陶瓷体,其中第一部分的总孔隙率为至少55体积%、至少60体积%、至少70体积%、至少80体积%、至少85体积%或至少90体积%。
实施例11.根据实施例7所述的整体陶瓷体,其中第一部分的总孔隙率不大于99体积%,诸如不大于97体积%、不大于95体积%、不大于85体积%、不大于80体积%或不大于70体积%。
实施例12.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分的总孔隙率小于第一部分的总孔隙率。
实施例13.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分的开孔率小于第一部分的开孔率。
实施例14.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分的总孔隙率小于第一部分的总孔隙率。
实施例15.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分的平均孔径小于第一部分的平均孔径。
实施例16.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分的密度大于第一部分的密度。
实施例17.根据前述实施例中任一项所述的整体陶瓷体,其中第二部分具有小于50体积%的孔隙率和至少10nm且不大于1cm的平均孔径。
实施例18.根据实施例17所述的整体陶瓷体,其中第二部分的平均孔径不大于0.5cm、不大于0.1cm、不大于500微米、不大于200微米、不大于100微米、不大于50微米、不大于20微米、不大于10微米、不大于1微米、不大于0.5微米、不大于0.3微米、不大于0.1微米、不大于0.05微米或不大于0.02微米。
实施例19.根据实施例17所述的整体陶瓷体,其中第二部分的孔隙率不大于40体积%、或不大于30体积%、或不大于25体积%、或不大于20体积%、或不大于15体积%、或不大于10体积%、或不大于5体积%或不大于3体积%。
实施例20.根据前述实施例中任一项所述的整体陶瓷体,其中限定互连网络的所述多个孔占总孔隙率的至少80%、或至少85%、或至少90%、或至少95%、或至少96%、或至少97%、或至少98%或至少99%。
实施例21.根据前述实施例中任一项所述的整体陶瓷体,其中所述多个孔具有不大于0.2的尺寸变化,其中尺寸变化计算为(P90–P10)/P50,其中P90为90%的孔的孔径,P10为10%的孔的孔径,并且P50为50%的孔的孔径。
实施例22.根据实施例1至20中任一项所述的整体陶瓷体,其中第一部分的所述多个孔包括从第一部分的第一外表面到第一部分的第二外表面的平均孔径的尺寸梯度。
实施例23.根据实施例1至20中任一项所述的整体陶瓷体,其中尺寸梯度使平均孔径从第一外表面到第二外表面减小至少20%,诸如至少30%、至少40%、至少50%、至少60%、至少70%、至少80%或至少90%。
实施例24.根据前述实施例中任一项所述的整体陶瓷体,其中陶瓷包含氧化物、碳化物、氮化物、硼化物或其任何组合。
实施例25.根据实施例24所述的整体陶瓷体,其中陶瓷包含氧化铝、二氧化硅、堇青石、碳化硅、氧化锆、锆石、碳化钨、氮化硅、六方氮化硼、立方氮化硼、SiAlON或其任何组合。
实施例26.根据前述实施例中任一项所述的整体陶瓷体,其中整体陶瓷体包含玻璃质材料、多晶材料、单晶材料或其组合。
实施例27.根据前述实施例中任一项所述的整体陶瓷体,其中陶瓷体为过滤器、催化剂载体、绝缘材料、电极材料、用于反应器的保护床、用于电池的支架、用于燃料电池的材料或生物支架。
实施例28.根据实施例27所述的整体陶瓷体,其中陶瓷体为过滤器。
实施例29.根据实施例28所述的整体陶瓷体,其中过滤器适用于熔融金属过滤。
实施例30.根据实施例2或3所述的整体陶瓷体,其中第二部分还包括至少一个互补接合结构。
实施例31.根据实施例1或30所述的整体陶瓷体,其中所述至少一个互补接合结构包括至少一个第一互补接合结构和至少一个第二互补接合结构。
实施例32.根据实施例31所述的整体陶瓷体,其中所述至少一个第一互补接合结构包括凹坑并且所述至少一个第二互补接合结构包括突起。
实施例33.根据实施例31或32所述的整体陶瓷体,其中第一互补接合结构的形状是非多边形,并且第二互补接合结构的形状与第一互补接合结构的形状互补。
实施例34.根据实施例1或实施例30至33中任一项所述的整体陶瓷体,其中整体陶瓷体包括矩形结构,并且至少一个互补接合结构在陶瓷体的整个厚度上位于整体陶瓷体的侧表面的中心。
实施例35.根据实施例1或实施例30至33中任一项所述的整体陶瓷体,其中整体陶瓷体包括矩形结构,并且两个侧表面中的每一者在陶瓷体的整个厚度上均包括一个互补接合结构。
实施例36.根据实施例1或实施例30至33中任一项所述的整体陶瓷体,其中整体陶瓷体包括矩形结构,并且四个侧表面中的每一者在陶瓷体的整个厚度上包括互补接合结构。
实施例37.根据实施例1或实施例30至33中任一项所述的整体陶瓷体,其中整体陶瓷体包括圆形结构,并且至少一个互补接合结构在陶瓷体的整个厚度上位于整体陶瓷体的圆周处。
实施例38.一种用于制备整体陶瓷体的工艺,所述工艺包括:通过增材制造工艺形成整体生坯,其中生坯包含陶瓷颗粒和粘合剂;通过热处理去除生坯的粘合剂;以及在至少700℃的温度下烧结生坯以获得陶瓷体,其中陶瓷体包括第一部分,所述第一部分包括限定孔互连网络的多个孔;第二部分,所述第二部分与第一部分整体形成并限定整体陶瓷体的周边表面的至少一部分,其中第二部分包括至少一个互补接合结构。
实施例39.根据实施例38所述的工艺,其中增材制造工艺是基于粉末的三维打印工艺,其包括以交替顺序:形成陶瓷粉末层,以及在粉末层的顶部上选择性地打印液体粘合剂。
实施例40.根据实施例39所述的工艺,其中陶瓷粉末包含氧化物、碳化物、氮化物、硼化物或其任何组合。
实施例41.根据实施例40所述的工艺,其中陶瓷粉末包含氧化铝、二氧化硅、堇青石、碳化硅、氧化锆、锆石、碳化钨、氮化硅、六方氮化硼、立方氮化硼、SiAlON或其任何组合。
实例
以下非限制性实例说明本发明。
实例1
三维堇青石体的增材制造。
使用ExOne的Innovent 3D打印机,经由粘合剂喷射工艺打印出由堇青石颗粒和粘合剂制成的生坯。用于粘合剂喷射打印的粉末材料是平均粒径为20微米的堇青石粉末。液体粘合剂BA005是打印机制造商的专有产品。
提供给打印机的CAD模型的数字图像如图4所示。互连孔结构41具有约1000微米的平均内孔尺寸直径。通过重复滚下陶瓷粉末的薄层并随后将液体粘合剂喷射到粉末层的与提供给打印机的数字图像相对应的所选择的位置来进行打印。重复形成粉末层然后喷射粘合剂的步骤,直到形成完整的生坯。
打印出生坯后,将整个构建体积放置在温度为180℃的干燥箱中四小时,以完全固化粘合剂。此后,用压缩空气从生坯中除去任何粘合剂未饱和的松散粉末。脱粉的生坯(101)的图像如图10A所示。
脱粉后,将生坯以5℃/min的速度加热至600℃,并在600℃下保持30分钟以去除粘合剂。之后,通过以5℃/min的速度进一步升温至1300℃来烧结脱粘体,在最高烧结温度下保持6小时,并且以5℃/min的速度冷却。
图10A示出了在烧结(102)之后获得的对应整体陶瓷体旁边的生坯(101)的透视图像。图10B是示出实例1的生坯(101)和烧结体(102)的俯视图的图像。可以看出,在烧结后,所获得的陶瓷体与生坯相比发生了一些收缩。烧结体中的多个孔的内孔直径为约1000微米,并且该尺寸的所有孔互连并开放。
实例2
陶瓷氧化铝体的增材制造。
使用氧化铝和玻璃的粉末混合物来打印生坯。粘合剂和3D打印机与实例1相同。
提供给打印机的数字图像是直径为50毫米的圆形本体,1毫米厚的实心区域框在过滤器的外圆周(第二部分),而本体的中心部分(第一部分)包含直径为1000微米的随机取向的互连孔。
在180℃下固化粘合剂,去除任何松散粉末,并在600℃下热处理以去除粘合剂(均以与实例1相同的方式进行)后,通过将温度升高至915℃来烧结脱粘体,在915℃下保持8小时,然后自然冷却至室温。
图11A和图11B示出了烧结过滤器的俯视图和透视侧视图的图像。测得的内孔直径在750微米至1250微米的范围内,并且这个尺寸的所有孔都是互连和开放的。烧结体在尺寸和形状上与原始数字图像非常相似。
实例3
包含加强部分的陶瓷氧化铝体的增材制造。
使用与实例2中所述相同的材料和打印工艺来打印具有相同直径尺寸的圆形生坯,不同之处在于提供给打印机的数字图像包含在不允许液体通过并具有为过滤器提供更多稳定性的功能的多个孔密集区域的区域之间。图12A和图12B提供了烧结过滤器的俯视图和侧视图。这种陶瓷体的孔结构是随机取向的,其中孔径在750微米至1250微米的范围内。这个尺寸的所有孔都是互连和开放的。陶瓷体在尺寸和形状上与原始数字图像非常相似。
在上述说明书中,参考具体实施例描述了这些概念。然而,本领域普通技术人员理解,可以在不脱离下面权利要求书所述的本发明的范围的情况下进行各种修改和变化。因此,说明书和附图被视为例示性的而非限制性的,并且所有这些修改都将被包括在本发明的范围内。

Claims (15)

1.一种整体陶瓷体,所述整体陶瓷体包括:
第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过所述整体陶瓷体的一部分的孔互连网络;
第二部分,所述第二部分与所述第一部分整体形成并限定所述整体陶瓷体的周边表面的至少一部分,其中所述第二部分包括至少一个互补接合结构。
2.一种多孔陶瓷组件,所述多孔陶瓷组件包括:
至少一个第一整体陶瓷体,所述至少一个第一整体陶瓷体包括:
第一部分,所述第一部分包括多个孔,所述多个孔限定延伸穿过所述整体陶瓷体的一部分的孔互连网络;和
第二部分,所述第二部分与所述第一部分整体形成并限定所述整体陶瓷体的周边表面的至少一部分,其中所述第二部分包括至少一个第一互补接合结构;以及
至少一个第二整体陶瓷体,所述至少一个第二整体陶瓷体包括:
至少一个第二互补接合结构,
其中所述至少一个第一整体陶瓷体和所述至少一个第二整体陶瓷体经由所述至少一个第一互补接合结构和所述至少一个第二互补接合结构彼此联接。
3.根据权利要求2所述的多孔陶瓷组件,其中所述第二整体陶瓷体包括第一部分,所述第一部分包括限定互连网络的多个孔,所述互连网络具有与所述第一整体陶瓷体的所述第一部分的所述多个孔相同的结构。
4.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中所述第一部分的所述多个孔具有至少30微米的平均孔径,并且所述第一部分的总孔隙率为至少50体积%。
5.根据权利要求4所述的整体陶瓷体,其中所述第一部分的所述多个孔具有至少500微米的平均孔径。
6.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中所述第二部分的平均孔径小于所述第一部分的平均孔径,并且所述第二部分具有小于50体积%的孔隙率。
7.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中限定互连网络的所述第一部分的所述多个孔占所述第一部分的所述总孔隙率的至少80%。
8.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中所述第一部分的所述多个孔包括从所述第一部分的第一外表面到所述第一部分的第二外表面的所述平均孔径的尺寸梯度,其中所述尺寸梯度使所述平均孔径从所述第一外表面到所述第二外表面减小至少20%。
9.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中所述陶瓷包含氧化物、碳化物、氮化物、硼化物或其任何组合。
10.根据权利要求1、2和3中任一项所述的整体陶瓷体,其中所述陶瓷体为过滤器、催化剂载体、绝缘材料、电极材料、用于反应器的保护床、用于电池的支架、用于燃料电池的材料或生物支架。
11.根据权利要求1所述的整体陶瓷体,其中所述至少一个互补接合结构包括至少一个第一互补接合结构和至少一个第二互补接合结构。
12.根据权利要求2或11所述的整体陶瓷体,其中所述至少一个第一互补接合结构包括凹坑并且所述至少一个第二互补接合结构包括突起。
13.根据权利要求2或11所述的整体陶瓷体,其中所述至少一个第一互补接合结构的形状是非多边形,并且所述至少一个第二互补接合结构的形状与所述至少一个第一互补接合结构的所述形状互补。
14.根据权利要求1所述的整体陶瓷体,其中所述整体陶瓷体包括矩形结构,并且两个侧表面中的每一者在所述陶瓷体的整个厚度上包括一个互补接合结构。
15.一种用于制备整体陶瓷体的工艺,所述工艺包括:
通过增材制造工艺形成整体生坯,其中所述生坯包含陶瓷颗粒和粘合剂;
通过热处理去除所述生坯的所述粘合剂;以及
在至少700℃的温度下烧结所述生坯以获得所述陶瓷体,
其中所述陶瓷体包括第一部分,所述第一部分包括限定孔互连网络的多个孔;第二部分,所述第二部分与所述第一部分整体形成并限定所述整体陶瓷体的周边表面的至少一部分,其中所述第二部分包括至少一个互补接合结构。
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