CN113949448A - Optical module receiving optical power monitoring method and optical module - Google Patents
Optical module receiving optical power monitoring method and optical module Download PDFInfo
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- CN113949448A CN113949448A CN202010686901.6A CN202010686901A CN113949448A CN 113949448 A CN113949448 A CN 113949448A CN 202010686901 A CN202010686901 A CN 202010686901A CN 113949448 A CN113949448 A CN 113949448A
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- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
- H04B10/075—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal
- H04B10/079—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
- H04B10/0795—Performance monitoring; Measurement of transmission parameters
- H04B10/07955—Monitoring or measuring power
Abstract
The application provides an optical module received optical power monitoring method and an optical module, when the method is used for LOS alarm, an LOS threshold value at the temperature is determined according to the acquired current temperature of a transimpedance amplifier chip, and the LOS threshold value changes along with the change of the temperature of the transimpedance amplifier chip, so that even if the bottom noise value of the transimpedance amplifier chip changes along with the temperature, the LOS signal can be accurately reported. In addition, when the method is used for monitoring the receiving optical power of the optical module in real time: according to a background noise value corresponding to the current temperature of the trans-impedance amplification chip; removing a bottom noise value from an initial value of a signal output by the transimpedance amplifier chip, and taking the removed bottom noise value as an effective value of the signal output by the transimpedance amplifier chip; and then according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the received optical power, the optical power value corresponding to the effective value is used as the received optical power of the optical module, so that the received optical power of the optical module can be accurately monitored at different temperatures.
Description
Technical Field
The present application relates to the field of optical fiber communication technologies, and in particular, to a method for monitoring received optical power of an optical module and an optical module.
Background
The optical module is an electronic component having a photoelectric conversion function and an electro-optical conversion function, and has wide application in an optical fiber network system. At present, in order to facilitate maintenance and management of an optical fiber link and to improve the reliability of operation of an optical fiber network system, an upper computer generally needs to monitor the operation state of an optical module in real time.
In the working process of the optical module, the receiving optical power of the optical module is one of important information to be monitored. For example, the received optical power value is written into a memory through an MCU (micro control Unit) of the optical module; the upper computer can monitor the running state of the optical module in real time by reading the written value in the memory of the optical module so as to quickly find and position system faults; and determining whether to generate an RX _ LOS (LOSs of reception, LOS for short) signal according to a comparison result of the received optical power and a preset threshold value so as to indicate whether the optical module detects the optical signal, wherein when the received optical power is lower than the preset threshold value, the RX _ LOS signal is generated so that the upper computer can know the optical signal receiving condition of the optical module through the state of the LOS signal and perform corresponding operation if necessary.
The optical module obtains the received optical power by using a sampling circuit to collect an electrical signal output by a transimpedance amplifier. However, most transimpedance amplifier chips have an inherent noise, i.e., they output an electrical signal in the absence of an optical signal and vary with the temperature of the chip. However, the ground noise interferes with the real signal output, and further affects the monitoring of the received optical power, resulting in inaccurate LOS signal reporting and inaccurate monitoring of the running state of the optical module by the upper computer.
Disclosure of Invention
The embodiment of the application provides a received optical power monitoring method for an optical module and the optical module, aiming at the problem that the existing transimpedance amplification chip has inherent noise and influences received optical power monitoring.
According to a first aspect of an embodiment of the present application, a method for monitoring received optical power of an optical module is provided, including:
acquiring the current temperature of the transimpedance amplification chip;
determining an LOS threshold corresponding to the current temperature according to a preset corresponding relation between the temperature of the transimpedance amplifier chip and the LOS threshold, and sending the LOS threshold to an LOS signal generation module;
the LOS signal generating module is used for outputting an LOS signal when the size of the signal output by the transimpedance amplification chip is lower than the LOS threshold value; the LOS threshold value of the optical module changes along with the change of the temperature of the transimpedance amplification chip.
According to a second aspect of the embodiments of the present application, there is provided another optical module received optical power monitoring method, including:
acquiring the current temperature of the transimpedance amplification chip;
determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature;
removing the noise floor value from the initial value of the signal output by the transimpedance amplifier chip, and taking the noise floor value as an effective value of the signal output by the transimpedance amplifier chip;
and according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the receiving optical power, taking the optical power value corresponding to the effective value as the receiving optical power of the optical module.
According to a third aspect of an embodiment of the present application, there is provided an optical module, including:
a circuit board;
the photoelectric conversion chip is electrically connected with the circuit board and is used for converting optical signals into electric signals;
the transimpedance amplification chip is electrically connected with the photoelectric conversion chip and is used for amplifying the electric signal;
the microprocessor is arranged on the circuit board and used for acquiring the current temperature of the transimpedance amplifier chip and determining the LOS threshold value under the temperature according to the temperature value;
and the LOS signal generating module is respectively electrically connected with the microprocessor and the transimpedance amplifier chip and is used for outputting an LOS signal to the microprocessor when the magnitude of the signal output by the transimpedance amplifier chip is lower than the LOS threshold value.
According to a fourth aspect of the embodiments of the present application, there is provided another optical module, including:
a circuit board;
the photoelectric conversion chip is electrically connected with the circuit board and is used for converting optical signals into electric signals;
the transimpedance amplification chip is electrically connected with the photoelectric conversion chip and is used for amplifying the electric signal;
the microprocessor is electrically connected with the transimpedance amplification chip;
the microprocessor is configured to: acquiring the current temperature of the transimpedance amplification chip; determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature; removing the noise floor value from the initial value of the signal output by the transimpedance amplifier chip, and taking the noise floor value as an effective value of the signal output by the transimpedance amplifier chip; and according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the receiving optical power, taking the optical power value corresponding to the effective value as the receiving optical power of the optical module.
The embodiment of the application provides a method for monitoring the received optical power of an optical module and the optical module, when the method is used for LOS alarm, the LOS threshold value at the temperature is determined according to the acquired current temperature of a transimpedance amplifier chip, and the LOS threshold value changes along with the change of the temperature of the transimpedance amplifier chip, so that even if the bottom noise value of the transimpedance amplifier chip changes along with the change of the temperature, the LOS signal can be accurately reported.
When the method is used for monitoring the receiving optical power of the optical module in real time: firstly, determining a bottom noise value of a transimpedance amplifier chip corresponding to the current temperature according to the acquired current temperature of the transimpedance amplifier chip; then, after removing a bottom noise value from the initial value of the signal output by the transimpedance amplifier chip, the bottom noise value is used as an effective value of the signal output by the transimpedance amplifier chip; and finally, according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the received light power, the light power value corresponding to the effective value is used as the received light power of the optical module, and therefore accurate monitoring of the received light power of the optical module at different temperatures can be achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
fig. 4 is an exploded schematic view of an optical module structure according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an exploded structure of a receiving end (local) of an optical module according to an embodiment of the present invention;
fig. 6 is a block diagram of an internal structure of an optical module according to an embodiment of the present invention;
fig. 7 is a schematic basic flow chart of a method for monitoring received optical power of an optical module according to an embodiment of the present application;
fig. 8 is a basic flowchart of another optical module received light power monitoring method according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.
The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;
one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.
An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.
The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.
The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.
The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.
Fig. 3 is a schematic diagram of an optical module structure according to an embodiment of the present invention, and fig. 4 is an exploded schematic diagram of an optical module structure according to an embodiment of the present invention, as shown in fig. 3 and fig. 4, an optical module 200 according to an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a light emission submodule 301, and a light reception submodule 400.
The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.
The two openings may be two openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitter sub-module 301 and the optical receiver sub-module 400 inside the optical module; the photoelectric devices such as the circuit board 300, the light-emitting sub-module 301 and the light-receiving sub-module 400 are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the transmitter sub-module 301, the receiver sub-module 400 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.
The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is located in a packaging cavity formed by the upper shell and the shell, and the circuit board 300 is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps of selecting chips to be set according to the requirements of products, wherein common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, an amplitude limiting amplifier LA chip, a power management chip and the like.
The transimpedance amplifier chip is closely associated with the light receiving chip, the short-distance wiring design can ensure good received signal quality, and in one packaging form of the optical module, the transimpedance amplifier chip and the light receiving chip are packaged together in an independent packaging body, such as the same coaxial tube shell TO or the same square cavity; the independent packaging body is independent of the circuit board 300, and the light receiving chip and the foot-spanning amplifying chip are electrically connected with the circuit board 300 through the independent packaging body; in another package form of the optical module, the light receiving chip and the transimpedance amplifier chip may be disposed on the surface of the circuit board 300 without using a separate package. Of course, the light receiving chip may be packaged separately, and the transimpedance amplifier chip may be disposed on the circuit board 300, so that the received signal quality may also meet some relatively low requirements.
The chip on the circuit board 300 may be an all-in-one chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of each circuit do not disappear due to the integration, and only the circuit form is integrated. Therefore, when the circuit board 300 is provided with three independent chips, namely, the MCU, the laser driving chip and the amplitude limiting amplifier chip, the scheme is equivalent to that when a single chip with three functions is provided on the circuit.
The circuit board 300 has a golden finger on the surface of its end, the golden finger is composed of a pin independent from each other, the circuit board 300 is inserted into the electric connector in the cage, and the golden finger is electrically connected with the upper computer.
The circuit board 300 is a carrier of main electrical components of the optical module, and the electrical components not arranged on the circuit board 300 are finally electrically connected to the circuit board 300, and the electrical connector on the circuit board 300 realizes the electrical connection between the optical module and the host computer thereof. The electrical connector typically used by the optical module is a gold finger.
The optical module further includes a transmitter optical subassembly and a receiver optical subassembly, which may be collectively referred to as an optical subassembly. As shown in fig. 4, the optical module provided in the embodiment of the present invention includes a tosa 301 and a rosa 400, and the tosa and the rosa are arranged on the surface of the circuit board 300 in a staggered manner, which is beneficial to achieve a better electromagnetic shielding effect.
The tosa 301 is disposed on the surface of the circuit board 300, and in another common packaging method (such as a coaxial TO package), the tosa is packaged independently, physically separated from the circuit board 300, and electrically connected through a flexible board; the rosa 400 is disposed on the surface of the circuit board 300, and in another common packaging method (such as a coaxial TO package), the rosa is packaged separately and physically separated from the circuit board 300, and is electrically connected through a flexible board.
Fig. 5 is a schematic diagram of an exploded structure of a receiving end (local) of an optical module according to an embodiment of the present invention. Fig. 5 shows that the optical module according to the embodiment of the present invention includes a circuit board 300 and an optical receive sub-module 400. The optical receive sub-module 400 is disposed on the surface of the circuit board 300, and the optical receive sub-module 400 includes an optical receive chip 401, an optical waveguide 402, a transimpedance amplifier chip 500, and an amplitude limiting amplifier chip 600.
The light receiving chip 401, the transimpedance amplification chip 500 and the amplitude limiting amplification chip 600 are respectively arranged on the surface of the circuit board and electrically connected with the circuit board; the optical waveguide 402 is located above the light receiving chip 401, the light-sensitive surface of the light receiving chip 401 faces the optical waveguide 402, and light carrying a mixed frequency signal is transmitted into the light receiving chip 401 through the optical waveguide 402.
The light receiving chip 401 is a chip used by a receiving end of the optical module to receive a light signal, after the light signal is incident on a photosensitive surface of the light receiving chip, the light receiving chip 401 generates a current signal by using a photoelectric conversion effect, and in a process of converting light into current, a carrier of the signal is changed, but information is not changed. The signal output by the light receiving chip is usually an analog signal, and the common light receiving chip is a PIN photodiode or a photo avalanche diode APD.
The photocurrent generated by the light receiving chip 401 is transmitted to the transimpedance amplifier chip 500, and the photocurrent is amplified by the transimpedance amplifier chip 500 and then output to the amplitude limiting amplifier chip 600. In addition, the transimpedance amplification chip 500 may also integrate a conversion circuit to convert the current for reception into a voltage signal.
In addition, the circuit board 30 is further provided with a sampling circuit 800, and the signal output by the transimpedance amplifier chip 500 is converted into a signal that can be received by the microprocessor 700 and then transmitted to the microprocessor 700, for example, the signal output by the transimpedance amplifier chip 500 is a current signal, but the microprocessor 700 can only receive a voltage signal, and then the current signal output by the transimpedance amplifier chip 500 is converted into a voltage signal of a preset magnitude by using the sampling circuit 800 and then transmitted to the microprocessor 700. Of course, in other embodiments, the transimpedance amplifier chip 500 and the microprocessor 700 can also be electrically connected directly.
The microprocessor 700 implements the received optical power strength detection function according to the received signal. For the received optical power strength detection, a monitoring bit may be set in a register inside the microprocessor 700 to implement real-time monitoring of the received optical power, and a LOS alarm bit may be set to indicate whether the optical module detects an optical signal at this time. Fig. 6 is a block diagram of an internal structure of an optical module according to an embodiment of the present invention.
As shown in fig. 6, the output end of the transimpedance amplifier chip 500 is connected to the input end of the first sampling circuit 801, the output end of the first sampling circuit 801 is electrically connected to the LOS signal generating module 900, and the LOS signal generating module 900 compares the magnitude of the received electrical signal with a preset threshold, where it can be set that when the optical module does not receive an optical signal or the received optical signal is lower than the threshold, that is, the received electrical signal is lower than the preset threshold, an LOS signal is output, if a high level signal is output to the microprocessor 700, and after the microprocessor 700 receives the signal, a first preset value is written into the LOS alarm bit to prompt the upper computer that no signal is input or the signal is lost; on the contrary, when the optical signal received by the optical module is higher than the threshold, that is, the electrical signal received by the optical module is higher than the preset threshold, the LOS signal is not output, if a low level signal is output to the microprocessor 700, and after the microprocessor 700 receives the signal, the first preset value in the LOS alarm bit is changed into the second preset value, where the second preset value may be a default value after the module is powered on. And the upper computer learns the optical signal receiving condition of the optical module through the state of the LOS signal and performs corresponding operation if necessary.
At present, the setting method of the preset threshold value for LOS alarm generally includes: after the light receiving chip 401, the transimpedance amplification chip 500 and the amplitude limiting amplification chip 600 are assembled, a preset threshold is firstly found out through a plurality of module samples, then the preset threshold is verified through a small batch of modules, the preset threshold is adjusted according to the verification condition, and then the preset threshold is solidified. However, most transimpedance amplifier chips 500 have an inherent noise, i.e., they output an electrical signal in the absence of an optical signal and vary with the temperature of the chip. Since the ground noise interferes with the real signal output, if the above-mentioned fixed preset threshold is continuously adopted, the problem of LOS alarm abnormality will be caused.
Therefore, the embodiment of the present application further provides that the microprocessor 700 is electrically connected to the LOS signal generating module 900, wherein the microprocessor 700 is configured to: firstly, acquiring the current temperature of the transimpedance amplification chip 500; then, according to the preset correspondence between the temperature of the transimpedance amplifier chip and the LOS threshold, the LOS threshold corresponding to the current temperature is determined, and the LOS threshold is sent to the LOS signal generation module, so that the LOS signal generation module 900 compares the received LOS threshold with the signal input by the first sampling circuit 801.
Since the bottom noise of the transimpedance amplifier chip 500 is a quantity that changes with temperature, the relationship of the bottom noise value of the transimpedance amplifier chip that changes with temperature can be fitted by collecting the bottom noise values of the transimpedance amplifier chip 500 at different temperatures, and certainly, the relationship can also be a corresponding relationship table of the bottom noise value and the temperature. Further, based on the different bottom noise values of the transimpedance amplifier chip 500 at different temperatures, different LOS thresholds are set according to the different bottom noise values of the transimpedance amplifier chip 500, and then a function of the LOS threshold changing along with the bottom noise is obtained, which may be a corresponding relation table of the LOS threshold and the bottom noise. Furthermore, the setting method corresponding to the correspondence between the temperature of the transimpedance amplifier chip 500 and the LOS threshold is as follows: firstly, determining a bottom noise value corresponding to the current temperature according to the change relation of the bottom noise value of a preset transimpedance amplification chip along with the temperature, specifically, the change relation can be a table look-up mode, a function calculation mode and the like; and determining an LOS threshold corresponding to the bottom noise value according to the change relation of the preset LOS threshold along with the bottom noise. Of course, the change relationship of the LOS threshold value along with the temperature of the transimpedance amplifier chip may also be obtained based on the change relationship of the bottom noise value of the transimpedance amplifier chip along with the temperature and the change relationship of the LOS threshold value along with the bottom noise, so that the MCU may directly obtain the LOS threshold value corresponding to the temperature according to the temperature of the transimpedance amplifier chip.
By setting the threshold values at different temperatures by the microprocessor 700, the influence of the variation of the bottom noise value of the transimpedance amplification chip with the temperature can be eliminated, and the LOS signal can be accurately reported.
Further, as shown in fig. 6, when the module receives real-time monitoring of the optical power, the output terminal of the transimpedance amplifier chip 500 is connected to the input terminal of the second sampling circuit 802, the output terminal of the second sampling circuit 802 is electrically connected to the microprocessor 700, and after receiving the signal, the microprocessor 700 performs analog-to-digital conversion on the signal, converts the signal into a corresponding optical power value, and writes the optical power value into a preset monitoring bit. The upper computer can monitor the running state of the optical module in real time by reading the written value in the monitoring position so as to quickly find and position system faults. The second sampling circuit 802 and the first sampling circuit 801 may be integrated into a single circuit.
However, the bottom noise of the transimpedance amplifier chip 500 affects the detection result of the received optical power value, so that the upper computer may misjudge the operation state of the optical module. To address this issue, the microprocessor 700 in the present embodiment is further configured to: firstly, acquiring the current temperature of the transimpedance amplification chip 500; then, according to a preset corresponding relation between the temperature of the transimpedance amplification chip and the background noise, determining a background noise value corresponding to the current temperature, and removing the background noise value from an initial value of a signal output by the transimpedance amplification chip to serve as an effective value of the signal output by the transimpedance amplification chip; and finally, according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the received light power, the light power value corresponding to the effective value is used as the received light power of the optical module, and therefore accurate monitoring of the received light power of the optical module at different temperatures can be achieved.
It should be noted that, for the acquisition of the temperature of the transimpedance amplifier chip 500, a temperature monitoring module may be disposed at the transimpedance amplifier chip 500 and electrically connected to the microprocessor 700, or the temperature acquired by the temperature monitoring module inside the microprocessor 700 may be used as the temperature of the transimpedance amplifier chip 500, which may be in other manners.
Based on the above structure, this embodiment further provides a method for monitoring the received optical power of the optical module, which is used for receiving an LOS alarm of the optical power. Fig. 7 is a basic flowchart illustrating a method for monitoring received optical power of an optical module according to an embodiment of the present application. As shown in fig. 7, the method includes the steps of:
s110: and acquiring the current temperature of the transimpedance amplification chip.
S120: according to the preset corresponding relation between the temperature of the transimpedance amplifier chip and the LOS threshold, the LOS threshold corresponding to the current temperature is determined, and the LOS threshold is sent to the LOS signal generation module.
The LOS signal generating module is used for outputting an LOS signal when the size of the signal output by the transimpedance amplification chip is lower than the LOS threshold value; the LOS threshold value of the optical module changes along with the change of the temperature of the transimpedance amplification chip.
The embodiment also provides another method for monitoring the receiving optical power of the optical module, which is used for monitoring the receiving optical power in real time. Fig. 8 is a basic flowchart of another optical module received light power monitoring method according to an embodiment of the present application. As shown in fig. 8, the method includes the steps of:
s210: and acquiring the current temperature of the transimpedance amplification chip.
S220: and determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature.
S230: and removing the background noise value from the initial value of the signal output by the transimpedance amplifier chip, and taking the signal as an effective value of the signal output by the transimpedance amplifier chip.
S230: and according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the receiving optical power, taking the optical power value corresponding to the effective value as the receiving optical power of the optical module.
The present embodiment is described in a progressive manner, and the same and similar parts among the various embodiments in this specification may be referred to each other. Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A method for monitoring the receiving optical power of an optical module is characterized by comprising the following steps:
acquiring the current temperature of the transimpedance amplification chip;
determining an LOS threshold corresponding to the current temperature according to a preset corresponding relation between the temperature of the transimpedance amplifier chip and the LOS threshold, and sending the LOS threshold to an LOS signal generation module;
the LOS signal generating module is used for outputting an LOS signal when the size of the signal output by the transimpedance amplification chip is lower than the LOS threshold value; the LOS threshold value of the optical module changes along with the change of the temperature of the transimpedance amplification chip.
2. The method of claim 1, wherein determining the LOS threshold corresponding to the current temperature according to a preset correspondence between the temperature of the transimpedance amplifier chip and the LOS threshold comprises:
determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature;
and determining an LOS threshold corresponding to the bottom noise value according to the change relation of a preset LOS threshold along with the bottom noise.
3. A method for monitoring the receiving optical power of an optical module is characterized by comprising the following steps:
acquiring the current temperature of the transimpedance amplification chip;
determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature;
removing the noise floor value from the initial value of the signal output by the transimpedance amplifier chip, and taking the noise floor value as an effective value of the signal output by the transimpedance amplifier chip;
and according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the receiving optical power, taking the optical power value corresponding to the effective value as the receiving optical power of the optical module.
4. A light module, comprising:
a circuit board;
the photoelectric conversion chip is electrically connected with the circuit board and is used for converting optical signals into electric signals;
the transimpedance amplification chip is electrically connected with the photoelectric conversion chip and is used for amplifying the electric signal;
the microprocessor is arranged on the circuit board and used for acquiring the current temperature of the transimpedance amplifier chip and determining the LOS threshold value under the temperature according to the temperature value;
and the LOS signal generating module is respectively electrically connected with the microprocessor and the transimpedance amplifier chip and is used for outputting an LOS signal to the microprocessor when the magnitude of the signal output by the transimpedance amplifier chip is lower than the LOS threshold value.
5. The light module of claim 4, further comprising a sampling circuit, wherein:
the input end of the sampling circuit is electrically connected with the output end of the transimpedance amplifier chip, the output end of the sampling circuit is electrically connected with the input end of the LOS signal generation module, and the sampling circuit is used for converting a current signal output by the transimpedance amplifier chip into a voltage signal and outputting the voltage signal to the LOS signal generation module.
6. The optical module of claim 4, wherein determining the LOS threshold corresponding to the current temperature according to a preset correspondence between the temperature of the transimpedance amplifier chip and the LOS threshold comprises:
determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature;
and determining an LOS threshold corresponding to the bottom noise value according to the change relation of a preset LOS threshold along with the bottom noise.
7. A light module, comprising:
a circuit board;
the photoelectric conversion chip is electrically connected with the circuit board and is used for converting optical signals into electric signals;
the transimpedance amplification chip is electrically connected with the photoelectric conversion chip and is used for amplifying the electric signal;
the microprocessor is electrically connected with the transimpedance amplification chip;
the microprocessor is configured to: acquiring the current temperature of the transimpedance amplification chip; determining a bottom noise value corresponding to the current temperature according to a preset variation relation of the bottom noise value of the transimpedance amplification chip along with the temperature; removing the noise floor value from the initial value of the signal output by the transimpedance amplifier chip, and taking the noise floor value as an effective value of the signal output by the transimpedance amplifier chip; and according to the corresponding relation between the size of the signal output by the transimpedance amplification chip and the receiving optical power, taking the optical power value corresponding to the effective value as the receiving optical power of the optical module.
8. The light module of claim 7, further comprising a sampling circuit, wherein:
the input end of the sampling circuit is electrically connected with the output end of the transimpedance amplifier chip, the output end of the sampling circuit is electrically connected with the input end of the LOS signal generation module, and the sampling circuit is used for converting a current signal output by the transimpedance amplifier chip into a voltage signal and outputting the voltage signal to the microprocessor.
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