WO2020108294A1

WO2020108294A1 - Optical module

Info

Publication number: WO2020108294A1
Application number: PCT/CN2019/117825
Authority: WO
Inventors: 吴铁山
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2018-11-28
Filing date: 2019-11-13
Publication date: 2020-06-04
Also published as: CN109586787A

Abstract

The present application relates to an optical module, comprising a circuit board, a laser transmitter, and a first laser receiver. A surface of the circuit board has gold fingers, a control chip, a first drive chip, and a second drive chip. The first drive chip is connected to a transmission pin of the gold fingers. The second drive chip is connected to the control chip. The first drive chip and the second drive chip drive, in a time division manner, the laser transmitter to generate laser light having a first wavelength, and the laser light enters an external optical fiber, wherein the transmission pin provides transmission data to the first drive chip. The first laser receiver receives reflected light having the first wavelength from the external optical fiber. The first drive chip and the second drive chip in the present embodiment share the laser transmitter to achieve the effect that functions of the optical module all have a laser transmitter emitting light, thereby reducing required lasers by one, and reducing the volume and the package size of the optical module.

Description

Optical module

This application requires the priority of a Chinese patent application filed on November 28, 2018, with the application number 201811430687.7 and the invention titled "optical module", the entire contents of which are incorporated by reference in this application.

Technical field

This application relates to the technical field of optical communication, and in particular to an optical module.

Background technique

Optical time domain reflectometer (Optical Time Domain Reflectometer, OTDR) equipment is commonly used in the optical communication industry to analyze whether there are breakpoints and other faults in the optical fiber link. The OTDR device inputs a series of light waves into the optical fiber, and the light waves will be reflected back when they encounter different refractive index media. Then, the reflected optical signal is received on the same side of the input light wave, and the intensity of the optical signal (as a function of time) can be detected, and then it can be converted into the length of the optical fiber according to the intensity of the optical signal.

Summary of the invention

This application provides an optical module that integrates the optical time domain detection function on the basis of the original data transmission function.

An embodiment of the present application provides an optical module, including a circuit board, a laser emitter, and a first laser receiver. The surface of the circuit board has a gold finger, a control chip, a first driving chip, and a second driving chip; The firing pin of the gold finger is electrically connected, and the second driving chip is electrically connected to the control chip;

The first driving chip and the second driving chip drive the laser emitter in a time-sharing manner to generate laser light of a first wavelength, and the laser light of the first wavelength enters an external optical fiber; wherein, the transmitting pin provides transmission data to the first driving chip;

The first laser receiver receives the reflected light of the first wavelength from the external optical fiber.

BRIEF DESCRIPTION

In order to more clearly explain the technical solution of the present application, the following will briefly introduce the drawings that need to be used in the embodiments. Obviously, for those of ordinary skill in the art, without paying creative labor, Other drawings can also be obtained from these drawings.

Figure 1 is a schematic diagram of the connection relationship of optical communication terminals;

Figure 2 is a schematic diagram of the structure of an optical network terminal;

3 is a schematic structural diagram of an optical module provided by an embodiment of the present application;

4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present application;

5 is a schematic diagram of an internal structure of an optical module provided by an embodiment of the present application;

6 is a circuit diagram of an optical module in the prior art;

7 is another internal circuit diagram of an optical module provided by an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals that carry information to be transmitted in information transmission equipment such as optical fibers/optical waveguides, and the passive transmission characteristics of light in optical fibers/optical waveguides can be used to realize low-cost and low-loss information transmission; and information processing equipment such as computers Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.

The optical module realizes the above-mentioned mutual conversion function of the optical and electrical signals in the field of optical fiber communication technology, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the golden finger on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding. The electrical connection method using the golden finger has become an optical module The industry's mainstream connection method is based on this, and the definition of the pin on the gold finger has formed a variety of industry protocols/specifications.

FIG. 1 is a schematic diagram of the connection relationship of optical communication terminals. As shown in FIG. 1, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103;

One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is The optical network terminal 100 with the optical module 200 is completed.

The optical port of the optical module 200 is externally connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100; The optical module internally realizes the mutual conversion of the optical signal and the electrical signal, so as to realize the establishment of the information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted from the optical module to the electrical signal and input into the optical network terminal 100 The electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber. The optical module 200 is a tool for realizing mutual conversion of photoelectric signals, and does not have the function of processing data. In the above photoelectric conversion process, information only changes in the transmission carrier, and information does not change.

The optical network terminal has an optical module interface 102 for accessing the optical module 200 to establish a bidirectional electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104 for accessing the network cable 103 to establish a bidirectional electrical connection with the network cable 103 Signal connection; establish a connection between the optical module 200 and the network cable 103 through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the optical The upper computer of the module monitors the operation of the optical module. Unlike optical modules, optical network terminals have certain information processing capabilities.

So far, the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.

Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the upper computer of the optical module, provides data signals to the optical module, and receives data signals from the optical module. The common optical module upper computer also has optical lines Terminal etc.

Figure 2 is a schematic diagram of the structure of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for access to electrical ports of optical modules such as gold fingers; A heat sink 107 is provided on the cage 106, and the heat sink 107 has raised portions such as fins that increase the heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the cage is provided with electrical connectors; the optical module is inserted into the cage, and the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage 106, and then diffuse through the radiator 107 on the cage.

FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application, and FIG. 4 is an exploded structural schematic diagram of an optical module provided by an embodiment of the present application. As shown in FIGS. 3 and 4, the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, and an optical transceiver device 400;

The upper housing 201 is closed on the lower housing 202 to form a package cavity with two openings; the outer contour of the package cavity generally presents a square body. Specifically, the lower housing includes a main board and two sides of the main board and the main board. Two side plates arranged vertically; the upper shell includes a cover plate, and the cover plate covers the two side plates of the upper shell to form a package cavity; the upper shell may also include two sides of the cover plate and the cover The two side walls of the board are arranged vertically, and the two side walls are combined with the two side boards to realize the upper housing cover closing on the lower housing.

The two openings can be two ends in the same direction (204, 205), or two openings in different directions; one of the openings is the electrical port 204, and the gold fingers of the circuit board extend from the electrical port 204 , Inserted into a host computer such as an optical network terminal; another opening is an optical port 205 for external fiber access to connect to the optical transceiver device 400 inside the optical module; the circuit board 300, optical transceiver device 400 and other optoelectronic devices are located in the package cavity in.

The assembly method of combining the upper case and the lower case is convenient for installing the circuit board 300, the optical transceiver device 400 and other devices into the case, and the upper case and the lower case form the outermost package protection case of the optical module ; The upper and lower housings are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made as an integral part, so that when assembling circuit boards and other devices, positioning components, heat dissipation and electromagnetic shielding Components cannot be installed and are not conducive to production automation.

The unlocking component 203 is located on the outer wall of the package cavity/lower housing 202 and is used to realize a fixed connection between the optical module and the host computer, or to release a fixed connection between the optical module and the host computer.

The unlocking component 203 has an engaging component that matches the upper computer cage; pulling the end of the unlocking component can relatively move the unlocking component on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the engaging component of the unlocking component inserts the optical module It is fixed in the cage of the host computer; by pulling the unlocking component, the engaging component of the unlocking component moves with it, thereby changing the connection relationship between the engaging component and the host computer to release the engaging relationship between the optical module and the host computer, so that the The optical module is withdrawn from the cage of the host computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) etc.

The circuit board connects the electrical components in the optical module according to the circuit design through circuit traces to achieve electrical functions such as power supply, electrical signal transmission, and grounding.

The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also carry a bearing effect. For example, the rigid circuit board can smoothly carry the chip; when the optical transceiver device is on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage, specifically, metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connection with the electrical connector; these are It is inconvenient for flexible circuit boards.

Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.

The optical module can integrate the OTDR function (optical time domain detection, used to detect the breakpoint position of the optical fiber) on the basis of implementing the OSC function (service data transmission function).

5 is a schematic diagram of an internal structure of an optical module provided by an embodiment of the present application. Referring to FIG. 5, an embodiment of the present application provides an optical module 200, including a circuit board 300, a laser transmitter TO1, and a first laser receiver TO2. The circuit board 300 has a gold finger 301, a control chip C1, a first driving chip LDD1, and a second driving chip LDD2 on the surface. among them,

The first driving chip LDD1 and the second driving chip LDD2 drive the laser emitter TO1 in a time-sharing manner to generate laser light of the first wavelength, and the laser light of the first wavelength enters the external optical fiber (the line connected to the right side of TO1 in the figure);

The first laser receiver TO2 receives the reflected light of the first wavelength from the external optical fiber.

In this embodiment, the first driving chip LDD1 is connected to the transmission pin Tx of the golden finger 301, and can receive the transmission data provided by the transmission pin Tx.

It should be noted that the first driving chip LDD1 is connected to the transmission pin Tx of the gold finger (GF) 301, which may be a direct connection or an indirect connection. For example, when indirectly connected, other auxiliary circuits or chips may be provided between the first driving chip LDD1 and the transmitting pin Tx of the gold finger 301, for example, the auxiliary circuit chip may be an amplifier circuit, a clock data recovery chip, etc. The scene is set, and the corresponding scheme falls into the protection scope of this application.

In this embodiment, the second driving chip LDD2 is connected to the control chip C1 and can receive the detection data provided by the control chip C1. Of course, the detection data received by the second driving chip LDD2 can also come from the gold finger 301 or a separately provided detection signal circuit ; Because the detection data is only used for detection purposes, the detection data is different from the transmission data provided by the transmission pin. The detection data can also be preset data. In the case of enabling the detection of the OTDR function, the technician can according to the specific scenario Select the source and data of the detection data.

For example, in this embodiment, a detection signal circuit or a detection signal chip may be provided on the surface of the circuit board 300, and the detection signal circuit or the detection signal chip provides detection data to the second driving chip LDD2. Of course, the detection signal circuit can also be integrated inside the control chip, and the technician can set it according to the specific scenario, and the corresponding solution falls within the protection scope of the present application.

The control chip in the embodiment of the present application may also be integrated into the MCU.

It should be noted that the second driving chip LDD2 is connected to the control chip C1, which may be a direct connection or an interval connection. In the indirect connection, other auxiliary circuits or chips may be provided between the second driving chip LDD2 and the control chip C1. For example, the auxiliary circuit chip may be an amplifier circuit, a clock data recovery chip, etc., and the technician can set it according to a specific scenario, and the corresponding solution falls within the protection scope of the present application.

So far, in this embodiment, the first driver chip and the second driver chip can drive the laser emitter to generate laser light of the first wavelength in a time-sharing manner, wherein the emission data of the first driver chip is provided by the emission pin of the gold finger, and the second driver The detection data of the chip can be provided by the control chip. Then, the laser transmitter generates laser light of the first wavelength and can enter the external optical fiber. When the external optical fiber has a fault, the first laser receiver can receive the reflected light of the first wavelength from the external optical fiber, which is convenient for subsequent determination of the fault based on the reflected light position. It can be seen that in this embodiment, the first driver chip LDD1 and the second driver chip LDD2 share the laser emitter, which can realize the effect of both the laser transmitter of the optical module OSC function and the OTDR function, which can save a laser and help reduce the light. The volume of the module and reduce the package size of the optical module.

In some embodiments, referring to FIG. 5, the circuit board 300 of the optical module 200 further has a microprocessor MCU connected to the control chip C1. The control chip C1 is connected to the mode pin and A driving chip LDD1 is connected to the second driving chip LDD2, and when receiving the mode signal provided by the mode pin, the first driving chip LDD1 and the second driving chip LDD2 are controlled to drive the laser emitter TO1 to generate laser light in a time-sharing manner.

When the control chip C1 is integrated in the MCU, the surface of the circuit board 300 of the optical module 200 also has a microprocessor MCU, which is connected to the mode pins of the gold finger 301, the first driver chip LDD1 and the second driver chip LDD2, respectively When the mode signal provided by the mode pin is received, the first driving chip LDD1 and the second driving chip LDD2 are controlled to drive the laser emitter TO1 to generate laser light in a time-sharing manner.

In some embodiments, the first laser receiver TO2 may convert the reflected light from the external optical fiber into an electrical signal, and then send the electrical signal to the control chip C1, and the control chip C1 processes the electrical signal after receiving the electrical signal. The breakpoint position of the external fiber can be determined, and then the breakpoint position is sent to the microprocessor MCU. The microprocessor MCU forwards the breakpoint position to the detection pin of the golden finger 301 (not shown in the figure). Understandably, in the forwarding process, the microprocessor can do some format conversion, code conversion and other processing on the breakpoint position data, so that the processed breakpoint position meets the requirements of the host. In this way, the control chip C1 drives the laser transmitter TO1 to emit light, and the first laser receiver TO2 can receive the reflected light, so that the laser transmitter TO1 and the first laser receiver TO2 can satisfy the OTDR function of the optical module.

Among them, the algorithm for the control chip C1 to process the electrical signal may be preset, which is not limited herein. In addition, the control chip C1 can obtain other types of fault problems in addition to the location of the breakpoint by processing the electrical signal. The fault problem can be matched with the processing algorithm. When the fault problem can be obtained, the corresponding solution falls under the protection of this application range.

In other embodiments, the first laser receiver TO2 may convert the reflected light from the external optical fiber into an electrical signal, and then send the electrical signal to the control chip C1. The control chip C1 forwards the electrical signal to the microprocessor MCU. After receiving the electrical signal, the microprocessor MCU processes the electrical signal, can determine the location of the breakpoint of the external optical fiber, and then provides the golden finger 301 after some format conversion, code conversion and other processing. Among them, the algorithm for the microprocessor MCU to process the electrical signal can be preset, which is not limited here. In addition, the microprocessor MCU processing electrical signals can not only obtain the location of the breakpoint, but also obtain other forms of fault problems. The fault problems can be matched with the processing algorithm. When the fault problems can be obtained, the corresponding solution falls into the protected range.

In still other embodiments, the first laser receiver TO2 converts the reflected light from the external optical fiber into an electrical signal, which is forwarded to the gold finger 301 through the control chip C1 and the microprocessor MCU in turn, and then forwarded by the gold finger 301 For the host, the host completes the processing of the electrical signal. The processing method can refer to the processing method of the control chip C1, and the corresponding scheme falls within the protection scope of the present application.

In some embodiments, with continued reference to FIG. 5, the optical module 200 further includes a second laser receiver TO3 and a linear amplifier (LA) on the surface of the circuit board 300. The second laser receiver TO3 is connected to the linear amplifier LA, converts the reflected light of the second wavelength from the external optical fiber into an electrical signal, and supplies the electrical signal to the linear amplifier LA.

Among them, the linear amplifier LA can be connected to the receiving pin (not shown in the figure) of the golden finger 301, and the electric signal is amplified and sent to the receiving pin. In this way, the second laser receiver TO3 receives the reflected light, which can satisfy the OSC function of the optical module.

It should be noted that the second laser receiver TO3 is connected to the linear amplifier LA, and may be connected directly or indirectly. During the indirect connection, the second laser receiver TO3 and the linear amplifier LA can be provided with other auxiliary circuits or chips, such as transimpedance amplifiers, and the technician can set them according to specific scenarios, and the corresponding scheme falls within the protection scope of the present application.

It should also be noted that the linear amplifier LA is connected to the gold finger 301, which may be a direct connection or an interval connection. During the indirect connection, other auxiliary circuits or chips may be provided between the linear amplifier LA and the gold finger 301, such as a clock data recovery chip. The technician can set them according to specific scenarios, and the corresponding solutions fall within the protection scope of the present application.

Combining the situation of the reflected light received by the first laser receiver TO2 and the second laser receiver TO3, in this embodiment, some adjustments can also be made to the external optical fiber through which the reflected light passes.

For example, the second laser receiver TO3 receives the reflected light of the second wavelength and the first wavelength receiver TO2 receives the reflected light of the first wavelength from the optical fiber encapsulated in the same external fiber, that is, the optical fiber into which the laser transmitter TO1 generates the laser light. 1. The optical fiber through which the reflected light of the first wavelength passes and the optical fiber through which the reflected light of the second wavelength passes are all encapsulated in the same external optical fiber. In this case, the number of external optical fibers may be one.

As another example, the second laser receiver TO3 receives the reflected light of the second wavelength and the first laser receiver TO2 receives the reflected light of the first wavelength from the optical fiber encapsulated in different external optical fibers, that is, the optical fiber into which the laser transmitter TO1 generates laser light. The optical fiber passing through the reflected light of the first wavelength is encapsulated in the same external optical fiber, and the optical fiber passing through the reflected light of the second wavelength is encapsulated in another external optical fiber. In this case, the number of external optical fibers may be two.

It should be noted that the technical personnel can adjust the encapsulation form of the external optical fiber according to the specific scenario, and without affecting the scheme of the present application, the corresponding scheme falls within the protection scope of the present application.

FIG. 6 is a circuit diagram of an optical module in the prior art. Referring to FIG. 6, after the existing optical module integrates the OTDR function (optical time domain reflection function for fiber breakpoint detection), two groups of laser devices will be provided, each group The laser device includes a laser transmitter and a laser receiver, namely laser transmitter TO1 and laser receiver TO2 and laser transmitter TO4 and laser receiver TO3.

The laser receiver TO3 and laser transmitter TO4 are used to realize the OSC function (service data transmission function) of the optical module. The control circuit controls the driving chip LDD2 (Laser Diode Driver) to work, and the driving chip LDD2 drives the laser emitter TO4 to emit light. The laser receiver TO3 then receives the reflected light and converts it into an electrical signal, which is amplified by the linear amplifier LA and sent to the control circuit. In this way, the control circuit receives the amplified electrical signal.

The laser transmitter TO1 and laser receiver TO2 are used to realize the OTDR function of the optical module. The control circuit controls the operation of the OTDR control circuit, and then the OTDR control circuit controls the operation of the driving chip LDD1, and the driving chip LDD1 drives the laser emitter TO1 to work, and the generated laser light enters the external optical fiber. Then, the laser receiver TO2 can receive the reflected light of the external optical fiber and convert it into an electrical signal, and send the electrical signal to the OTDR control circuit. The OTDR control circuit can calculate the breakpoint position in the fiber link and send the breakpoint position to the control circuit.

However, the existing optical module with integrated OTDR function will increase the volume of the optical module due to the use of four laser devices, which is not conducive to reducing the package size. In addition, the existing optical module OSC function and OTDR function corresponding to the laser transmitter may emit light at the same time, so it is necessary to make the laser transmitter TO4 and the laser transmitter TO1 emit light of different wavelengths, so as to avoid optical signal interference, which will also Increase the design difficulty of the optical module.

FIG. 7 is another internal circuit diagram of an optical module provided by an embodiment of the present application. Referring to FIG. 7, the optical module 200 includes a circuit board 300, a laser transmitter TO1, a first laser receiver TO2, and a second laser receiver TO3. The circuit board 300 has a gold finger 301, a control chip C1, a microprocessor MCU, a detection signal circuit TE, a first driving chip LDD1, a second driving chip LDD2, and a linear amplifier LA on the surface. among them,

The first end (label 1) of the first driver chip LDD1 is connected to the transmitting pin (label Tx) of the gold finger 301, and the second end (label 2) of the first driver chip LDD1 is connected to the second end of the microprocessor MCU ( Mark 2) connection, the third end of the first driver chip LDD1 (mark 3) is connected to the first end of the laser emitter TO1 (mark 1), and the fourth end of the first driver chip LDD1 (mark 4) is connected to the laser emitter The second end of TO1 (identification 2) is connected.

The first end of the microprocessor MCU (identification 1) is connected to the mode pin (identification C) of the gold finger 301, and the third end of the microprocessor MCU (identification 3) is connected to the first end of the control chip C1 (identification 1) Connected, the fourth end of the microprocessor MCU (mark 4) is connected to the fourth end of the control chip C1 (mark 4), the fifth end of the microprocessor MCU (mark 5) and the detection pin of the gold finger 301 (mark D) Connect.

The first end (label 1) of the second driving chip LDD2 is connected to the detection signal circuit TE, and the second end (label 2) of the second driving chip LDD2 is connected to the second end (label 2) of the control chip C1; the second driving The third end of the chip LDD2 (mark 3) is connected to the first end of the laser emitter TO1 (mark 1), and the fourth end of the second driver chip LDD2 (mark 4) is connected to the second end of the laser emitter TO1 (mark 2) )connection.

The third end (label 3) of the control chip C1 is connected to the first laser receiver TO2.

The first terminal (label 1) of the linear amplifier LA is connected to the second laser receiver TO3, and the second terminal (label 2) of the linear amplifier LA is connected to the receiving pin (label Rx) of the gold finger 301.

The following describes the working process of an optical module provided by an embodiment of the present application with reference to FIG. 3:

The optical module 200 is connected to a host (not shown in the figure) through a golden finger 301, and the host can send or receive data through the golden finger 301.

The mode pin C of the gold finger 301 in the optical module 200 can output the received mode signal Con1 to the microprocessor MCU. The mode signal Con1 may indicate a mode in which the host expects the optical module 200 to operate in the OSC function, and may also indicate a mode in which the host expects the optical module 200 to operate in the OTDR function. For example, the value of Con1 is 1, which means that the optical module 200 works in the OSC function mode, and the value of Con1 is 0, which means that the optical module works in the OTDR function mode.

After receiving the mode signal Con1, the microprocessor MCU can interpret the meaning of the mode signal Con1:

In some embodiments of the present application, the optical module 200 is expected to work in the OSC function mode

The microprocessor MCU sends a control signal Con2 to the first driving chip LDD1, so that the first driving chip LDD1 drives the laser emitter TO1 to generate laser light, and at the same time, the first driving chip LDD1 can receive the transmission data provided by the transmission pin Tx of the gold finger 301 TX1, then adjusts the bias current bias output at the third terminal and the drive current mod output at the fourth terminal according to the transmission data TX1, and outputs the bias current bias and the drive current mod to the laser transmitter TO1. The laser emitter TO1 adjusts the amplitude and power of the laser light of the first wavelength generated according to the bias current bias and the drive current mod, and inputs the laser light of the first wavelength to the external optical fiber.

The second laser receiver TO3 receives the reflected light of the second wavelength reflected by the external optical fiber. The laser light of the second wavelength is generated by the opposite end laser transmitter and input into the external optical fiber. The second laser receiver TO3 converts the reflected light of the second wavelength into an electrical signal R1 and sends it to the linear amplifier LA. The linear amplifier LA linearly amplifies the telecommunication signal R1 to obtain the received signal RX, and provides the received signal RX to the receiving pin Rx of the golden finger 301. The host can read the received signal RX through the receiving pin Rx and process the received signal RX.

In some embodiments of the present application, it is expected that the optical module works in the OTDR function mode

The microprocessor MCU sends a control signal Con2 to the control chip C1, and the control chip C1 provides a control signal Con3 to the second driving chip LDD2 in response to the control signal Con2 to control the second driving chip LDD2 to drive the laser emitter TO1 to generate laser light while the second The driving chip LDD2 can receive the standard signal TX2 provided by the detection signal circuit TE, and then adjust the bias current bias output at its third terminal and the drive current mod output at its fourth terminal according to the standard signal TX2, and convert the bias current bias and drive The current mod is output to the laser transmitter TO1. The laser emitter TO1 adjusts the amplitude and power of the laser light of the first wavelength generated according to the bias current bias and the drive current mod, and inputs the laser light of the first wavelength to the external optical fiber.

The first laser receiver TO2 receives the reflected light reflected from the external optical fiber, converts the reflected light into an electrical signal R2, and sends it to the control chip C1. The control chip C1 preprocesses the electrical signal R2 to determine the calculated length of the external fiber. Combining the calculated length and actual length of the external fiber, you can get whether the external fiber has faults such as breakpoints. For example, if the calculated length is the same as the actual length, there is no fault in the external fiber. If the calculated length is less than the actual length, it can be determined that the external fiber has a breakpoint and breakpoint location Data2. Then, the control chip C1 sends the breakpoint position Data2 to the microprocessor MCU. The microprocessor MCU performs some format conversion or code conversion processing on the breakpoint position Data2 to obtain the detection data Data1, and provides the detection data Data1 to the detection pin D of the gold finger 301. The host can read the detection data Data1 from the detection pin D and feed it back to the user.

It can be seen that in this embodiment, by sharing the first laser with the first driving chip LDD1 and the second driving chip LDD2, the purpose of both the laser in the optical module OSC function and the OTDR function can be achieved. Compared with the four laser devices in the related art, this embodiment can save one laser emitter, which is beneficial to reduce the volume of the optical module and reduce the package size of the optical module.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still Modifications to the technical solutions described in the foregoing embodiments, or equivalent replacement of some of the technical features therein; and these modifications or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

An optical module, characterized in that it includes

Circuit board with gold finger, first driving chip and second driving chip on the surface;

The first driving chip is electrically connected to the emitting pin of the golden finger, and is used to obtain the emission data of the driving laser from the emitting pin;

The second driving chip is used to obtain detection data different from the emission data;

The laser emitter is electrically connected to the first driving chip and the second driving chip respectively, and is driven by the first driving chip and the second driving chip in a time-sharing manner, and emits the first wavelength incident on the external optical fiber Laser

The first laser receiver is configured to receive the light of the first wavelength reflected by the external optical fiber.
The optical module according to claim 1, further comprising a microprocessor on the surface of the circuit board, the microprocessor and the mode pin of the golden finger, the first driving chip and the control Chip connection, the second driving chip is connected to the control chip;

When the processor receives the mode signal provided by the mode pin, the processor provides a control signal to the first driving chip and the control chip, so as to realize the separation of the first driving chip and the second driving chip The laser emitter is driven from time to time to generate laser light.
The optical module according to claim 1, further comprising a microprocessor on the surface of the circuit board, the microprocessor and the mode pin of the golden finger, the first driving chip and all The second driving chip is connected to control the first driving chip and the second driving chip to drive the laser emitter to generate laser light in a time-sharing manner when receiving the mode signal provided by the mode pin.
The optical module according to claim 1, further comprising a second laser receiver and a linear amplifier on the surface of the circuit board;

The second laser receiver is connected to the linear amplifier, converts the reflected light of the second wavelength from the external optical fiber into an electrical signal, and provides the electrical signal to the linear amplifier, and provides the electrical signal To the linear amplifier.
The optical module according to claim 4, wherein the second laser receiver receives the reflected light of the second wavelength and the reflected light of the first wavelength received by the first laser receiver comes from the same external optical fiber; or,

The second laser receiver receives the reflected light of the second wavelength and the reflected light of the first wavelength received by the first laser receiver comes from different external optical fibers.