WO2020108294A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2020108294A1
WO2020108294A1 PCT/CN2019/117825 CN2019117825W WO2020108294A1 WO 2020108294 A1 WO2020108294 A1 WO 2020108294A1 CN 2019117825 W CN2019117825 W CN 2019117825W WO 2020108294 A1 WO2020108294 A1 WO 2020108294A1
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WO
WIPO (PCT)
Prior art keywords
driving chip
laser
optical module
chip
optical
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Application number
PCT/CN2019/117825
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English (en)
Chinese (zh)
Inventor
吴铁山
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青岛海信宽带多媒体技术有限公司
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Publication of WO2020108294A1 publication Critical patent/WO2020108294A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
    • H04B10/071—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using a reflected signal, e.g. using optical time domain reflectometers [OTDR]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
    • G01M11/31—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter and a light receiver being disposed at the same side of a fibre or waveguide end-face, e.g. reflectometers
    • G01M11/3109—Reflectometers detecting the back-scattered light in the time-domain, e.g. OTDR
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • This application relates to the technical field of optical communication, and in particular to an optical module.
  • Optical Time Domain Reflectometer Optical Time Domain Reflectometer
  • OTDR Optical Time Domain Reflectometer
  • the OTDR device inputs a series of light waves into the optical fiber, and the light waves will be reflected back when they encounter different refractive index media. Then, the reflected optical signal is received on the same side of the input light wave, and the intensity of the optical signal (as a function of time) can be detected, and then it can be converted into the length of the optical fiber according to the intensity of the optical signal.
  • This application provides an optical module that integrates the optical time domain detection function on the basis of the original data transmission function.
  • An embodiment of the present application provides an optical module, including a circuit board, a laser emitter, and a first laser receiver.
  • the surface of the circuit board has a gold finger, a control chip, a first driving chip, and a second driving chip;
  • the firing pin of the gold finger is electrically connected, and the second driving chip is electrically connected to the control chip;
  • the first driving chip and the second driving chip drive the laser emitter in a time-sharing manner to generate laser light of a first wavelength, and the laser light of the first wavelength enters an external optical fiber; wherein, the transmitting pin provides transmission data to the first driving chip;
  • the first laser receiver receives the reflected light of the first wavelength from the external optical fiber.
  • Figure 1 is a schematic diagram of the connection relationship of optical communication terminals
  • Figure 2 is a schematic diagram of the structure of an optical network terminal
  • FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an internal structure of an optical module provided by an embodiment of the present application.
  • FIG 7 is another internal circuit diagram of an optical module provided by an embodiment of the present application.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses optical signals that carry information to be transmitted in information transmission equipment such as optical fibers/optical waveguides, and the passive transmission characteristics of light in optical fibers/optical waveguides can be used to realize low-cost and low-loss information transmission; and information processing equipment such as computers Electrical signals are used.
  • information transmission equipment such as optical fibers/optical waveguides
  • information processing equipment such as computers Electrical signals are used.
  • the optical module realizes the above-mentioned mutual conversion function of the optical and electrical signals in the field of optical fiber communication technology, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the golden finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding.
  • the electrical connection method using the golden finger has become an optical module
  • the industry's mainstream connection method is based on this, and the definition of the pin on the gold finger has formed a variety of industry protocols/specifications.
  • FIG. 1 is a schematic diagram of the connection relationship of optical communication terminals.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103;
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100;
  • the optical module internally realizes the mutual conversion of the optical signal and the electrical signal, so as to realize the establishment of the information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted from the optical module to the electrical signal and input into the optical network terminal 100 The electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical module 200 is a tool for realizing mutual conversion of photoelectric signals, and does not have the function of processing data. In the above photoelectric conversion process, information only changes in the transmission carrier, and information does not change.
  • the optical network terminal has an optical module interface 102 for accessing the optical module 200 to establish a bidirectional electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104 for accessing the network cable 103 to establish a bidirectional electrical connection with the network cable 103 Signal connection; establish a connection between the optical module 200 and the network cable 103 through the optical network terminal 100.
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the optical The upper computer of the module monitors the operation of the optical module.
  • optical network terminals have certain information processing capabilities.
  • the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the upper computer of the optical module, provides data signals to the optical module, and receives data signals from the optical module.
  • the common optical module upper computer also has optical lines Terminal etc.
  • FIG. 2 is a schematic diagram of the structure of an optical network terminal.
  • the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for access to electrical ports of optical modules such as gold fingers; A heat sink 107 is provided on the cage 106, and the heat sink 107 has raised portions such as fins that increase the heat radiation area.
  • the optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the cage is provided with electrical connectors; the optical module is inserted into the cage, and the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage 106, and then diffuse through the radiator 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application
  • FIG. 4 is an exploded structural schematic diagram of an optical module provided by an embodiment of the present application.
  • the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, and an optical transceiver device 400;
  • the upper housing 201 is closed on the lower housing 202 to form a package cavity with two openings; the outer contour of the package cavity generally presents a square body.
  • the lower housing includes a main board and two sides of the main board and the main board. Two side plates arranged vertically; the upper shell includes a cover plate, and the cover plate covers the two side plates of the upper shell to form a package cavity; the upper shell may also include two sides of the cover plate and the cover
  • the two side walls of the board are arranged vertically, and the two side walls are combined with the two side boards to realize the upper housing cover closing on the lower housing.
  • the two openings can be two ends in the same direction (204, 205), or two openings in different directions; one of the openings is the electrical port 204, and the gold fingers of the circuit board extend from the electrical port 204 , Inserted into a host computer such as an optical network terminal; another opening is an optical port 205 for external fiber access to connect to the optical transceiver device 400 inside the optical module; the circuit board 300, optical transceiver device 400 and other optoelectronic devices are located in the package cavity in.
  • the assembly method of combining the upper case and the lower case is convenient for installing the circuit board 300, the optical transceiver device 400 and other devices into the case, and the upper case and the lower case form the outermost package protection case of the optical module ;
  • the upper and lower housings are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made as an integral part, so that when assembling circuit boards and other devices, positioning components, heat dissipation and electromagnetic shielding Components cannot be installed and are not conducive to production automation.
  • the unlocking component 203 is located on the outer wall of the package cavity/lower housing 202 and is used to realize a fixed connection between the optical module and the host computer, or to release a fixed connection between the optical module and the host computer.
  • the unlocking component 203 has an engaging component that matches the upper computer cage; pulling the end of the unlocking component can relatively move the unlocking component on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the engaging component of the unlocking component inserts the optical module It is fixed in the cage of the host computer; by pulling the unlocking component, the engaging component of the unlocking component moves with it, thereby changing the connection relationship between the engaging component and the host computer to release the engaging relationship between the optical module and the host computer, so that the The optical module is withdrawn from the cage of the host computer.
  • the circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) etc.
  • electronic components such as capacitors, resistors, transistors, MOS tubes
  • chips such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) etc.
  • the circuit board connects the electrical components in the optical module according to the circuit design through circuit traces to achieve electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also carry a bearing effect. For example, the rigid circuit board can smoothly carry the chip; when the optical transceiver device is on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage, specifically, metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connection with the electrical connector; these are It is inconvenient for flexible circuit boards.
  • Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.
  • the optical module can integrate the OTDR function (optical time domain detection, used to detect the breakpoint position of the optical fiber) on the basis of implementing the OSC function (service data transmission function).
  • OTDR function optical time domain detection, used to detect the breakpoint position of the optical fiber
  • FIG. 5 is a schematic diagram of an internal structure of an optical module provided by an embodiment of the present application.
  • an embodiment of the present application provides an optical module 200, including a circuit board 300, a laser transmitter TO1, and a first laser receiver TO2.
  • the circuit board 300 has a gold finger 301, a control chip C1, a first driving chip LDD1, and a second driving chip LDD2 on the surface. among them,
  • the first driving chip LDD1 and the second driving chip LDD2 drive the laser emitter TO1 in a time-sharing manner to generate laser light of the first wavelength, and the laser light of the first wavelength enters the external optical fiber (the line connected to the right side of TO1 in the figure);
  • the first laser receiver TO2 receives the reflected light of the first wavelength from the external optical fiber.
  • the first driving chip LDD1 is connected to the transmission pin Tx of the golden finger 301, and can receive the transmission data provided by the transmission pin Tx.
  • the first driving chip LDD1 is connected to the transmission pin Tx of the gold finger (GF) 301, which may be a direct connection or an indirect connection.
  • the auxiliary circuit chip may be an amplifier circuit, a clock data recovery chip, etc.
  • the second driving chip LDD2 is connected to the control chip C1 and can receive the detection data provided by the control chip C1.
  • the detection data received by the second driving chip LDD2 can also come from the gold finger 301 or a separately provided detection signal circuit ; Because the detection data is only used for detection purposes, the detection data is different from the transmission data provided by the transmission pin.
  • the detection data can also be preset data. In the case of enabling the detection of the OTDR function, the technician can according to the specific scenario Select the source and data of the detection data.
  • a detection signal circuit or a detection signal chip may be provided on the surface of the circuit board 300, and the detection signal circuit or the detection signal chip provides detection data to the second driving chip LDD2.
  • the detection signal circuit can also be integrated inside the control chip, and the technician can set it according to the specific scenario, and the corresponding solution falls within the protection scope of the present application.
  • control chip in the embodiment of the present application may also be integrated into the MCU.
  • the second driving chip LDD2 is connected to the control chip C1, which may be a direct connection or an interval connection.
  • the control chip C1 may be a direct connection or an interval connection.
  • other auxiliary circuits or chips may be provided between the second driving chip LDD2 and the control chip C1.
  • the auxiliary circuit chip may be an amplifier circuit, a clock data recovery chip, etc., and the technician can set it according to a specific scenario, and the corresponding solution falls within the protection scope of the present application.
  • the first driver chip and the second driver chip can drive the laser emitter to generate laser light of the first wavelength in a time-sharing manner, wherein the emission data of the first driver chip is provided by the emission pin of the gold finger, and the second driver The detection data of the chip can be provided by the control chip. Then, the laser transmitter generates laser light of the first wavelength and can enter the external optical fiber. When the external optical fiber has a fault, the first laser receiver can receive the reflected light of the first wavelength from the external optical fiber, which is convenient for subsequent determination of the fault based on the reflected light position.
  • the first driver chip LDD1 and the second driver chip LDD2 share the laser emitter, which can realize the effect of both the laser transmitter of the optical module OSC function and the OTDR function, which can save a laser and help reduce the light.
  • the circuit board 300 of the optical module 200 further has a microprocessor MCU connected to the control chip C1.
  • the control chip C1 is connected to the mode pin and
  • a driving chip LDD1 is connected to the second driving chip LDD2, and when receiving the mode signal provided by the mode pin, the first driving chip LDD1 and the second driving chip LDD2 are controlled to drive the laser emitter TO1 to generate laser light in a time-sharing manner.
  • the surface of the circuit board 300 of the optical module 200 also has a microprocessor MCU, which is connected to the mode pins of the gold finger 301, the first driver chip LDD1 and the second driver chip LDD2, respectively.
  • the first driving chip LDD1 and the second driving chip LDD2 are controlled to drive the laser emitter TO1 to generate laser light in a time-sharing manner.
  • the first laser receiver TO2 may convert the reflected light from the external optical fiber into an electrical signal, and then send the electrical signal to the control chip C1, and the control chip C1 processes the electrical signal after receiving the electrical signal.
  • the breakpoint position of the external fiber can be determined, and then the breakpoint position is sent to the microprocessor MCU.
  • the microprocessor MCU forwards the breakpoint position to the detection pin of the golden finger 301 (not shown in the figure). Understandably, in the forwarding process, the microprocessor can do some format conversion, code conversion and other processing on the breakpoint position data, so that the processed breakpoint position meets the requirements of the host.
  • the control chip C1 drives the laser transmitter TO1 to emit light, and the first laser receiver TO2 can receive the reflected light, so that the laser transmitter TO1 and the first laser receiver TO2 can satisfy the OTDR function of the optical module.
  • the algorithm for the control chip C1 to process the electrical signal may be preset, which is not limited herein.
  • the control chip C1 can obtain other types of fault problems in addition to the location of the breakpoint by processing the electrical signal.
  • the fault problem can be matched with the processing algorithm. When the fault problem can be obtained, the corresponding solution falls under the protection of this application range.
  • the first laser receiver TO2 may convert the reflected light from the external optical fiber into an electrical signal, and then send the electrical signal to the control chip C1.
  • the control chip C1 forwards the electrical signal to the microprocessor MCU.
  • the microprocessor MCU processes the electrical signal, can determine the location of the breakpoint of the external optical fiber, and then provides the golden finger 301 after some format conversion, code conversion and other processing.
  • the algorithm for the microprocessor MCU to process the electrical signal can be preset, which is not limited here.
  • the microprocessor MCU processing electrical signals can not only obtain the location of the breakpoint, but also obtain other forms of fault problems. The fault problems can be matched with the processing algorithm. When the fault problems can be obtained, the corresponding solution falls into the protected range.
  • the first laser receiver TO2 converts the reflected light from the external optical fiber into an electrical signal, which is forwarded to the gold finger 301 through the control chip C1 and the microprocessor MCU in turn, and then forwarded by the gold finger 301
  • the host completes the processing of the electrical signal.
  • the processing method can refer to the processing method of the control chip C1, and the corresponding scheme falls within the protection scope of the present application.
  • the optical module 200 further includes a second laser receiver TO3 and a linear amplifier (LA) on the surface of the circuit board 300.
  • the second laser receiver TO3 is connected to the linear amplifier LA, converts the reflected light of the second wavelength from the external optical fiber into an electrical signal, and supplies the electrical signal to the linear amplifier LA.
  • the linear amplifier LA can be connected to the receiving pin (not shown in the figure) of the golden finger 301, and the electric signal is amplified and sent to the receiving pin.
  • the second laser receiver TO3 receives the reflected light, which can satisfy the OSC function of the optical module.
  • the second laser receiver TO3 is connected to the linear amplifier LA, and may be connected directly or indirectly.
  • the second laser receiver TO3 and the linear amplifier LA can be provided with other auxiliary circuits or chips, such as transimpedance amplifiers, and the technician can set them according to specific scenarios, and the corresponding scheme falls within the protection scope of the present application.
  • the linear amplifier LA is connected to the gold finger 301, which may be a direct connection or an interval connection.
  • other auxiliary circuits or chips may be provided between the linear amplifier LA and the gold finger 301, such as a clock data recovery chip. The technician can set them according to specific scenarios, and the corresponding solutions fall within the protection scope of the present application.
  • the second laser receiver TO3 receives the reflected light of the second wavelength and the first wavelength receiver TO2 receives the reflected light of the first wavelength from the optical fiber encapsulated in the same external fiber, that is, the optical fiber into which the laser transmitter TO1 generates the laser light.
  • the optical fiber through which the reflected light of the first wavelength passes and the optical fiber through which the reflected light of the second wavelength passes are all encapsulated in the same external optical fiber. In this case, the number of external optical fibers may be one.
  • the second laser receiver TO3 receives the reflected light of the second wavelength and the first laser receiver TO2 receives the reflected light of the first wavelength from the optical fiber encapsulated in different external optical fibers, that is, the optical fiber into which the laser transmitter TO1 generates laser light.
  • the optical fiber passing through the reflected light of the first wavelength is encapsulated in the same external optical fiber, and the optical fiber passing through the reflected light of the second wavelength is encapsulated in another external optical fiber.
  • the number of external optical fibers may be two.
  • FIG. 6 is a circuit diagram of an optical module in the prior art.
  • the laser device includes a laser transmitter and a laser receiver, namely laser transmitter TO1 and laser receiver TO2 and laser transmitter TO4 and laser receiver TO3.
  • the laser receiver TO3 and laser transmitter TO4 are used to realize the OSC function (service data transmission function) of the optical module.
  • the control circuit controls the driving chip LDD2 (Laser Diode Driver) to work, and the driving chip LDD2 drives the laser emitter TO4 to emit light.
  • the laser receiver TO3 then receives the reflected light and converts it into an electrical signal, which is amplified by the linear amplifier LA and sent to the control circuit. In this way, the control circuit receives the amplified electrical signal.
  • the laser transmitter TO1 and laser receiver TO2 are used to realize the OTDR function of the optical module.
  • the control circuit controls the operation of the OTDR control circuit, and then the OTDR control circuit controls the operation of the driving chip LDD1, and the driving chip LDD1 drives the laser emitter TO1 to work, and the generated laser light enters the external optical fiber.
  • the laser receiver TO2 can receive the reflected light of the external optical fiber and convert it into an electrical signal, and send the electrical signal to the OTDR control circuit.
  • the OTDR control circuit can calculate the breakpoint position in the fiber link and send the breakpoint position to the control circuit.
  • the existing optical module with integrated OTDR function will increase the volume of the optical module due to the use of four laser devices, which is not conducive to reducing the package size.
  • the existing optical module OSC function and OTDR function corresponding to the laser transmitter may emit light at the same time, so it is necessary to make the laser transmitter TO4 and the laser transmitter TO1 emit light of different wavelengths, so as to avoid optical signal interference, which will also Increase the design difficulty of the optical module.
  • FIG. 7 is another internal circuit diagram of an optical module provided by an embodiment of the present application.
  • the optical module 200 includes a circuit board 300, a laser transmitter TO1, a first laser receiver TO2, and a second laser receiver TO3.
  • the circuit board 300 has a gold finger 301, a control chip C1, a microprocessor MCU, a detection signal circuit TE, a first driving chip LDD1, a second driving chip LDD2, and a linear amplifier LA on the surface. among them,
  • the first end (label 1) of the first driver chip LDD1 is connected to the transmitting pin (label Tx) of the gold finger 301, and the second end (label 2) of the first driver chip LDD1 is connected to the second end of the microprocessor MCU ( Mark 2) connection, the third end of the first driver chip LDD1 (mark 3) is connected to the first end of the laser emitter TO1 (mark 1), and the fourth end of the first driver chip LDD1 (mark 4) is connected to the laser emitter The second end of TO1 (identification 2) is connected.
  • the first end of the microprocessor MCU (identification 1) is connected to the mode pin (identification C) of the gold finger 301, and the third end of the microprocessor MCU (identification 3) is connected to the first end of the control chip C1 (identification 1) Connected, the fourth end of the microprocessor MCU (mark 4) is connected to the fourth end of the control chip C1 (mark 4), the fifth end of the microprocessor MCU (mark 5) and the detection pin of the gold finger 301 (mark D) Connect.
  • the first end (label 1) of the second driving chip LDD2 is connected to the detection signal circuit TE, and the second end (label 2) of the second driving chip LDD2 is connected to the second end (label 2) of the control chip C1; the second driving The third end of the chip LDD2 (mark 3) is connected to the first end of the laser emitter TO1 (mark 1), and the fourth end of the second driver chip LDD2 (mark 4) is connected to the second end of the laser emitter TO1 (mark 2) )connection.
  • the third end (label 3) of the control chip C1 is connected to the first laser receiver TO2.
  • the first terminal (label 1) of the linear amplifier LA is connected to the second laser receiver TO3, and the second terminal (label 2) of the linear amplifier LA is connected to the receiving pin (label Rx) of the gold finger 301.
  • the optical module 200 is connected to a host (not shown in the figure) through a golden finger 301, and the host can send or receive data through the golden finger 301.
  • the mode pin C of the gold finger 301 in the optical module 200 can output the received mode signal Con1 to the microprocessor MCU.
  • the mode signal Con1 may indicate a mode in which the host expects the optical module 200 to operate in the OSC function, and may also indicate a mode in which the host expects the optical module 200 to operate in the OTDR function.
  • the value of Con1 is 1, which means that the optical module 200 works in the OSC function mode
  • the value of Con1 is 0, which means that the optical module works in the OTDR function mode.
  • the microprocessor MCU After receiving the mode signal Con1, the microprocessor MCU can interpret the meaning of the mode signal Con1:
  • the optical module 200 is expected to work in the OSC function mode
  • the microprocessor MCU sends a control signal Con2 to the first driving chip LDD1, so that the first driving chip LDD1 drives the laser emitter TO1 to generate laser light, and at the same time, the first driving chip LDD1 can receive the transmission data provided by the transmission pin Tx of the gold finger 301 TX1, then adjusts the bias current bias output at the third terminal and the drive current mod output at the fourth terminal according to the transmission data TX1, and outputs the bias current bias and the drive current mod to the laser transmitter TO1.
  • the laser emitter TO1 adjusts the amplitude and power of the laser light of the first wavelength generated according to the bias current bias and the drive current mod, and inputs the laser light of the first wavelength to the external optical fiber.
  • the second laser receiver TO3 receives the reflected light of the second wavelength reflected by the external optical fiber.
  • the laser light of the second wavelength is generated by the opposite end laser transmitter and input into the external optical fiber.
  • the second laser receiver TO3 converts the reflected light of the second wavelength into an electrical signal R1 and sends it to the linear amplifier LA.
  • the linear amplifier LA linearly amplifies the telecommunication signal R1 to obtain the received signal RX, and provides the received signal RX to the receiving pin Rx of the golden finger 301.
  • the host can read the received signal RX through the receiving pin Rx and process the received signal RX.
  • the optical module works in the OTDR function mode
  • the microprocessor MCU sends a control signal Con2 to the control chip C1, and the control chip C1 provides a control signal Con3 to the second driving chip LDD2 in response to the control signal Con2 to control the second driving chip LDD2 to drive the laser emitter TO1 to generate laser light while the second
  • the driving chip LDD2 can receive the standard signal TX2 provided by the detection signal circuit TE, and then adjust the bias current bias output at its third terminal and the drive current mod output at its fourth terminal according to the standard signal TX2, and convert the bias current bias and drive The current mod is output to the laser transmitter TO1.
  • the laser emitter TO1 adjusts the amplitude and power of the laser light of the first wavelength generated according to the bias current bias and the drive current mod, and inputs the laser light of the first wavelength to the external optical fiber.
  • the first laser receiver TO2 receives the reflected light reflected from the external optical fiber, converts the reflected light into an electrical signal R2, and sends it to the control chip C1.
  • the control chip C1 preprocesses the electrical signal R2 to determine the calculated length of the external fiber. Combining the calculated length and actual length of the external fiber, you can get whether the external fiber has faults such as breakpoints. For example, if the calculated length is the same as the actual length, there is no fault in the external fiber. If the calculated length is less than the actual length, it can be determined that the external fiber has a breakpoint and breakpoint location Data2. Then, the control chip C1 sends the breakpoint position Data2 to the microprocessor MCU.
  • the microprocessor MCU performs some format conversion or code conversion processing on the breakpoint position Data2 to obtain the detection data Data1, and provides the detection data Data1 to the detection pin D of the gold finger 301.
  • the host can read the detection data Data1 from the detection pin D and feed it back to the user.
  • this embodiment by sharing the first laser with the first driving chip LDD1 and the second driving chip LDD2, the purpose of both the laser in the optical module OSC function and the OTDR function can be achieved. Compared with the four laser devices in the related art, this embodiment can save one laser emitter, which is beneficial to reduce the volume of the optical module and reduce the package size of the optical module.

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  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention concerne un module optique, comprenant une carte de circuit imprimé, un émetteur laser, et un premier récepteur laser. Une surface de la carte de circuit imprimé comprend des doigts d'or, une puce de contrôle, une première puce de commande, et une seconde puce de commande. La première puce de commande est connectée à une broche de transmission des doigts d'or. La seconde puce de commande est connectée à la puce de contrôle. La première puce de commande et la seconde puce de commande commandent, par répartition dans le temps, l'émetteur laser afin de générer une lumière laser comprenant une première longueur d'onde, et la lumière laser entre dans une fibre optique externe, la broche de transmission fournissant des données de transmission à la première puce de commande. Le premier récepteur laser reçoit une lumière réfléchie comprenant la première longueur d'onde à partir de la fibre optique externe. La première puce de commande et la seconde puce de commande partagent l'émetteur laser afin d'obtenir l'effet selon lequel les fonctions du module optique comprennent toutes un émetteur laser émettant de la lumière, réduisant ainsi les lasers requis par un, et réduisant le volume et la taille du boîtier du module optique.
PCT/CN2019/117825 2018-11-28 2019-11-13 Module optique WO2020108294A1 (fr)

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WO2021007706A1 (fr) 2019-07-12 2021-01-21 Huawei Technologies Co., Ltd. Procédé et appareil pour un émetteur-récepteur optique
CN115442528B (zh) * 2022-08-31 2024-05-14 维沃移动通信有限公司 摄像头模组和电子设备

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